CN111831171B - Preparation method of PET (polyethylene terephthalate) substrate, capacitor film, capacitive touch screen module and complete machine module - Google Patents
Preparation method of PET (polyethylene terephthalate) substrate, capacitor film, capacitive touch screen module and complete machine module Download PDFInfo
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- CN111831171B CN111831171B CN202010504916.6A CN202010504916A CN111831171B CN 111831171 B CN111831171 B CN 111831171B CN 202010504916 A CN202010504916 A CN 202010504916A CN 111831171 B CN111831171 B CN 111831171B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
One or more embodiments of the present disclosure provide a method for preparing a PET substrate, and a capacitor film, a capacitive touch screen module, and a complete machine module, where the method includes: coating an imprinting glue layer on the surface of the PET substrate, and imprinting the imprinting glue layer to form a silver filling groove on the imprinting glue layer; the embossing area comprises a touch control area and a peripheral wiring area; filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste; and after the carbon paste layer is coated, coating a protective film on the surface of the imprinting adhesive layer. When the PET base material is prepared, coining is carried out on the touch control area and the peripheral wiring area at the same time, and the peripheral wiring area and the touch control area are made of the same material; compared with the traditional imprinting technology, the impedance of the capacitive film prepared based on the PET substrate is obviously reduced, and the screen signal is improved, so that the touch experience effect is greatly improved; in addition, the manufacturing time of the PET base material and the capacitor film is saved by one-step molding, and the yield of finished products is greatly improved, so that the production efficiency is improved.
Description
Technical Field
One or more embodiments of the present disclosure relate to the technical field of capacitive films, and in particular, to a method for preparing a PET substrate, a capacitive film, a capacitive touch screen module, and a complete machine module.
Background
Currently, in the preparation process of a large-size capacitive screen using Metal Mesh as a conductive material, a yellow light process (subtraction) and an imprinting process (addition) are commonly used; the most common stamping process is to operate separately for the visible area and the wiring area, and if one link is bad, the stamping process is a defective product; the next link is inevitably lost in the production process; therefore, the production method has complicated procedures and relatively low yield.
Disclosure of Invention
In view of this, an objective of one or more embodiments of the present disclosure is to provide a method for preparing a PET substrate, a capacitive film, a capacitive touch screen module, and a complete machine module, so as to solve the problems of complicated process and relatively low yield in the existing large-size capacitive screen preparation process.
In view of the above object, a first aspect of the present specification provides a method for producing a PET substrate, the method comprising:
coating an imprinting glue layer on the surface of the PET substrate, and imprinting the imprinting glue layer to form a silver filling groove on the imprinting glue layer; the embossing area comprises a touch control area and a peripheral wiring area;
Filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste;
and after the carbon paste layer is coated, coating a protective film on the surface of the imprinting adhesive layer.
Optionally, before the step of filling the silver paste into the silver filling groove and coating the carbon paste layer on the surface of the silver paste, the method further comprises:
and filling carbon paste into the silver filling groove.
Optionally, the filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste, including:
and filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the silver filling groove.
Optionally, the coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver-filled groove on the imprinting glue layer, including:
coating a first imprinting adhesive layer on the surface of a first PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer;
coating a second imprinting adhesive layer on the surface of a second PET substrate, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver filling groove on the second imprinting adhesive layer;
the method further comprises the steps of:
the first PET substrate coated with the protective film is bonded to the second PET substrate coated with the protective film.
Optionally, the coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver-filled groove on the imprinting glue layer, including:
coating a first imprinting adhesive layer on the first surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer;
and coating a second imprinting adhesive layer on a second surface of the PET substrate opposite to the first surface, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver filling groove on the second imprinting adhesive layer.
Optionally, the coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver-filled groove on the imprinting glue layer, including:
coating an imprinting adhesive layer on the surface of the PET substrate;
dividing the imprinting glue layer into a first part and a second part by adopting an insulating material;
stamping the first part by using a first stamping die to form a first silver-filling groove on the first part;
the second portion is imprinted with a second imprint mold to form a second silver-filled trench on the second portion.
Optionally, the coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver-filled groove on the imprinting glue layer, including:
Coating a first imprinting adhesive layer on the surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer;
filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste, wherein the silver filling groove comprises the following steps:
filling silver paste into the first silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove;
after the step of coating the carbon paste layer, before the step of coating the protective film on the surface of the imprinting glue layer, the method further comprises:
after filling up the first silver filling groove, coating a second imprinting adhesive layer on the surface of the first imprinting adhesive layer, and imprinting the second imprinting adhesive layer by adopting a second pressing die to form a second silver filling groove on the second imprinting adhesive layer;
filling silver paste into the second silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove;
after the carbon paste layer is coated, a protective film is coated on the surface of the imprinting adhesive layer, and the method comprises the following steps:
and coating a carbon slurry layer in the second silver filling groove, and coating a protective film on the surface of the second imprinting adhesive layer.
Based on the same object, a second aspect of the present specification provides a capacitive film comprising a PET substrate prepared by the method for preparing a PET substrate according to any one of the first aspects of the present specification.
Based on the same object, a third aspect of the present specification provides a capacitive touch screen module, which is prepared by bonding a capacitive film and a cover plate according to the second aspect of the present specification.
Based on the same purpose, the fourth aspect of the present specification provides a complete machine module, where the complete machine module is manufactured by laminating the capacitive touch screen module and the LCM module in a full-paste or frame-paste manner according to the third aspect of the present specification.
From the above, it can be seen that, in the preparation method of the PET substrate, the capacitor film, the capacitive touch screen module and the complete machine module provided in one or more embodiments of the present disclosure, when the PET substrate is prepared, the touch area and the peripheral routing area are stamped and formed at the same time, and the peripheral routing area and the touch area are made of the same material; compared with the traditional imprinting technology, the impedance of the capacitive film prepared based on the PET substrate is obviously reduced, and the screen signal is improved, so that the touch experience effect is greatly improved; in addition, the preparation time of the PET base material is saved by one-step molding, the manufacturing time of the capacitor film is obviously shortened, and the yield of the finished product is greatly improved, so that the production efficiency is improved, the increasing capacity requirement of the market can be met, and the economic benefit of enterprises is improved.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, the drawings that are necessary for the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only one or more embodiments of the present description, from which other drawings can be obtained, without inventive effort, for a person skilled in the art.
FIG. 1 is a schematic flow diagram of a method for preparing a capacitive film according to one or more embodiments of the present disclosure;
FIG. 2 is a schematic flow diagram of another process for making a capacitive film according to one or more embodiments of the present disclosure;
FIG. 3 is a schematic diagram illustrating a capacitive touch screen module bonded to an LCM module according to one or more embodiments of the present disclosure;
fig. 4 is a schematic structural diagram of another capacitive touch screen module according to one or more embodiments of the present disclosure after bonding with an LCM module.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
It is noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present disclosure should be taken in a general sense as understood by one of ordinary skill in the art to which the present disclosure pertains. The use of the terms "first," "second," and the like in one or more embodiments of the present description does not denote any order, quantity, or importance, but rather the terms "first," "second," and the like are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
According to the research of the inventor, the trend of the large-size capacitive screen is more and more obvious along with the market application demand, and the development of the existing conductive material by using Metal Mesh and nano silver wires is more mature; the Metal Mesh has excellent conductivity, can realize large-size breakthrough, and is considered to be the most opportunity to become one of the main touch technologies for large-size application.
Currently, in the process of manufacturing a large-size capacitive screen using Metal Mesh as a conductive material, a yellow light process (subtraction) and an imprinting process (addition) are commonly used: the yellow light process includes transferring the main pattern on the photomask onto photosensitive material, irradiating the photosensitive material with light, soaking the irradiated part with solvent to dissolve or retain the irradiated part, and the formed photoresist pattern is identical to or complementary to the photomask and includes exposure, development, etching and cleaning steps.
The embossing process is carried out by embossing the pattern of the visible area (namely the touch area), printing the silver paste of the peripheral circuit, and finally carrying out the laser peripheral wiring.
The most common stamping process is to operate separately for the visible area and the wiring area, and if one link is bad, the stamping process is a defective product; the next link is inevitably lost in the production process; therefore, the production method has complicated procedures and relatively low yield.
In order to solve the problems, the specification provides a preparation method of a PET substrate, a capacitor film, a capacitive touch screen module and a complete machine module, wherein the preparation method comprises the steps of firstly coating an imprinting adhesive layer on the surface of the PET substrate, simultaneously imprinting a touch control area and a peripheral wiring area, and forming a silver filling groove in the imprinting adhesive layer; filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste; after the carbon paste layer is coated, a protective film is coated on the surface of the imprinting adhesive layer.
According to the preparation method of the PET substrate provided by the specification, the touch control area and the peripheral wiring area are coined at the same time, and are molded at one time, and the peripheral wiring area and the touch control area are made of the same material; compared with the traditional imprinting technology, the impedance of the capacitive film prepared based on the PET substrate is obviously reduced, and the screen signal is improved, so that the touch experience effect is greatly improved; in addition, the preparation time of the PET base material is saved by one-step molding, the manufacturing time of the capacitor film is obviously shortened, and the yield of the finished product is greatly improved, so that the production efficiency is improved, the increasing capacity requirement of the market can be met, and the economic benefit of enterprises is improved.
For easy understanding, the method for producing the PET substrate is described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a method for preparing a capacitor film according to an embodiment of the present disclosure; as shown in fig. 1, the preparation method of the capacitor film comprises the following steps:
s11, coating a first imprinting adhesive layer on the surface of a first PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer; the first imprinting mold comprises an imprinting model of a first touch control area and a first peripheral wiring area;
S12, filling silver paste into the first silver filling groove, and then coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove;
s13, coating a protective film on the surface of the first imprinting adhesive layer after coating the carbon slurry layer;
s14, coating a second imprinting adhesive layer on the surface of the second PET substrate, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver filling groove on the second imprinting adhesive layer; the second imprinting mold comprises an imprinting model of a second touch control area and a second peripheral wiring area;
s15, filling silver paste into the second silver filling groove, and then coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove;
s16, coating a protective film on the surface of the second imprinting adhesive layer after coating the carbon slurry layer;
and S17, bonding the first PET base material coated with the protective film and the second PET base material coated with the protective film.
In practical application, the preparation method of the capacitor film specifically comprises the following steps:
(1) Firstly, preparing two PET substrates, namely a first PET substrate and a second PET substrate, wherein the PET substrates are transparent, and substrate protection films are adhered to two sides of the PET substrates so as to avoid adhesion and scratch of foreign matters. Coating a first imprinting adhesive layer on the surface of a first PET (polyethylene terephthalate) substrate, wherein the imprinting adhesive layer can be formed by coating UV (ultraviolet) adhesive on the surface of the PET substrate, and when the imprinting adhesive layer is prepared, the imprinting adhesive layer can be prepared by a method of baking the transferred UV adhesive in a furnace; after the first imprinting adhesive layer is coated, imprinting the first imprinting adhesive layer by adopting a first imprinting mold, so that a first silver filling groove is formed on the first imprinting adhesive layer; the thickness of the first imprint adhesive layer, the depth of the first silver filling groove and the width of the first silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
The first imprinting mold comprises an imprinting model of the first touch area and an imprinting model of the first peripheral routing area, and the imprinting model of the first touch area can be snowflake-shaped, diamond-like-shaped and the like, and is not limited in detail.
(2) And filling silver paste into the first silver filling groove after the first silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove. After the carbon paste layer is coated on the surface of the silver paste, the filling circuit of the silver paste in the silver filling groove can be blackened, the transparency of the capacitor film is improved, and the development phenomenon is avoided. In practical application, before filling silver paste into the first silver filling groove, firstly filling carbon paste into the first silver filling groove, wherein the ratio of the filled carbon paste to the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; likewise, the ratio of the carbon paste to the silver paste used when the carbon paste layer is coated on the surface of the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; and (3) coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove, namely, the carbon paste layer in the first silver filling groove is flush with the part of the first stamping glue layer from which the first silver filling groove is removed, wherein the thickness of the carbon paste layer can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited. The carbon paste is filled first before the silver paste is filled into the first silver filling groove, so that the stability of the overall performance of the capacitor film can be improved.
(3) After the carbon paste layer is coated, a protective film is integrally coated on the surface of the first imprinting adhesive layer so as to protect the first imprinting adhesive layer from adhering or scratching foreign matters. In practical application, if the first PET substrate and the second PET substrate are processed simultaneously, a protective film or an adhesive glue layer can be selectively coated on the surface of the first imprinting glue layer according to practical requirements; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited.
(4) And coating a second imprinting adhesive layer on the surface of the second PET substrate, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold after coating the second imprinting adhesive layer, so that a second silver filling groove is formed on the second imprinting adhesive layer. The thickness of the second imprint adhesive layer, the depth of the second silver filling groove and the width of the second silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
Similarly, the second imprint mold also includes an imprint model of the second touch area and an imprint model of the second peripheral trace area, where the imprint model of the second touch area may be snowflake-shaped, diamond-like, and the like, and is not limited in detail.
It is noted that, before the preparation of the capacitor film, an imprinting mold is designed first; when the imprinting mold is designed, the design of Sensor Pattern drawing is carried out through CAD software, the Pattern shapes of the imprinting mold of the touch control area and the peripheral wiring area are reflected on the same Mask tool, namely, the imprinting model of the touch control area and the imprinting model of the peripheral wiring area are reflected on the same Mask tool at the same time, so that the patterns of the touch control area and the peripheral wiring area are molded at one time.
The pattern shape of the imprint model of the first imprint mold touch area and the pattern shape of the imprint model of the second imprint mold touch area are mostly diamond-like derivative shapes, and are not particularly limited. The design of the pattern direction of the imprinting model of the first imprinting mold touch control area, the pattern direction of the imprinting model of the second imprinting mold touch control area and the included angle between the pattern direction and the pattern direction is designed according to the LCM module selected in the follow-up process in order to avoid the moire interference of the whole machine; the direction of the second silver filling groove and the direction of the first silver filling groove are also related to the LCM module selected in the subsequent process, and the method is not particularly limited.
(5) And filling silver paste into the second silver filling groove after the second silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove. In practical application, before filling silver paste into the second silver filling groove, firstly filling carbon paste into the second silver filling groove, wherein the ratio of the filled carbon paste to the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; similarly, the ratio of the carbon paste to the silver paste adopted when the carbon paste layer is coated on the surface of the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove, namely, the carbon paste layer in the second silver filling groove is flush with the part of the second stamping glue layer from which the second silver filling groove is removed. The carbon paste is filled first before the silver paste is filled into the second silver filling groove, so that the stability of the overall performance of the capacitor film can be improved.
(6) After the carbon paste layer is coated in the second silver filling groove, a protective film is integrally coated on the surface of the second imprinting adhesive layer so as to protect the second imprinting adhesive layer and prevent foreign matters from adhering or scratching. In practical application, if the first PET substrate and the second PET substrate are processed simultaneously, a protective film or an adhesive glue layer can be selectively coated on the surface of the second imprinting glue layer according to practical requirements; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited.
(7) And bonding the first PET substrate and the second PET substrate to obtain the capacitor film.
In the case of bonding the first PET substrate to the second PET substrate, in one case, in order to obtain a capacitor film of the first PET substrate on the second PET substrate, the protective film coated on the surface of the second imprint adhesive layer is removed, and the substrate protective film on the surface of the first PET substrate is removed, and then an adhesive glue layer is coated on the surface of the second imprint adhesive layer or the surface of the first PET substrate from which the substrate protective film is removed, the first PET substrate and the second PET substrate are bonded by using the adhesive glue layer, and the adhesive glue layer may be prepared by using an OCA optical adhesive or an OCR optical adhesive, specifically without limitation. When the capacitive touch screen module is required to be further prepared, the protective film coated on the surface of the first imprinting adhesive layer can be removed, then an adhesive layer is coated on the surface of the first imprinting adhesive layer or the surface of the cover plate, and the first imprinting adhesive layer and the cover plate are adhered by adopting the adhesive layer to obtain the capacitive touch screen module. After the capacitive touch screen module is obtained, the capacitive touch screen module can be further bonded with an LCM module to prepare a complete machine module, the substrate protective film on the surface of the second PET substrate can be torn off, and then the second PET substrate from which the substrate protective film is torn off is bonded with the LCM module in a full-paste or frame-paste mode; when the capacitive touch screen module is bonded in a full-paste mode, OCA optical adhesive or OCR optical adhesive can be coated on the surface of the LCM module or the surface of the second PET substrate, from which the substrate protective film is removed, so that the capacitive touch screen module and the LCM module are bonded to prepare a complete machine module; when the capacitive touch screen module is adhered in a frame-sticking mode, 3M glue can be coated on the periphery of the surface of the LCM module or the periphery of the surface of the second PET substrate, from which the substrate protective film is removed, so that the capacitive touch screen module and the LCM module are adhered to prepare the complete machine module, and the obtained structure is shown in figure 3.
Fig. 3 is a schematic structural diagram of a capacitive touch screen module and an LCM module after bonding, which is provided in the specification, namely a schematic structural diagram of a complete machine module; as shown in fig. 3, the structure includes a sensing layer 31, a driving layer 32, an adhesive layer 33, a cover plate 34, an LCM module 35, a first PET substrate 36, and a second PET substrate 37; the induction layer 31 is coated on the surface of the first PET substrate 36, and the driving layer 32 is coated on the surface of the second PET substrate 37; the cover plate 34 is respectively adhered to the sensing layer 31, the first PET substrate 36 is adhered to the driving layer 32, and the second PET substrate 37 is adhered to the LCM module 35 through an adhesive layer 33.
In practical applications, the first imprinting adhesive layer provided with the first silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the induction layer, and the second imprinting adhesive layer provided with the second silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the driving layer.
In this case, in order to obtain a capacitor film of the first PET substrate on the lower layer of the second PET substrate, the protective film coated on the surface of the first imprinting adhesive layer is removed, and the substrate protective film on the surface of the second PET substrate is removed, and then an adhesive glue layer is coated on the surface of the first imprinting adhesive layer or the surface of the second PET substrate from which the substrate protective film is removed, and the first PET substrate and the second PET substrate are adhered by using the adhesive glue layer, and the adhesive glue layer may be prepared by using OCA optical glue or OCR optical glue, without limitation. When the capacitive touch screen module is required to be further prepared, the protective film coated on the surface of the second imprinting adhesive layer can be removed, then an adhesive glue layer is coated on the surface of the second imprinting adhesive layer or the surface of the cover plate, and the second imprinting adhesive layer is adhered with the cover plate by adopting the adhesive glue layer to obtain the capacitive touch screen module; after the capacitive touch screen module is obtained, the capacitive touch screen module can be further bonded with an LCM module to prepare a complete machine module, the substrate protective film on the surface of the first PET substrate can be torn off, and then the first PET substrate from which the substrate protective film is torn off is bonded with the LCM module in a full-paste or frame-paste mode to prepare the complete machine module; when the capacitive touch screen module is bonded in a full-paste mode, OCA optical adhesive or OCR optical adhesive can be coated on the surface of the LCM module or the surface of the first PET substrate removed from the substrate protective film, so that the capacitive touch screen module and the LCM module are bonded to prepare a complete machine module; when the capacitive touch screen module is adhered in a frame-sticking mode, 3M glue can be coated on the periphery of the surface of the LCM module or the periphery of the surface of the second PET substrate, from which the substrate protective film is removed, so that the capacitive touch screen module and the LCM module are adhered to prepare the complete machine module.
It is noted that after the first imprinting adhesive layer is coated on the surface of the first PET substrate and the first imprinting adhesive layer is imprinted by the first imprinting mold to form the first silver-filled groove in the first imprinting adhesive layer, the same treatment can be continuously performed on the second PET substrate, namely, the second imprinting adhesive layer is coated on the surface of the second PET substrate, and the second imprinting adhesive layer is imprinted by the second imprinting mold to form the second silver-filled groove in the second imprinting adhesive layer; and then carrying out subsequent operation on the first silver filling groove and the second silver filling groove respectively so as to save the preparation time of the capacitor film.
The capacitor film prepared by the preparation method of the capacitor film comprises the following steps: the first PET substrate, the coating is equipped with the first silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill in the first impression glue film of first PET substrate surface, the second PET substrate, the coating is equipped with the second silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill in the second impression glue film of second PET substrate surface, the bonding glue layer that sets up between first PET substrate and second impression glue film, the coating is at the protection film of first impression glue film surface. In practical applications, the first imprinting adhesive layer provided with the first silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the induction layer, and the second imprinting adhesive layer provided with the second silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the driving layer.
When the capacitive film is prepared in the embodiment of the specification, the touch control area and the peripheral wiring area are coined at the same time, and are molded at one time, and the peripheral wiring area and the touch control area are made of the same material; compared with the traditional imprinting technology, the impedance of the capacitive film prepared based on the PET substrate is obviously reduced, and the screen signal is improved, so that the touch experience effect is greatly improved; in addition, the preparation time of the PET base material is saved by one-step molding, the manufacturing time of the capacitor film is obviously shortened, and the yield of the finished product is greatly improved, so that the production efficiency is improved, the increasing capacity requirement of the market can be met, and the economic benefit of enterprises is improved.
FIG. 2 is a schematic diagram of a capacitor film according to another embodiment of the present disclosure; as shown in fig. 2, the preparation method of the capacitor film includes:
s21, coating a first imprinting adhesive layer on the first surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer; the first imprinting mold comprises an imprinting model of a first touch control area and a first peripheral wiring area;
s22, filling silver paste into the first silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove;
S23, coating a protective film on the surface of the first imprinting adhesive layer after coating the carbon slurry layer;
s24, coating a second imprinting adhesive layer on a second surface of the PET substrate opposite to the first surface, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver-filled groove on the second imprinting adhesive layer; the second imprinting mold comprises an imprinting model of a second touch control area and a second peripheral wiring area;
s25, filling silver paste into the second silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove;
s26, coating a protective film on the surface of the second imprinting adhesive layer after coating the carbon slurry layer.
In practical application, the preparation method of the capacitor film specifically comprises the following steps:
(1) Firstly, preparing a PET base material, taking down the base material protective film for cleaning treatment, and carrying out subsequent construction. And coating a first imprinting adhesive layer on the first surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold after coating the first imprinting adhesive layer, so that a first silver filling groove is formed on the first imprinting adhesive layer.
The thickness of the first imprint adhesive layer, the depth of the first silver filling groove and the width of the first silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(2) And filling silver paste into the first silver filling groove after the first silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove. In practical application, before filling silver paste into the first silver filling groove, firstly filling carbon paste into the first silver filling groove, wherein the ratio of the filled carbon paste to the silver paste can be comprehensively determined according to the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; similarly, the ratio of the carbon paste to the silver paste used in the application of the carbon paste layer on the surface of the silver paste can be determined comprehensively according to the requirements of users, the size of the capacitor film and the scheme of the semiconductor element. And coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove, namely, the carbon paste layer in the first silver filling groove is flush with the part of the first stamping glue layer from which the first silver filling groove is removed.
(3) After the carbon paste layer is coated, a protective film is integrally coated on the surface of the first imprinting adhesive layer so as to protect the first imprinting adhesive layer from adhering or scratching foreign matters.
(4) And coating a second imprinting adhesive layer on the second surface of the PET substrate, wherein the second surface is opposite to the first surface, and imprinting the second imprinting adhesive layer by using a second imprinting mold after coating the second imprinting adhesive layer, so that a second silver filling groove is formed on the second imprinting adhesive layer. The thickness of the second imprint adhesive layer, the depth of the second silver filling groove and the width of the second silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(5) And filling silver paste into the second silver filling groove after the second silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove. In practical application, before filling silver paste into the second silver filling groove, firstly filling carbon paste into the second silver filling groove, wherein the proportion of the filled carbon paste to the silver paste can be determined according to the user requirement, the size of the capacitor film and the scheme of the semiconductor element; similarly, the ratio of the carbon paste to the silver paste used in the application of the carbon paste layer on the surface of the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element. And coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove, namely, the carbon paste layer in the second silver filling groove is flush with the part of the second stamping glue layer from which the second silver filling groove is removed.
(6) And after the carbon paste layer is coated in the second silver filling groove, a protective film is continuously coated on the whole surface of the second imprinting adhesive layer so as to protect the second imprinting adhesive layer and prevent foreign matters from adhering or scratching. In practical application, if the capacitive film is not a target product, after filling up the second silver filling groove, the capacitive touch screen module needs to be immediately adhered to the cover plate to prepare the capacitive touch screen module, and after the carbon paste layer is coated, an adhesive glue layer can be integrally coated on the surface of the second imprinting glue layer, so that the preparation of the subsequent capacitive touch screen module is facilitated; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited.
In practical application, after the capacitive film is obtained, if the capacitive touch screen module is further desired to be obtained, and the capacitive film is adopted to prepare the capacitive touch screen module after a period of time is elapsed from the obtaining of the capacitive film, the protective film on the surface of the first imprinting adhesive layer or the protective film on the surface of the second imprinting adhesive layer can be removed, then an adhesive glue layer is coated on the surface of the first imprinting adhesive layer or the surface of the second imprinting adhesive layer, and the first surface of the PET substrate or the second surface of the PET substrate and the cover plate are adhered by adopting the adhesive glue layer to obtain the capacitive touch screen module; the protective film on the surface of the first stamping adhesive layer or the protective film on the surface of the second stamping adhesive layer can be removed, then an adhesive glue layer is coated on the surface of the cover plate, and the first surface of the PET substrate or the second surface of the PET substrate and the cover plate are adhered by the adhesive glue layer to obtain the capacitive touch screen module, which is not particularly limited; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited. After the capacitive touch screen module is obtained, the capacitive touch screen module can be further bonded with an LCM module to prepare a complete machine module, the protective film on the surface of the second imprinting adhesive layer or the protective film on the surface of the first imprinting adhesive layer can be removed again, and then the second surface of the PET substrate or the first surface of the PET substrate and the LCM module are bonded in a full-paste or frame-paste mode to prepare the complete machine module; when the capacitive touch screen module is bonded in a full-paste mode, OCA optical adhesive or OCR optical adhesive can be coated on the surface of the second imprinting adhesive layer or the surface of the first imprinting adhesive layer, so that the capacitive touch screen module and the LCM module are bonded; OCA optical cement or OCR optical cement can be coated on the surface of the LCM module, so that the capacitive touch screen module and the LCM module can be bonded, and the method is not particularly limited. When the capacitive touch screen module is adhered in a frame-sticking mode, 3M glue can be coated on the periphery of the surface of the second stamping glue layer or the periphery of the surface of the first stamping glue layer, so that the capacitive touch screen module is adhered with the LCM module; the 3M glue may be applied around the surface of the LCM module, so as to bond the capacitive touch screen module and the LCM module, and the resulting structure is shown in fig. 4.
Fig. 4 is a schematic structural diagram of a capacitive touch screen module and an LCM module after bonding, that is, a schematic structural diagram of a complete machine module; as shown in fig. 4, the structure includes a sensing layer 31, a driving layer 32, an adhesive layer 33, a cover plate 34, an LCM module 35, and a first PET substrate 36; the sensing layer 31 and the driving layer 32 are respectively coated on two sides of the first PET substrate 36; the cover plate 34 is adhered to the sensing layer 31, the driving layer 32 is adhered to the LCM module 35 through the adhesive layer 33.
The capacitor film prepared by the preparation method of the capacitor film comprises the following steps: the PET substrate, respectively coating are equipped with the first silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill level in the first impression glue film of PET substrate both sides and second impression glue film, and be equipped with the second silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill level in the second impression glue film, the protection film of coating on first impression glue film surface and the protection film of coating on second impression glue film surface. In practical applications, the first imprinting adhesive layer provided with the first silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the induction layer, and the second imprinting adhesive layer provided with the second silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the driving layer.
The capacitor film prepared in the embodiment of the present specification has the same advantageous effects as described above. Meanwhile, the induction layer and the driving layer are prepared on the same side of the same PET substrate, so that the consumption of the PET substrate is reduced, and the production cost is further reduced.
In still another embodiment of the present disclosure, a method for preparing a capacitive film includes:
s31, coating an imprinting adhesive layer on the surface of the PET substrate;
s32, dividing the stamping adhesive layer into a first part and a second part by adopting an insulating material;
s33, imprinting the first part by adopting a first imprinting mold to form a first silver-filled groove on the first part; the first imprinting mold comprises an imprinting model of a first touch control area and a first peripheral wiring area;
s34, filling silver paste into the first silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove;
s35, stamping the second part by adopting a second stamping die to form a second silver filling groove on the second part; the second imprinting mold comprises an imprinting model of a second touch control area and a second peripheral wiring area;
s36, filling silver paste into the second silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove;
and S37, coating protective films on the surfaces of the first imprinting adhesive layer and the second imprinting adhesive layer after coating the carbon slurry layer.
In practical application, the preparation method of the capacitor film specifically comprises the following steps:
(1) Firstly, preparing a PET substrate, wherein the PET substrate is transparent, substrate protection films are adhered to two sides of the PET substrate to avoid adhesion and scratch of foreign matters, when preparing a capacitor film, the substrate protection film on one side of the PET substrate needs to be removed for cleaning treatment, then an imprinting adhesive layer is coated on one side of the PET substrate from which the substrate protection film is removed, and the thickness of the imprinting adhesive layer can be comprehensively determined according to the size of the capacitor film and the scheme of a semiconductor element without limitation.
(2) After the imprinting glue layer is coated, the imprinting glue layer is further divided into a first part and a second part by using an insulating material. The adoption of the insulating side material to divide the stamping adhesive layer into the first part and the second part can prevent the occurrence of the phenomenon of short circuit of the two parts in the capacitor film manufactured finally in the subsequent manufacturing process. The ratio of the first portion to the second portion can be determined comprehensively according to the size of the capacitor film and the scheme of the semiconductor element, and is not particularly limited.
(3) Then, imprinting the first part by adopting a first imprinting mold, and forming a first silver filling groove on the first part; the depth of the first silver filling groove and the width of the first silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(4) And filling silver paste into the first silver filling groove after the first silver filling groove is obtained, coating a carbon paste layer on the surface of the silver paste, and filling up the first silver filling groove. After the carbon paste layer is coated on the surface of the silver paste, the filling circuit of the silver paste in the silver filling groove can be blackened, the transparency of the capacitor film is improved, and the development phenomenon is avoided. In practical application, before filling silver paste into the first silver filling groove, firstly filling carbon paste into the first silver filling groove, wherein the ratio of the filled carbon paste to the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; the ratio of the carbon paste to the silver paste used in the application of the carbon paste layer on the surface of the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element. And coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove, namely, the carbon paste layer in the first silver filling groove is flush with the part of the first stamping glue layer from which the first silver filling groove is removed.
(5) And stamping the second part by using a second stamping die, and forming a second silver filling groove on the second part. The depth of the second silver filling groove and the width of the second silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(6) And after the second silver filling groove is obtained, filling silver paste into the second silver filling groove, and then coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove. In practical application, before filling silver paste into the second silver filling groove, firstly filling carbon paste into the second silver filling groove, wherein the proportion of the filled carbon paste to the silver paste can be determined according to the user requirement, the size of the capacitor film and the scheme of the semiconductor element; the proportion of the carbon paste to the silver paste adopted when the carbon paste layer is coated on the surface of the silver paste can be determined according to the comprehensive consideration of the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove, namely, the carbon paste layer in the second silver filling groove is flush with the part of the second stamping glue layer from which the second silver filling groove is removed.
(7) After the carbon paste layer is coated in the second silver filling groove, the surfaces of the first stamping glue layer and the second stamping glue layer are coated with protective films integrally so as to protect the first stamping glue layer and the second stamping glue layer and prevent foreign matters from adhering or scratching. In practical application, if the capacitive film is not a target product, the capacitive film is immediately adhered to the cover plate to prepare the capacitive touch screen module after filling the second silver filling groove, and after the carbon paste layer is coated, an adhesive glue layer can be integrally coated on the surface of the first imprinting glue layer or the surface of the second imprinting glue layer, so that the subsequent preparation of the capacitive touch screen module is facilitated; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited.
In practical application, after the capacitive film is obtained, if the capacitive touch screen module is further desired to be obtained, the protective film on the surface of the first part of the imprinting adhesive layer or the protective film on the surface of the second part of the imprinting adhesive layer can be removed, then an adhesive glue layer is coated on the surface of the first part of the imprinting adhesive layer or the surface of the second part of the imprinting adhesive layer, and the first part of the imprinting adhesive layer or the second part of the imprinting adhesive layer and the cover plate are adhered by adopting the adhesive glue layer to obtain the capacitive touch screen module; the protective film on the surface of the first part of the imprinting adhesive layer or the protective film on the surface of the second part of the imprinting adhesive layer can be removed, then an adhesive layer is coated on the surface of the cover plate, and the first part of the imprinting adhesive layer or the second part of the imprinting adhesive layer is adhered to the cover plate by adopting the adhesive layer to obtain the capacitive touch screen module, which is not particularly limited. After the capacitive touch screen module is obtained, the capacitive touch screen module can be further bonded with an LCM module to prepare a complete machine module, the protective film on the surface of the second part of the imprinting adhesive layer or the protective film on the surface of the first part of the imprinting adhesive layer can be removed again, and then the second part of the imprinting adhesive layer or the first part of the imprinting adhesive layer is bonded with the LCM module in a full-paste or frame-paste mode to prepare the complete machine module; when the capacitive touch screen module is bonded in a full-paste mode, OCA optical adhesive or OCR optical adhesive can be coated on the surface of the second part of the imprinting adhesive layer or the surface of the first part of the imprinting adhesive layer, so that the capacitive touch screen module and the LCM module are bonded; OCA optical cement or OCR optical cement can be coated on the surface of the LCM module, so that the capacitive touch screen module and the LCM module can be bonded, and the method is not particularly limited. When the capacitive touch screen module is adhered in a frame-sticking mode, 3M glue can be coated on the periphery of the surface of the second part of the stamping glue layer or the periphery of the surface of the first part of the stamping glue layer, so that the capacitive touch screen module and the LCM module are adhered; and 3M glue can be coated on the periphery of the surface of the LCM module, so that the capacitive touch screen module and the LCM module are bonded.
It is noted that the first silver-filled groove may be formed in the first portion of the imprint adhesive layer by using a first imprint mold, and the second silver-filled groove may be formed in the second portion of the imprint adhesive layer by using a second imprint mold, that is, the first silver-filled groove may be formed in the first portion of the imprint adhesive layer and the second silver-filled groove may be formed in the second portion of the imprint adhesive layer; and then carrying out subsequent operations on the first silver filling groove and the second silver filling groove respectively.
The capacitor film prepared by the preparation method of the capacitor film comprises the following steps: the PET substrate, the impression glue film of coating in PET substrate one side, and insulating material divide into first part and second part with the impression glue film, is equipped with the first silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill level in first part, is equipped with the second silver filling groove that fills silver thick liquid and adopt the carbon thick liquid layer to fill level in the second part, the protection film of coating on first part surface and the protection film of coating on second part surface. In practical application, a first portion of the imprinting adhesive layer provided with a first silver filling groove filled with silver paste and filled with a carbon paste layer may be regarded as an induction layer, and a second portion of the imprinting adhesive layer provided with a second silver filling groove filled with silver paste and filled with a carbon paste layer may be regarded as a driving layer, which is not particularly limited.
The capacitor film prepared in the embodiment of the present specification has the same advantageous effects as described above.
In still another embodiment of the present disclosure, a method for preparing a capacitive film includes:
s41, coating a first imprinting adhesive layer on the surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer; the first imprinting mold comprises an imprinting model of a first touch control area and a first peripheral wiring area;
s42, filling silver paste into the first silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove;
s43, after filling up the first silver filling groove, coating a second imprinting adhesive layer on the surface of the first imprinting adhesive layer, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver filling groove on the second imprinting adhesive layer; the second imprinting mold comprises an imprinting model of a second touch control area and a second peripheral wiring area;
s44, filling silver paste into the second silver filling groove, and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove;
s45, coating a carbon paste layer in the second silver filling groove, and coating a protective film on the surface of the second imprinting adhesive layer.
In practical application, the preparation method of the capacitor film specifically comprises the following steps:
(1) Firstly, preparing a PET substrate, wherein the PET substrate is transparent, substrate protection films are adhered to two sides of the PET substrate to avoid adhesion and scratch of foreign matters, when preparing a capacitor film, the substrate protection film on one side of the PET substrate needs to be taken down for cleaning treatment, then a first embossing adhesive layer is coated on one side of the PET substrate from which the substrate protection film is removed, after the first embossing adhesive layer is coated, the first embossing adhesive layer is embossed by a first embossing die, and therefore a first silver filling groove is formed on the first embossing adhesive layer.
The thickness of the first imprint adhesive layer, the depth of the first silver filling groove and the width of the first silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(2) And filling silver paste into the first silver filling groove after the first silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove. In practical application, before filling silver paste into the first silver filling groove, firstly filling carbon paste into the first silver filling groove, wherein the ratio of the filled carbon paste to the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; similarly, the ratio of the carbon paste to the silver paste used in the application of the carbon paste layer on the surface of the silver paste can be determined by comprehensively considering the requirements of users, the size of the capacitor film and the scheme of the semiconductor element. And coating a carbon paste layer on the surface of the silver paste to fill up the first silver filling groove, namely, the carbon paste layer in the first silver filling groove is flush with the part of the first stamping glue layer from which the first silver filling groove is removed.
(3) And after the carbon paste layer is coated and filled up the first silver filling groove, coating a second imprinting adhesive layer on the surface of the first imprinting adhesive layer to obtain a second imprinting adhesive layer, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold, thereby forming a second silver filling groove on the second imprinting adhesive layer. The thickness of the second imprint adhesive layer, the depth of the second silver filling groove and the width of the second silver filling groove can be comprehensively determined according to the size of the capacitor film and the scheme of the semiconductor element, and the method is not particularly limited.
(4) And filling silver paste into the second silver filling groove after the second silver filling groove is obtained, and then coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove. In practical application, before filling silver paste into the second silver filling groove, firstly filling carbon paste into the second silver filling groove, wherein the proportion of the filled carbon paste to the silver paste can be determined according to the user requirement, the size of the capacitor film and the scheme of the semiconductor element; the proportion of the carbon paste to the silver paste adopted when the carbon paste layer is coated on the surface of the silver paste can be determined according to the comprehensive consideration of the requirements of users, the size of the capacitor film and the scheme of the semiconductor element; and coating a carbon paste layer on the surface of the silver paste to fill up the second silver filling groove, namely, the carbon paste layer in the second silver filling groove is flush with the part of the second stamping glue layer from which the second silver filling groove is removed.
(5) And after the carbon paste layer is coated in the second silver filling groove, a protective film is continuously coated on the whole surface of the second imprinting adhesive layer so as to protect the second imprinting adhesive layer and prevent foreign matters from adhering or scratching. In practical application, if the capacitive film is not a target product, after filling up the second silver filling groove, the capacitive touch screen module needs to be immediately adhered to the cover plate to prepare the capacitive touch screen module, and after the carbon paste layer is coated, an adhesive glue layer can be integrally coated on the surface of the second imprinting glue layer, so that the preparation of the subsequent capacitive touch screen module is facilitated; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited.
In practical application, after the capacitive film is obtained, a capacitive touch screen module is further required to be obtained, and a certain time interval is reserved between the preparation of the capacitive film and the preparation of the capacitive touch screen module, the protective film on the surface of the second imprinting adhesive layer can be removed, then an adhesive glue layer is coated on the surface of the second imprinting adhesive layer or the surface of the cover plate, and the second imprinting adhesive layer and the cover plate are adhered by adopting the adhesive glue layer to obtain the capacitive touch screen module; the adhesive glue layer can be prepared by OCA optical glue or OCR optical glue, and is not particularly limited. After the capacitive touch screen module is obtained, the capacitive touch screen module can be further bonded with an LCM module to prepare a complete machine module, then the substrate protective film on the other side of the PET substrate can be removed again, and then the surface of one side of the PET substrate, from which the substrate protective film is removed, is bonded with the LCM module in a full-paste or frame-paste mode to prepare the complete machine module; when the capacitive touch screen module is bonded in a full-paste mode, OCA optical adhesive or OCR optical adhesive can be coated on one side surface of the PET substrate, from which the substrate protective film is removed, or on the surface of the LCM module, so that the capacitive touch screen module and the LCM module are bonded. When the capacitive touch screen module is adhered in a frame-sticking mode, 3M glue can be coated on the periphery of one side surface of the PET substrate, from which the substrate protective film is removed, or the periphery of the surface of the LCM module, so that the capacitive touch screen module and the LCM module are adhered.
The capacitor film prepared by the preparation method of the capacitor film comprises the following steps: the PET substrate, the first imprinting adhesive layer coated on the surface of the PET substrate, the second imprinting adhesive layer coated on the surface of the first imprinting adhesive layer and the protective film coated on the surface of the second imprinting adhesive layer; and a first silver filling groove filled with silver paste and filled with a carbon paste layer is formed in the first stamping glue layer, and a second silver filling groove filled with silver paste and filled with a carbon paste layer is formed in the second stamping glue layer.
In practical applications, the second imprinting adhesive layer provided with the second silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the induction layer, and the first imprinting adhesive layer provided with the first silver filling groove filled with silver paste and filled with the carbon paste layer can be regarded as the driving layer.
The capacitor film prepared in the embodiment of the present specification has the same advantageous effects as described above.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; combinations of features of the above embodiments or in different embodiments are also possible within the spirit of the present disclosure, steps may be implemented in any order, and there are many other variations of the different aspects of one or more embodiments described above which are not provided in detail for the sake of brevity.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description.
The present disclosure is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the one or more embodiments of the disclosure, are therefore intended to be included within the scope of the disclosure.
Claims (6)
1. A method of making a PET substrate, the method comprising:
coating an imprinting glue layer on the surface of the PET substrate, and imprinting the imprinting glue layer to form a silver filling groove on the imprinting glue layer; the embossing area comprises a touch control area and a peripheral wiring area;
filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste;
after the carbon paste layer is coated, a protective film is coated on the surface of the imprinting adhesive layer;
the step of coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver filling groove on the imprinting glue layer comprises the following steps:
Coating an imprinting adhesive layer on the surface of the PET substrate;
dividing the imprinting glue layer into a first part and a second part by adopting an insulating material;
stamping the first part by using a first stamping die to form a first silver-filling groove on the first part;
stamping the second portion with a second stamping die to form a second silver-filled slot on the second portion; wherein the first portion corresponds to the sensing layer; the second part corresponds to the driving layer;
or alternatively
The step of coating an imprinting glue layer on the surface of the PET substrate, imprinting the imprinting glue layer to form a silver filling groove on the imprinting glue layer comprises the following steps:
coating a first imprinting adhesive layer on the surface of the PET substrate, and imprinting the first imprinting adhesive layer by adopting a first imprinting mold to form a first silver filling groove on the first imprinting adhesive layer;
filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste, wherein the silver filling groove comprises the following steps:
filling silver paste into the first silver filling groove, and coating a carbon paste layer on the surface of the silver paste until the first silver filling groove is filled;
after the step of coating the carbon paste layer, before the step of coating the protective film on the surface of the imprinting glue layer, the method further comprises:
after filling up the first silver filling groove, coating a second imprinting adhesive layer on the surface of the first imprinting adhesive layer, and imprinting the second imprinting adhesive layer by adopting a second imprinting mold to form a second silver filling groove on the second imprinting adhesive layer;
Filling silver paste into the second silver filling groove, and coating a carbon paste layer on the surface of the silver paste until the second silver filling groove is filled;
after the carbon paste layer is coated, a protective film is coated on the surface of the imprinting adhesive layer, and the method comprises the following steps:
coating a carbon slurry layer in the second silver filling groove, and coating a protective film on the surface of the second imprinting adhesive layer; wherein the first imprinting adhesive layer corresponds to the induction layer; the second imprinting glue layer corresponds to the driving layer.
2. The method of producing a PET substrate according to claim 1, wherein before the step of filling the silver paste into the silver filling tank and coating the surface of the silver paste with a carbon paste layer, the method further comprises:
and filling carbon paste into the silver filling groove.
3. The method for producing a PET substrate according to claim 1, wherein the filling the silver paste into the silver filling tank and coating a carbon paste layer on the surface of the silver paste comprises:
filling silver paste into the silver filling groove, and coating a carbon paste layer on the surface of the silver paste until the silver filling groove is filled.
4. A capacitor film comprising the PET substrate prepared by the method of preparing a PET substrate according to any one of claims 1 to 3.
5. A capacitive touch screen module, wherein the capacitive touch screen module is prepared by bonding the capacitive film of claim 4 to a cover plate.
6. The complete machine module is characterized in that the complete machine module is manufactured by adopting the capacitive touch screen module and the LCM module in a full-paste or frame-paste mode.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014117477A1 (en) * | 2013-02-04 | 2014-08-07 | 南昌欧菲光科技有限公司 | Double-layered transparent conducting film and preparation method therefor |
| CN103984457A (en) * | 2014-05-06 | 2014-08-13 | 无锡格菲电子薄膜科技有限公司 | Double-layer capacitive touch screen and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103164100B (en) * | 2013-03-28 | 2014-08-06 | 南昌欧菲光科技有限公司 | Capacitive touch screen |
| CN103235660B (en) * | 2013-04-12 | 2014-08-06 | 深圳欧菲光科技股份有限公司 | Double-layer touch screen and manufacturing method thereof |
| CN103365473B (en) * | 2013-07-05 | 2016-02-24 | 南昌欧菲光显示技术有限公司 | Optical filter box and touch display screen |
| JP6240756B2 (en) * | 2014-05-16 | 2017-11-29 | 富士フイルム株式会社 | Touch panel and manufacturing method thereof |
| CN106445225A (en) * | 2016-08-03 | 2017-02-22 | 深圳市骏达光电股份有限公司 | Touch screen and processing method thereof |
| CN109935385A (en) * | 2017-12-15 | 2019-06-25 | 南昌欧菲光科技有限公司 | Conductive film, fingerprint recognition component, pressure touch component and terminal device |
-
2020
- 2020-06-05 CN CN202010504916.6A patent/CN111831171B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014117477A1 (en) * | 2013-02-04 | 2014-08-07 | 南昌欧菲光科技有限公司 | Double-layered transparent conducting film and preparation method therefor |
| CN103984457A (en) * | 2014-05-06 | 2014-08-13 | 无锡格菲电子薄膜科技有限公司 | Double-layer capacitive touch screen and preparation method thereof |
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| CN111831171A (en) | 2020-10-27 |
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