CN111868901A - Tool height adjusting device and chip component transfer printing device with same - Google Patents
Tool height adjusting device and chip component transfer printing device with same Download PDFInfo
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- CN111868901A CN111868901A CN201980019450.6A CN201980019450A CN111868901A CN 111868901 A CN111868901 A CN 111868901A CN 201980019450 A CN201980019450 A CN 201980019450A CN 111868901 A CN111868901 A CN 111868901A
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- 238000010023 transfer printing Methods 0.000 title description 3
- 238000003384 imaging method Methods 0.000 claims abstract description 43
- 238000012546 transfer Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 32
- 238000010586 diagram Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention provides a tool height adjusting device, which can accurately adjust the height position of a chip holding part in a picking tool using a soft component with small pressure change along with contacting the chip holding part. Specifically, a tool height adjusting device is provided, which comprises: a transparent plate; an imaging unit that obtains an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling vertical driving of the pickup tool, a function of controlling an operation of the imaging unit, and a function of analyzing an image obtained by the imaging unit, wherein the control unit analyzes the image obtained by the imaging unit while approaching the chip holding portion in the direction of the transparent plate, and detects a height position at which the chip holding portion effectively holds the upper surface of the transparent plate.
Description
Technical Field
The present invention relates to a tool height adjusting device for a pickup tool used when picking up a chip component on a transfer source substrate in a chip component transfer device used when transferring the chip component on the transfer source substrate onto a transfer target substrate.
Background
The miniaturization of semiconductor chips by the progress of microfabrication technology and the miniaturization of LED chips by the improvement of light emission efficiency of LEDs are being advanced. Therefore, a plurality of chip components such as semiconductor chips and LED chips can be densely formed on one wafer substrate.
If a plurality of small chip components are densely formed in this manner, it is extremely inefficient to transfer the chip components one by one to another substrate. Therefore, in order to improve efficiency, various methods have been studied, and one of them is a method of picking up a plurality of chip components at the same time (for example, patent document 1).
Fig. 7 shows an example of picking up a plurality of chip components C densely arranged on the transfer source substrate B0 at the same time and transferring them onto the transfer target substrate B1 with intervals, showing a case of performing transfer using a pickup tool 2 having a plurality of chip holding portions 21 holding the chip components C.
Fig. 7 (a) shows a state where the chip holding portion 21 and the chip component C are aligned, and then the pickup tool 2 is lowered to bring the chip holding portion 21 into contact with the chip component C as shown in fig. 7 (B), and if the pickup tool 2 is raised with the chip holding portion 21 holding the chip component C, a plurality of chip components C can be simultaneously picked up from the transfer source substrate B0 as shown in fig. 7 (C). Then, as shown in fig. 7 (d), in a state where the transfer target substrate B1 is disposed below the pickup tool 2, after the pickup tool 2 is lowered to bring the chip component C into close contact with the transfer target substrate B1 as shown in fig. 7 (e), the chip component C is released from being held by the chip holding portion 21, and the pickup tool 2 is raised as shown in fig. 7 (f), so that the chip component C can be transferred to the transfer target substrate B1.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2015-529400
Patent document 2: japanese laid-open patent publication No. 2008-201883
Disclosure of Invention
Problems to be solved by the invention
When the chip holding portion 21 shown in fig. 7 holds the chip component C, a vacuum suction method is conventionally used. That is, in the chip holding portion 21 shown in the cross-sectional view in fig. 8 (a), the pressure inside the suction holes 2V of the chip holding portion 21 is reduced in a state where the suction holes 2V are in contact, so that the chip holding portion 21 sucks the chip component C, and if the chip holding portion 21 is raised in this state, the chip component C can be peeled from the transfer source substrate B0 and picked up. Here, as the pickup tool 2 and the chip holding portion 21, metal is generally used from the viewpoint of mechanical strength and workability.
As shown in fig. 7, chip components C picked up simultaneously are several tens of μm square and very small. Therefore, due to the pressure when the metal chip holding portion 21 is in contact, there is also a chip component C in which cracks are generated as shown in fig. 8 (b). As shown in fig. 8 (C), the chip component C may be broken during the picking process and may not be held by suction, and even if the chip component C is transferred to the transfer target substrate B1 in a state where a crack is generated, a defect may occur.
Therefore, as a countermeasure against breakage of the chip component C during such picking up, it is conceivable to use the flexible member 21S in the portion of the chip holding portion 21 that contacts the chip component C. Fig. 9 (a) to 9 (C) show a case where the chip component C is picked up by the chip holding portion 21 having the flexible member 21S, and the flexible member 21S is deformed so that a pressure is not applied to the chip component C rapidly.
Further, since it is necessary to perform extremely fine processing and high cost to form the suction holes 2V for sucking the minute chip components C, it is conceivable to hold the chip components C by a method other than vacuum suction. One of them is a method using intermolecular force (van der waals force), and is equivalent to using a so-called gecko tape (patent document 2) or the like (fig. 10). In this case as well, the chip holding portion 21 is a flexible member, unlike metal or the like, in a portion that contacts the chip component C. Accordingly, the gecko tape shown in fig. 10 is also labeled as a flexible member 21S. Fig. 10 (a) to 10 (C) show a case where the chip holding portion 21 picks up the chip component C, the chip holding portion 21 has a flexible member 21S capable of holding the chip component C by intermolecular force, and the flexible member 21S is deformed so as not to apply a rapid pressure to the chip component C, as in fig. 9 (a) to 9 (C).
However, although the chip component C can be prevented from being damaged by using the flexible member for the chip holding portion 21, a problem arises in the adjustment of the height position of the chip holding portion 21. That is, in the chip holding portion 21 using the flexible member 21S, it is necessary to grasp the relative distance from the chip component C in order to reliably hold the chip component C, but it is difficult to adjust the height position of the chip holding portion 21 as a premise in the conventional method. This is because, in the conventional system, the height position of the chip holding portion 21 is grasped by detecting a pressure change when the chip holding portion contacts a known surface, but it is difficult to detect a pressure change when the chip holding portion 21 contacts a surface by using the flexible member 21S.
The present invention has been made in view of the above problems, and provides a tool height adjusting device capable of accurately adjusting the height position of a chip holding portion in a pickup tool using a flexible member having a small pressure change due to contact with the chip holding portion. In addition, a chip component transfer device with the tool height adjusting device is also provided.
Means for solving the problems
In order to solve the above-described problem, the invention according to claim 1 is a tool height adjusting device for adjusting a height position of a chip holding portion of a pickup tool that picks up a chip component by moving the chip holding portion up and down, the tool height adjusting device including: a transparent plate; an imaging unit that obtains an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling vertical driving of the pickup tool, a function of controlling an operation of the imaging unit, and a function of analyzing an image obtained by the imaging unit, wherein the control unit analyzes the image obtained by the imaging unit while approaching the chip holding portion in the direction of the transparent plate, and detects a height position at which the chip holding portion effectively holds the upper surface of the transparent plate.
The invention described in claim 2 is a tool height adjusting device for adjusting a height position of a chip holding portion of a pickup tool for picking up a chip component by moving the chip holding portion up and down, the tool height adjusting device including: a transparent plate; an imaging unit that obtains an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and a control unit having a function of controlling vertical driving of the pickup tool, a function of controlling operation of the imaging unit, and a function of analyzing an image obtained by the imaging unit, wherein the control unit causes the chip holding portion to temporarily come into close contact with the transparent plate, and detects a height position at which the chip holding portion effectively holds the upper surface of the transparent plate by analyzing the image obtained by the imaging unit while driving the pickup tool in a direction in which the chip holding portion is separated from the transparent plate.
The invention described in claim 3 is the tool height adjusting device described in claim 1 or 2, wherein the tool height adjusting device adjusts a height position of a chip holding portion of a pick-up tool provided with a plurality of chip holding portions.
The invention described in claim 4 is the tool height adjusting apparatus described in claim 3, wherein the control unit has functions of: the parallelism of the region formed by the plurality of chip holding portions with respect to the upper surface of the transparent plate is evaluated by analyzing the image acquired by the imaging unit.
The invention described in claim 5 is the tool height adjusting device described in any one of claims 1 to 4, wherein the tool height adjusting device adjusts a height position of a chip holding portion of a pick-up tool using a flexible member in the chip holding portion.
The invention described in claim 6 is a chip component transfer apparatus that picks up a chip component from a transfer source substrate and places the chip component on a transfer target substrate, wherein the chip component transfer apparatus has the tool height adjusting apparatus described in any one of claims 1 to 5 for adjusting a height position of a chip holding portion of a pickup tool that picks up the chip component from the transfer source substrate.
Effects of the invention
In a pickup tool using a flexible member with a small pressure change caused by contact with a chip holding portion, the height position of the chip holding portion can be accurately adjusted, and a chip component to be picked up is not damaged by pressurization.
Drawings
Fig. 1 is a sectional view showing the structure of a tool height adjusting apparatus according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing an operating state of the tool height adjusting device according to the embodiment of the present invention.
Fig. 3 is an example of an image acquired by the imaging unit of the tool height adjusting apparatus according to the embodiment of the present invention, in which fig. 3 (a) is a diagram showing a state in which the chip holding portion is away from the focal point of the imaging unit, fig. 3 (b) is a diagram showing a state in which the chip holding portion is in a stage close to the focal point of the imaging unit, fig. 3 (c) is a diagram showing a state in which the chip holding portion is in contact with a surface provided at the focal point of the imaging unit, and fig. 3 (d) is a diagram showing a state in which the chip holding portion is in close contact with a surface provided at the focal point of the imaging unit.
Fig. 4 is a diagram showing an example of the relationship between the tool height adjusting device according to the embodiment of the present invention and the transfer source stage, the transfer source substrate, the chip component, and the transfer target substrate.
Fig. 5 (a) is a diagram showing a state in which the focus of the image pickup unit is performed in the tool height adjusting device according to the embodiment of the present invention, and fig. 5 (b) is a diagram showing a focus jig used for focusing the image pickup unit.
Fig. 6 is a diagram showing an image obtained by the imaging unit of the tool height adjusting apparatus according to the embodiment of the present invention, and is an example in which the pickup tool is tilted.
Fig. 7 is an example of picking up and transferring a plurality of minute chip components at the same time, where fig. 7 (a) is a diagram showing a state of alignment of a pickup tool with a chip component, fig. 7 (b) is a diagram showing a state of holding a chip component by a pickup tool, fig. 7 (c) is a diagram showing a state of pickup of a chip component by a pickup tool, fig. 7 (d) is a diagram showing a state of alignment of a pickup tool with a transfer target substrate, fig. 7 (e) is a diagram showing a state of arranging a chip component on a transfer target substrate by a pickup tool, and fig. 7 (f) is a diagram showing a state of completion of transfer of a chip component by a pickup tool.
Fig. 8 is a diagram illustrating a problem in picking up a minute chip component by a conventional vacuum suction method, in which fig. 8 (a) is a diagram showing a state in which a chip holding portion is disposed on an upper portion of a chip component, fig. 8 (b) is a diagram showing a state in which the chip holding portion is brought into close contact with the chip component, and fig. 8 (c) is a diagram showing a state in which the chip holding portion sucks the chip component to pick up the chip component.
Fig. 9 is a diagram illustrating an example in which a minute chip component is sucked and held by a chip holding portion using a flexible member and picked up, in which fig. 9 (a) is a diagram showing a state in which the flexible member is in contact with the chip component, fig. 9 (b) is a diagram showing a state in which the flexible member is held in close contact with the chip component, and fig. 9 (c) is a diagram showing a state in which the chip holding portion is raised and the chip component is picked up.
Fig. 10 is a diagram illustrating an example in which a chip component is held and picked up by a holding force of a flexible component, in which fig. 10 (a) is a diagram illustrating a state in which the flexible component is in contact with the chip component, fig. 10 (b) is a diagram illustrating a state in which the flexible component is held in close contact with the chip component, and fig. 10 (c) is a diagram illustrating a state in which a chip holding portion is raised and the chip component is picked up.
Detailed Description
Embodiments of the present invention will be explained. Fig. 1 is a sectional view showing the structure of a tool height adjusting apparatus 1 according to an embodiment of the present invention. The tool height adjusting device 1 adjusts the height position of the chip holding portion 21 of the pickup tool 2, and includes a transparent plate 4, an imaging unit 5, and a control unit 10.
Here, the pickup tool 2 picks up the chip components C from the transfer source substrate B0 held by the transfer source stage 3, and the pickup tool 2 has a plurality of chip holding portions 21 so as to pick up a plurality of chip components C at the same time. The region formed by the plurality of chip holding portions 21 is formed in a flat surface so as to simultaneously hold the plurality of chip components C existing on the same plane. In addition, the flexible member 21S shown in fig. 9 and 10 is used in a portion of the chip holding portion 21 that contacts the chip component C. The chip component C is not particularly limited in material and application as long as it is a microchip smaller than 500 μm square, and is intended for chip components used in LED chips, wireless chips, MEMS chips, and the like.
The transparent plate 4 in the pickup tool 1 is a transparent plate provided to the transfer source stage 3 such that the transparent plate upper surface 41 is parallel to the transfer source stage upper surface 31. The transparent plate 4 is preferably made of a material which is transparent without cloudiness, is not easily deformed, and is not easily damaged, and is preferably made of glass or quartz. The height of transparent plate upper surface 41 with respect to transfer source stage upper surface 31 may be set arbitrarily as long as it can be accurately grasped, but it is preferable that the height be in the range from 0 μm (transparent plate upper surface 41 and transfer source stage upper surface 31 form the same plane) to up to down 1000 μm.
As shown in fig. 1, the imaging unit 5 is disposed below the transparent plate 4 so that the chip holding portion 21 of the pickup tool 2 enters the field of view through the transparent plate 4. In fig. 1, the imaging unit 5 is configured such that the optical axis is bent by the prism 51 and an image is acquired by the imaging device 50, but if a sufficient space can be provided directly below the transparent plate 4, the imaging device 50 may have a field of view directly above without using the prism 51.
The control unit 10 has the following functions: a function of controlling the vertical driving of the picking tool 2 via a driving unit not shown; a function of controlling the operation of the imaging unit 5; and a function of analyzing the image acquired by the imaging unit 5. Here, in the vertical driving of the pickup tool 2, the vertical driving can be controlled while calculating the vertical movement distance using an encoder or the like. In the operation of the imaging unit 5, the timing of acquiring the image can be controlled, and the image can be acquired in conjunction with the vertical driving position of the pickup tool 2. In addition, a general-purpose image analysis software may be used for the image analysis function of the image acquired by the imaging unit 5.
Hereinafter, a process of adjusting the height of the chip holding portion 21 of the pickup tool 2 using the tool height adjusting device 1 will be described.
First, with respect to (the imaging device 50 of) the imaging unit 5, the transparent plate upper surface 41 is brought into focus in advance. At this stage, as shown in fig. 1, the pickup tool 2 is disposed so that the chip holding portion 21 is away from the transparent plate upper surface 41.
From this state, the control unit 10 gradually lowers the pickup tool 2, and stops the stage where the chip holding portion 21 is in close contact with the transparent plate upper surface 41 as shown in fig. 2. Further, even if the chip holding portion 21 uses the flexible member 21S, since a large pressure is applied to the pickup tool 2 when the flexible member 21S is sufficiently pressurized, the close contact between the chip holding portion 21 and the transparent plate upper surface 41 can be detected by pressure detection.
During the period when the picking tool 2 reaches the state of fig. 2 from the state of fig. 1, the control unit 10 takes an image in association with the moving distance of the picking tool 2 by the photographing unit 5. That is, in a state where the chip holding portion 21 is close to the transparent plate upper surface 41, an image is acquired in association with a distance, and an example of the acquired image is shown in fig. 3. In fig. 3, (a) of fig. 3 is a state where the chip holding portion 21 is away from the transparent plate upper surface 41, and since the photographing unit 5 is focused on the transparent plate upper surface 41, an image I21 of the chip holding portion 21 is blurred. Then, as the pickup tool 2 descends, the contrast of the image I21 improves ((b) of fig. 3). Thereafter, the contrast of the image I21 is improved after the chip holding portion 21 comes into contact with the transparent plate upper surface 41 as shown in fig. 3 (c) and until the chip holding portion 21 comes into close contact with and is pressed against the transparent plate upper surface 41 as shown in fig. 3 (d). This is considered to be because the surface of the chip holding portion 21 is not smooth and has minute irregularities, so that light is diffusely reflected between the chip holding portion 21 and the transparent plate 4 to deteriorate the contrast, and by bringing the chip holding portion 21 into close contact with the transparent plate 4, diffuse reflection is suppressed to improve the contrast, thereby obtaining a clear image.
Further, when the chip holding portion 21 picks up the chip component C, it is difficult to hold the chip component C in a state where only the tip of the flexible member 21S reaches the chip component C. On the other hand, if the chip holding portion 21 and the chip component C are brought into close contact with each other until the soft component 21S is compressed excessively, the chip component C may be damaged. Therefore, in order to effectively hold chip component C, flexible component 21S should be in a state of being appropriately compressed and in close contact with transparent plate upper surface 41.
Therefore, in the tool height adjustment of the present invention, the height position at which it is determined that the chip holding portion 21 substantially reaches the transparent plate upper surface 41 (the transparent plate upper surface 41 is effectively held) is detected during a period from a state in which the chip holding portion 21 is in contact with the transparent plate upper surface 41 to a state in which a pressure of a predetermined pressure or more is applied to the transparent plate 4. That is, the control section 10 analyzes the image acquired by the imaging section 5, and determines that the chip holding portion 21 has substantially reached the transparent plate upper surface 41 in the period from fig. 3 (c) to fig. 3 (d) with respect to the image I21. Specifically, the control unit 10 analyzes an evaluation item such as contrast of an image obtained in association with a distance by which the pickup tool 2 is lowered, and determines that the chip holding portion 21 has substantially reached the transparent plate upper surface 41 when the evaluation item reaches a certain criterion.
Through the above steps, the reference position of the height in the moving distance of the pickup tool 2 can be set. For example, as shown in fig. 4, if the height h0 of the transparent plate upper surface 41 with respect to the transfer source stage upper surface 31 is measured by the laser sensor 7 or the like, the height position at which the chip holding portion 21 substantially reaches the transfer source stage upper surface 31 can be set. Further, if the height h1 of the transfer source substrate B0 with respect to the upper surface of the transfer source stage and the height h2 of the chip component C on the transfer source substrate B0 are measured, the height position at which the chip holding portion 21 effectively holds the chip component C can be set.
In addition, if the height of the transfer target substrate B1 with respect to the transparent plate upper surface 41 is also measured in the same manner, the chip holding portion 21 when the chip component C is transferred to the transfer target substrate B1 can also be set to an appropriate height by taking into account the height h2 of the chip component.
In the above description, the embodiment in which the height position at which the chip holding portion 21 substantially reaches the transparent plate upper surface 41 is detected while the chip holding portion 21 is brought close to the transparent plate upper surface 41 has been described, but the height position at which the chip holding portion 21 substantially separates from the transparent plate upper surface 41 (the holding of the transparent plate upper surface 41 is released) can also be detected in the direction in which the chip holding portion 21 separates from the transparent plate upper surface 41. That is, after the chip holding portion 21 is brought into a close contact state in which the pressure applied to the transparent plate 41 reaches a predetermined value, the pickup tool 2 may be driven to separate the chip holding portion 21 from the transparent plate upper surface 41, and the image may be acquired by the imaging unit 5 in association with the movement distance. This method reveals the height position at which the chip holding portion 21 is substantially separated from the transparent plate upper surface 41, and also reveals that if the chip holding portion 21 and the transparent plate upper surface 41 are close to each other from the height position, effective holding can be performed.
In addition, when focusing the photographing unit 5 on the transparent plate upper surface 41, as shown in fig. 5 (a), a focusing jig 6 marked with a mark 6M for focusing may be used. Here, as shown in fig. 5 (b), if a plurality of marks 6M are arranged on the focusing jig 6 and alignment is performed in a state where the plurality of marks 6M are within the field of view of the imaging unit 5, optical axis alignment can be performed perpendicular to the transparent plate upper surface 41.
By aligning the optical axis of the photographing unit 5 perpendicularly to the transparent plate upper surface 41, it is also possible to evaluate the parallelism of the region formed by the plurality of chip holding portions 21 and the transparent plate upper surface 41. That is, in the case where the region formed by the plurality of chip holding portions 21 is inclined with respect to the transparent plate upper surface 41, a difference occurs in the contrast of the image I21 of the plurality of chip holding portions 21 in the visual field. Fig. 6 shows this case, and it is understood that there is a difference in the distance between the chip holding portion 21A corresponding to the image 21A and the chip holding portion 21B corresponding to the image 21B and the transparent plate upper surface 41. Further, since the distance between the chip holding portion 21B and the transparent plate upper surface 41 is larger than that of the chip holding portion 21A, it is also known that adjustment of the tilt of the pickup tool 2 or the like can be performed with reference to the image.
In the present embodiment, the flexible member 21S is used for the chip holding portion 21, but the present invention is not limited to this, and the present invention can be applied to a chip holding portion 21 that does not use the flexible member 21S. That is, if the surface for holding the chip component C without using the flexible member 21S is flat, the evaluation items (such as contrast) of the image acquired by the imaging unit 5 reach the determination criterion immediately after the chip holding portion 21 comes into contact with the transparent plate upper surface 41, and therefore, the evaluation items can be used for tool height adjustment.
As described above, by using the tool height adjusting apparatus of the present invention in a chip component transfer apparatus that picks up a chip component from a transfer source substrate held on a transfer source stage 3 shown in fig. 4 and transfers the chip component onto a transfer target substrate, even if the chip component is minute, the transfer can be performed accurately without causing damage.
Description of the reference symbols
1: a tool height adjustment device; 2: a picking tool; 3: a transfer source stage; 4: a transparent plate; 5: a shooting unit; 6: a focusing jig; 7: a laser length measuring device; 10: a control unit; 21: a chip holding section; 21S: a soft member; 31: the upper surface of the transfer printing source carrying platform; 41: an upper surface of the transparent plate; 50: a photographing device; 51: a prism; 61: the lower surface of the focusing jig; b0: a transfer source substrate; b1: transferring a target substrate; c: a chip component; i21: chip holder image.
Claims (6)
1. A tool height adjusting device for adjusting the height position of a chip holding part of a pick-up tool for picking up a chip component by moving the chip holding part up and down,
the tool height adjusting device comprises:
a transparent plate;
an imaging unit that obtains an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and
a control unit having a function of controlling vertical driving of the pickup tool, a function of controlling an operation of the imaging unit, and a function of analyzing an image acquired by the imaging unit,
the control unit analyzes the image obtained by the imaging unit while bringing the chip holding portion close to the transparent plate, and detects a height position at which the chip holding portion effectively holds the upper surface of the transparent plate.
2. A tool height adjusting device for adjusting the height position of a chip holding part of a pick-up tool for picking up a chip component by moving the chip holding part up and down,
the tool height adjusting device comprises:
a transparent plate;
an imaging unit that obtains an image by focusing on an upper surface of the transparent plate from a lower side of the transparent plate; and
A control unit having a function of controlling vertical driving of the pickup tool, a function of controlling an operation of the imaging unit, and a function of analyzing an image acquired by the imaging unit,
the control unit detects a height position at which the chip holding portion effectively holds the upper surface of the transparent plate by analyzing the image obtained by the imaging unit while driving a pickup tool in a direction in which the chip holding portion is separated from the transparent plate while temporarily bringing the chip holding portion into close contact with the transparent plate.
3. The tool height adjusting apparatus according to claim 1 or 2,
the tool height adjusting device adjusts the height position of a chip holding part of a picking tool provided with a plurality of chip holding parts.
4. The tool height adjustment apparatus according to claim 3,
the control unit has the following functions: the parallelism of the region formed by the plurality of chip holding portions with respect to the upper surface of the transparent plate is evaluated by analyzing the image acquired by the imaging unit.
5. The tool height adjusting apparatus according to any one of claims 1 to 4,
The tool height adjusting device adjusts the height position of the chip holding part of the picking tool using the soft component in the chip holding part.
6. A chip component transfer apparatus that picks up a chip component from a transfer source substrate and places the chip component on a transfer target substrate, wherein,
the chip component transfer apparatus has a tool height adjusting apparatus according to any one of claims 1 to 5 for adjusting a height position of a chip holding portion of a pickup tool for picking up a chip component from a transfer source substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018061143A JP6752250B2 (en) | 2018-03-28 | 2018-03-28 | Tool height adjustment device and chip component transfer device equipped with this |
| JP2018-061143 | 2018-03-28 | ||
| PCT/JP2019/011063 WO2019188470A1 (en) | 2018-03-28 | 2019-03-18 | Tool height adjustment device and chip component transfer device equipped with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111868901A true CN111868901A (en) | 2020-10-30 |
| CN111868901B CN111868901B (en) | 2024-06-21 |
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ID=
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| CH707308A1 (en) * | 2012-12-05 | 2014-06-13 | Esec Ag | Method for determining height of adhesive dispensing nozzle over reference surface, involves checking image of plate until image dark area meets preset criterion, and setting detected corresponding height of nozzle as reference height |
| WO2015083221A1 (en) * | 2013-12-02 | 2015-06-11 | 富士機械製造株式会社 | Die supply device adjustment system and adjustment jig |
| JP2018041912A (en) * | 2016-09-09 | 2018-03-15 | ヤマハ発動機株式会社 | Substrate work device |
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| JPH1163932A (en) * | 1997-08-25 | 1999-03-05 | Matsushita Electric Ind Co Ltd | Wire height inspection in wire bonding |
| JP2000283751A (en) * | 1999-03-30 | 2000-10-13 | Matsushita Electric Ind Co Ltd | Location measuring device |
| JP2012004143A (en) * | 2010-06-14 | 2012-01-05 | Panasonic Corp | Mounting device and mounting method for electronic component |
| CH707308A1 (en) * | 2012-12-05 | 2014-06-13 | Esec Ag | Method for determining height of adhesive dispensing nozzle over reference surface, involves checking image of plate until image dark area meets preset criterion, and setting detected corresponding height of nozzle as reference height |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20200136906A (en) | 2020-12-08 |
| WO2019188470A1 (en) | 2019-10-03 |
| KR102633517B1 (en) | 2024-02-06 |
| JP6752250B2 (en) | 2020-09-09 |
| JP2019175961A (en) | 2019-10-10 |
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