CN111818687A - Automatic production method and system of LED lamp - Google Patents

Automatic production method and system of LED lamp Download PDF

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Publication number
CN111818687A
CN111818687A CN202010699935.9A CN202010699935A CN111818687A CN 111818687 A CN111818687 A CN 111818687A CN 202010699935 A CN202010699935 A CN 202010699935A CN 111818687 A CN111818687 A CN 111818687A
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led lamp
automatic
production
test
pcba
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CN111818687B (en
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付文华
张晔
陈世利
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Shanghai Iglow Lighting Technology Co ltd
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Shanghai Iglow Lighting Technology Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/04Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
    • B23P19/06Screw or nut setting or loosening machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention discloses an automatic production system of an LED lamp, which comprises: the automatic assembling method comprises the steps of synchronously operating a driving production branch line, a PCBA production branch line and a basic structure component production branch line, and automatically assembling and testing qualified semi-finished products of the production branch lines to obtain an assembling production line of the LED lamp finished product. The invention can improve the production efficiency of the LED lamp and control the product quality of the LED lamp at the same time.

Description

Automatic production method and system of LED lamp
Technical Field
The invention relates to production equipment of an LED lamp, in particular to an automatic production method and system capable of improving the production efficiency of LED lamp manufacturing.
Background
With the gradual maturity of the technology of the LED industry, the delivery cycle and the product quality of the LED lamp are not required to be improved; the requirements for shortening the manufacturing production period of the LED lamp and improving the product quality are more and more urgent. The existing automatic production line of the LED lamp has the problems that the number of production equipment is large, the production equipment is responsible for different processes, sometimes, required environments are different, arrangement is generally dispersed in a factory, the transportation cost of the production line of the LED lamp is high, the structure is complex, the occupied space is large, the product quality detection in a production link is not timely and in place, the product quality is easy to be unstable, and the like.
Disclosure of Invention
In order to solve the technical problem that the arrangement of an automatic production line of LED lamps in the prior art is relatively dispersed, the invention provides an automatic production system of the LED lamps, which comprises: the automatic assembling method comprises the steps of synchronously operating a driving production branch line, a PCBA production branch line and a basic structure component production branch line, and automatically assembling and testing qualified semi-finished products of the production branch lines to obtain an assembling production line of the LED lamp finished product.
Furthermore, a first chip mounter, a first reflow soldering device, a first automatic testing device, an automatic wire welding device and a driving assembly device are sequentially arranged on the driving production branch line, and the first automatic testing device, the first reflow soldering device, the first automatic testing device, the automatic wire welding device and the driving assembly device are used for debugging the output current value of the driving channel and controlling the output current value within a preset precision range.
Furthermore, a second chip mounter, a second reflow soldering device and a second automatic testing device which is used for debugging the photoelectric parameters of each LED lamp bead loop on the PCBA and controlling the photoelectric parameters within a preset range are sequentially arranged on the PCBA production branch line.
Further, a structure assembling device is arranged on the basic structure component production branch line.
Furthermore, an automatic screw locking device, an integral assembling device, an LED finished product parameter verifying device, an air tightness testing device for simulating a waterproof test and a safety testing device are sequentially arranged on the assembling production line.
Further, the first automatic testing device comprises a first voltage and current detection module for monitoring the voltage and the current of the driving channels, a first resistance adjustment module for adjusting the resistance values of the digital current limiting resistors corresponding to the driving channels, and a first controller for receiving the monitoring value of the voltage and current detection module to control the resistance adjustment module to adjust the resistance values of the digital current limiting resistors until the output current value of the driving channels reaches a preset precision range.
Further, the second automatic testing device comprises a voltage detection module for monitoring the voltage of each loop of the PCBA to enable the voltage to reach a preset range, a second resistance adjusting module for adjusting the resistance value of the digital resistance of each loop of the PCBA, and a customized integrating sphere module for controlling the second resistance adjusting module to adjust the resistance value of the digital resistance, so that the photoelectric parameters generated after the LED lamp beads on the PCBA emit light can be tested until the value of the photoelectric parameters reaches the preset range. The photoelectric parameters comprise at least one of color temperature, color tolerance, color rendering index, luminous flux and wavelength.
Further, the LED lamp finished product parameter verification device comprises an automatic parameter setting module, a functional parameter testing module and a two-dimensional code printer for printing the parameters of the LED lamp finished product obtained by the functional parameter testing module on the LED lamp finished product in a two-dimensional code form. The two-dimensional code printer is a laser printer.
The invention optimizes the production process, adds the corresponding automatic detection device and the corresponding assembly device, synchronously completes the procedures which can be completed in advance by dividing the procedures into a plurality of production branches, adopts a plurality of automatic test devices to test each key component of the LED lamp, ensures the product quality, and adds the air tightness test device, so that the LED lamp product can test whether the product reaches the waterproof IP grade without using a production line.
Meanwhile, the process flow can be optimized, the time for manual transportation is saved, and a substitute testing device is introduced through a new process, so that the time is saved, and the production period is shortened; the automatic detection device is introduced, so that accurate data can be tested in each key process, the detection is quick and effective, and the yield and the quality of products are improved.
Drawings
The invention is described in detail below with reference to examples and figures, in which:
FIG. 1 is a block diagram of the present invention.
FIG. 2 is a block diagram of a first automatic test apparatus according to an embodiment of the present invention.
FIG. 3 is a block diagram of a second automatic test apparatus according to an embodiment of the present invention.
FIG. 4 is a partial schematic view of a PCBA in accordance with the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Thus, a feature indicated in this specification will serve to explain one of the features of one embodiment of the invention, and does not imply that every embodiment of the invention must have the stated feature. Further, it should be noted that this specification describes many features. Although some features may be combined to show a possible system design, these features may also be used in other combinations not explicitly described. Thus, the combinations illustrated are not intended to be limiting unless otherwise specified.
The principles of the present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the production of the LED lamp is divided into three production branches simultaneously, and the three production branches operating synchronously are a driving production branch, a PCBA production branch and a basic structure component production branch. And finally, the three branches enter an assembly production line, and the qualified semi-finished products of the production branches are automatically assembled and tested by the assembly production line to obtain the finished products of the LED lamps meeting the requirements.
When the method is applied specifically, the production branch line of the basic structure component and the assembly production line can be the same production line, and qualified semi-finished products of the driving production branch line and the PCBA production branch line are all transferred to the assembly production line to complete production of finished products of the LED lamps.
The driving production branch line is sequentially provided with a first chip mounter, a first reflow soldering device, a first automatic testing device, an automatic wire welding device and a driving assembly device, the driving of the LED lamp is subjected to chip mounting through the first chip mounter, then after the welding is completed through the first reflow soldering device, the driving channels are tested and debugged through the first automatic testing device, and the output current values of the driving channels are controlled within a preset precision range. As shown in fig. 2, the first automatic testing device has a corresponding operation interface, a debugging worker can perform corresponding debugging setting through the operation interface and can see information such as a debugging result, and in addition, the first automatic testing device further includes a first voltage and current detection module for monitoring voltage and current of each driven channel, a first resistance adjustment module for adjusting resistance values of digital current limiting resistors corresponding to each driven channel, and a first controller for receiving a monitoring value of the voltage and current detection module to control the resistance adjustment module to adjust the resistance values of the digital current limiting resistors until an output current value of the driven channel reaches a preset precision range. When the driver is conveyed to the first automatic testing device, the driver is fixed by the tool fixture, and then the driven multi-channel is tested, so that the output current value of each driven channel is within a preset range, and the precision of the output current of the driver is controlled within a range of +/-1%. Wherein the voltage of each channel is a fixed voltage of 100 mV. Specifically, the formula is I = U/R, I is the output current of each channel, U is the voltage of each channel, the voltage of each channel is the fixed voltage of 100mV, and R is a digital current-limiting resistor. And the qualified drive after debugging is to weld wires through the automatic wire welding device and then complete the assembly of the components such as the drive shell and the like through the drive assembly device, and then enter an assembly production line together with semi-finished products of other production branches. In this embodiment, the first controller is a DMX512 controller.
Wherein, be equipped with second chip mounter, second reflow soldering and the automatic testing arrangement of second on the PCBA production branch line in proper order. After the PCBA of the LED lamp is subjected to surface mounting by the second surface mounting machine and then is welded by the second reflow soldering, the PCBA enters the second automatic testing device to be debugged, and the second automatic testing device debugs the photoelectric parameters of all LED lamp bead loops on the PCBA, so that the photoelectric parameters of the LED lamp bead loops are controlled within a preset range. As shown in figure 3 of the drawings,the second automatic testing device comprises a voltage detection module for monitoring the voltage of each circuit of the PCBA to enable the forward voltage of the circuit to be within a preset range, a second resistance adjusting module for adjusting the resistance value of each circuit digital resistance of the PCBA, a customized integrating sphere module for controlling the second resistance adjusting module to adjust the resistance value of the digital resistance, so that the photoelectric parameters generated after the LED lamp beads on the PCBA emit light can be tested until the value of the photoelectric parameters reaches the preset range, a fixture for fixing the PCBA and the like. The photoelectric parameters of each LED lamp bead loop specifically comprise at least one of color temperature, color tolerance, color rendering index, luminous flux and wavelength of the LED lamp beads. The forward voltage value (VF value) after debugging is usually controlled within ± 1% of the standard voltage value, while the power is controlled within ± 2% of the standard power. The specific forward voltage value adopts a formula of U = IR, wherein U is the forward voltage value, I is fixed current, R is digital resistance, and the power adopts a calculation formula of P = I2R and P are power of each loop, I is fixed current, and R is a digital resistor. The commissioned PCBA will then proceed with the drive to the assembly line. Fig. 4 shows a schematic diagram of a part of the structure of the PCBA loop, in which R, G, B, W each corresponds to one branch.
The basic structure component production branch line is provided with a structure assembling device, the structure assembling device is used for assembling other parts except the drive and the PCBA, different LED lamps are different in specific structure, and therefore the structure assembling device is different, and the structure assembling device is used for assembling parts such as a base and a support of the LED lamp. After the components are assembled, they will be fed into the assembly line along with the drive and PCBA.
After all the debugged and assembled semi-finished products enter an assembly production line, the semi-finished products are fixedly connected through an automatic screw locking device, then the assembly of the LED finished products is completed through an integral assembly device, and then the LED finished products are verified through an LED finished product parameter verification device, wherein the LED lamp finished product parameter verification device comprises an automatic parameter setting module, a functional parameter testing module and a two-dimensional code printer, the two-dimensional code printer is used for printing the parameters of the LED lamp finished products obtained by the functional parameter testing module on the LED lamp finished products in a two-dimensional code mode, the two-dimensional code printer can adopt a laser printer, and then the LED lamp finished products printed with the main parameters of the lamps enter an air tightness testing device to perform simulated waterproof testing.
In the prior art, because the waterproof test needs to simulate various test situations such as a water droplet splashing intrusion test, a spraying intrusion test, a water intrusion test of heavy waves and the like, the adopted equipment has higher requirements and more complex equipment composition, and water in the waterproof test can easily influence the humidity control and other devices of a production workshop, so that a continuous production line is difficult to form. When the LED lamp is subjected to a water discharge test, the water discharge test is specifically carried out according to a liquid pressure intensity formula
Figure DEST_PATH_IMAGE002
Calculating the pressure, wherein P is the liquid pressure; rho is the density of the liquid, and g is the acceleration of gravity; h is the height of the object from the surface of the liquid. For example, the pressure of a liquid at a deep water level of 1m
Figure DEST_PATH_IMAGE004
I.e. the pressure generated in the depth of 1 meter of water is converted to an atmospheric pressure of 10 kpa. The IP is a code number which is internationally used for identifying the protection grade, the IP grade consists of two numbers, the first number represents dustproof, the second number represents waterproof, and the larger the number is, the better the protection grade is, and the specific table is shown in the following tables 1 and 2.
Number (I) Degree of protection Definition of
0 Without protection Without special protection
1 Prevent the intrusion of objects larger than 50mm Prevent human body from accidentally touching internal parts of electrical equipment
2 Prevent the intrusion of objects larger than 12mm Prevent that finger from touching electrical equipment internals
3 Prevent the object larger than 2.5mm from totally intruding Preventing the intrusion of tools, wires or objects having a diameter greater than 2.5mm
4 Prevent the intrusion of objects larger than 1.0mm Preventing the invasion of mosquitoes, flies, insects or objects with a diameter of more than 1.0mm
5 Dust prevention The dust can not be prevented from entering completely, but the dust entering amount can not affect the normal operation of the electric appliance
6 Dust prevention Completely preventing dust from invading
TABLE 1 dust protection rating
0 Without protection Without special protection
1 Preventing drip intrusion Prevent water drops from dripping vertically
2 Prevent dripping water intrusion when inclined at 15 degrees When the electrical equipment is inclined by 15 degrees, the dripping can be prevented
3 Preventing the intrusion of sprayed water Prevent rain or water sprayed in a direction perpendicular to an included angle of less than 50 DEG
4 Preventing splash water ingress Prevent water from splashing in all directions
5 Preventing water intrusion of big waves Prevent water from intruding from waves or water jet holes
6 Preventing water intrusion of big waves The electrical equipment can still ensure the normal operation of the equipment when immersed in water for a certain time or under the condition of water pressure
7 Preventing water intrusion The electrical equipment can still ensure the normal operation of the equipment under the condition of certain water pressure in the indefinite submerged water
8 Preventing the influence of sinking
TABLE 2 Water repellency rating
In the prior art, the name of the IPX 1 method is a vertical dripping test, the adopted test equipment is a dripping test device, a sample is placed on a rotating sample table at 1r/min according to the normal working position of the sample, the distance from the top of the sample to a dripping port is not more than 200mm, the test condition requires that the dripping amount is 10.05 mm/min, and the duration is 10 min.
The IPX 2 method is named as a 15-degree inclined dripping test, the adopted test equipment is a dripping test device, a test sample is placed for a specific time, one surface of the test sample forms a 15-degree angle with a vertical line, and the distance from the top of the test sample to a dripping port is not more than 200 mm. After each test, one side was changed for another four times. The water dropping amount under the test conditions was (3.0 + 0.5) mm/min and the duration was 4X 2.5 min (total 10 min).
The IPX 3 method is named as a water spraying test, the test method comprises two methods, one method is a swing pipe type water spraying test, the test equipment is a swing pipe type water spraying and splashing test device, the sample is placed specifically by selecting a swing pipe with a proper radius, the height of a sample table top is enabled to be located at the diameter position of the swing pipe, the sample is placed on a sample table, the distance from the top of the sample table top to a sample water spraying port is enabled to be not more than 200mm, and the sample table does not rotate. The water flow under the test condition is calculated according to the number of the water spraying holes of the swinging pipe, each hole is 0.07L/min, and when water is sprayed, the water spraying holes in the arc sections with 60 degrees on both sides of the middle point of the swinging pipe spray water to the sample. The sample to be tested is placed in the center of the semicircle of the swing pipe. The swinging pipes swing 60 degrees along two sides of the vertical line respectively, and the swinging angles are 120 degrees in total. Each time of swinging (2 multiplied by 120 degrees) for about 4s, and the test time is 10min of continuous water spraying; the other is a spray head type water spraying test, the test equipment is a handheld water spraying and splashing test device, the sample is placed specifically, the parallel distance between the top of the test and a water spray opening of the handheld spray head is 300 mm-500 mm, the test condition is that a baffle with a balance weight is installed during the test, the water flow is 10L/min, the test time is calculated according to the surface area of a shell of the tested sample, the square meter is 1 min (excluding the installation area), and the minimum time is 5 min.
The IPX 4 method is named as a splash test, two test methods are provided, one is a swing pipe type splash test, and the test equipment and the sample placement are the same as the A type of the IPX 3; the test conditions were the same as those of the above-mentioned IPX 3, except for the following conditions; the water spraying area is that the water spraying holes in the arc sections with 90 degrees on both sides of the midpoint of the swinging pipe spray water to the sample. The sample to be tested is placed in the center of the semicircle of the swing pipe. The swinging pipes swing 180 degrees along two sides of the vertical line respectively, and the swinging angles are about 360 degrees in total. The test time was the same as the above-mentioned pattern a of IPX 3 (i.e., 10 min) for about 12s per oscillation (2X 360 ℃). The other is a nozzle type water splashing test, and the test equipment and the sample placement are the same as the b type of the IPX 3; under the test conditions, the baffle plate with a balance weight is arranged on the equipment, and the rest parts are the same as the part b of the IPX 3; the test time is the same as that of the above-mentioned IPX 3, i.e., 1 min (excluding the installation area) per square meter is at least 5min, calculated on the surface area of the housing of the sample to be tested.
The IPX5 method is named as a water spray test, the inner diameter of a water spray opening of a nozzle of test equipment is 6.3mm, the specific time of test conditions enables the distance between a test sample and the water spray opening to be 2.5-3 m, the water flow is 12.5L/min (750L/h), the test time is 1 min (excluding the installation area) per square meter calculated according to the surface area of a shell of the tested sample, and the minimum time is 3 min.
The IPX 6 method is named as a strong water spraying test, the inner diameter of a water spraying opening of a nozzle of the test equipment is 12.5 mm, the test conditions are similar to that of IPX5, but the water flow is 100L/min (6000L/h), the test time is 1 min (excluding the installation area) per square meter according to the surface area of a shell of a tested sample, and the minimum time is 3 min.
The IPX 7 method is named as short time immersion test, and the test equipment and test conditions are immersion tanks. The size of the sample is such that the distance from the bottom of the sample to the water surface is at least 1m after the sample is placed in the immersion water tank. The distance from the top of the sample to the water surface is at least 0.15m, and the test time is 30 min.
The method name of IPX 8 is the continuous diving test; the test equipment, test conditions and test time are agreed by both suppliers and suppliers.
The LED lamp obtained by the production system, such as an outdoor LED lamp, has the protection grade requirement of IP65 or above, the protection grade IP65 is converted into the pressure of 6kpa, the protection grade IP66 is converted into the pressure of 8kpa, the protection grade IP67 is converted into the pressure of 10kpa, and the protection grade IP68 is converted into the pressure of more than 10 kpa.
In practical application, whether an LED lamp product meets the IP protection standard or not is tested and checked according to the IP standard, and some disadvantages may also exist, such as: some sealing positions of the product structural design can not be flushed by water with pressure, so that the product can not be ensured to work under the IP protection level for a long time. The airtightness detection is to achieve a set air pressure intensity through the inflation in the lamp, and any position of the inner cavity of the lamp related to the sealing can be tested through the pressure generated by the air pressure, so that the product can be more effectively ensured to achieve a set protection level; the air tightness test replaces the common waterproof test, so that the production efficiency can be improved, the labor cost, the equipment investment, the production space and the like can be saved.
After the waterproof test is completed, the LED lamp finished product is tested in safety regulations such as insulation, grounding, voltage resistance, leakage and the like by the safety regulation testing device, and then the LED lamp finished product can be obtained.
The automatic parameter setting module and the functional parameter testing module can be a whole device or two separate devices, wherein the functional parameter testing module is similar to the first automatic testing device and the second automatic testing device in principle, and is used for verifying and acquiring main parameters of an assembled LED lamp finished product again at present to see whether the requirements are met or not and tracking product information.
According to the technical scheme, the production process of the LED lamp can be accelerated, the production efficiency is improved, and the product quality of the LED lamp can be well controlled.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. An LED lamp automatic production system is characterized by comprising: the automatic assembling method comprises the steps of synchronously operating a driving production branch line, a PCBA production branch line and a basic structure component production branch line, and automatically assembling and testing qualified semi-finished products of the production branch lines to obtain an assembling production line of the LED lamp finished product.
2. The automated LED lamp production system according to claim 1, wherein the driving production branch line is sequentially provided with a first chip mounter, a first reflow soldering, a first automatic testing device for debugging an output current value of the driving channel and controlling the output current value within a preset accuracy range, an automatic wire bonding device, and a driving assembly device.
3. The automatic production system of the LED lamp as claimed in claim 1, wherein a second chip mounter, a second reflow soldering and a second automatic testing device for debugging the photoelectric parameters of each LED lamp bead loop on the PCBA and controlling the photoelectric parameters within a preset range are sequentially arranged on the PCBA production branch line.
4. The automated LED luminaire production system of claim 1, wherein the infrastructure component production branch is provided with a structural assembly device.
5. The automatic production system of the LED lamp as claimed in claim 1, wherein an automatic screw locking device, an integral assembling device, an LED finished product parameter verifying device, an air tightness testing device for simulating a waterproof test, and a safety testing device are sequentially arranged on the assembling production line.
6. The LED lamp automatic production system according to claim 2, wherein the first automatic testing device includes a first voltage/current detection module that monitors voltage/current of the driving channels, a first resistance adjustment module that adjusts resistance values of the digital current limiting resistors corresponding to the driving channels, and a first controller that receives a monitoring value of the voltage/current detection module and controls the resistance adjustment module to adjust the resistance values of the digital current limiting resistors until an output current value of the driving channels reaches a predetermined accuracy range.
7. The automatic production system of the LED lamp according to claim 3, wherein the second automatic testing device comprises a voltage detection module for monitoring the voltage of each circuit of the PCBA so that the voltage reaches a preset range, a second resistance adjustment module for adjusting the resistance value of the digital resistance of each circuit of the PCBA, and a customized integrating sphere module for controlling the second resistance adjustment module to adjust the resistance value of the digital resistance so as to test the photoelectric parameter generated after the LED lamp bead on the PCBA emits light until the value of the photoelectric parameter reaches a preset range.
8. The LED lamp automated production system of claim 7, wherein the optoelectronic parameters include at least one of color temperature, color tolerance, color rendering index, luminous flux, wavelength.
9. The automatic production system of the LED lamp according to claim 5, wherein the LED lamp finished product parameter verification device includes an automatic parameter setting module, a functional parameter testing module, and a two-dimensional code printer that prints the parameters of the LED lamp finished product obtained by the functional parameter testing module on the LED lamp finished product in a two-dimensional code form.
10. The automated LED lamp production system of claim 9, wherein the two-dimensional code printer is a laser printer.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110050682A1 (en) * 2009-08-31 2011-03-03 Au Optronics Corporation Liquid Crystal Display Device and Back Light Module of the Liquid Crystal Display Device
CN102182988A (en) * 2011-03-24 2011-09-14 大峡谷光电科技(苏州)有限公司 Device and method for protecting surface-mounted light emitting diode (LED)
CN105280556A (en) * 2014-07-22 2016-01-27 严敏 Integration method of LED display module and LED display module
JP2016054283A (en) * 2014-09-02 2016-04-14 ジン アン、クァン LED module assembly
CN105810115A (en) * 2016-05-30 2016-07-27 深圳市奥蕾达科技有限公司 Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof
CN110449782A (en) * 2019-08-02 2019-11-15 惠州市圣士照明有限公司 LED light automatic assembly equipment
CN111157876A (en) * 2019-12-31 2020-05-15 苏州市运泰利自动化设备有限公司 System and method for testing PCBA (printed circuit board assembly) with luminous LED (light-emitting diode)

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110050682A1 (en) * 2009-08-31 2011-03-03 Au Optronics Corporation Liquid Crystal Display Device and Back Light Module of the Liquid Crystal Display Device
CN102182988A (en) * 2011-03-24 2011-09-14 大峡谷光电科技(苏州)有限公司 Device and method for protecting surface-mounted light emitting diode (LED)
CN105280556A (en) * 2014-07-22 2016-01-27 严敏 Integration method of LED display module and LED display module
JP2016054283A (en) * 2014-09-02 2016-04-14 ジン アン、クァン LED module assembly
CN105810115A (en) * 2016-05-30 2016-07-27 深圳市奥蕾达科技有限公司 Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof
CN110449782A (en) * 2019-08-02 2019-11-15 惠州市圣士照明有限公司 LED light automatic assembly equipment
CN111157876A (en) * 2019-12-31 2020-05-15 苏州市运泰利自动化设备有限公司 System and method for testing PCBA (printed circuit board assembly) with luminous LED (light-emitting diode)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
程良明: "T8 LED日光灯生产工艺流程图", 《百度文库》 *

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