CN111849098A - Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method - Google Patents

Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method Download PDF

Info

Publication number
CN111849098A
CN111849098A CN202010771784.3A CN202010771784A CN111849098A CN 111849098 A CN111849098 A CN 111849098A CN 202010771784 A CN202010771784 A CN 202010771784A CN 111849098 A CN111849098 A CN 111849098A
Authority
CN
China
Prior art keywords
aerogel
copper
fiber cloth
prepreg
clad plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010771784.3A
Other languages
Chinese (zh)
Inventor
常稳
罗肖宁
杨浩
张祖琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Aibiaihe New Material Co ltd
Original Assignee
Henan Aibiaihe New Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Aibiaihe New Material Co ltd filed Critical Henan Aibiaihe New Material Co ltd
Priority to CN202010771784.3A priority Critical patent/CN111849098A/en
Publication of CN111849098A publication Critical patent/CN111849098A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • B32B38/164Drying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02Synthetic macromolecular fibres
    • B32B2262/0261Polyamide fibres
    • B32B2262/0269Aromatic polyamide fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18Homopolymers or copolymers of tetrafluoroethylene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2477/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2477/10Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention discloses a prepreg, a copper-clad plate and a preparation method of aerogel fiber cloth and reinforced resin, wherein the prepreg comprises the following preparation steps: s1, preparing a fiber spinning solution; s2, preparing aerogel fibers; s3, preparing aerogel fiber cloth; s4, preparing resin; s5, coating; and S6, drying to obtain the prepreg. The preparation method of the copper-clad plate by the prepreg comprises the following steps: d1, matching boards; d2, pressing; d3, cutting. The copper-clad plate comprises a copper foil I, a copper foil II, a resin layer and aerogel fiber cloth; be equipped with resin layer and at least one deck aerogel fibre cloth between copper foil I and the copper foil II, aerogel fibre cloth is wrapped up by the resin layer. According to the invention, the good dielectric properties of the aerogel fibers are utilized to replace glass fiber reinforced materials which occupy higher volume content and have relatively higher dielectric constant and dielectric loss in the composite material, so that the dielectric constant and dielectric loss of the whole copper-clad plate are reduced, and the problem that the dielectric constant and dielectric loss of the traditional glass fiber cloth reinforced resin copper-clad plate are relatively higher is solved.

Description

Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method
Technical Field
The invention belongs to the technical field of copper-clad plates, and particularly relates to a prepreg of aerogel fiber cloth and reinforced resin, a copper-clad plate and a preparation method.
Background
The copper-clad plate is one of basic insulating plates in low-voltage electrical appliances and electronic industries, is mainly used for processing and manufacturing printed circuit boards (PCB for short), and is a main part of electronic and electrical products such as computers, mobile communication, televisions, displays and the like.
In the prior art, the copper-clad plate is mainly prepared by laminating resin, a reinforcing material and a metal foil, wherein the reinforcing material mainly comprises wood pulp paper, glass fiber paper, glass cloth, quartz fiber cloth, aromatic polyamide cloth and the like, the glass fiber cloth is widely applied, but the dielectric constant of the glass fiber cloth is higher than that of a resin base material, and the glass fiber cloth occupies higher volume fraction of the copper-clad plate, so that the dielectric property of the copper-clad plate is directly influenced. However, the existing research for reducing the dielectric constant and dielectric loss of the copper-clad plate is mostly on the base materials such as PTFE/ceramic resin material, hydrocarbon resin material and modified epoxy resin material, and so on, so far, no relevant research and literature report of adopting aerogel fiber cloth as a reinforcing material for preparing the glass fiber copper-clad plate is seen.
Disclosure of Invention
Aiming at the defects described in the prior art, the invention provides a prepreg, a copper-clad plate and a preparation method of aerogel fiber cloth and reinforced resin.
The technical scheme adopted by the invention is as follows:
a preparation method of a prepreg of aerogel fiber cloth and reinforced resin comprises the following steps:
and S1, preparing the nanofiber spinning solution.
Dissolving 1-20 g of organic fiber in 1L of solvent to prepare a nanofiber spinning solution, wherein the organic fiber can be aramid fiber, polyurethane fiber, polyimide fiber and other organic fibers, and the solvent is dimethyl sulfoxide solvent.
S2, preparing aerogel fibers;
s2.1, extruding the nanofiber spinning solution into an ethanol solution through a wet spinning process, and gelling to form wet gel fibers.
S2.2, carrying out ethanol dehydration on the wet gel fibers, and carrying out carbon dioxide supercritical drying after dehydration to prepare aerogel fibers, wherein the diameter of the prepared aerogel fibers is 50-400 mu m.
The prepared aerogel fiber can be organic aerogel fibers such as aramid aerogel fiber, polyurethane aerogel fiber, polyimide aerogel fiber and the like.
And S3, preparing the aerogel fiber cloth.
And weaving the aerogel fiber yarns according to the warp-weft ratio of 1: 1.5-1.5: 1 to obtain the aerogel fiber cloth.
S4, providing a resin.
The polytetrafluoroethylene resin adhesive with the glass transition temperature of 240-350 ℃ and the viscosity of 1000-6000 mPas is selected.
And S5, coating.
Resin is soaked on the aerogel fiber cloth by a vertical gluing machine to obtain the coated aerogel fiber cloth, and the resin coating thickness is 10-800 mu m.
And S6, drying to obtain the prepreg.
And drying the coated aerogel fiber cloth by using an oven to obtain a prepreg, wherein the temperature is 100-180 ℃, and the time is 10-30 min. The prepreg has certain viscosity, which is beneficial to the subsequent pressing.
As a preferable scheme of the present invention, the present invention provides a prepreg obtained by using the above preparation method.
As a preferred scheme of the invention, the invention also provides an application of the prepreg obtained by the preparation method in a copper-clad plate.
As a preferred scheme of the invention, the invention also provides a method for obtaining a copper-clad plate by using the prepreg, which comprises the following steps:
d1, matching boards.
And (3) placing the prepregs on one copper foil, wherein the area of the prepregs is smaller than that of the copper foil, and stacking the prepregs according to the way that one or more layers of prepregs are arranged in the middle and one copper foil is arranged on each of the upper surface and the lower surface of the prepregs to obtain the composite board to be laminated.
D2, pressing.
And pressing the composite board to be pressed by using a vacuum press to obtain the copper-clad plate, wherein the pressing curing pressure is 150-1200PSI, the curing temperature is 150-400 ℃, and the vacuum degree is 0.1 mbar-10 bar.
D3, cutting.
And cutting the copper-clad plate obtained by pressing to obtain the copper-clad plate with the required size.
As a preferred scheme of the invention, the invention provides a copper-clad plate of aerogel fiber cloth and reinforced resin, which comprises a copper foil I, a copper foil II, a resin layer and aerogel fiber cloth; be equipped with resin layer and at least one deck aerogel fibre cloth between copper foil I and the copper foil II, and aerogel fibre cloth is wrapped up by the resin layer.
Has the advantages that:
at present, the high-speed high-frequency PCB is a trend of future development, and a copper-clad plate with low dielectric constant and dielectric loss is needed corresponding to raw materials; at present, most of copper-clad plates use glass fiber cloth as a reinforcing material and resin as a base material, however, the dielectric constant of the glass fiber cloth is higher than that of the resin base material and occupies higher volume fraction of the copper-clad plate, so that the dielectric property of the copper-clad plate is directly influenced; the invention adopts the fiber cloth woven by aerogel fiber materials as the reinforcing material, which not only has the ultralow dielectric property (dielectric constant (1.15-3.8 (10 GHz, SPDR)) and dielectric loss (0.001-0.025 (10 GHz, SPDR)) of aerogel, but also has certain mechanical strength, the prepreg or the copper clad laminate with excellent dielectric property (dielectric constant (1.5-4.0 (10 GHz, SPDR)) and dielectric loss (0.0015-0.028 (10 GHz, SPDR)) can be obtained, the invention makes full use of the advantages of good dielectric property (low dielectric constant, low dielectric loss) and the like of aerogel fibers to replace glass fiber reinforced materials which have higher volume content and relatively higher dielectric constant and dielectric loss in composite materials, and the dielectric constant and the dielectric loss of the whole copper-clad plate are reduced, and the problem that the dielectric constant and the dielectric loss of the traditional glass fiber cloth reinforced resin copper-clad plate are relatively high is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic drawing of a copper-clad plate of the present invention in section.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Example 1:
a preparation method of a prepreg of aerogel fiber cloth and reinforced resin comprises the following steps:
and S1, preparing the nanofiber spinning solution.
Dissolving 1 g-20 g of aramid fiber in 1L of dimethyl sulfoxide solvent (DMSO) to prepare a nanofiber spinning solution.
The fibers used may be organic fibers such as polyurethane fibers and polyimide fibers, and are dissolved in a dimethyl sulfoxide solvent, but aramid fibers are preferable in the present embodiment.
S2, preparing aerogel fibers.
Extruding the nanofiber spinning solution into an ethanol solution through a wet spinning process, gelling to form wet gel fibers, then dehydrating the wet gel fibers with ethanol, and finally drying the wet gel fibers through supercritical carbon dioxide to obtain aerogel fibers, wherein the diameter of the prepared aerogel fibers is 50-400 mu m.
And S3, preparing the aerogel fiber cloth.
And weaving the aerogel fiber yarns according to a warp-weft ratio of 1: 1.5-1.5: 1 to obtain the aramid aerogel fiber cloth.
S4, providing a resin.
The polytetrafluoroethylene resin adhesive with the glass transition temperature of 240-350 ℃ and the viscosity of 1000-6000 mPas is selected, and other organic resins and modified or mixed resins of more than two kinds of organic resins can be used.
And S5, coating.
Resin is soaked on the aerogel fiber cloth by a vertical gluing machine to obtain the coated aerogel fiber cloth, and the resin coating thickness is 10-800 mu m.
And S6, drying to obtain the prepreg.
And drying the coated aerogel fiber cloth by using an oven to obtain a prepreg, wherein the temperature is 100-180 ℃, and the time is 10-30 min.
The preparation method is the same as the above step when the polyurethane fiber or the polyimide fiber is used.
Example 2: a method for obtaining a copper-clad plate by using the prepreg obtained in the embodiment 1 comprises the following steps:
d1, matching boards.
And (3) placing the prepregs on one copper foil, wherein the area of the prepregs is smaller than that of the copper foil, and stacking the prepregs according to the way that one or more layers of prepregs are arranged in the middle and one copper foil is arranged on each of the upper surface and the lower surface of the prepregs to obtain the composite board to be laminated.
D2, pressing.
And pressing the composite board to be pressed by using a vacuum press to obtain the copper-clad plate, wherein the pressing curing pressure is 150-1200PSI, the curing temperature is 150-400 ℃, and the vacuum degree is 0.1 mbar-10 bar.
D3, cutting.
And cutting the copper-clad plate obtained by pressing to obtain the copper-clad plate with the required size.
Example 3: the copper-clad plate comprises copper foil I1, copper foil II2, a resin layer 3 and aerogel fiber cloth 4; resin layer 3 and at least one layer of aerogel fiber cloth 4 are arranged between copper foil I1 and copper foil II2, and aerogel fiber cloth 4 is wrapped by resin layer 3.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (7)

1. The preparation method of the prepreg of the aerogel fiber cloth and the reinforced resin is characterized by comprising the following steps:
s1, preparing a nanofiber spinning solution;
dissolving 1 g-20 g of organic fiber in 1L of solvent to prepare a nanofiber spinning solution;
s2, preparing aerogel fibers;
s3, preparing aerogel fiber cloth;
weaving the aerogel fiber yarns according to a warp-weft ratio of 1: 1.5-1.5: 1 to obtain aerogel fiber cloth;
s4, providing a resin;
s5, coating;
dipping resin onto aerogel fiber cloth by using a vertical gluing machine to obtain the coated aerogel fiber cloth, wherein the resin coating thickness is 10-600 mu m;
s6, drying to obtain a prepreg;
and drying the coated aerogel fiber cloth by using an oven to obtain a prepreg, wherein the temperature is 100-180 ℃, and the time is 10-30 min.
2. The method for preparing the prepreg of the aerogel fiber cloth and the reinforced resin according to claim 1, wherein in step S2, the specific steps for preparing the aerogel fibers are as follows:
s2.1, extruding the nanofiber spinning solution into an ethanol solution through a wet spinning process, and gelling to form wet gel fibers;
and S2.2, dehydrating the wet gel fiber with ethanol, and performing supercritical drying with carbon dioxide after dehydration to obtain the aerogel fiber.
3. The method for preparing the prepreg of the aerogel fiber cloth and the reinforcing resin according to claim 2, wherein: the diameter of the aerogel fibers is 50-400 mu m.
4. Prepreg obtained by the process according to any one of claims 1 to 3.
5. The use of prepregs according to claim 3 in copper-clad laminates.
6. A method for obtaining a copper-clad plate by using prepregs according to claim 4 is characterized by comprising the following steps:
d1, matching boards;
directly placing at least one layer of prepreg between two copper foils to obtain a composite board to be laminated, wherein the area of the prepreg is smaller than that of the copper foil;
d2, pressing;
pressing the composite board to be pressed by using a vacuum press to obtain the copper-clad plate, wherein the pressing curing pressure is 150-;
d3, cutting;
and cutting the copper-clad plate obtained by pressing to obtain the copper-clad plate with the required size.
7. The copper-clad plate of aerogel fiber cloth and reinforced resin is characterized in that: comprises a copper foil I (1), a copper foil II (2), a resin layer (3) and aerogel fiber cloth (4); be equipped with resin layer (3) and at least one deck aerogel fibre cloth (4) between copper foil I (1) and copper foil II (2), and aerogel fibre cloth (4) are wrapped up by resin layer (3).
CN202010771784.3A 2020-08-04 2020-08-04 Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method Pending CN111849098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010771784.3A CN111849098A (en) 2020-08-04 2020-08-04 Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010771784.3A CN111849098A (en) 2020-08-04 2020-08-04 Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method

Publications (1)

Publication Number Publication Date
CN111849098A true CN111849098A (en) 2020-10-30

Family

ID=72953189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010771784.3A Pending CN111849098A (en) 2020-08-04 2020-08-04 Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method

Country Status (1)

Country Link
CN (1) CN111849098A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114621543A (en) * 2020-12-08 2022-06-14 河南爱彼爱和新材料有限公司 High-frequency prepreg, high-frequency copper-clad plate and preparation method thereof
CN115302885A (en) * 2022-08-10 2022-11-08 江门建滔积层板有限公司 High-heat-resistance high-thermal-conductivity copper-clad plate and preparation method thereof
WO2024021897A1 (en) * 2022-07-27 2024-02-01 华为技术有限公司 Prepreg, substrate, printed circuit board and related preparation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108330561A (en) * 2018-04-18 2018-07-27 苏州同玄新材料有限公司 A kind of skin-core structure aeroge composite fibre, preparation method and application
CN110468461A (en) * 2018-05-10 2019-11-19 中国科学院苏州纳米技术与纳米仿生研究所 Polyamide airsetting glue fiber, preparation method and application
CN111171736A (en) * 2020-01-14 2020-05-19 广东生益科技股份有限公司 Lacquer cloth, preparation method thereof, copper-clad plate comprising lacquer cloth and application

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108330561A (en) * 2018-04-18 2018-07-27 苏州同玄新材料有限公司 A kind of skin-core structure aeroge composite fibre, preparation method and application
CN110468461A (en) * 2018-05-10 2019-11-19 中国科学院苏州纳米技术与纳米仿生研究所 Polyamide airsetting glue fiber, preparation method and application
CN111171736A (en) * 2020-01-14 2020-05-19 广东生益科技股份有限公司 Lacquer cloth, preparation method thereof, copper-clad plate comprising lacquer cloth and application

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114621543A (en) * 2020-12-08 2022-06-14 河南爱彼爱和新材料有限公司 High-frequency prepreg, high-frequency copper-clad plate and preparation method thereof
CN114621543B (en) * 2020-12-08 2024-03-29 河南爱彼爱和新材料有限公司 High-frequency prepreg, high-frequency copper-clad plate and preparation method of high-frequency prepreg and high-frequency copper-clad plate
WO2024021897A1 (en) * 2022-07-27 2024-02-01 华为技术有限公司 Prepreg, substrate, printed circuit board and related preparation method
CN115302885A (en) * 2022-08-10 2022-11-08 江门建滔积层板有限公司 High-heat-resistance high-thermal-conductivity copper-clad plate and preparation method thereof
CN115302885B (en) * 2022-08-10 2023-12-19 江门建滔积层板有限公司 High-heat-resistance high-heat-conductivity copper-clad plate and preparation method thereof

Similar Documents

Publication Publication Date Title
CN111849098A (en) Prepreg and copper-clad plate of aerogel fiber cloth and reinforced resin and preparation method
US6245696B1 (en) Lasable bond-ply materials for high density printed wiring boards
JP4536010B2 (en) Double woven glass cloth, and prepreg and printed wiring board substrate using the glass cloth
WO2012100648A1 (en) Prepreg comprising aromatic synthetic fiber paper and printed circuit board made using the prepreg
CN114771050B (en) High-frequency copper-clad plate and preparation method thereof
WO2021031250A1 (en) Copper-clad laminated board, printed circuit board, and fabrication method for printed circuit board
CN105437668B (en) A kind of ultra-thin copper-clad plate and preparation method thereof
CN107057098B (en) Prepreg for circuit substrate, laminate, method of preparing the same, and printed circuit board including the same
CN111472191A (en) Para-aramid fiber plate and preparation method thereof
CN103731980A (en) Copper clad laminate
US20040170795A1 (en) Lasable bond-ply materials for high density printed wiring boards
CN219164807U (en) Low dielectric and toughened liquid crystal polymer base circuit substrate
CN111605265A (en) Liquid crystal polymer disturbing copper-clad plate and manufacturing method thereof
CN102296488B (en) Production method for low-warpage paper base laminating circuit board body paper and paper base laminating circuit board body paper
JPH1037054A (en) Base material for circuit board, prepreg and printed circuit board using the same
CN102051021A (en) Prepreg applied to printed circuit board in filling nanometer molecular sieve and preparation method thereof
CN105555021B (en) The substrate and its manufacturing method of anti-CAF printed wiring board
CN113930062A (en) Prepreg and manufacturing method thereof, and manufacturing method of copper-clad plate
CN115028869B (en) Polyimide paper-based prepreg and copper-clad plate prepared from same
CN210537014U (en) Printed circuit board
CN115162050A (en) Modified polyimide fiber paper for copper-clad plate and preparation method thereof
JPS6147844A (en) Glass cloth for multilayered printed wiring board and multilayered printed wiring board using the same
JP2002348754A (en) Glass cloth, prepreg, laminated sheet, and printed wiring board
CN105437672A (en) Ultrathin CCL (copper clad laminate) and production method thereof
JP3129652B2 (en) Manufacturing method of laminated board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20201030

RJ01 Rejection of invention patent application after publication