CN111856771B - Integrated optical device, integrated projection module and manufacturing process of integrated optical device - Google Patents
Integrated optical device, integrated projection module and manufacturing process of integrated optical device Download PDFInfo
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- CN111856771B CN111856771B CN202010880014.2A CN202010880014A CN111856771B CN 111856771 B CN111856771 B CN 111856771B CN 202010880014 A CN202010880014 A CN 202010880014A CN 111856771 B CN111856771 B CN 111856771B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000010410 layer Substances 0.000 claims abstract description 104
- 239000012790 adhesive layer Substances 0.000 claims abstract description 80
- 239000011241 protective layer Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims description 62
- 230000008569 process Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- -1 polyethylene terephthalate Polymers 0.000 claims description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004049 embossing Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 210000000438 stratum basale Anatomy 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0961—Lens arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18302—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] comprising an integrated optical modulator
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
The invention provides an integrated optical device, an integrated projection module and a manufacturing process of the integrated optical device. The integrated optical device comprises a protective layer, a first adhesive layer, a second adhesive layer and a fixed layer which are sequentially overlapped, and further comprises: a diffraction structure; a light homogenizing structure; the diffraction structure is arranged on the first adhesive layer, the light homogenizing structure is arranged on the second adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped; or the diffraction structure is arranged on the second adhesive layer, the light homogenizing structure is arranged on the first adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped. The method solves the problem that in the prior art, the switching of the structured light projection mode and the flight time projection mode of different application scenes is difficult.
Description
Technical Field
The invention relates to the technical field of optical imaging equipment, in particular to an integrated optical device, an integrated projection module and a manufacturing process of the integrated optical device.
Background
With the rapid development of the optical industry, the 3D sensing system has become more and more powerful, and has become an industry trend for several years in the future. The structured light projection module is used for projecting the structured pattern outwards, and is an important component of the 3D sensing system. The module mainly comprises a vertical cavity surface emitting laser and a projection end lens, wherein the lens comprises a collimating mirror and a diffraction optical component. The laser beam passes through the collimating lens to form uniform and parallel light beams, and is modulated by the diffraction optical component to form scattered spot clouds which are projected on the measured object; unlike structured light projection modules, time-of-flight projection modules are mainly used to project a uniform light field outwards, and are also a major component of emerging 3D sensing schemes. The component mainly comprises a vertical cavity surface emitting laser and a light homogenizing sheet. The laser emitted by the vertical cavity surface emitting laser is modulated by the light homogenizing sheet to form a uniform light field, and the uniform light field is projected onto an object. The structured light scheme and the flight time scheme have respective advantages and disadvantages, different scenes are applied differently, and the mutual switching of the two projection modes is difficult to realize according to different application scenes.
That is, the prior art has a problem that the structured light projection mode and the time-of-flight projection mode are difficult to switch under different application scenes.
Disclosure of Invention
The invention mainly aims to provide an integrated optical device, an integrated projection module and a manufacturing process of the integrated optical device, so as to solve the problem that in the prior art, the switching of the structured light projection mode and the flight time projection mode of different application scenes is difficult.
In order to achieve the above object, according to one aspect of the present invention, there is provided an integrated optical device including a protective layer, a first adhesive layer, a second adhesive layer, and a fixing layer stacked in this order, further comprising: a diffraction structure; a light homogenizing structure; the diffraction structure is arranged on the first adhesive layer, the light homogenizing structure is arranged on the second adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped; or the diffraction structure is arranged on the second adhesive layer, the light homogenizing structure is arranged on the first adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped.
Further, the fixing layer includes: connecting the adhesive layer; the second adhesive layer is connected with the basal layer through the connecting adhesive layer.
Further, the material of the protective layer comprises one of polyethylene terephthalate or glass; and/or the material of the base layer comprises one of polyethylene terephthalate or glass.
Further, the refractive index n1 of the first adhesive layer is larger than the refractive index n2 of the second adhesive layer; and/or the refractive index n2 of the second glue layer is smaller than the refractive index n3 of the third glue layer.
Further, the thickness of the first adhesive layer is more than or equal to 1 micron and less than or equal to 10 microns; and/or the thickness of the second adhesive layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers; and/or the thickness of the connecting adhesive layer is more than or equal to 10 micrometers and less than or equal to 100 micrometers.
Further, the diffraction structure is a diffraction grating, and the line width of the diffraction grating is more than or equal to 100 nanometers and less than or equal to 500 nanometers; and/or the depth of the diffraction grating is greater than or equal to 500 nanometers and less than or equal to 1500 nanometers.
Further, the light homogenizing structure is arranged on the second adhesive layer and comprises a plurality of micro lenses, the micro lenses are arranged on one side, close to the fixed layer, of the second adhesive layer, the micro lenses are connected with the fixed layer, and the height of the micro lenses is more than or equal to 3 microns and less than or equal to 50 microns; and/or the diameter of the micro lens is more than or equal to 3 microns and less than or equal to 50 microns.
According to another aspect of the present invention, there is provided an integrated projection module comprising: the integrated optical device described above; the laser structure is arranged on one side of the fixed layer of the integrated optical device, which is far away from the protective layer of the integrated optical device; the lens is arranged between the integrated optical device and the laser structure, and the projection of the diffraction structure of the lens and the integrated optical device to the laser structure is at least partially overlapped; the integrated projection module is used for measuring the distance L between the integrated projection module and the object and feeding the distance L back to the laser structure, and the laser structure emits laser to the dodging structure or the diffraction structure of the integrated optical device according to the size of the distance L.
Further, the laser structure includes: the first vertical cavity surface emitting laser is at least partially overlapped with the projection of the diffraction structure to the laser structure; the second vertical cavity surface emitting laser is at least partially overlapped with the projection of the dodging structure to the laser structure; and when the distance L is smaller than the preset distance L0, the first vertical cavity surface emitting laser emits laser to the diffraction structure.
Further, the laser structure includes: a laser; the moving device is arranged on the laser, the position of the moving device is changed according to the distance L, when the distance L is larger than the preset distance L0, the moving device sends the laser to the lower side of the dodging structure, and when the distance L is smaller than the preset distance L0, the moving device sends the laser to the lower side of the diffraction structure.
Further, the projection structure includes: the transmitting end lens is used for transmitting light to an object; the receiving end lens is used for receiving light reflected by the object; the integrated projection module further comprises a calculation module, the calculation module is electrically connected with the transmitting end lens and the receiving end lens, and the calculation module is used for calculating the distance L according to the transmitting light time of the transmitting end lens and the receiving light time of the receiving end lens.
According to still another aspect of the present invention, there is provided a process for manufacturing an integrated optical device, the integrated optical device being manufactured by the process for manufacturing an integrated optical device, comprising: coating glue on the diffraction structure mother plate to form a first glue layer; arranging a protective layer on the diffraction structure mother plate coated with the glue; reversely imprinting the diffraction structure mother plate, and separating the first adhesive layer and the protective layer from the diffraction structure mother plate to obtain a diffraction structure soft film sub-plate; and the light homogenizing structure is connected to the fixed layer, glue is coated on the light homogenizing structure to form a second glue layer, and the soft film sub-board of the diffraction structure is connected to one side of the second glue layer far away from the fixed layer and subjected to imprinting exposure to form the integrated optical device.
By applying the technical scheme of the invention, the integrated optical device comprises a protective layer, a first adhesive layer, a second adhesive layer, a fixed layer, a diffraction structure and a light homogenizing structure which are sequentially overlapped; the diffraction structure is arranged on the first adhesive layer, the light homogenizing structure is arranged on the second adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped; or the diffraction structure is arranged on the second adhesive layer, the light homogenizing structure is arranged on the first adhesive layer, and the projections of the diffraction structure and the light homogenizing structure to the fixed layer are not overlapped.
By arranging the diffraction structure on the first adhesive layer and the light homogenizing structure on the second adhesive layer, the integrated optical device has both diffraction function and light homogenizing function. Therefore, one integrated optical device can perform structured light projection and flight time projection, effectively reduces the volumes of the two devices, and enables the devices to meet the requirement of miniaturization. The projection of the diffraction structure and the light homogenizing structure to the fixed layer is not coincident, so that the diffraction structure and the light homogenizing structure are arranged separately, the diffraction structure and the light homogenizing structure can be used independently, and interference between the diffraction structure and the light homogenizing structure is avoided. Meanwhile, the switching between the structured light projection and the flight time projection can be more convenient. Of course, the diffraction structure can also be arranged on the second adhesive layer, and the light homogenizing structure is arranged on the first adhesive layer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
FIG. 1 shows a schematic diagram of the structure of an integrated optical device of the present invention;
FIG. 2 shows a schematic diagram of the structure of the integrated projection module of the present invention;
FIG. 3 shows a schematic diagram of the structure of a diffraction structure master of the fabrication process of the integrated optical device of the present invention;
FIG. 4 shows a schematic diagram of a diffraction structure master batch of the fabrication process of the integrated optical element of the present invention;
FIG. 5 shows a schematic illustration of the back-embossing of the fabrication process of the integrated optical element of the present invention;
FIG. 6 shows a schematic diagram of a diffraction structure soft film sub-plate of the fabrication process of the integrated optical element of the present invention;
FIG. 7 is a schematic diagram of the structure of a light homogenizing structure of the manufacturing process of the integrated optical element of the present invention;
FIG. 8 is a schematic diagram of a light homogenizing structure for the fabrication process of the integrated optical element of the present invention;
FIG. 9 is a schematic diagram showing the combination of a light homogenizing structure and a soft film sub-plate of a diffraction structure of a glue for the fabrication process of an integrated optical element according to the present invention;
fig. 10 shows a schematic diagram of an imprint exposure of a fabrication process of an integrated optical element of the present invention.
Wherein the above figures include the following reference numerals:
10. a protective layer; 20. a first adhesive layer; 21. a diffraction structure; 30. a second adhesive layer; 31. a light homogenizing structure; 311. a microlens; 40. a fixed layer; 41. connecting the adhesive layer; 42. a base layer; 50. an integrated optical device; 60. a lens; 70. a laser structure; 71. a first vertical cavity surface emitting laser; 72. a second vertical cavity surface emitting laser; 80. a projection structure; 81. a transmitting end lens; 82. a receiving end lens; 90. an object; 211. a diffraction structure master; 212. diffraction structure soft film sub-plate.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
It is noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless otherwise indicated.
In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.
In order to solve the problem that in the prior art, the switching of the structured light projection mode and the flight time projection mode of different application scenes is difficult, the invention provides an integrated device, a projection module and a manufacturing process.
As shown in fig. 1, the integrated optical device includes a protective layer 10, a first adhesive layer 20, a second adhesive layer 30, and a fixing layer 40, which are sequentially stacked, and further includes a diffraction structure 21 and a light homogenizing structure 31; wherein, the diffraction structure 21 is disposed on the first adhesive layer 20, the light homogenizing structure 31 is disposed on the second adhesive layer 30, and the projections of the diffraction structure 21 and the light homogenizing structure 31 to the fixed layer 40 are not overlapped; or the diffraction structure 21 is arranged on the second glue layer 30, the dodging structure 31 is arranged on the first glue layer 20, and the projections of the diffraction structure 21 and the dodging structure 31 to the fixed layer 40 are not overlapped.
By providing the diffraction structure 21 on the first glue layer 20 and the light homogenizing structure 31 on the second glue layer 30, one integrated optical device has both a diffraction function and a light homogenizing function. Therefore, one integrated optical device can perform structured light projection and flight time projection, effectively reduces the volumes of the two devices, and enables the devices to meet the requirement of miniaturization. The projections of the diffraction structure 21 and the dodging structure 31 to the fixed layer 40 are not coincident, so that the diffraction structure 21 and the dodging structure 31 are separately arranged, the diffraction structure 21 and the dodging structure 31 can be used independently, and interference between the diffraction structure 21 and the dodging structure 31 is avoided. Meanwhile, the switching between the structured light projection and the flight time projection can be more convenient. Of course, the diffraction structure 21 may also be disposed on the second adhesive layer 30, and the light homogenizing structure 31 is disposed on the first adhesive layer 20.
Specifically, the fixing layer 40 includes a connection adhesive layer 41 and a substrate layer 42, and the second adhesive layer 30 is connected to the substrate layer 42 through the connection adhesive layer 41. Through setting up and connecting glue film 41 for the second glue film 30 is more firm with the connection of stratum basale 42, increases overall structure intensity, plays simultaneously and accepts the effect of device, makes the device more stable in the use, reduces the risk that second glue film 30 breaks away from with stratum basale 42.
Specifically, the material of the protective layer 10 includes one of polyethylene terephthalate or glass. Through the material of the protective layer 10 is polyethylene terephthalate or glass, the polyethylene terephthalate or glass can play a role in bearing and protecting the device, so that the device is firmer, the abrasion to the first adhesive layer 20 can be effectively reduced, the service life of the device is effectively prolonged, meanwhile, the packaging procedure is reduced, and the processing time is saved. Of course, the protection layer 10 may be made of other materials with bearing and protecting functions.
Specifically, the material of the base layer 42 includes one of polyethylene terephthalate or glass. By using polyethylene terephthalate or glass as the material of the base layer 42, the base layer 42 can function as a carrier, so that the device can be effectively fixed, and the device is more stable in use. Of course, the base layer 42 may be formed of other materials having a carrier.
Specifically, the refractive index n1 of the first glue layer 20 is greater than the refractive index n2 of the second glue layer 30. By controlling the difference between the refractive index n1 of the first glue layer 20 and the refractive index n2 of the second glue layer 30, it can be ensured that all effective light rays are injected into the diffraction structure 21, so that the diffraction structure 21 has good diffraction performance, and thus the integrated optical device 50 can be ensured to have good structural light projection performance.
Specifically, the refractive index n2 of the second glue layer 30 is smaller than the refractive index n3 of the connection glue layer 41. By controlling the difference between the refractive index n2 of the second glue layer 30 and the refractive index n3 of the connection glue layer 41, it can be ensured that the effective light is totally injected into the light homogenizing structure 31, so that the light homogenizing structure 31 has good light homogenizing performance, and thus the integrated optical device 50 can be ensured to have good time-of-flight projection performance.
Specifically, the thickness of the first adhesive layer 20 is 1 micron or more and 10 microns or less. If the thickness of the first adhesive layer 20 is less than 1 micron, the diffraction structure 21 is not easy to be assembled in the first adhesive layer 20, and meanwhile, the function of connecting the protective layer 10 and the second adhesive layer 30 cannot be achieved, if the thickness of the first adhesive layer 20 is greater than 10 microns, the thickness of the first adhesive layer 20 is increased, the first adhesive layer 20 is easy to influence the transmission of light, and meanwhile, the requirement of miniaturization cannot be met. Limiting the thickness of the first glue layer 20 to a range of 1 to 10 microns ensures that the diffraction structure 21 can be stably assembled into the first glue layer 20 while serving to connect the protective layer 10 with the second glue layer 30.
Specifically, the thickness of the second adhesive layer 30 is 10 micrometers or more and 100 micrometers or less. If the thickness of the second glue layer 30 is smaller than 10 micrometers, the light homogenizing structure 31 is not easy to be assembled in the second glue layer 30, and meanwhile, the effect of connecting the first glue layer 20 with the connecting glue layer 41 cannot be achieved, and if the thickness of the second glue layer 30 is larger than 100 micrometers, the thickness of the second glue layer 30 is increased, the second glue layer 30 is easy to influence the light transmission, and meanwhile, the requirement of miniaturization cannot be met. Limiting the thickness of the second glue layer 30 to a range of 10 micrometers to 100 micrometers ensures that the light homogenizing structure 31 can be stably assembled into the second glue layer 30 and simultaneously plays a role of connecting the first glue layer 20 with the connecting glue layer 41.
Specifically, the thickness of the joint compound layer 41 is 10 micrometers or more and 100 micrometers or less. If the thickness of the connection adhesive layer 41 is less than 10 micrometers, the function of connecting the second adhesive layer 30 with the substrate layer 42 cannot be achieved, and if the thickness of the connection adhesive layer 41 is greater than 100 micrometers, the thickness of the connection adhesive layer is increased, so that the connection adhesive layer 41 is easy to influence the transmission of light rays, and meanwhile, the requirement of miniaturization cannot be met. Limiting the thickness of the connection glue layer 41 to a range of 10 micrometers to 100 micrometers can effectively ensure the transmission of light in the connection glue layer 41 and simultaneously play a role in connecting the second glue layer 30 with the substrate layer 42.
Specifically, the diffraction structure 21 is a diffraction grating, and the line width of the diffraction grating is 100 nm or more and 500 nm or less. If the line width of the diffraction grating is smaller than 100 nanometers, the brightness of the diffraction result is not obvious and is not easy to observe, and if the line width of the diffraction grating is larger than 500 nanometers, the brightness distribution of the diffraction result is uneven. The line width of the diffraction grating is limited to be in the range of 100 nanometers and 500 nanometers, so that a diffraction result with obvious brightness and uniform distribution can be obtained, and the performance of the diffraction structure 21 is ensured.
Specifically, the depth of the diffraction grating is 500 nm or more and 1500 nm or less. If the depth of the diffraction grating is less than 500 nm, the diffraction grating is not suitable for processing, and processing cost is increased, and if the depth of the diffraction grating is greater than 1500 nm, the assemblability of the diffraction structure 21 and the first adhesive layer 20 is affected. Limiting the depth of the diffraction grating to a range of 500 nm and 1500 nm allows the diffraction structure 21 to be stably assembled in the first adhesive layer 20 while reducing the processing difficulty.
It should be noted that the diffraction grating is uniformly distributed on the first adhesive layer 20.
Specifically, the light homogenizing structure 31 is disposed on the second adhesive layer 30, the light homogenizing structure 31 includes a plurality of microlenses 311, the plurality of microlenses 311 are disposed on a side of the second adhesive layer 30 near the fixing layer 40, and the microlenses 311 are connected to the fixing layer 40. By connecting the micro lenses 311 with the fixing layer 40, the fixing layer 40 plays a role in bearing and protecting the micro lenses 311, and structural stability is improved.
It should be noted that the plurality of microlenses 311 are uniformly and continuously distributed on the second adhesive layer 30.
Specifically, the height of the microlenses 311 is 3 micrometers or more and 50 micrometers or less. If the height of the micro lens 311 is less than 3 micrometers, the processing difficulty of the micro lens is increased, and if the height of the micro lens 311 is greater than 50 micrometers, the assembling difficulty of the micro lens 311 and the second adhesive layer 30 is increased. Limiting the height of the micro lens 311 to be within the range of 3 micrometers and 50 micrometers can ensure the stability of the micro lens 311 on the second adhesive layer 30, reduce the processing difficulty, and further improve the performance stability of the micro lens 311.
The height of the microlens 311 refers to the farthest distance between the microlens 311 and the fixing layer 40.
Specifically, the diameter of the microlens 311 is 3 micrometers or more and 50 micrometers or less. If the diameter of the micro lens 311 is smaller than 3 micrometers, the processing difficulty of the micro lens is increased, and if the diameter of the micro lens 311 is larger than 50 micrometers, the assembling difficulty of the micro lens 311 and the second adhesive layer 30 is increased, and meanwhile, the light homogenizing effect of the light homogenizing structure 31 is poor. Limiting the diameter of the micro lens 311 to be within the range of 3 micrometers and 50 micrometers can ensure the stability of the micro lens 311 on the second adhesive layer 30, reduce the processing difficulty, and further improve the performance stability of the micro lens 311 to ensure the light homogenizing effect of the light homogenizing structure 31.
As shown in fig. 2, the integrated projection module includes the integrated optical device 50, the laser structure 70, the lens 60 and the projection structure 80, where the laser structure 70 is disposed on a side of the fixing layer 40 of the integrated optical device 50 away from the protective layer 10; the lens 60 is arranged between the integrating optic 50 and the laser structure 70, and the lens 60 at least partially coincides with the projection of the diffractive structure 21 of the integrating optic 50 onto the laser structure 70; the projection structure 80 is electrically connected with the laser structure 70, the projection structure 80 is used for emitting light from the object 90 and receiving reflected light from the object 90, the integrated projection module measures a distance L between the integrated projection module and the object 90, and feeds back the distance L to the laser structure 70, and the laser structure 70 emits laser to the dodging structure 31 or the diffraction structure 21 of the integrated optical device 50 according to the size of the distance L.
By arranging the integrated optical device 50 in the integrated projection module, the structure light projection mode and the flight time projection mode can be mutually switched, so that the integrated projection module is more convenient to use, and the miniaturization of the integrated projection module can be ensured. By arranging the lens 60 between the integrating optic 50 and the laser structure 70 with the lens 60 at least partially coinciding with the projection of the diffractive structure 21 of the integrating optic 50 onto the laser structure 70, the laser light emitted by the laser structure 70 can reach the diffractive structure 21 of the integrating optic 50 through the lens 60, whereby an image can be formed through the diffractive structure 21 to achieve a structured light projection pattern. The projection structure 80 is electrically connected with the laser structure 70, so that the projection structure 80 can emit light to the object 90 and receive reflected light of the object 90, the integrated projection module can measure the distance L according to the time difference between the light emitted by the projection structure 80 and the light received by the object 90, and the distance L is fed back to the laser structure 70, so that the laser structure 70 emits laser to the dodging structure 31 or the diffraction structure 21 of the integrated optical device 50 according to the distance L, and further the mutual switching between the structural light projection mode and the flight time projection mode is realized.
Preferably, the lens 60 is fully coincident with the projection of the diffractive structure 21 of the integrated optic 50 onto the laser structure 70. Of course, it is also possible that the lens 60 is located in the projection of the diffractive structure 21 of the integrated optics 50 into the laser structure 70.
Specifically, the laser structure 70 includes a first vcl 71 and a second vcl 72, where the first vcl 71 is at least partially coincident with the projection of the diffraction structure 21 onto the laser structure 70; the second VCSEL 72 at least partially coincides with the projection of the light homogenizing structure 31 onto the laser structure 70; wherein, when the distance L is greater than the preset distance L0, the second vcsels 72 emit laser light to the light-homogenizing structure 31, and when the distance L is less than the preset distance L0, the first vcsels 71 emit laser light to the diffraction structure 21. By providing the first vcsels 71 to at least partially coincide with the projection of the diffraction structures 21 onto the laser structures 70, the laser light emitted by the first vcsels 71 is made to impinge on the diffraction structures 21, thereby constituting the structured light projection module. By arranging the second vcsels 72 to at least partially coincide with the projection of the dodging structure 31 onto the laser structure 70, the laser light emitted by the second vcsels 72 is irradiated onto the dodging structure 31, thereby forming a time-of-flight projection module. When the distance L is greater than the preset distance L0, the second vcsels 72 emit laser light to the dodging structure 31, which is a time-of-flight projection module. When the distance L is smaller than the preset distance L0, the first vcsels 71 emit laser light to the diffraction structure 21, which is a structured light projection module. Through judging the size relation of distance L and preset distance L0, realize the mutual switching between flight time projection module and the structure light projection module for integrated projection module uses more extensively, and the practicality is stronger.
In the present embodiment, the switching between the time-of-flight projection module and the structured light projection module is achieved by controlling the operation of the first vcsels 71 and 72.
Specifically, the projection structure 80 includes an emission end lens 81 and a receiving end lens 82, and the emission end lens 81 is used for emitting light to the object 90; the receiving lens 82 is used for receiving light reflected by the object 90; the integrated projection module further includes a calculation module electrically connected to the transmitting lens 81 and the receiving lens 82, where the calculation module is configured to calculate the distance L according to the light emission time of the transmitting lens 81 and the light receiving time of the receiving lens 82. Meanwhile, after knowing the distance L, the calculating module determines the relationship between the distance L and the preset distance L0 to control the operation of the first vcsels 71 and 72.
As shown in fig. 3 to 10, the fabrication process of the integrated optical device includes the above-mentioned integrated optical device 50 being fabricated by the fabrication process of the integrated optical device 50, the fabrication process of the integrated optical device 50 including the steps of: coating glue on the diffraction structure master 211 to form a first glue layer 20; providing a protective layer 10 on the master 211 of the diffraction structure coated with glue; reversely imprinting the diffraction structure mother plate 211, and separating the first adhesive layer 20 and the protective layer 10 from the diffraction structure mother plate 211 to obtain a diffraction structure soft film sub-plate 212; the light homogenizing structure 31 is connected to the fixing layer 40; coating glue on the light homogenizing structure 31 to form a second glue layer 30; the diffraction structured soft film sub-plate 212 is attached to the side of the second glue layer 30 remote from the fixing layer 40 and is stamp-exposed to form the integrated optical device 50. The integrated optical device 50 having the function of switching between the time-of-flight projection module and the structured light projection module is fabricated using the fabrication process of the integrated optical device.
Example two
The difference from the first embodiment is the specific structure of the laser structure 70.
In this embodiment, the laser structure 70 includes a laser and a moving device, the laser is disposed on the moving device, the moving device changes the position of the moving device according to a distance L, when the distance L is greater than a preset distance L0, the moving device sends the laser to the lower side of the dodging structure 31, and when the distance L is less than the preset distance L0, the moving device sends the laser to the lower side of the diffraction structure 21. The laser is arranged on the mobile device, so that the mobile device can change the position of the mobile device according to the distance L, the mutual switching between the structured light projection mode and the flight time projection mode is realized, only one laser is adopted, and the cost is reduced. In the present embodiment, the switching between the time-of-flight projection module and the structured light projection module is adjusted by changing the position of the moving device.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. An integrated optical device comprising a protective layer (10), a first glue layer (20), a second glue layer (30) and a fixing layer (40) stacked in sequence, the integrated optical device further comprising:
a diffraction structure (21);
a light homogenizing structure (31);
the diffraction structure (21) is arranged on the first adhesive layer (20), the light homogenizing structure (31) is arranged on the second adhesive layer (30), and the projections of the diffraction structure (21) and the light homogenizing structure (31) to the fixed layer (40) are not overlapped; or the diffraction structure (21) is arranged on the second adhesive layer (30), the light homogenizing structure (31) is arranged on the first adhesive layer (20), and the projections of the diffraction structure (21) and the light homogenizing structure (31) to the fixed layer (40) are not overlapped;
the diffractive structure (21) is a diffraction grating,
the line width of the diffraction grating is more than or equal to 100 nanometers and less than or equal to 500 nanometers;
the depth of the diffraction grating is more than or equal to 500 nanometers and less than or equal to 1500 nanometers;
the light homogenizing structure (31) comprises a plurality of micro lenses (311), wherein the height of each micro lens (311) is more than or equal to 3 microns and less than or equal to 50 microns, and the diameter of each micro lens (311) is more than or equal to 3 microns and less than or equal to 50 microns.
2. The integrated optical device according to claim 1, wherein the fixed layer (40) comprises:
a connection glue layer (41);
-a substrate layer (42), said second glue layer (30) being connected to said substrate layer (42) by means of said connection glue layer (41).
3. The integrated optical device of claim 2, wherein the integrated optical device comprises,
the material of the protective layer (10) comprises one of polyethylene terephthalate or glass; and/or
The material of the substrate layer (42) comprises one of polyethylene terephthalate or glass; and/or
The refractive index n1 of the first glue layer (20) is larger than the refractive index n2 of the second glue layer (30); and/or
The refractive index n2 of the second adhesive layer (30) is smaller than the refractive index n3 of the connecting adhesive layer (41); and/or
The thickness of the first adhesive layer (20) is more than or equal to 1 micron and less than or equal to 10 microns; and/or
The thickness of the second adhesive layer (30) is more than or equal to 10 micrometers and less than or equal to 100 micrometers; and/or
The thickness of the connection adhesive layer (41) is more than or equal to 10 micrometers and less than or equal to 100 micrometers.
4. -integrated optical device according to any of claims 1 to 3, characterized in that the light homogenizing structure (31) is arranged on the second glue layer (30), that a plurality of the micro-lenses (311) are arranged on the side of the second glue layer (30) close to the fixing layer (40), and that the micro-lenses (311) are connected with the fixing layer (40).
5. An integrated projection module, comprising:
the integrated optical device (50) of any one of claims 1 to 4;
-a laser structure (70), the laser structure (70) being arranged on a side of the fixed layer (40) of the integrated optical device (50) remote from the protective layer (10) of the integrated optical device (50);
-a lens (60), the lens (60) being arranged between the integrated optics (50) and the laser structure (70), and the lens (60) and the projection of the diffraction structure (21) of the integrated optics (50) onto the laser structure (70) at least partially coincide;
the projection structure (80), projection structure (80) with laser structure (70) electricity is connected, projection structure (80) are used for to object (90) transmission light and receipt object (90) reflection light, integrated projection module is measured integrated projection module with distance L between object (90) and with distance L feedback is laser structure (70), laser structure (70) are right according to distance L's size dodging structure (31) of integrated optics (50) or diffraction structure (21) transmission laser.
6. The integrated projection module of claim 5, wherein the laser structure (70) comprises:
-a first vertical cavity surface emitting laser (71), said first vertical cavity surface emitting laser (71) at least partially coinciding with a projection of said diffractive structure (21) onto said laser structure (70);
a second vertical cavity surface emitting laser (72), the second vertical cavity surface emitting laser (72) at least partially coinciding with the projection of the light homogenizing structure (31) onto the laser structure (70);
when the distance L is larger than a preset distance L0, the second vertical cavity surface emitting laser (72) emits laser to the light homogenizing structure (31), and when the distance L is smaller than the preset distance L0, the first vertical cavity surface emitting laser (71) emits laser to the diffraction structure (21).
7. The integrated projection module of claim 5, wherein the laser structure (70) comprises:
a laser;
the laser device is arranged on the moving device, the position of the moving device is changed according to the distance L, when the distance L is larger than a preset distance L0, the moving device sends the laser device to the lower portion of the dodging structure (31), and when the distance L is smaller than the preset distance L0, the moving device sends the laser device to the lower portion of the diffraction structure (21).
8. The integrated projection module of any one of claims 5 to 7, wherein the projection structure (80) comprises:
an emission end lens (81), the emission end lens (81) being for emitting light to the object (90);
a receiving end lens (82), wherein the receiving end lens (82) is used for receiving light reflected by the object (90);
the integrated projection module further comprises a calculation module, the calculation module is electrically connected with the transmitting end lens (81) and the receiving end lens (82), and the calculation module is used for calculating the distance L according to the transmitting light time of the transmitting end lens (81) and the receiving light time of the receiving end lens (82).
9. A process for manufacturing an integrated optical device, characterized in that an integrated optical device (50) according to any one of claims 1 to 4 is manufactured by a process for manufacturing the integrated optical device (50), the process for manufacturing the integrated optical device (50) comprising:
coating glue on the diffraction structure mother plate (211) to form a first glue layer (20);
arranging a protective layer (10) on the diffraction structure master plate (211) coated with glue;
reversely stamping the diffraction structure mother plate (211), and separating the first adhesive layer (20) and the protective layer (10) from the diffraction structure mother plate (211) to obtain a diffraction structure soft film sub-plate (212);
the light homogenizing structure (31), the light homogenizing structure (31) is connected on the fixed layer (40), glue is coated on the light homogenizing structure (31) to form a second glue layer (30), and the diffraction structure soft film sub-board (212) is connected to one side, far away from the fixed layer (40), of the second glue layer (30) and subjected to embossing exposure to form the integrated optical device (50).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110493400A (en) * | 2019-08-28 | 2019-11-22 | Oppo广东移动通信有限公司 | Projective module group and terminal |
| CN111812663A (en) * | 2020-08-24 | 2020-10-23 | 浙江水晶光电科技股份有限公司 | Depth measurement module and system |
| CN212623374U (en) * | 2020-08-27 | 2021-02-26 | 宁波舜宇奥来技术有限公司 | Integrated optical device and integrated projection module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110493400A (en) * | 2019-08-28 | 2019-11-22 | Oppo广东移动通信有限公司 | Projective module group and terminal |
| CN111812663A (en) * | 2020-08-24 | 2020-10-23 | 浙江水晶光电科技股份有限公司 | Depth measurement module and system |
| CN212623374U (en) * | 2020-08-27 | 2021-02-26 | 宁波舜宇奥来技术有限公司 | Integrated optical device and integrated projection module |
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