CN111843216A - Glass substrate side processing device and processing method thereof - Google Patents
Glass substrate side processing device and processing method thereof Download PDFInfo
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- CN111843216A CN111843216A CN202010713291.4A CN202010713291A CN111843216A CN 111843216 A CN111843216 A CN 111843216A CN 202010713291 A CN202010713291 A CN 202010713291A CN 111843216 A CN111843216 A CN 111843216A
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- glass substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Optics & Photonics (AREA)
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- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a glass substrate side processing device and a processing method thereof, wherein the processing device comprises: a base; one end of the first support is slidably mounted on one side surface of the base, and the extending direction of the first support is vertical to the base; one end of the second support column is slidably mounted on the first support column, the extending direction of the second support column is vertical to the first support column, and the second support column is arranged opposite to the base; a first camera mounted on the first pillar; a second camera mounted on the second pillar; the image identification positioning processor is connected with the first camera and the first camera; the controller is connected with the image recognition positioning processor, the first support and the second support; and the laser emitter is arranged on the second support, and the working surface of the laser emitter faces the base. The invention can simplify the processing process of the glass substrate, improve the processing efficiency, improve the processing precision and prevent the quality of the glass substrate from being reduced.
Description
Technical Field
The invention belongs to the technical field of glass substrate processing, and particularly relates to a glass substrate side processing device and a processing method thereof.
Background
The glass substrate is one of the basic components constituting the liquid crystal display device. This is a float process that produces thin glass sheets with extremely smooth surfaces. The glass substrate is an important component of the liquid crystal flat panel display and has very wide development prospect. Generally, the glass substrate is cut by scribing, cutter wheel scribing, laser scribing, or the like. At this time, the glass substrate is in a state where the cut surface (side surface) is not strengthened, the strength thereof is remarkably decreased, and the both side edge portions are also cut very sharply. The side surfaces of the glass substrate are not strengthened, and the chipping of the two side edge parts causes the crack of the glass substrate even if a small impact is applied to the glass substrate, thereby influencing the yield of the glass substrate and reducing the quality of the glass substrate. Even if the side surface of the glass substrate is strengthened in some embodiments, the processing process is complicated and the processing efficiency is reduced because the corner portions of the two sides need to be chamfered for many times.
Disclosure of Invention
In order to solve the above-mentioned problems of the prior art, the present invention provides a glass substrate side processing apparatus and a processing method thereof, which can align a laser to a substrate side by recognizing and positioning the substrate side, and then simultaneously chamfer both side edge portions while reinforcing the glass substrate side by deforming a cross-sectional shape of a laser beam emitted from the laser, thereby simplifying a processing process, improving processing efficiency, uniformly processing both side edge portions into the same shape, improving processing precision, and preventing quality deterioration of the glass substrate.
The invention provides a glass substrate side processing device, which comprises:
a base;
the first supporting column is arranged on one side surface of the base in a sliding mode, and the extending direction of the first supporting column is perpendicular to the base;
one end of the second support column is slidably mounted on the first support column, the extending direction of the second support column is perpendicular to the first support column, and the second support column is arranged opposite to the base;
a first camera mounted on the second pillar;
a second camera mounted on the second pillar;
the image identification positioning processor is connected with the first camera and the second camera;
a controller connected with the image recognition positioning processor, the first support and the second support;
a laser emitter mounted on the second support with a working surface of the laser emitter facing the base.
In one embodiment of the invention, the laser emitter comprises a laser emitting head, an optical element and a meniscus lens, which are arranged in sequence, wherein the concave surface of the meniscus lens faces the glass substrate.
In an embodiment of the invention, the laser transmitter further includes a mask, the mask is disposed on one side of the concave surface of the meniscus lens, and the mask is provided with a through hole.
In one embodiment of the present invention, the through-hole has a shape in which a cross-sectional width of a central portion of the through-hole is smaller than a cross-sectional width of an edge portion of the through-hole.
In one embodiment of the invention, a first screw rod support is arranged on one side surface of the base, a first screw rod is arranged on the first screw rod support, and the first support is sleeved on the first screw rod.
In an embodiment of the present invention, two sides of the first lead screw are respectively provided with a first slide rail, and the first support is slidably mounted on the first slide rail.
In an embodiment of the present invention, a second lead screw support is disposed on the first support, a second lead screw is disposed on the second lead screw support, and the second support is sleeved on the second lead screw.
In an embodiment of the present invention, two sides of the second lead screw are respectively provided with a second slide rail, and the second support is slidably mounted on the second slide rail.
The invention also provides a glass substrate side processing method, which at least comprises the following steps:
providing a glass substrate side processing apparatus, the processing apparatus comprising:
a base;
the first supporting column is arranged on one side surface of the base in a sliding mode, and the extending direction of the first supporting column is perpendicular to the base;
one end of the second support column is slidably mounted on the first support column, the extending direction of the second support column is perpendicular to the first support column, and the second support column is arranged opposite to the base;
a first camera mounted on the second pillar;
a second camera mounted on the second pillar;
the image identification positioning processor is connected with the first camera and the first camera;
a controller connected with the image recognition positioning processor, the first support and the second support;
a laser emitter mounted on the second support with a working surface of the laser emitter facing the base;
placing the glass substrate on the base with the side face upward;
acquiring image information of the side boundary of the glass substrate through a first camera and a second camera;
determining the boundary of the side surface of the glass substrate through an image recognition positioning processor, and acquiring the position of the side surface of the glass substrate;
and controlling the first support and the second support to move through a controller, so that the laser beam emitted by the laser emitter on the second support is aligned to the side surface of the glass substrate, and processing the side surface of the glass substrate.
In one embodiment of the present invention, a method of processing a side of the glass substrate includes the steps of:
in the laser beam forming stage, a laser emitter is used for forming a laser beam with a quadrangular cross section, and the intensity of the laser beam is maximum at the corner part along with the gradual increase of the intensity of the central part beam far away from the cross section; and
and a side processing stage, wherein the laser beam formed in the laser beam forming stage is arranged opposite to the side of the glass substrate, so that the side of the glass substrate is stripped by a certain thickness, and simultaneously, the side of the glass substrate and the corner part of the glass substrate are chamfered.
The device and the method for processing the side surface of the glass substrate can simplify the processing process and save the time required by processing, thereby improving the processing efficiency. Meanwhile, according to the glass substrate side processing apparatus and the processing method of the present invention, precise processing can be performed, and the quality of the glass substrate can be prevented from being degraded. Meanwhile, according to the method for processing a side surface of a glass substrate of the present invention, the chamfering ratio of the both side edge portions of the side surface of the glass substrate can be selectively adjusted as necessary, so that the processing width is widened, and the both side edge portions of the side surface of the glass substrate can be processed in various forms.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a glass substrate side processing apparatus according to the present invention;
FIG. 2 is a schematic diagram of an embodiment of the laser transmitter of FIG. 1;
FIG. 3 is a schematic structural diagram of another embodiment of the laser transmitter of FIG. 1;
FIG. 4 is a flow chart of a method of processing a side of a glass substrate according to the present invention;
FIG. 5 is a schematic diagram of the first cross-sectional shape and the intensity distribution of the laser beam in the first cross-sectional shape obtained in step S5 of FIG. 4;
fig. 6 is a schematic diagram of a second cross-sectional shape and an intensity distribution of the laser beam on the second cross-sectional shape obtained in step S5 of fig. 4;
fig. 7 is a schematic diagram of the third cross-sectional shape obtained in step S5 in fig. 4 and the intensity distribution of the laser beam on the third cross-sectional shape.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the prior art, the glass substrate is generally processed and cut by scribing, cutter wheel scribing, laser scribing and the like. At this time, the glass substrate is in a state where the cut surface (side surface) is not strengthened, the strength thereof is remarkably decreased, and the both side edge portions are also cut very sharply. If the side surfaces of the glass substrate are not strengthened and chips or the like are present at the side edge portions, cracks may be generated even if a slight impact is applied, which may affect the yield of the glass substrate or may cause a problem of quality degradation of the glass substrate. Therefore, it is preferable to round both side edges of the glass substrate side surface by chamfering the both side edges while strengthening the side surface of the glass substrate to have a certain degree of strength. In some embodiments, the chamfering may be performed by irradiating a laser beam to one of the two side corner portions of the side surface of the glass substrate. Then, after moving the laser beam or moving the glass substrate, the laser beam is irradiated to the corner portion on the other side, and the corner portion opposite to the chamfered corner portion is chamfered. As described above, the corner portions at both sides need to be chamfered many times, which results in a problem of troublesome processing and a decrease in processing efficiency. In addition, it is difficult to uniformly process both side edges into the same shape, and the processing precision is low, which causes a problem of deterioration in quality of the glass substrate.
Referring to fig. 1, the present invention provides a glass substrate side processing apparatus, which includes: the device comprises a base 1, a first support column 2, a second support column 3, a first camera 4, a second camera 5, an image recognition positioning processor 6, a controller 7 and a laser transmitter 8.
Referring to fig. 1, one end of a first pillar 2 is slidably mounted on a side surface of a base 1, an extending direction of the first pillar 2 is perpendicular to the base 1, specifically, a first lead screw support is disposed on the side surface of the base 1, a first lead screw is disposed on the first lead screw support, the first pillar 2 is sleeved on the first lead screw, in this embodiment, the first pillar 2 is in threaded connection with the first lead screw, a first slide rail is disposed on each of two sides of the first lead screw, and the first pillar 2 is slidably mounted on the first slide rail. Meanwhile, the first support 2 can also slide along the first slide rail, and the first support 2 can move and accurately displace relative to the base 1 through the matching of the stepping motor, the first screw rod and the first slide rail.
Referring to fig. 1, one end of a second support 3 is slidably mounted on the first support 2, an extending direction of the second support 3 is perpendicular to the first support 2, the second support 3 is disposed opposite to the base 1, specifically, a second lead screw support is disposed on the first support 2, a second lead screw is disposed on the second lead screw support, the second support 3 is sleeved on the second lead screw, in this embodiment, the second support 3 is in threaded connection with the second lead screw, two sides of the second lead screw are respectively provided with a second slide rail, the second support 3 is slidably mounted on the second slide rail, in this embodiment, a second driving motor is further disposed in the apparatus and connected with the second lead screw, the second driving motor is, for example, a step motor, specifically, the second driving motor drives the second lead screw to rotate, due to the threaded connection between the second support 3 and the second lead screw, the second support 3 is allowed to move along the extending direction of the second screw rod along with the rotation of the second screw rod, meanwhile, the second support 3 can also slide along the second slide rail, and the second support 3 can move and accurately displace relative to the first support 2 through the matching of the stepping motor, the second screw rod and the second slide rail.
Referring to fig. 1, a first camera 4 is installed on the second pillar 3, a second camera 5 is also installed on the second pillar 3, the first camera 4 and the second camera 5 are arranged side by side, and an image recognition and positioning processor 6 is connected to the first camera 4 and the first camera 4, in this embodiment, the first camera 4 and the second camera 5 may be, for example, binocular cameras, the first camera 4 and the second camera are used for collecting picture information of a substrate position and transmitting the picture information to the image recognition and positioning processor 6, the image recognition and positioning processor 6 recognizes and positions a position of a side surface of the substrate according to the picture information and transmits the position information to a controller 7, and the controller 7 controls the first pillar 2 and the second pillar 3 to move according to the position information. More specifically, in order to obtain the position information of the boundary point of the side surface of the substrate, the first camera 4 and the second camera 5 can simultaneously obtain the picture information of a certain boundary point at different positions, the image recognition and positioning processor 6 calculates the coordinate information of the boundary point one by one according to the picture information, thereby positioning the position of the side surface of the substrate, and transmits the position information to the controller 7, and the controller 7 controls the first support column 2 and the second support column 3 to move according to the position information. In some embodiments, obtaining the picture information of the boundary point may also be implemented by a camera, for example, moving a camera in a preset manner, observing the boundary point on the side surface of the substrate at different positions, or projecting an image of the boundary point formed at different positions onto a camera in an optical imaging manner, which may all implement positioning of the side surface of the substrate.
Referring to fig. 1 to 7, the laser emitter 8 is mounted on the second pillar 3, the laser beam emitted by the laser emitter 8 faces the base 1, the image recognition and positioning processor 6 calculates the coordinate information of the boundary point one by one according to the picture information, thereby positioning the position of the side surface of the substrate and transmitting the position information to the controller 7, and the controller 7 controls the first pillar 2 and the second pillar 3 to move according to the position information, so that the laser emitter 8 on the second pillar 3 emits the laser beam 10 to align with the side surface of the glass substrate, and the side surface of the glass substrate is processed. In this embodiment, the laser emitter 8 includes a laser emitting head 9, an optical element 11 and a meniscus lens 12 arranged in sequence, the concave surface of the meniscus lens 12 faces the glass substrate, specifically, as shown in fig. 6, the laser beam 10 may be output from the CO2 laser emitter 8, the laser beam 10 output from the CO2 laser emitter 8 may be in a quadrangle shape by forming a first cross-sectional shape 141 by the diffractive optical element 11 and the meniscus lens 12, for example, and at this time, the intensity of the laser beam 10 is in a state where the intensity of the cross-section is uniform. In some embodiments, the laser beam 10 of the first cross-sectional shape 141 passes through a mask 15, and the mask 15 has a through hole with a cross-sectional width smaller in the central portion than in the edge portion, and specifically, as shown in fig. 7, for example, the cross-sectional width of the through hole gradually decreases from the edge portion to the central portion, thereby forming the laser beam 10 with a cross-sectional width gradually decreasing from the edge portion to the central portion. The laser beam 10 passing through the mask in which the through-holes are formed has a cross-sectional shape 151 identical to that of the through-holes, so that the side surface of the glass substrate is irradiated, that is, the cross-sectional shape 151 of the laser beam 10 passing through the mask is such that the cross-sectional width of the central portion is narrow and the cross-sectional width of the edge portion is wide. Although the intensity of the laser beam is uniform in the entire cross section, the energy of the laser beam 10 (a concept of multiplying the intensity and the area) is the largest at the edge portion, the energy gradually decreases toward the center portion, and the energy of the laser beam 10 is the smallest at the center portion because of the cross-sectional shape 151. Therefore, the energy of the laser beam 10 irradiated to the both side edge portions of the side surface of the glass substrate is higher than the energy of the laser beam 10 irradiated to the central portion of the side surface of the glass substrate.
Referring to fig. 4, the present invention further provides a method for processing a side surface of a glass substrate, which at least includes the following steps:
s1, a glass substrate side processing device is provided, the device includes:
a base 1;
a first pillar 2, one end of which is slidably mounted on one side surface of the base 1, wherein the extending direction of the first pillar 2 is perpendicular to the base 1;
a second support 3, one end of which is slidably mounted on the first support 2, wherein the extending direction of the second support 3 is perpendicular to the first support 2, and the second support 3 is arranged opposite to the base 1;
a first camera 4 mounted on the second pillar 3;
a second camera 5 mounted on the second pillar 3;
an image recognition positioning processor 6 connected to the first camera 4 and the second camera 5;
a controller 7 connected to the image recognition positioning processor 6, the first support column 2, and the second support column 3;
and the laser emitter 8 is installed on the second support column 3, and the working surface of the laser emitter 8 faces the base 1.
S2, placing the side face of the glass substrate on the base 1 in an upward mode;
s3, acquiring image information of the boundary of the side face of the glass substrate through a first camera 4 and a second camera 5;
s4, determining the boundary of the side surface of the glass substrate through an image recognition positioning processor 6, and acquiring the position of the side surface of the glass substrate;
s5, the controller 7 controls the first support column 2 and the second support column 3 to move, so that the laser beam 10 emitted by the laser emitter 8 on the second support column 3 is aligned to the side face of the glass substrate, and the side face of the glass substrate is processed.
Referring to fig. 4, in steps S1 to S4, the functions of the glass substrate side processing apparatus and the components are described in detail above, and are not repeated here.
Referring to fig. 4 to 7, in step S5, the method for processing the side surface of the glass substrate includes the following steps:
H1. a laser beam 10 forming stage, wherein a laser emitter 8 is used for forming a laser beam 10 with a quadrangular cross section, and the intensity of the laser beam 10 is the maximum at the corner part along with the gradual increase of the intensity of the central part beam far away from the cross section; and
H2. and a side processing stage, wherein the laser beam 10 formed in the laser beam 10 forming stage is arranged opposite to the side of the glass substrate, so that the side of the glass substrate is stripped by a certain thickness, and simultaneously, the side of the glass substrate and the corner part thereof are chamfered.
Referring to fig. 4 to 7, in detail, the laser beam 10 at the stage of forming the laser beam 10 has a generally quadrangular cross-sectional shape as viewed from above, and has a relatively lowest intensity at the center of the cross-section as viewed from the side of the intensity of the laser beam 10, and the intensity gradually increases as it goes away from the center of the cross-section. Therefore, the intensity of the laser beam 10 is maximized at the corner portions farthest from the central portion of the cross-section. The laser beam 10 shaping stage in this embodiment may include a first shaping stage. The first molding step is to mold the laser beam 10 having the first cross-sectional shape 141 of a quadrangle at the focal position 14. More specifically, at this time, the laser beam 10 may be output by, for example, the CO2 laser emitter 8, and the laser beam 10 may obtain the laser beam 10 having the first cross-sectional shape 141 of a quadrangle at the focal position 14 through the diffractive optical element 11 and the meniscus lens 12, at this time, although the intensity of the laser beam 10 is uniform throughout the cross section at the focal position 14, the intensity of the laser beam 10 becomes non-uniform at the defocused position. That is, if the side of the glass substrate is disposed at the position 13 within the meniscus lens 12 and the focal position 14 used in the first molding stage, the second sectional shape 131 is obtained at this time, and the strength of the corner portion 15b is relatively greater than the strength 15a of the central portion at this time. As described above, by providing the side surface of the glass substrate at the position 13 within the meniscus lens 12 and the focal point 14, the laser beam 10 having the intensity of the light beam gradually increased at the center portion and the intensity of the light beam maximized at the corner portion, which are distant from the cross section, can be obtained, and the side surface of the glass substrate can be processed by the laser beam 10, so that the side surface of the glass substrate is peeled by a certain thickness, and the both side edge portions of the side surface of the glass substrate can be simultaneously chamfered. More specifically, the laser beam 10 shaped at the shaping stage of the laser beam 10 is disposed opposite to the side surface of the glass substrate, and the shaped laser beam 10 or the glass substrate is moved in the direction in which the side surface of the glass substrate is formed by moving the first support 2. When the laser beam 10 is first irradiated to the side surface of the glass substrate, heat penetrates to a certain depth, and cracks may be generated at the interface between the portion where heat penetration occurs and the portion where heat penetration does not occur due to a rapid change in thermal stress. At this time, if the laser beam 10 moves in the direction in which the side surface of the glass substrate is formed, the crack-generated portion spreads in the direction in which the laser beam 10 moves, and the side surface of the glass substrate is peeled off by a certain thickness. After the cutting process is performed, the side face of the uneven glass substrate is peeled off with a certain thickness, and the smooth face is exposed, so that the strength of the side face can be improved. After cutting, the rough surface roughness such as chipping is called a starting point of a crack, and becomes a cause of weakening the strength of the glass substrate, but peeling at a certain thickness can obtain a smooth surface, and a large part of a portion where the crack is likely to occur is blocked, thereby improving the strength of the side surface of the glass substrate.
Referring to fig. 4 to 7, in addition to the irradiation of the laser beam 10 having a relatively higher beam intensity at the corner portion to the side surface of the glass substrate, the side surface of the glass substrate is irradiated at the center portion of the laser beam 10 having a lower beam intensity. Thereby supplying higher energy to the corner portions of the side surfaces of the glass substrate to naturally chamfer the corner portions of the side surfaces of the glass substrate, thereby achieving simultaneous chamfering of the corner portions of both sides of the side surfaces of the glass substrate even if the laser beam 10 is irradiated once.
Referring to fig. 4 to 7, in other embodiments, the position 13 of the side of the glass substrate is adjusted by moving the second support 3 within the meniscus lens 12 and the focal position 14, so that the beam intensity of the corner of the laser beam 10 can be varied. For example, the intensity deviation of the central portion and the corner portion of the laser beam 10 is relatively small at a position relatively close to the focal position 14 within the meniscus lens 12 and the focal position 14, and the intensity deviation of the central portion and the corner portion of the laser beam 10 is relatively large at a position relatively close to the meniscus lens 12 within the meniscus lens 12 and the focal position 14. In the case of processing the side surface of the glass substrate by the laser beam 10 having a relatively small intensity deviation between the central portion and the edge portion of the laser beam 10, the amount of chamfering the corner portion of the side surface of the glass substrate is small, and in the case of processing the side surface of the glass substrate by the laser beam 10 having a relatively large intensity deviation between the central portion and the edge portion of the laser beam 10, the amount of chamfering the corner portion of the side surface of the glass substrate is large. As described above, by changing the beam intensity of the corner portion of the laser beam 10, the chamfering rate of the corner portion of the side surface of the glass substrate can be adjusted.
Referring to fig. 4 to 7, in some other embodiments, the laser beam 10 forming stage may further include a second forming stage, in which the laser beam 10 formed in the first forming stage passes through a mask 15, and the mask 15 has a through hole with a width decreasing from the edge portion to the central portion, so as to form the laser beam 10 with a cross-sectional shape having a width decreasing from the edge portion to the central portion. The laser beam 10 passing through the mask in which the through-hole is formed has the third cross-sectional shape 151 identical to the shape of the through-hole, and the side surface of the glass substrate is irradiated, that is, the third cross-sectional shape 151 of the laser beam 10 passing through the mask has a narrow cross-sectional width in the central portion and a wide cross-sectional width in the edge portion. Although the intensity of the laser beam is uniform in the entire cross section, the energy of the laser beam 10 (a concept of multiplying the intensity and the area) is the largest at the edge portion, the energy gradually decreases toward the center portion, and the energy of the laser beam 10 is the smallest at the center portion because of the third cross-sectional shape 151. Therefore, the energy of the laser beam 10 irradiated to the both side edge portions of the side surface of the glass substrate is higher than the energy of the laser beam 10 irradiated to the central portion of the side surface of the glass substrate. In the side processing step, the side of the glass substrate may be peeled off by a predetermined thickness, and the corners of both sides of the side of the glass substrate may be chamfered at the same time. As described above, the third cross-sectional shape 151 of the laser beam 10 is deformed and then the glass substrate is peeled off and the corner portions of both sides are chamfered, so that the processing process can be simplified, the time required for processing can be saved, and the processing efficiency can be improved. And can perform precision processing to prevent the quality of the glass substrate from being reduced.
Referring to fig. 4 to 7, in another embodiment, in the second molding stage, the third cross-sectional shape 151 of the laser beam 10 may be changed by using a mask having a plurality of through-holes having different ratios of gradually decreasing widths of cross sections from the edge portion to the central portion, so that the chamfering ratio of the both side edge portions of the side surface of the glass substrate may be selectively adjusted as necessary to widen the processing width, thereby processing the both side edge portions of the side surface of the glass substrate in various forms.
As described above, according to the apparatus and method for processing a side surface of a glass substrate of the present invention, the laser beam 10 is used to simultaneously peel and chamfer the side surface of the glass substrate after changing the cross-sectional intensity distribution or shape of the laser beam 10, thereby simplifying the processing process, saving the time required for processing, and improving the processing efficiency. In addition, the apparatus and method for processing the side surface of the glass substrate of the present invention can change the intensity distribution or shape of the cross section of the laser beam 10, thereby selectively adjusting the chamfering ratio of the two side edge portions of the side surface of the glass substrate as required, thereby widening the processing width, and processing the two side edge portions of the side surface of the glass substrate in various forms.
The above disclosure of selected embodiments of the invention is intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A glass substrate side processing device is characterized by comprising:
a base;
the first supporting column is arranged on one side surface of the base in a sliding mode, and the extending direction of the first supporting column is perpendicular to the base;
one end of the second support column is slidably mounted on the first support column, the extending direction of the second support column is perpendicular to the first support column, and the second support column is arranged opposite to the base;
a first camera mounted on the second pillar;
a second camera mounted on the second pillar;
the image identification positioning processor is connected with the first camera and the second camera;
a controller connected with the image recognition positioning processor, the first support and the second support;
a laser emitter mounted on the second support with a working surface of the laser emitter facing the base.
2. The glass substrate side processing apparatus according to claim 1, wherein the laser emitter comprises a laser emitting head, an optical element, and a meniscus lens, which are arranged in this order, and a concave surface of the meniscus lens faces the glass substrate.
3. The glass substrate side processing apparatus according to claim 2, wherein the laser emitter further comprises a mask, the mask being disposed on a side of the concave surface of the meniscus lens, the mask being provided with a through hole.
4. The glass substrate side processing apparatus according to claim 3, wherein the through-hole has a shape in which a cross-sectional width of a central portion of the through-hole is smaller than a cross-sectional width of an edge portion of the through-hole.
5. The glass substrate side processing apparatus according to claim 1, wherein a first lead screw support is provided on one side of the base, a first lead screw is provided on the first lead screw support, and the first support is fitted over the first lead screw.
6. The glass substrate side processing apparatus as claimed in claim 5, wherein a first slide rail is respectively provided on both sides of the first lead screw, and the first support is slidably mounted on the first slide rail.
7. The glass substrate side processing apparatus according to claim 1, wherein a second lead screw support is provided on the first support, a second lead screw is provided on the second lead screw support, and the second support is fitted over the second lead screw.
8. The glass substrate side processing apparatus as claimed in claim 7, wherein a second slide rail is provided on each of two sides of the second lead screw, and the second support is slidably mounted on the second slide rail.
9. A method for processing the side surface of a glass substrate is characterized by at least comprising the following steps:
providing a glass substrate side processing apparatus, the processing apparatus comprising:
a base;
the first supporting column is arranged on one side surface of the base in a sliding mode, and the extending direction of the first supporting column is perpendicular to the base;
one end of the second support column is slidably mounted on the first support column, the extending direction of the second support column is perpendicular to the first support column, and the second support column is arranged opposite to the base;
a first camera mounted on the second pillar;
a second camera mounted on the second pillar;
the image identification positioning processor is connected with the first camera and the first camera;
a controller connected with the image recognition positioning processor, the first support and the second support;
a laser emitter mounted on the second support with a working surface of the laser emitter facing the base;
placing the glass substrate on the base with the side face upward;
acquiring image information of the side boundary of the glass substrate through a first camera and a second camera; determining the boundary of the side surface of the glass substrate through an image recognition positioning processor, and acquiring the position of the side surface of the glass substrate;
and controlling the first support and the second support to move through a controller, so that the laser beam emitted by the laser emitter on the second support is aligned to the side surface of the glass substrate, and processing the side surface of the glass substrate.
10. The method for processing a side surface of a glass substrate according to claim 9, wherein the method for processing the side surface of the glass substrate comprises the steps of:
in the laser beam forming stage, a laser emitter is used for forming a laser beam with a quadrangular cross section, and the intensity of the laser beam is maximum at the corner part along with the gradual increase of the intensity of the central part beam far away from the cross section; and
and a side processing stage, wherein the laser beam formed in the laser beam forming stage is arranged opposite to the side of the glass substrate, so that the side of the glass substrate is stripped by a certain thickness, and simultaneously, the side of the glass substrate and the corner part of the glass substrate are chamfered.
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