CN111829705A - Impact force detection sensor based on piezoelectric polymer expansion ring - Google Patents
Impact force detection sensor based on piezoelectric polymer expansion ring Download PDFInfo
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- CN111829705A CN111829705A CN202010679452.2A CN202010679452A CN111829705A CN 111829705 A CN111829705 A CN 111829705A CN 202010679452 A CN202010679452 A CN 202010679452A CN 111829705 A CN111829705 A CN 111829705A
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- 229920000642 polymer Polymers 0.000 title claims abstract description 69
- 238000001514 detection method Methods 0.000 title claims abstract description 37
- 230000001681 protective effect Effects 0.000 claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- 239000002033 PVDF binder Substances 0.000 claims description 10
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 229920006132 styrene block copolymer Polymers 0.000 claims description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920000098 polyolefin Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 6
- 229920006254 polymer film Polymers 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229920005669 high impact polystyrene Polymers 0.000 claims description 3
- 239000004797 high-impact polystyrene Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 239000004636 vulcanized rubber Substances 0.000 claims description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 230000006378 damage Effects 0.000 abstract description 5
- 230000035945 sensitivity Effects 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0052—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to impact
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention relates to an impact force detection sensor based on a piezoelectric polymer expansion ring, and belongs to the technical field of sensors. The technical problems of short service life and low sensitivity of the impact force detection sensor in the prior art are solved. The sensor comprises a protective shell, an annular buffer layer, an outer electrode layer, a piezoelectric polymer expansion ring, an inner electrode layer, an inner impacted layer and an external lead wire, wherein the outer electrode layer is arranged on the inner electrode layer; wherein, the outer electrode layer and the inner electrode layer are respectively fixed on the outer surface and the inner surface of the piezoelectric polymer expansion ring; the annular buffer layer is fixed on the outer surface of the outer electrode, and the inner impacted layer is fixed on the inner surface of the inner electrode; the protective shell comprises a bottom packaging protective shell and a top packaging protective shell; the two external leads are respectively fixedly connected with the outer electrode layer and the inner electrode layer, and the exposed ends of the two external leads are led out from the protective shell. The sensor reduces the risk of damage of the piezoelectric polymer expansion ring and improves the sensitivity of the impact force detection sensor.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to an impact force detection sensor based on a piezoelectric polymer expansion ring.
Background
The impact force detection sensor is one kind of pressure sensor, shows excellent response to dynamic force detection, and is one device capable of converting outer impact force into charge or voltage output signal.
Compared with piezoelectric ceramic materials, the piezoelectric polymer material has the characteristics of light weight, good flexibility, no toxicity, excellent biocompatibility, excellent durability and the like, and is one of ideal materials for manufacturing the piezoelectric layer of the impact force detection sensor. However, whether the piezoelectric crystal or the flexible polymer piezoelectric film is a piezoelectric crystal, there is a risk of damage or destruction of the piezoelectric layer when a large impact force is applied, which seriously affects the service life of the impact force detection sensor. Meanwhile, the sensitivity of the impact force detection sensor is generally low, and the application of the impact force detection sensor in the fields of intelligent traffic, water conservancy and hydropower, building engineering, military industry and the like is severely limited.
Disclosure of Invention
In view of this, the invention provides an impact force detection sensor based on a piezoelectric polymer expansion ring, which aims to solve the technical problems of short service life and low sensitivity of the impact force detection sensor in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows.
The impact force detection sensor based on the piezoelectric polymer expansion ring comprises a protective shell, an annular buffer layer, an outer electrode layer, the piezoelectric polymer expansion ring, an inner electrode layer, an internal impacted layer and an external lead;
the outer electrode layer, the piezoelectric polymer expansion ring and the inner electrode layer are all annular and have the same height, are coaxially arranged from outside to inside and are aligned up and down, and the outer electrode layer and the inner electrode layer are respectively fixed on the outer surface and the inner surface of the piezoelectric polymer expansion ring; the piezoelectric polymer expansion ring is made of a piezoelectric polymer film;
the height of the annular buffer layer is 1.1-1.5 times of that of the piezoelectric polymer expansion ring, the annular buffer layer and the outer electrode layer are coaxially arranged, and the middle part of the inner surface is fixed on the outer surface of the outer electrode layer;
the inner impacted layer consists of a base and a boss; the base is cylindrical and has the same height as the annular buffer layer, the base and the inner electrode layer are coaxially arranged, the middle part of the outer surface of the base is fixedly connected with the inner surface of the inner electrode layer, and the upper surface and the lower surface of the base are respectively aligned with the upper surface and the lower surface of the annular buffer layer; the boss is cylindrical, the lower surface of the boss is fixed on the upper surface of the base and is coaxial with the base, the top end of the boss extends out of the central through hole of the cover plate, and the upper surface of the boss is higher than the upper surface of the cover plate;
the protective shell comprises a bottom packaging protective shell and a top packaging protective shell; the bottom packaging protection shell is a cylinder with an opening at the top end, the diameter of the inner cavity is in transition fit with the outer diameter of the annular buffer layer, and the annular buffer layer is placed in the inner cavity of the bottom packaging protection shell; the top packaging protection shell consists of a fixing plate and a cover plate, wherein the fixing plate is annular, and the inner diameter of the fixing plate is in interference fit with the outer diameter of the bottom packaging protection shell; the cover plate is annular, the outer edge of the cover plate is fixed along the inner edge of the top end of the fixing plate, the inner diameter of the cover plate is 1.1-1.5 times of the outer diameter of the boss, and the lower surface of the cover plate is pressed on the upper surface of the inner punched layer;
the two external leads are respectively fixedly connected with the outer electrode layer and the inner electrode layer, and the exposed ends of the external leads are led out of the protective shell.
Furthermore, the protective shell is made of stainless steel or aluminum alloy, and the thickness of the protective shell is 0.5-4 mm.
Furthermore, the annular buffer layer is made of styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer or organic silicon elastomer, and the thickness of the annular buffer layer is 0.5-5 mm.
Further, the outer electrode layer and the inner electrode layer are respectively a silver electrode, a carbon electrode, a chromium/gold multilayer electrode or a nickel/copper multilayer electrode, and the thickness of the outer electrode layer and the thickness of the inner electrode layer are respectively 0.02-5 μm.
Furthermore, the piezoelectric polymer expansion ring is made of a polyvinylidene fluoride piezoelectric film, a polyvinylidene fluoride copolymer piezoelectric film, a polyvinylidene fluoride composite piezoelectric film, a polytetrafluoroethylene piezoelectric electret film, a polypropylene piezoelectric electret film or a polyethylene glycol terephthalate piezoelectric electret film, and the thickness of the piezoelectric polymer expansion ring is 5-150 μm.
Further, the material of the inner impacted layer is styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer, organic silicon elastomer, vulcanized rubber or high impact polystyrene.
Furthermore, the external lead is a copper wire or a silver-plated copper wire.
Furthermore, the external lead is connected with the outer electrode layer/the inner electrode layer through conductive adhesive.
Furthermore, the conductive adhesive is conductive silver paste.
Compared with the prior art, the invention has the beneficial effects that:
according to the impact force detection sensor based on the piezoelectric polymer expansion ring, on one hand, a huge impact force is applied to an internal impacted layer, so that the sensor is prevented from damaging the piezoelectric polymer expansion ring when being impacted violently, and the risk of damage to the piezoelectric polymer expansion ring is reduced; on the other hand, when external impact force acts, the impact force is indirectly converted into the stretching force of the piezoelectric polymer expansion ring through the deformation of the internal impacted layer, and therefore the sensitivity of the impact force detection sensor is improved. The impact force signal acquisition and detection device can be used for acquisition and detection of impact force signals in different fields.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an impact force detecting sensor based on a piezoelectric polymer expansion ring according to the present invention;
FIG. 2 is a graph showing the voltage output response of an impact force detection sensor based on a piezoelectric polymer expansion ring according to embodiment 1 of the present invention under different impact forces;
fig. 3 shows the voltage output response of an impact force repeatability test experiment (10 times, 2N, 3Hz) of the impact force detection sensor based on the piezoelectric polymer expansion ring in embodiment 1 of the present invention.
In the figure, 1, a protective shell, 1-1, a bottom packaging protective shell, 1-2 top packaging protective shell, 1-2-1, a fixing plate, 1-2-2, a cover plate, 2, an annular buffer layer, 3, an outer electrode layer, 4, a piezoelectric polymer expansion ring, 5, an inner electrode layer, 6, an inner punched layer, 6-1, a base, 6-2, a boss, 7 and an external lead are arranged.
Detailed Description
For a further understanding of the invention, preferred embodiments of the invention are described below in conjunction with the detailed description, but it is to be understood that the description is intended to further illustrate the features and advantages of the invention and not to limit the claims to the invention.
As shown in fig. 1, the impact force detection sensor based on the piezoelectric polymer expansion ring of the present invention includes a protective casing 1, an annular buffer layer 2, an outer electrode layer 3, a piezoelectric polymer expansion ring 4, an inner electrode layer 5, an internal impacted layer 6, and an external lead 7.
The piezoelectric polymer expansion ring 4 is annular and can be obtained by cutting (laser cutting machine) to obtain a long strip-shaped piezoelectric polymer film and riveting two ends of the long strip-shaped piezoelectric polymer film. The piezoelectric polymer expansion ring 4 is made of polyvinylidene fluoride piezoelectric film, polyvinylidene fluoride copolymer piezoelectric film, polyvinylidene fluoride composite piezoelectric film, polytetrafluoroethylene piezoelectric electret film, polypropylene piezoelectric electret film and polyethylene glycol terephthalate piezoelectric electret film, and has a thickness of 5-150 μm. The above materials are all commercially available.
The outer electrode layer 3 is annular, the inner diameter of the outer electrode layer is matched with the outer diameter of the piezoelectric polymer expansion ring 4, the height of the outer electrode layer is the same as that of the piezoelectric polymer expansion ring 4, the inner surface of the outer electrode layer 3 is fixed on the outer surface of the piezoelectric polymer expansion ring 4, and the inner surface and the outer surface are coaxial and aligned up and down. The material of the outer electrode layer 3 is preferably a silver, carbon, chromium/gold multilayer or nickel/copper multilayer electrode with a thickness of 0.02-5 μm. When the material of the outer electrode layer 3 is silver or carbon, the outer electrode layer 3 can be obtained by screen printing conductive silver paste or conductive carbon paste on the outer surface of the piezoelectric polymer expansion ring 4, and then air-drying or curing; when the material of the outer electrode layer 3 is a chromium/gold multilayer electrode or a nickel/copper multilayer electrode, the chromium/gold multilayer electrode or the nickel/copper multilayer electrode may be directly deposited on the outer surface of the piezoelectric polymer expansion ring 4 by a vacuum evaporation method. The adhesiveness between the outer electrode layer 3 and the piezoelectric polymer expansion ring 4 is improved, so that the electric signal can be acquired, and the outer electrode layer 3 can be prevented from falling off when the piezoelectric polymer expansion ring 4 deforms. To improve the adhesion between the outer electrode layer 3 and the piezoelectric polymer expansion ring 4, the outer surface of the piezoelectric polymer expansion ring 4 may be surface-treated by corona or plasma before the outer electrode layer 3 is fabricated.
The inner electrode layer 5 is annular, the outer diameter of the inner electrode layer is matched with the inner diameter of the piezoelectric polymer expansion ring 4, the height of the inner electrode layer is the same as that of the piezoelectric polymer expansion ring 4, the outer surface of the inner electrode layer 5 is fixed on the inner surface of the piezoelectric polymer expansion ring 4, and the inner electrode layer and the outer electrode layer are coaxial and aligned. The material of the inner electrode layer 5 is preferably silver, carbon, chromium/gold multilayer electrode or nickel/copper multilayer electrode, and the thickness is 0.02-5 μm respectively. When the material of the inner electrode layer 5 is silver or carbon, the inner electrode layer 5 can be obtained by screen printing conductive silver paste or conductive carbon paste on the inner surface of the piezoelectric polymer expansion ring 4, and then air-drying or curing; when the material of the outer electrode layer 3 is a chromium/gold multilayer electrode or a nickel/copper multilayer electrode, the chromium/gold multilayer electrode or the nickel/copper multilayer electrode may be directly deposited on the inner surface of the piezoelectric polymer expansion ring 4 by a vacuum evaporation method. The adhesion between the inner electrode layer 5 and the piezoelectric polymer expansion ring 4 is improved, so that the electric signals can be acquired, and the inner electrode layer 5 can be prevented from falling off when the piezoelectric polymer expansion ring 4 deforms. To improve the adhesion between the inner electrode layer 5 and the piezoelectric polymer expansion ring 4, the inner surface of the piezoelectric polymer expansion ring 4 may be surface treated by corona or plasma prior to the fabrication of the inner electrode layer 5.
The annular buffer layer 2 is annular, the inner diameter of the annular buffer layer is matched with the outer diameter of the outer electrode layer 3, the height of the annular buffer layer is 1.1-1.5 times of the height of the outer electrode layer 3, and the middle part of the inner surface of the annular buffer layer 2 is fixed on the outer surface of the outer electrode layer 3. The fixing mode generally adopts sticking and fixing. The adhesive material is usually epoxy glue. The annular buffer layer 2 is made of styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer or organic silicon elastomer. Are all commercially available. The thickness of the annular buffer layer is 0.5-5 mm. The annular buffer layer 2 is used for buffering the deformation of the inner impact layer 6 under the impact force, and the piezoelectric polymer expansion ring 4 is prevented from being damaged due to large deformation.
The inner impacted layer 6 consists of a base 6-1 and a boss 6-2. The base 6-1 is cylindrical and has the same height as the annular buffer layer 2, the base 6-1 and the inner electrode layer 5 are coaxially arranged, the middle of the outer surface is fixedly connected with the inner surface of the inner electrode layer 5, and the upper surface and the lower surface of the outer surface are respectively aligned with the upper surface and the lower surface of the annular buffer layer 2. The fixing mode generally adopts sticking and fixing. The adhesive material is usually epoxy glue. The boss 6-2 is cylindrical, the lower surface of the boss is fixed on the upper surface of the base 6-1 and is coaxial with the base 6-1, the top end of the boss extends out of the central through hole of the cover plate 1-2-2, and the upper surface of the boss is higher than the upper surface of the cover plate 1-2-2. The material of the inner impacted layer 6 is styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer, organic silicon elastomer, vulcanized rubber or high impact polystyrene. Are all commercially available. The larger the elastic modulus of the material of the inner impacted layer 6, the wider the impact force detection range. The internal impacted layer 6 is a part directly stressed by the impact force detection sensor, and converts impact force into stretching force on the piezoelectric polymer expansion ring 4 through longitudinal deformation, so that electric charge or voltage signal output is generated, the piezoelectric sensitive layer is prevented from being damaged by impact, and the piezoelectric polymer expansion ring 4 can be effectively protected.
The protective shell 1 comprises a bottom packaging protective shell 1-1 and a top packaging protective shell 1-2; the bottom packaging protection shell 1 is a cylinder with an opening at the top end, the diameter of an inner cavity is in transition fit with the outer diameter of the annular buffer layer 2, and the annular buffer layer 2 is placed in the inner cavity of the bottom packaging protection shell 1; the top packaging protection shell 1-2 consists of a fixing plate 1-2-1 and a cover plate 1-2-2, wherein the fixing plate 1-2-1 is annular, and the inner diameter of the fixing plate is in interference fit with the outer diameter of the bottom packaging protection shell 1-1; the cover plate 1-2-2 is of an annular structure, the outer edge of the cover plate is fixed along the inner edge of the top end of the fixing plate 1-2-1, the inner diameter of the cover plate is 1.1-1.5 times of the outer diameter of the boss 6-2, and the lower surface of the cover plate is pressed on the upper surface of the inner punched layer 6. The material of the protective casing 1 is stainless steel or aluminum alloy. The thickness of the protective casing 1 is 0.5-4 mm. The protective housing 1 serves to protect the sensor internal structure from damage.
The two external leads 7 are respectively fixedly connected with the outer electrode layer 3 and the inner electrode layer 5, and the exposed ends of the external leads are led out from the protective shell 1. The external lead 7 is a copper wire or a silver-plated copper wire. Preferably, the external lead 7 is connected to the outer electrode layer 3/the inner electrode layer 5 by a conductive paste. The conductive adhesive is conductive silver paste.
The present invention is further illustrated by the following examples.
Example 1
Impact force detection sensor based on piezoelectric polymer expansion ring: the structure is as described in the specific embodiment, the material of the piezoelectric polymer expansion ring 4 is polyvinylidene fluoride piezoelectric film, the thickness is 25 μm, the height is 2mm, and the outer diameter is 1 cm; the outer electrode layer 3 is made of solidified conductive silver paste with the thickness of 2 μm; the inner electrode layer 5 is made of solidified conductive silver paste with the thickness of 2 microns; the annular buffer layer 2 is made of styrene block copolymer, the height is 2.4mm, and the thickness is as follows; the inner impacted layer 6 is made of organic silicon elastomer polydimethylsiloxane, the height is 2.4mm, and the thickness is 2.5 mm; the protective shell 1 is made of stainless steel and has the thickness of 2.5 mm; the external lead 7 is a silver-plated copper wire.
The impact force detection sensor based on the piezoelectric polymer expansion ring of example 1 was tested.
Fig. 2 is a voltage output response of the impact force detection sensor based on the piezoelectric polymer expansion ring of example 1 under different impact forces (1N, 2N, 5N and 10N), and it can be seen that the output voltage of the sensor increases linearly with the increase of the impact force.
Fig. 3 is a result of repeated impact force test of the impact force detection sensor based on the piezoelectric polymer expansion ring under 3Hz and 2N impact forces, and it can be seen that the impact force detection sensor shows the same voltage output under 10 consecutive same impact forces, indicating that it has good reproducibility.
The above-mentioned embodiments only express the embodiments of the present invention, and the description is more specific and detailed, but not understood as the limitation of the scope of the present invention, but all the technical solutions obtained by using the equivalent substitution or the equivalent transformation should be within the protection scope of the present invention.
Claims (9)
1. The impact force detection sensor based on the piezoelectric polymer expansion ring is characterized by comprising a protective shell (1), an annular buffer layer (2), an outer electrode layer (3), a piezoelectric polymer expansion ring (4), an inner electrode layer (5), an internal impacted layer (6) and an external lead (7);
the outer electrode layer (3), the piezoelectric polymer expansion ring (4) and the inner electrode layer (5) are all annular, have the same height, are coaxially arranged from outside to inside and are aligned up and down, and the outer electrode layer (3) and the inner electrode layer (5) are respectively fixed on the outer surface and the inner surface of the piezoelectric polymer expansion ring (4); the piezoelectric polymer expansion ring (4) is made of a piezoelectric polymer film;
the height of the annular buffer layer (2) is 1.1-1.5 times of that of the piezoelectric polymer expansion ring (4), the annular buffer layer (2) and the outer electrode layer (3) are coaxially arranged, and the middle part of the inner surface is fixed on the outer surface of the outer electrode layer (3);
the inner impacted layer (6) consists of a base (6-1) and a boss (6-2); the base (6-1) is cylindrical and has the same height as the annular buffer layer (2), the base (6-1) and the inner electrode layer (5) are coaxially arranged, the middle part of the outer surface is fixedly connected with the inner surface of the inner electrode layer (5), and the upper surface and the lower surface are respectively aligned with the upper surface and the lower surface of the annular buffer layer (2); the boss (6-2) is cylindrical, the lower surface of the boss is fixed on the upper surface of the base (6-1) and is coaxial with the base (6-1), the top end of the boss extends out of the central through hole of the cover plate, and the upper surface of the boss is higher than the upper surface of the cover plate;
the protective shell (1) comprises a bottom packaging protective shell (1-1) and a top packaging protective shell (1-2); the bottom packaging protection shell (1-1) is a cylinder with an opening at the top end, the diameter of an inner cavity is in transition fit with the outer diameter of the annular buffer layer (2), and the annular buffer layer (2) is placed in the inner cavity of the bottom packaging protection shell (1); the top packaging protection shell (1-2) consists of a fixing plate (1-2-1) and a cover plate (1-2-2), wherein the fixing plate (1-2-1) is annular, and the inner diameter of the fixing plate is in interference fit with the outer diameter of the bottom packaging protection shell (1-1); the cover plate (1-2) is annular, the outer edge is fixed along the inner edge of the top end of the fixing plate, the inner diameter is 1.1-1.5 times of the outer diameter of the boss (6-2), and the lower surface is pressed on the upper surface of the inner punched layer (6);
the two external leads (7) are respectively fixedly connected with the outer electrode layer (3) and the inner electrode layer (5), and the exposed ends of the external leads are led out of the protective shell (1).
2. The impact force detection sensor based on piezoelectric polymer expansion ring according to claim 1, wherein the material of the protective housing (1) is stainless steel or aluminum alloy, and the thickness of the protective housing (1) is 0.5-4 mm.
3. The impact force detection sensor based on the piezoelectric polymer expansion ring as claimed in claim 1, wherein the material of the annular buffer layer (2) is styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer or silicone elastomer, and the thickness of the annular buffer layer (2) is 0.5-5 mm.
4. The impact force detection sensor based on piezoelectric polymer expansile loop according to claim 1, wherein the outer electrode layer (3) and the inner electrode layer (5) are silver electrode, carbon electrode, chromium/gold multilayer electrode or nickel/copper multilayer electrode, respectively, and the thickness of the outer electrode layer (3) and the inner electrode layer (5) is 0.02-5 μm, respectively.
5. The impact force detection sensor based on piezoelectric polymer expansion ring according to claim 1, wherein the material of the piezoelectric polymer expansion ring (4) is polyvinylidene fluoride piezoelectric film, polyvinylidene fluoride copolymer piezoelectric film, polyvinylidene fluoride composite piezoelectric film, polytetrafluoroethylene piezoelectric electret film, polypropylene piezoelectric electret film or polyethylene terephthalate piezoelectric electret film, and the thickness is 5-150 μm.
6. The impact force detection sensor based on piezoelectric polymer expansion ring according to claim 1, wherein the material of the inner impacted layer (6) is styrene block copolymer, thermoplastic polyurethane, polyolefin thermoplastic elastomer, silicone elastomer, vulcanized rubber or high impact polystyrene.
7. The impact force detection sensor based on piezoelectric polymer expansion ring according to claim 1, wherein the external lead (7) is copper wire or silver-plated copper wire.
8. The impact force detection sensor based on piezoelectric polymer expansion ring according to claim 1, wherein the external lead (7) is connected to the outer electrode layer (3)/the inner electrode layer (5) through conductive paste.
9. The impact force detecting sensor based on piezoelectric polymer expansion ring of claim 8, wherein the conductive adhesive is conductive silver paste.
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