CN111823575A - Multifunctional 3D printer - Google Patents
Multifunctional 3D printer Download PDFInfo
- Publication number
- CN111823575A CN111823575A CN202010610264.4A CN202010610264A CN111823575A CN 111823575 A CN111823575 A CN 111823575A CN 202010610264 A CN202010610264 A CN 202010610264A CN 111823575 A CN111823575 A CN 111823575A
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- CN
- China
- Prior art keywords
- multifunctional
- axis direct
- conductive material
- acting mechanism
- electronic component
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/379—Handling of additively manufactured objects, e.g. using robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
Abstract
The invention discloses a multifunctional 3D printer which comprises a rack, wherein an X-axis direct-acting mechanism, a Y-axis direct-acting mechanism and a Z-axis direct-acting mechanism are fixed on the rack, the Y-axis direct-acting mechanism is in transmission connection with the X-axis direct-acting mechanism, a printing platform is fixed on the Y-axis direct-acting mechanism, the Z-axis direct-acting mechanism is in transmission connection with a cross shaft of the rack, a molten plastic extrusion mechanism, a conductive material coating mechanism and an electronic component sucking and releasing mechanism are fixed on the cross shaft, and a conductive material pre-curing module is installed at the lower part of the rack. The invention integrates all modules on one printer, has high process integration level and can realize integrated manufacturing; the electronic device can be directly embedded, so that manual assembly is omitted, the labor cost is reduced, and the efficiency is improved; the design is simple and convenient, and the modification is simple; hybrid 3D printing can make complex structured electronic products; the customization of the product height can be realized, and the product can be produced quickly according to the requirement; the circuit is implanted in the electronic product substrate, so that the reliability and the safety are improved.
Description
Technical Field
The invention relates to a 3D printer, in particular to a multifunctional 3D printer.
Background
With the rise of innovative economy, the iteration speed of novel electronic products is obviously accelerated, enterprises generally want to shorten the product design and development period, so that the products are put into the market as soon as possible and the market share is seized, on the other hand, the demands of consumers on personalized and customized electronic products are continuously expanded, so that the enterprises are required to turn from a large-batch traditional manufacturing mode to personalized and rapid production, and meanwhile, the forms and structures of the electronic products are increasingly complex. Conventional manufacturing processes, represented by Printed Circuit Boards (PCBs), are increasingly difficult to meet.
The 3D printing technique is a technique for manufacturing a solid part by a layer-by-layer material accumulation method based on three-dimensional CAD data. Due to the flexibility and controllability of the 3D printing, the development of the 3D printing has been greatly advanced recently, and the diversification and systematization of the processing technology and the raw materials are realized. Common 3D printing processes include: selective laser melting molding, fused deposition molding, photocuring molding and the like. The processing raw materials include metals, thermoplastics, photocurable resins, ceramics, and the like. 3D printing technology is very promising as an efficient method of manufacturing customized electronic products. However, the conventional 3D printing technology can only realize the manufacture of single-material and single-function components, and cannot meet the requirements of the structure and function integrated manufacture of customized electronic products.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a multifunctional 3D printer to solve the problem of rapid manufacturing of customized electronic products.
The technical scheme is as follows: the invention comprises a frame, wherein an X-axis direct-acting mechanism, a Y-axis direct-acting mechanism and a Z-axis direct-acting mechanism are fixed on the frame, the Y-axis direct-acting mechanism is in transmission connection with the X-axis direct-acting mechanism, a printing platform is fixed on the Y-axis direct-acting mechanism, the Z-axis direct-acting mechanism is in transmission connection with a cross shaft of the frame, a molten plastic extrusion mechanism, a conductive material coating mechanism and an electronic component sucking and releasing mechanism are fixed on the cross shaft, and a conductive material pre-curing module is installed at the lower part of the frame.
The molten plastic extruding mechanism adopts a plastic wire extruder or a screw granule extruder driven by a motor.
The conductive material coating mechanism adopts a pneumatic needle cylinder dispensing valve or a screw extruder or a pneumatic injection valve.
The electronic component sucking and releasing mechanism comprises a vacuum pump, an electromagnetic valve, a sucking and releasing pen and a hose.
The machine frame is characterized in that a computer control system is installed on the lower portion of the machine frame, and the computer control system is electrically connected with the X-axis direct-acting mechanism, the Y-axis direct-acting mechanism, the Z-axis direct-acting mechanism, the molten plastic extrusion mechanism, the conductive material coating mechanism, the electronic component sucking and releasing mechanism and the conductive material pre-curing module respectively to control the operation of each module.
And a plastic material feeding tray is fixed at the upper part of the frame.
The rear part of the printing platform is provided with an electronic component scattering disk which can move along with the printing platform under the drive of an X, Y-axis direct-acting mechanism.
The upper surface of the electronic component bulk material tray is parallel to the printing platform.
Has the advantages that: the invention integrates all modules on one printer, has high process integration level and can realize integrated manufacturing; the electronic device can be directly embedded, so that manual assembly is omitted, the labor cost is reduced, and the efficiency is improved; the design is simple and convenient, and the modification is simple; hybrid 3D printing can make complex structured electronic products; the customization of the product height can be realized, and the product can be produced quickly according to the requirement; the circuit is implanted in the electronic product substrate, so that the reliability and the safety are improved.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a flow chart of the process for manufacturing a planar circuit board according to the present invention;
fig. 4 is a process flow diagram for fabricating a three-dimensional circuit structure according to the present invention.
Detailed Description
The invention will be further explained with reference to the drawings.
As shown in fig. 1 and 2, the invention comprises a frame 1, wherein a support leg 10 is arranged at the bottom of the frame 1, an X-axis direct-acting mechanism 8 is fixed on the frame 1, the X-axis direct-acting mechanism 8 is connected with an X-axis transmission belt 14, a Y-axis direct-acting mechanism 7 is in transmission connection with the X-axis direct-acting mechanism 8, the Y-axis direct-acting mechanism 7 is connected with a Y-axis transmission belt 15, and a printing platform 5 is fixed on a sliding table of the Y-axis direct-acting mechanism 7 and can move freely in an XY plane. The rear part of the printing platform 5 is provided with an electronic component bulk material tray 16 which can move along with the printing platform, and the upper surface of the electronic component bulk material tray 16 is parallel to the printing platform 5. A Z-axis direct-acting mechanism 13 is fixed on the upright post of the frame 1 and is in transmission connection with the transverse shaft 4 of the frame, so that the transverse shaft 4 is driven to move up and down in the Z-axis direction. The X, Y, Z axial translation mechanism can be driven by a motor with a toothed bar/screw/ball screw/belt, or an electric push rod, or an electric cylinder, or an oil cylinder, or an air cylinder. A plastic material feeding tray 2 is also fixed on the frame 1 at the upper part of the transverse shaft 4 and is used for feeding molten plastic extruding mechanisms 9.
The horizontal shaft 4 is provided with a conductive material coating mechanism 3, a molten plastic extruding mechanism 9 and an electronic component sucking and releasing mechanism 11 in parallel, and the conductive material coating mechanism, the molten plastic extruding mechanism and the electronic component sucking and releasing mechanism can move up and down along with the horizontal shaft 4. The molten plastic extruding mechanism 9 employs a plastic filament extruder or a screw pellet extruder driven by a motor for coating molten plastic and printing a substrate. The conductive material coating mechanism 3 adopts a pneumatic syringe dispensing valve or a screw extruder or a pneumatic injection valve, and the computer control system 12 controls the conductive material coating mechanism 3 to manufacture a circuit structure. The electronic component sucking and releasing mechanism 11 comprises a vacuum pump, an electromagnetic valve, a sucking and releasing pen and a hose, wherein the on-off of the electromagnetic valve is controlled by the computer control system 12, and the negative pressure of the sucking and releasing pen is controlled to realize the sucking and releasing of the electronic component.
The two sides of the lower part of the rack 1 are also provided with a conductive material pre-curing module 6, a power supply 17 and a computer control system 12, and the conductive material pre-curing module 6 is used for pre-curing after the conductive material is printed; the computer control system 12 is respectively in conductive connection with the X, Y, Z axial direct-acting mechanism, the molten plastic extrusion mechanism 9, the conductive material coating mechanism 3, the electronic component absorbing and releasing mechanism 11 and the conductive material pre-curing module 6, and controls the work of each module. The computer control system 12 may be comprised of a CNC automatic controller commonly used in 3D printers.
The operation process of the invention is as follows:
(1) designing a model of a two-dimensional/three-dimensional electronic product using computer aided design software (CAD);
(2) setting printing parameters in 3D printing slicing software, and carrying out slicing processing to obtain a numerical control programming language code for driving the hybrid 3D printing equipment to work;
(3) the computer control system 12 drives the X, Y, Z axis direct-acting mechanism to move according to the numerical control programming language code, and controls the molten plastic extrusion mechanism 9 to print the plastic substrate with the electronic circuit structure layer by layer;
(4) the computer control system 12 pauses the printing of the molten plastic extrusion mechanism 9 on the circuit implantation layer according to the numerical control programming language code, starts the electronic component suction and discharge mechanism 11, takes out the electronic components from the electronic component bulk material tray 16 by driving X, Y, Z the axial direct-acting mechanism to move, and distributes the electronic components at the corresponding positions of the plastic substrate;
(5) after the electronic components are distributed, the computer control system 12 suspends the work of the electronic component sucking and releasing mechanism 11 according to the numerical control programming language code, starts the conductive material coating mechanism 3, and coats the conductive material on the plastic substrate to form a circuit by driving X, Y, Z the axial direct-acting mechanism to move;
(6) after the circuit is coated, the computer control system 12 suspends the operation of the conductive material coating mechanism 3 according to the numerical control programming language code, moves the printing structure to the conductive material pre-curing module 6 side by driving the X, Y, Z shaft direct-acting mechanism, starts the conductive material pre-curing module 6, pre-cures the conductive material, and pre-bonds the pins of the electronic component and the conductive material;
(7) and starting the molten plastic extrusion mechanism 9 to encapsulate the circuit and the electronic component in the matrix, and completing the manufacturing of the two-dimensional/three-dimensional electronic product with the complex geometric shape by circulating the processes and performing a high-temperature post-curing process.
The invention integrates the modules of the molten plastic extruding mechanism 9, the conductive material coating mechanism 3, the electronic component sucking and releasing mechanism 11 and the like into the same 3D printer, realizes the integrated integration of the 3D printing, circuit printing and electronic component distributing process of the electronic product substrate, improves the manufacturing efficiency and the reliability of the electronic product, and provides a solution for the rapid manufacturing of the customized electronic product.
In example 1, the molten plastic extrusion mechanism 9 is constituted by a plastic filament extruder driven by a stepping motor; the conductive material coating mechanism 3 is composed of a screw extruder; the conductive material pre-curing module 6 is composed of a hot air gun, and pre-curing of the conductive adhesive is realized in a hot air blowing mode.
As shown in fig. 3, the process for manufacturing the two-dimensional circuit structure of the present embodiment includes: firstly, a model of an electronic circuit is designed by using computer aided design software (CAD); then, setting printing parameters in 3D printing slicing software (such as Slicer3R), and carrying out slicing processing to obtain a numerical control programming language Code (such as a G-Code) for driving the hybrid 3D printing equipment to work; the computer control system 12 drives the X, Y, Z-axis ball screw to move according to the numerical control programming language code, and controls the plastic wire extruder to print the plastic substrate with the electronic circuit structure layer by layer; then, the printing of the plastic substrate is suspended on the circuit implantation layer, the electromagnetic valve is started to enable the suction pen point to generate negative pressure, and the electronic components are sucked from the electronic component material scattering disk 16 and distributed at the corresponding positions of the plastic substrate through the movement of the X, Y, Z-axis ball screw; then, the computer control system 12 starts the screw extruder and drives X, Y, Z shaft translation mechanism to move, and conductive adhesive is coated on the plastic substrate to form a circuit; then, the computer control system 12 drives the X, Y, Z-axis direct-acting mechanism to move the printing structure to the hot air blower conductive material pre-curing module side, starts a hot air gun to pre-cure the conductive adhesive, and pre-bonds the pins of the electronic component and the conductive adhesive; and finally, putting the two-dimensional circuit structure into an oven, and performing post-curing to completely cure the conductive adhesive.
Example 2, the molten plastic extrusion mechanism 9 consists of a pellet screw extruder driven by a stepping motor; the conductive material coating mechanism 3 is constituted by a jet type printing head; the conductive material pre-curing module 6 is composed of a UV lamp, and pre-curing of the conductive ink is achieved through a light curing mode.
As shown in fig. 4, the method for manufacturing the three-dimensional circuit structure of the present embodiment includes: firstly, a model of an electronic circuit is designed by using computer aided design software (CAD); setting printing parameters in 3D printing slicing software (such as Slicer3R), and performing slicing processing to obtain numerical control programming language codes (such as G-Code codes) for driving the hybrid 3D printing equipment to work; then, the computer control system 12 drives X, Y, Z shaft ball screw rods to move according to the numerical control programming language codes, and controls the granular screw type extruder to print the electronic circuit structure plastic matrix layer by layer; then, the printing of the plastic substrate is suspended on the circuit implantation layer, the electromagnetic valve is started to enable the suction pen point to generate negative pressure, and the electronic components are sucked from the electronic component bulk material disc 16 and distributed at the corresponding positions of the plastic substrate through the movement of the X, Y, Z-axis direct-acting mechanism; then, the computer control system 12 starts the jet extruder and drives X, Y, Z shaft direct-acting mechanism to move, and UV curing conductive ink is coated on the plastic substrate to form a circuit; then, the computer control system 12 drives the X, Y, Z-axis direct-acting mechanism to move the printing structure to the side of the UV lamp conductive material pre-curing module, starts the UV lamp to pre-cure the conductive ink, and pre-bonds the pins of the electronic component and the conductive ink; and then, the computer control system 12 drives the X, Y, Z-shaft ball screw to move according to the numerical control programming language code, controls the granular screw extruder to print, package and distribute the finished electronic circuit components layer by layer, and repeats the steps. And finally, putting the three-dimensional circuit structure into an oven, and performing post-curing to completely cure the conductive ink.
Claims (8)
1. The utility model provides a multi-functional 3D printer, includes frame (1), frame (1) on be fixed with X axle direct action mechanism (8), Y axle direct action mechanism (7) and Z axle direct action mechanism (13), Y axle direct action mechanism (7) be connected with X axle direct action mechanism (8) transmission, be fixed with on the Y axle direct action mechanism (7) and print platform (5), Z axle direct action mechanism (13) be connected with frame cross axle (4) transmission, a serial communication port, cross axle (4) on be fixed with melting plastics extrusion mechanism (9), conducting material coating mechanism (3) and electronic components inhale and put mechanism (11), frame (1) lower part install conducting material precuring module (6).
2. The multifunctional 3D printer according to claim 1, characterized in that the molten plastic extrusion mechanism (9) is a plastic filament extruder or a screw pellet extruder driven by a motor.
3. The multifunctional 3D printer according to claim 1, wherein the conductive material coating mechanism (3) is a pneumatic syringe dispensing valve, a screw extruder, or a pneumatic jet valve.
4. The multifunctional 3D printer according to claim 1, wherein the electronic component sucking and discharging mechanism (11) comprises a vacuum pump, an electromagnetic valve, a sucking and discharging pen and a hose.
5. The multifunctional 3D printer according to claim 1, wherein a computer control system (12) is installed on the lower portion of the frame (1), and the computer control system (12) is electrically connected with the X-axis direct-acting mechanism (8), the Y-axis direct-acting mechanism (7), the Z-axis direct-acting mechanism (13), the molten plastic extrusion mechanism (9), the conductive material coating mechanism (3), the electronic component sucking and releasing mechanism (11) and the conductive material pre-curing module (6) respectively.
6. Multifunctional 3D printer according to claim 1 or 5 characterized in that the upper part of the frame (1) is fixed with a plastic material feeding tray (2).
7. The multifunctional 3D printer according to claim 1, characterized in that the rear part of the printing platform (5) is provided with an electronic component scattering tray (16).
8. The multifunctional 3D printer according to claim 7, characterized in that the upper surface of the electronic component bulk tray (16) is parallel to the printing platform (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010610264.4A CN111823575A (en) | 2020-06-30 | 2020-06-30 | Multifunctional 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010610264.4A CN111823575A (en) | 2020-06-30 | 2020-06-30 | Multifunctional 3D printer |
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| Publication Number | Publication Date |
|---|---|
| CN111823575A true CN111823575A (en) | 2020-10-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010610264.4A Pending CN111823575A (en) | 2020-06-30 | 2020-06-30 | Multifunctional 3D printer |
Country Status (1)
| Country | Link |
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| CN (1) | CN111823575A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112545092A (en) * | 2020-12-01 | 2021-03-26 | 安徽东锦服饰有限公司 | Automatic printing equipment for intelligent clothing production |
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Application publication date: 20201027 |