CN111799988B

CN111799988B - Half-bridge module for a power converter of an electric vehicle

Info

Publication number: CN111799988B
Application number: CN202010595947.7A
Authority: CN
Inventors: 不公告发明人
Original assignee: Chongqing Jinkang New Energy Automobile Co Ltd
Current assignee: Chongqing Jinkang New Energy Automobile Co Ltd
Priority date: 2019-11-19
Filing date: 2020-06-28
Publication date: 2021-07-06
Anticipated expiration: 2040-06-28
Also published as: CN111799988A

Abstract

A half-bridge module for a power converter of an electric vehicle drive system is provided. The half-bridge module may include a thermal interface having a mating member. The half-bridge module may include a first switching device, which may be disposed over the first surface of the thermal interface. The half-bridge module may include a clip having a first spring arm and a second spring arm. The first spring arm may be disposed proximate the first switching device and the second spring arm may be disposed proximate the second surface of the thermal interface. The clip may include an aperture formed to receive a mating member of the thermal interface. The clip may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold.

Description

Half-bridge module for a power converter of an electric vehicle

Background

Vehicles, such as automobiles, have a power demand to operate the vehicle and associated or peripheral systems. The power source may include an on-board battery or fuel cell, gasoline or other fossil or plant-based fuel, and combinations thereof.

Disclosure of Invention

The present disclosure relates to a self-locking clip that couples one or more switching devices to a thermal interface within a half-bridge module for a power converter of an electric vehicle drive system. The half-bridge module may include one or more switching devices located within a defined distance from or in contact with the thermal interface such that the thermal interface provides heat dissipation for the respective one or more switching devices during operation or use of the half-bridge module. As described herein, the clip can connect with and hold the switching device in place, in place within a defined distance, or in contact with a thermal interface. The clamp may include an inactive state and an active state. In the inactive state, the clip may be installed into the half-bridge module and apply zero or little force to the switching device and/or thermal interface. In the activated state, the clamp may apply a defined level of force to at least one surface of the switching device and/or at least one surface of the thermal interface to hold the switching device in place, in place within a defined distance, or in contact with the thermal interface. For example, the thermal interface may include a mating member and the clip may include an aperture and first and second spring arms. The mating member of the thermal interface may contact or connect with the aperture of the clip to transition the clip from the inactive state to the active state. In the activated state, the spring arms of the clip may apply a clamping force or pressure to at least one surface of the switching device and/or at least one surface of the thermal interface to hold the switching device in place, in place within a defined distance, or in contact with the thermal interface.

At least one aspect relates to a half-bridge module for powering an electric vehicle. The half-bridge module may include a thermal interface having a first surface and a second surface. The thermal interface may include a mating member. The half-bridge module may include a first switching device having a first surface and a second surface. The second surface of the first switching device may be disposed over the first surface of the thermal interface. The half-bridge module may include a clip having a first spring arm and a second spring arm. The first spring arm may be disposed proximate to a first surface of the first switching device. The second spring arm may be disposed proximate to the second surface of the thermal interface. The clip may include an aperture formed therethrough and between the first and second spring arms. The aperture may be formed to receive a mating member of the thermal interface. The clip may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold.

At least one aspect relates to a method of forming a half-bridge module for powering an electric vehicle. The method may include providing a thermal interface having a first surface and a second surface. The method may include forming a mating member of the thermal interface. The method may include providing a first switching device having a first surface and a second surface. The second surface of the first switching device may be located above the first surface of the thermal interface. The method may include providing a clamp having a first spring arm and a second spring arm. The method may include forming an aperture through the clamp and between the first spring arm and the second spring arm. The aperture may be formed to receive a mating member of the thermal interface. The method may include disposing a first spring arm proximate to a first surface of a first switching device. The method may include disposing a second spring arm proximate to a second surface of the thermal interface. The aperture may be formed to receive a mating member of the thermal interface. The clip may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold.

At least one aspect relates to an electric vehicle. An electric vehicle may include a half-bridge module that powers the electric vehicle. The half-bridge module may include a thermal interface having a first surface and a second surface. The thermal interface may include a mating member. The half-bridge module may include a first switching device having a first surface and a second surface. The second surface of the first switching device may be disposed over the first surface of the thermal interface. The half-bridge module may include a clip having a first spring arm and a second spring arm. The first spring arm may be disposed proximate to a first surface of the first switching device. The second spring arm may be disposed proximate to the second surface of the thermal interface. The clip may include an aperture formed through the clip and between the first and second spring arms. The aperture may be formed to receive a mating member of the thermal interface. The clip may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold.

At least one aspect relates to a method of providing a half bridge module. The method may include providing a half-bridge module. The half-bridge module may include a thermal interface having a first surface and a second surface. The thermal interface may include a mating member. The half-bridge module may include a first switching device having a first surface and a second surface. The second surface of the first switching device may be disposed over the first surface of the thermal interface. The half-bridge module may include a clip having a first spring arm and a second spring arm. The first spring arm may be disposed proximate to a first surface of the first switching device. The second spring arm may be disposed proximate to the second surface of the thermal interface. The clip may include an aperture formed through the clip and between the first and second spring arms. The aperture may be formed to receive a mating member of the thermal interface. The clip may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold.

These and other aspects and embodiments are discussed in detail below. The foregoing information and the following detailed description include illustrative examples of various aspects and embodiments, and provide an overview or framework for understanding the nature and character of the claimed aspects and embodiments. The accompanying drawings are included to provide an illustration and a further understanding of the various aspects and embodiments, and are incorporated in and constitute a part of this specification.

Drawings

The figures are not drawn to scale. Like reference numbers and designations in the various drawings indicate like elements. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:

fig. 1 shows an exemplary isometric view of a clip of a half bridge module in accordance with an illustrative embodiment;

FIG. 2 shows an exemplary side view of a thermal interface with mating components in accordance with an illustrative embodiment;

FIG. 3 shows an exemplary angled view of a clip positioned proximate a thermal interface including a first switching device coupled to a first surface and a second switching device coupled to a second surface, in accordance with an illustrative embodiment;

FIG. 4 shows an exemplary side view of a clip positioned proximate a thermal interface including a first switching device coupled to a first surface and a second switching device coupled to a second surface, in accordance with an illustrative embodiment;

FIG. 5 shows an exemplary front view of a clip positioned proximate a thermal interface including a first switching device coupled to a first surface and a second switching device coupled to a second surface, in accordance with an illustrative embodiment;

FIG. 6 shows an exemplary oblique view of a clip coupled with a thermal interface including a first switching device coupled to a first surface and a second switching device coupled to a second surface, in accordance with an illustrative embodiment;

FIG. 7 shows an exemplary side view of a clip coupled with a thermal interface including a first switching device coupled to a first surface and a second switching device coupled to a second surface, in accordance with an illustrative embodiment;

FIG. 8 is a block diagram showing a cross-sectional view of an exemplary electric vehicle mounted with a half-bridge module having a clamp;

9-10 show a flow diagram of a method of coupling one or more switching devices to a thermal interface using a clip for a half bridge module in accordance with an illustrative embodiment; and

fig. 11 provides a method of providing a half bridge module.

Following are more detailed descriptions of various concepts and embodiments thereof related to methods, apparatus, and systems for providing an inverter/capacitor assembly for an electric vehicle. The various concepts introduced above and discussed in greater detail below may be implemented in any of numerous ways, as the described concepts are not limited to any particular implementation.

Detailed Description

The systems and methods described herein relate to a clip (e.g., a self-locking clip) for coupling at least one switching device with a thermal interface of a half-bridge module of an inverter module of an electric vehicle, for example, to hold or press the switching device in contact with or within a predetermined distance from the thermal interface for heat dissipation and to maintain low thermal resistance. The clip may be formed with a geometry that allows the clip to be installed in the half bridge module in an inactive state (e.g., no clamping pressure) and switched to an active state such that the clip provides a clamping pressure to the switching device to hold or press the switching device in contact with or within a predetermined distance from the thermal interface. For example, the clip may be formed with a first spring arm and a second spring arm extending from the intermediate region. The intermediate region of the clip may include an aperture or hole formed to receive a mating member of the thermal interface. The clamp may be installed using a defined level of pressure (e.g., pressure) so that the clamp can be activated and locked into place without the need for additional tools, particularly manufacturing tools or fasteners. Rather, the clips described herein may be installed by a linear pressing motion.

The clip may be coupled with a mating member of the thermal interface to transition from the inactive state to the active state such that the clip provides a clamping pressure to the switching device to hold or press the switching device in contact with or within a predetermined distance from the thermal interface. For example, the clip may be activated in response to pressure applied to the clip such that the first spring arm is coupled to or in contact with a surface of the switching device and the second spring arm is coupled to or in contact with a thermal interface or a surface of the second switching device. The mating member of the thermal interface may be coupled with or locked into the aperture of the clamp to transition the clamp from the inactive state to the active state. The spring arm of the clip can hold or press the switching device or devices into contact with or within a predetermined distance from the thermal interface to provide heat dissipation for the switching devices within the half bridge module.

A half-bridge module of an inverter module of an electric vehicle may include one or more switching devices (e.g., transistors, discrete switches) placed in contact with or within a predetermined distance from a thermal interface such that the thermal interface may provide or perform heat dissipation for the one or more switching devices. The thermal interface may include, but is not limited to, a heat sink, a cold plate, a cooling channel, or a chassis. External pressure is typically applied to the switching device to hold the switching device in place. However, the pressure applicators used may require special tools to install, which may need to be pulled apart, placed in place, and then released. The pressure applicator may require increased size or space for a special tool to access and install the pressure applicator. The pressure applicator may require the use of fasteners to hold the pressure applicator in place after installation. The pressure applicator may engage one switching device along each line of force.

The clamps described herein may be installed using, for example, linear motion, without the need for special tools or additional fasteners. Thus, the size or space occupied by the jig can be reduced, thereby reducing the overall size required for the components of the half-bridge module. In embodiments, a single clamp may contact or provide pressure to two switching devices (rather than just one switching device), for example, coupled with two different sides of a thermal interface. For example, the spring arms of the clips may extend until they contact and provide pressure (e.g., clamping force, clamping pressure) to the surface of the switching device to keep the switching device in contact with or within a predetermined distance from the thermal interface. The spring arm and clip may be activated in response to contact from a mating member of the thermal interface that transitions the clip from the inactivated state to the activated state. The aperture of the clip may receive a locking feature of a mating member of the thermal interface to secure and lock the clip to the switching device and the thermal interface and prevent movement of the clip or the switching device. In embodiments, the clamps described herein may include self-locking clamps to clamp the switching device to both sides of the thermal interface, eliminating the need for special tools, fasteners, and reducing the required size for securing the switching device to the thermal interface within the electric vehicle's half-bridge module.

Fig. 1 shows an isometric view 100 of a clamp 105 having a first spring arm 110, a second spring arm 115, and an aperture 120. The clamp 105 may include or correspond to a fastener or device for connecting or coupling objects together. For example, the clamp 105 may be configured to couple, connect, hold in place, in place within a defined distance, or contact at least one switching device with a thermal interface. The clamp 105 may couple or connect with at least one switching device with at least one surface of the switching device and/or at least one surface of the thermal interface to hold the switching device in place, in place within a defined distance, or in contact with the thermal interface. The clamp 105 and each of the different components (e.g., the first spring arm 110, the second spring arm 115, the intermediate region 125) forming the clamp 105 may be formed from a variety of different materials, including but not limited to steel, spring steel, and alloys.

The clip 105 may be sized for a variety of different applications and configurations, and the size of the clip 105 may be varied to accommodate a variety of different sized switching devices and/or a variety of different sized thermal interfaces. For example, the clamp 105 may be sized based in part on the size and dimensions of the switching device to which the clamp 105 is to be coupled, the size and dimensions of the thermal interface to which the clamp 105 is to be coupled, and/or the size and dimensions of a combination of one or more switching devices and thermal interfaces that the clamp 105 is to be coupled together. The thickness of the clamp 105 may range from 0.3mm to 2 mm. The thickness of the clip 105 may be selected based in part on the hardness or flexibility of the material forming the clip 105. The thickness of the clamp 105 may be selected based in part on the clamping force that the clamp 105 is required to provide. The length or height of the clamp 105 may range from 10mm to 30 mm. The length or height of the clamp 105 may be selected based at least in part on the size of the switching device to which the clamp 105 is to be connected and/or the desired location at which a force (e.g., clamping force) is to be applied on the switching device by the clamp 105. The width of the clamp 105 may range from 10mm to 20 mm. The width of the clip 105 may be selected based at least in part on the width of the switching device and/or the distance between two or more switching devices. The size of the clamp 105 may vary within these ranges or outside these ranges.

The first spring arm 110 may include or correspond to an extension, flange, gull wing, or first portion of the clamp 105. The first spring arm 110 may extend from a middle region 125 of the clamp 105. The first spring arm 110 may be an extension of and integrally formed with (e.g., of the same material as) the middle region 125 of the clip. For example, the first spring arm 110 may extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees relative to a surface (e.g., a top surface) of the middle region 125 of the clamp 105. The first spring arm 110 may be formed to have a straight shape, a curved shape, a gull-wing shape, an inverted gull-wing shape, or a shape having one or more curves or curves to allow the first spring arm 110 to apply a force or pressure to a surface of an object (e.g., a surface of a switching device, a surface of a thermal interface) to which the clamp 105 is coupled or in contact. The first spring arm 110 may include a first end 145 and a second end 140. The first end 145 may be connected to or integrally formed with the first end 150 of the intermediate region 125. The second end 140 of the first spring arm 110 may correspond to an end or first end of the clamp 105.

The thickness of the first spring arm 110 may range from 0.3mm to 2 mm. The thickness of the first spring arm 110 may be selected based at least in part on the hardness or flexibility of the material forming the first spring arm 110. The thickness of the first spring arm 110 may be selected based at least in part on the clamping force that the first spring arm 110 is required to provide. The length from the first end 145 to the second end 140 of the first spring arm 110 may range from 10mm to 30 mm. The length of the first spring arm 110 may be selected based at least in part on the size of the switching device to which the first spring arm 110 is to be connected and/or the desired location at which the first spring arm 110 provides the applied force (e.g., clamping force) on the switching device. The width of the first spring arm 110 may range from 4mm to 20 mm. The width of the first spring arm 110 may be selected based at least in part on the width of the switching device and/or the distance between two or more switching devices. The size of the first spring arm 110 may vary within these ranges or outside these ranges.

The apertures 120 may include or correspond to openings, holes, threaded holes, slots, slits, entrances, or entry points formed through the intermediate region 125 of the clamp 105. The aperture 120 may be formed through the clamp 105 and located between the first spring arm 110 and the second spring arm 115. The aperture 120 may be formed to receive a mating member of the thermal interface. For example, the apertures 120 may be formed to receive mating members of a thermal interface. The clip 105 may change from the first state to the second state in response to contact from a mating member of the thermal interface to the clip being greater than a force threshold. The force threshold may correspond to an amount of force or pressure applied to the clamp 105 through the orifice 120 or intermediate region 125 of the clamp to transition the clamp from the first, inactive state to the second, active state. The force threshold may be in the range of 30N (newtons) to 200N (newtons). The force threshold may vary within this range or outside this range.

The aperture 120 may be formed to contact, connect, or couple with a locking feature of a mating member. For example, the apertures 120 may be formed in a variety of different shapes and/or with a range of sizes to receive locking features and/or mating members. The orifice 120 may be formed to have a circular, rectangular, or square shape. The shape of the aperture 120 may be selected based in part on the shape of the object (e.g., locking feature, mating member) to be connected or coupled with the aperture 120. The width, diameter or size of the opening forming the orifice 120 may range from 0mm to 5 mm. The size of the aperture 120 may be selected based in part on the size of the object (e.g., locking feature, mating member) to be connected or coupled with the aperture 120. The shape and/or size of the orifice 120 may vary within these ranges or outside these ranges. The location or position of the aperture 120 within the intermediate region 125 of the clamp may vary and may be selected based in part on the shape and/or size of the object (e.g., locking feature, mating member) to be connected or coupled with the aperture 120. For example, the apertures 120 may be formed in a middle portion of the middle region 125 of the clamp 105 or in an offset position (e.g., offset to the left, offset to the right) relative to the middle portion of the middle region 125.

The orifice 120 may include a first inner surface 170 and a second inner surface 175. The first and second

inner surfaces

170 and 175 may include or correspond to edge or side surfaces of the orifice 120. The first and second

inner surfaces

170 and 175 may include straight edge surfaces or curved edge surfaces. The first and second

inner surfaces

170, 175 may be configured to receive and couple with locking features of mating members of a thermal interface. For example, locking features may extend over or clip onto the first and second

inner surfaces

170, 175 to connect the clip 105 with a thermal interface. The first and second

inner surfaces

170 and 175 may correspond to opposing edges or side surfaces of the aperture 120. The aperture 120 may include two

inner surfaces

170, 175 or four

inner surfaces

170, 175 to receive and couple locking features of mating members of the thermal interface.

The second spring arm 115 may include or correspond to an extension, flange, gull wing, or second portion of the clamp 105. The second spring arm 115 may extend from the middle region 125 of the clamp 105. The second spring arm 115 may be an extension of and integrally formed with (e.g., of the same material as) the middle region 125 of the clip. For example, the second spring arms 115 may extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees relative to a surface (e.g., a top surface) of the middle region 125 of the clamp 105. The second spring arm 115 may be formed to have a straight shape, a curved shape, a gull-wing shape, an inverted gull-wing shape, or a shape having one or more curves or curves to allow the second spring arm 115 to apply a force or pressure to a surface of an object (e.g., a surface of a switching device, a surface of a thermal interface) to which the clamp 105 is coupled or in contact. The second spring arm 115 may include a first end 160 and a second end 165. The first end 160 of the second spring arm 115 may be connected to or integrally formed with the second end 155 of the intermediate region 125. The second end 165 of the second spring arm 115 may correspond to one end or a second end of the clamp 105.

The thickness of the second spring arm 115 may range from 0.3mm to 2 mm. The thickness of the second spring arm 115 may be selected based at least in part on the hardness or flexibility of the material forming the second spring arm 115. The thickness of the second spring arm 115 may be selected based at least in part on the desired clamping force to be provided by the second spring arm 115. The length from the first end 160 to the second end 165 of the second spring arm 115 may range from 10mm to 30 mm. The length of the second spring arm 115 may be selected based at least in part on the size of the switching device to which the second spring arm 115 is to be connected and/or the desired location at which a force (e.g., a clamping force) is to be applied on the switching device by the second spring arm 115. The width of the second spring arm 115 may range from 4mm to 20 mm. The width of the second spring arm 115 may be selected based at least in part on the width of the switching device and/or the distance between two or more switching devices. The size of the second spring arm 115 may vary within these ranges or outside these ranges.

The second spring arm 115 and the first spring arm 110 may be formed to have the same or similar size, shape, and/or properties. For example, the second spring arm 115 may have the same dimensions as the first spring arm 110. The second spring arm 115 may have the same shape as the first spring arm 110. The second spring arm 115 may extend from the surface of the intermediate region 125 at the same angle or within the same range as the first spring arm 110.

The clamp can include one or

more slots

130, 135 formed therethrough to provide a degree of flexibility and/or a defined level of pressure or force to the clamp when the clamp 105 is activated or in an activated state. For example, the clamp 105 may be formed with one or

more slots

130, 135 to allow or for bending of the clamp 105 or to apply a clamping pressure (e.g., force) to a surface of an object to which the clamp 105 is coupled or in contact. The one or

more slots

130, 135 can be configured to cause the first and

second spring arms

110, 115 of the clamp 105 to apply a clamping pressure (e.g., force) to a surface of an object to which the clamp 105 is coupled or in contact. The

slots

130, 135 may be connected with the aperture 120. For example, the

slots

130, 135 may connect with the aperture 120 to form first and second tabs within the clip 105. The first tab may include a portion of the first spring arm 110 and a portion of the middle region 125. The first tab may include a first slot 130 as a first boundary of the first tab, a second slot 135 as a second boundary, and an aperture 120 as a boundary or endpoint. The second tab may include a portion of the second spring arm 115 and a portion of the middle region 125. The second tab may include a first slot 130 as a first boundary of the second tab, a second slot 135 as a second boundary, and an aperture 120 as a boundary or endpoint. In an embodiment, the

slots

130, 135 may be independent of the aperture 120 and not connected with the aperture 120. For example, the

slots

130, 135 may be separate holes formed through the clip 105 and not connected with the aperture 120.

The number of

slots

130, 135, the size and/or dimensions of the

slots

130, 135 may be selected based at least in part on a defined or desired level of pressure or force that the

spring arms

110, 115 are to provide to a surface of an object to which the clamp 105 is coupled or in contact. In fig. 1, the clamp 105 is shown with a first slot 130 and a second slot 135, however, the clamp 105 may be formed without slots, with a single slot, or with more than two slots. The first slot 130 and the second slot 135 may be formed to have the same or similar shape and/or size. For example, the first slot 130 and the second slot 135 may be formed to have a circular, rectangular, or square shape. The length of the first and

second slots

130 and 135 may range from 5mm to 25 mm. The width of the first and

second slots

130 and 135 may range from 0mm to 5 mm. The size and dimensions of the first slot 130 and the second slot 135 may vary within these ranges or outside these ranges.

Fig. 2 shows a top view 200 of a thermal interface 205 of a half bridge module. The thermal interface 205 includes a first side surface 210, a second side surface 215, and a mating feature 220 extending from the first side surface 210 of the thermal interface 205. A thermal interface 205 may be located within the half-bridge module to provide heat dissipation, passive cooling, and/or active cooling to one or more components (e.g., electrical components, switching devices) of the half-bridge module. For example, the thermal interface 205 may be located within the half-bridge module such that it is proximate to, adjacent to, or in contact with an electronic device, such as a transistor, capacitor, or PCB, to provide passive cooling, active cooling, heat dissipation, and/or heat removal for the half-bridge module. The thermal interface 205 may include or correspond to a heat sink, a cooling plate, one or more cooling channels, or a combination of one or more of a heat sink, a cooling plate, or one or more cooling channels. For example, the thermal interface 205 may include a cooling plate having one or more cooling channels to which coolant may be provided and flowed to provide passive and/or active cooling. The thermal interface 205 may include an aluminum or aluminum heat spreader, a thermally conductive paste, a thermally conductive pad, a ceramic, and/or other forms of material intended to disperse or dissipate heat. The thermal interface 205 may include one or more different layers or one or more different materials.

The thermal interface 205 may include a first surface 245 and a second surface 250. The first surface 245 may include or correspond to a top surface of the thermal interface 205. The second surface 250 may include or correspond to a bottom surface of the thermal interface 205. The first surface 245 and the second surface 250 may include or correspond to opposing surfaces of the thermal interface 205. The thermal interface 205 may be formed to have a square, rectangular, or circular shape. The thermal interface 205 may have a length in the range of 10mm to 30mm, i.e., the distance from the first side surface 210 to the second side surface 215. The thermal interface 205 may have a width in the range of 5mm to 30mm, such as the width of the first surface 245 or the second surface 250. The thermal interface 205 may have a thickness or height, i.e., a distance from the first surface 245 to the second surface 250, in the range of 5mm to 30 mm. The size and/or dimensions of the thermal interface 205 may vary within these ranges or outside these ranges.

The thermal interface 205 may include a mating member 220. The mating member 220 may include or correspond to an extension of the thermal interface 205. For example, the mating member 220 may include a first end 255 extending from the first side surface 210 of the thermal interface 205, connected to the first side surface 210, or coupled with the first side surface 210. The mating member 220 may include a second end 260, the second end 260 including a locking feature 230, connected to the locking feature 230, or coupled with the locking feature 230. The mating member 220 may be integrally formed with the thermal interface 205 and comprise the same or similar material as the thermal interface 205. The mating member 220 may extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees relative to the first side surface 210 of the thermal interface 205.

The fitting member 220 may be formed to have a square, rectangular, or circular shape. The mating member 220 may have a length, i.e., a distance from the first end 255 to the second end 260, in the range of 0mm to 10 mm. The mating member 220 may have a width in the range of 5mm to 15 mm. The mating member 220 may have a thickness or height in the range of 5mm to 15 mm. The size and/or dimensions of mating member 220 may vary within these ranges or outside of these ranges.

The mating member 220 may include a locking feature 230. The locking feature 230 may include or correspond to an extension, end, or component of the mating member 220. The locking feature 230 may be integrally formed with and comprise the same material as the mating member 220. The locking feature 230 may extend from the second end 260 of the mating member 220, be connected to the second end 260, or be coupled with the second end 260. The locking feature 230 may extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees relative to the second end 260 of the mating member 220.

The locking feature 230 may be shaped to couple or connect with one or more

inner surfaces

170, 175 of the aperture 120 of the clamp 102. For example, the locking feature 230 may include a first edge 235 and a second edge 240. The first edge 235 and the second edge 240 may include or correspond to an indentation, groove, curved edge, notch, or recess formed in the outer surface of the locking feature 230. The first edge 235 and the second edge 240 may be shaped to connect or couple the

inner surfaces

170, 175 of the apertures 120 of the clamp 102.

In an embodiment, the first edge 235 and the second edge 240 may include or correspond to a groove or indentation formed in an outer surface of the locking feature 230, and thus include the same edge surface. For example, the first edge 235 and the second edge 240 may be parts or portions of a continuous groove formed in the outer surface of the locking feature 230. The locking features 230 may be formed to have a square, rectangular, circular, or arrow shape. The locking feature 230 may be formed such that the locking feature forms an endpoint having a 45 degree angle. The angle of the end point of the locking feature 230 may range from 20 degrees to 70 degrees.

The locking feature 230 may have a length in the range of 3mm to 10 mm. The locking feature 230 may have a width in the range of 5mm to 15 mm. The locking feature 230 may have a thickness or height in the range of 5mm to 15 mm. The size and/or dimensions of the locking features 230 may vary within these ranges or outside of these ranges.

Fig. 3-4 show

different views

300, 400 of the clip 105 located near or near the thermal interface 205 with a first switching device 305 coupled to the first surface 245 of the thermal interface 205 and a second switching device 305 coupled to the second surface 250 of the thermal interface 205. For example, fig. 3 shows an oblique view 300 of the clip 105, the thermal interface 205, and the first and second switching devices 305. Fig. 4 shows a side view 400 of the clip 105, the thermal interface 205, and the first and second switching devices 305. The clip 105 is located near, adjacent to, or near the mating member 220 and the locking feature 230 of the thermal interface 205.

The first spring arm 110 and the second spring arm 115 are located near, adjacent to, or near certain portions of the thermal interface 205 and/or the first and second switching devices 305. The proximity may include or correspond to being located adjacent, proximate, in contact with, or spaced a distance (e.g., a vertical distance, a horizontal distance, a multi-dimensional distance) from at least one surface, edge, or portion of the object. For example, when the clip 105 is positioned adjacent or proximate to the thermal interface 205 and/or the one or more switching devices 305, the clip 105 may be positioned proximate to the thermal interface 205 and/or the one or more switching devices 305. When the first spring arm 110 of the clip 105 is positioned adjacent or proximate to a portion of the first surface 310 of the first switching device 305 and the second spring arm 115 is positioned adjacent or proximate to a portion of the first surface 310 of the second switching device 305 or to a portion of the second surface 250 of the thermal interface 205, the clip 105 may be positioned proximate to the thermal interface 205 and/or one or more switching devices 305.

When the first spring arm 110 of the clip 105 is spaced a distance (e.g., a vertical distance, a horizontal distance, a multi-dimensional distance) from a portion of the first surface 310 of the first switching device 305 and the second spring arm 115 is spaced a distance (e.g., a vertical distance, a horizontal distance, a multi-dimensional distance) from a portion of the first surface 310 of the second switching device 305, or a distance (e.g., a vertical distance, a horizontal distance, a multi-dimensional distance) from a portion of the second surface 250 of the thermal interface 205, the clip 105 may be positioned proximate to the thermal interface 205 and/or one or more switching devices 305. When the first spring arm 110 of the clip 105 is positioned over a portion of the first surface 310 of the first switching device 305 and the second spring arm 115 is positioned over a portion of the first surface 310 of the second switching device 305 or over a portion of the second surface 250 of the thermal interface 205, the clip 105 may be positioned proximate to the thermal interface 205 and/or one or more switching devices 305.

The first spring arm 110 and the second spring arm 115 may be located near, adjacent to, or near certain portions of the thermal interface 205 and/or the first and second switching devices 305. Portions of the thermal interface 205 and/or the first and second switching devices 305 may include a percentage of the respective surface or less than the overall or full size of the surface. For example, the first spring arm 110 of the clip 105 may be disposed over or in contact with a portion of the first surface 310 of the first switching device 305 that is less than the full size or length of the first surface 310 of the first switching device 305. The second spring arm 115 may be disposed over or in contact with a portion of the first surface 310 of the second switching device 305 that is less than the full size or length of the first surface 310 of the second switching device 305. The second spring arm 115 may be disposed on or in contact with a portion of the second surface 250 of the thermal interface 205 that is less than the full size or length of the second surface 250 of the thermal interface 205. The portion of the surface may include or correspond to a range of 10% of the respective surface to 80% of the respective surface.

The first and second switching devices 305 may include or correspond to transistors, semiconductor devices, or discrete switching devices. The first and second switching devices 305 may comprise TO-247 transistors, TO-247 discrete Insulated Gate Bipolar Transistor (IGBT) components, or IGBT semiconductor dies. The switching device 305 may be located in contact with or within a defined distance from a surface of the thermal interface 205 to receive heat dissipation from the thermal interface 205 and/or cooling from the thermal interface 205. Switching device 305 may include a first surface 310 and a second surface 315. The first surface 310 may correspond to a top surface of the switching device 305. The second surface 315 may correspond to a bottom surface of the switching device 305. The switching devices 305 may include a plurality of leads 320 extending radially from an edge surface of the respective switching device 305, for example, to couple with a capacitor or other target connection within the half-bridge module. The switching device 305 may include a lead 320. Each of the three leads 320 may correspond to at least one of the terminals of the respective switching device 305. For example, the first lead 320 may correspond to a base terminal or a base lead. The second lead 320 may correspond to a collector terminal or a collector lead. The third wire 320 may correspond to an emitter terminal or an emitter wire. The leads 320 may receive or provide a voltage signal or a current signal.

The aperture 120 of the clamp 102 is positioned or aligned to receive, connect, or couple with the locking feature 230 of the thermal interface 205. The first spring arm 110 and the second spring arm 115 of the clamp 105 are positioned to contact the first switching device 305. For example, the first spring arm 110 may be positioned in coupling with the first surface 310 of the first switching device 305 to maintain the first switching device 305 in contact with or within a defined distance from the first surface 245 of the thermal interface 205. The first spring arm 110 may be disposed adjacent, or resting on a portion of the first surface 310 of the first switching device 305. The second spring arm 115 may be located at a first surface 310 coupled to the second switching device 305 to maintain the second switching device 305 in contact with or within a defined distance from the second surface 250 of the thermal interface 205. The second spring arm 115 may be disposed adjacent, or resting on a portion of the first surface 310 of the second switching device 305. In embodiments having a single switching device 305, the second spring arm 115 may be disposed proximate, adjacent, or disposed on a portion of the second surface 250 of the thermal interface 205.

Fig. 5 illustrates an oblique view 500 of the clip 105 coupled or connected to the thermal interface 205 having a first switching device 305 coupled to a first surface 245 of the thermal interface 205 and a second switching device 305 coupled to a second surface 250 of the thermal interface 205. The apertures 120 may be positioned or aligned to receive the locking features 230 of the mating member 220 of the thermal interface 205. A first force 505 at a first level may be applied to the clip 105 to couple or connect the clip with the thermal interface 205 and the first and second switching devices 305. The force 505 may include or correspond to a linear force or a lateral force applied to an outer surface of the clamp 105 to push or mount the clamp 105 within the half-bridge module. The force 505 may range from 30N (newtons) to 200N (newtons). The force 505 may vary within this range or outside of this range. Other forms of force or pressure may be used to mount the clamp 105, including but not limited to non-linear force, one-dimensional motion, and multi-dimensional motion. In an embodiment, the clamp 105 may be installed within the half-bridge module without the use of special installation tools, equipment, or fasteners. For example, the clamp 105 may be mounted such that the first spring arm 110 slides, pushes, or is positioned over the first surface 310 of the first switching device 305 and the second spring arm 115 slides, pushes, or is positioned over the first surface 310 of the second switching device 305.

The clamp 105 may be installed in a first state corresponding to an inactive state. In the first state, the first spring arm 110 of the clamp 105 may apply a first level of force to the first surface 310 of the first switching device 305. In the first state, the first spring arm 110 may be located on, near, or adjacent to the first surface 310 of the first switching device 305. For example, the first spring arm 110 may be spaced a distance from the first surface 310 of the first switching device 305. In embodiments, the first level of force applied by the first spring arm 110 to the first surface 310 of the first switching device 305 may be zero or no applied force. In the first state, the first spring arm 110 may contact (e.g., directly contact) or touch the first surface 310 of the first switching device 305. In an embodiment, the first level of force applied by the first spring arm 110 to the first surface 310 of the first switching device 305 may vary, for example, from 0N (newtons) to 5N (newtons). In an embodiment, the first level of force applied by the first spring arm 110 to the first surface 310 of the first switching device 305 may include, but is not limited to, just touching the first surface 310 of the first switching device 305. The level of force applied by the first spring arm 110 to the first surface 310 of the first switching device 305 may vary within or outside of this range.

In the first state, the second spring arm 115 of the clamp 105 may apply a first level of force to the first surface 310 of the second switching device 305. In the first state, the second spring arm 115 may be located above, near, or adjacent to the first surface 310 of the second switching device 305. For example, the second spring arm 115 may be spaced a distance from the first surface 310 of the second switching device 305. In embodiments, the first level of force applied by the second spring arm 115 to the first surface 310 of the second switching device 305 may be zero or no applied force. In the first state, the second spring arm 115 may contact (e.g., directly contact) or touch the first surface 310 of the second switching device 305. In an embodiment, the first level of force applied by the second spring arm 115 to the first surface 310 of the second switching device 305 may vary, for example, from 0N (newtons) to 5N (newtons). In an embodiment, the first level of force applied by the second spring arm 115 to the first surface 310 of the second switching device 305 may include, but is not limited to, just touching the first surface 310 of the second switching device 305. The level of force applied by the second spring arm 115 to the first surface 310 of the second switching device 305 may vary within or outside of this range.

The thermal interface 205 may include only a single switching device 305 coupled to the first surface 245 of the thermal interface 205. For example, the first spring arm 110 of the clip 105 may be located on, near, adjacent to, or in contact with the first surface 310 of the second switching device 305. The second spring arms 115 of the clip 105 may be positioned on, near, adjacent to, or in contact with the second surface 250 of the thermal interface 205. In the first state, the second spring arm 115 may be spaced a distance from the second surface 250 of the thermal interface 205. In embodiments, the first level of force applied by the second spring arm 115 to the second surface 250 of the thermal interface 205 may be zero or no applied force. In the first state, the second spring arm 115 may contact (e.g., directly contact) or touch the second surface 250 of the thermal interface 205. In an embodiment, the first level of force applied by the second spring arm 115 to the second surface 250 of the thermal interface 205 may vary, for example, from 0N (newtons) to 5N (newtons). In an embodiment, the first level of force applied to the second surface 250 of the thermal interface 205 by the second spring arm 115 may include, but is not limited to, just contacting the second surface 250 of the thermal interface 205. The level of force applied by the second spring arm 115 to the second surface 250 of the thermal interface 205 may vary within this range or outside of this range.

Fig. 6-7 show

different views

600, 700 of the clip 105 coupled or connected to the thermal interface 205 having a first switching device 305 coupled to the first surface 245 of the thermal interface 205 and a second switching device 305 coupled to the second surface 250 of the thermal interface 205. Fig. 6 illustrates an oblique view 600 of the aperture 120 of the clamp 105 coupled with the locking feature 230 of the thermal interface 205, the first spring arm 110 in contact with the first surface 310 of the first switching device 305 and the second spring arm 115 in contact with the first surface 310 of the second switching device 305. Fig. 7 illustrates a side view 700 of the aperture 120 of the clamp 105 coupled with the locking feature 230 of the thermal interface 205, the first spring arm 110 in contact with the first surface 310 of the first switching device 305, and the second spring arm 115 in contact with the first surface 310 of the second switching device 305.

The clamp 105 may be transitioned from a first state to a second state. For example, in response to a force applied to the clip 105 by the mating member 220 of the thermal interface 205, the clip 105 may change or transition from a first state to a second state in which the first spring arm 110 is positioned proximate, adjacent, or in contact with the first surface 310 of the first switching device 305 and the second spring arm 115 is positioned proximate, adjacent, or in contact with the first surface 310 of the second switching device 305. The applied force may be greater than or equal to a force threshold. The force may be applied to the aperture 120, the

inner surfaces

170, 175 of the aperture 120, and/or the intermediate region 125 of the clip 105 by the locking feature 230. The second state of the clamp 105 may correspond to an activated state. For example, in the second state, the clamp 105 may compress, hold, or position the first and second switching devices 305 in contact with, near, adjacent to, or within a defined distance from the first and

second surfaces

245, 250 of the thermal interface 205 so that the thermal interface 205 provides heat dissipation for the first and second switching devices 305.

In a second state (e.g., an activated state) of the clamp 105, the first and

second spring arms

110 and 115 may apply a clamping force or press against the first and second switching devices 305, respectively, to hold the first and second switching devices 305 in contact with, proximate to, adjacent to, or within a defined distance from the first and

second surfaces

245 and 250 of the thermal interface 205. For example, in the second state, the first spring arm 110 of the clamp 105 may apply a second level of clamping force 705 to the first surface 310 of the first switching device 305. The first spring arm 110 may be in contact with a first surface 310 of the first switching device 305 to compress or hold the first switching device 305 in contact with, near, adjacent to, or within a defined distance from the first surface 245 of the thermal interface 205. In an embodiment, one or more intermediate layers, including but not limited to one or more adhesive layers and/or one or more insulating layers, may be disposed or provided between the surface of the first spring arm 110 and the first surface 310 of the first switching device 305. The clamping force 705 may be in the range of 5N (newtons) to 50N (newtons). The clamping force 705 may vary within this range or outside of this range.

In the second state, the second spring arm 115 of the clamp 105 may apply a second level of clamping force 705 to the first surface 310 of the second switching device 305. The second spring arm 115 may be in contact with the first surface 310 of the second switching device 305 to compress or hold the second switching device 305 in contact with, near, adjacent to, or within a defined distance from the second surface 250 of the thermal interface 205. In an embodiment, one or more intermediate layers, including but not limited to one or more adhesive layers and/or one or more insulating layers, may be disposed or provided between the surface of the second spring arm 115 and the first surface 310 of the second switching device 305. The clamping force 705 may be in the range of 5N (newtons) to 50N (newtons). The clamping force 705 may vary within this range or outside of this range.

In an embodiment, the thermal interface 205 may include only a single switching device 305 coupled with the first surface 245 of the thermal interface 205. For example, the first spring arm 110 of the clip 105 may be located on, near, adjacent to, or in contact with the first surface 310 of the second switching device 305. The second spring arms 115 of the clip 105 may be positioned on, near, adjacent to, or in contact with the second surface 250 of the thermal interface 205. In the second state of the clip 105, the second spring arm 115 may contact (e.g., directly contact) or touch the second surface 250 of the thermal interface 205. In an embodiment, one or more intermediate layers, including but not limited to one or more adhesive layers and/or one or more insulating layers, may be disposed or provided between the surface of the second spring arm 115 and the second surface 250 of the thermal interface 205. The second spring arm 115 may apply a clamping force 705 to the second surface 250 of the thermal interface 205. The clamping force 705 may be in the range of 5N (newtons) to 50N (newtons). The clamping force 705 may vary within this range or outside of this range.

The locking feature 230 may extend through the aperture 120 of the clip 105 to couple the clip 105 with the thermal interface 205. The locking feature 230 may include a first edge 235 coupled with the first inner surface 170 of the aperture 120, and a second edge 240 coupled with the second inner surface 175 of the aperture 120, thereby coupling or locking the clip 105 with the thermal interface 205. First edge 235 may pinch, wrap, or engage first edge 235 of aperture 120. For example, the first edge 235 may include a notch or groove into which the first edge 235 extends when the clip 105 is coupled with the thermal interface 205. The first edge 235 may have a shape (e.g., V-shape, indentation) such that the first inner surface 170 (e.g., tip, edge) contacts or extends into a middle portion of the first edge 235. A first portion of the first edge 235 may wrap or clip over the first inner surface 170. A second portion of the first edge 235 may be located below the first inner surface 170. A middle portion of the first edge 235 may be located between the first and second portions of the first edge 235 to receive the first inner surface 170 of the orifice 120.

The first edge 235 may exert or provide a locking force 710 on the first inner surface 170 of the aperture 120 to lock the locking feature 230 into the clip 105 or with the clip 105. For example, the first edge 235 may provide a linear force, a lateral force, or an outward compression toward the first inner surface 170 to hold the clip 105 in place and couple with the thermal interface 205. The locking force 710 may range from 0N (newtons) to 100N (newtons). The locking force 710 may vary within this range or outside of this range. The second edge 240 may pinch, wrap, or engage the second inner surface 175 of the aperture 120. For example, the second edge 240 may include an indentation or groove into which the second inner surface 175 extends when the clip 105 is coupled with the thermal interface 205. The second edge 240 can have a shape (e.g., V-shape, indentation) such that the second inner surface 175 (e.g., tip, edge) contacts or extends into an intermediate portion of the second edge 240, a first portion of the second edge 240 wraps around or is sandwiched over the second inner surface 175, and a second portion of the second edge 240 is located below the second inner surface 175. An intermediate portion of the second rim 240 may be located between the first and second portions of the second rim 240 to receive the second inner surface 175 of the aperture 120.

The second edge 240 can exert or provide a locking force 710 on the second inner surface 175 of the aperture 120 to lock the locking feature 230 into the clamp 105 or with the clamp 105. For example, the second edge 240 may provide a linear force, a lateral force, or press outward toward the second inner surface 175 to hold the clamp 105 in place and couple with the thermal interface 205. The locking force 710 may range from 0N (newtons) to 100N (newtons). The locking force 710 may vary within this range or outside of this range.

Fig. 8 depicts an exemplary cross-sectional view 800 of an electric vehicle 805 with a battery pack 810 installed. Battery pack 810 may include a half bridge module 815 having clamp 105, thermal interface 205, and switching device 305. The clamp 105 may couple, connect, or compress the switching device 305 into contact with or within a distance from a surface of the thermal interface 205 to provide heat dissipation, passive cooling, and/or active cooling during operation of the electric vehicle 805.

The battery pack 810 may correspond to a power train unit 810 of the electric vehicle 805. For example, the battery pack 810 may be provided within the power train unit 810 or as a component of the power train unit 810. The drive train unit 810 (and battery pack 810) may provide power to the electric vehicle 4605. For example, the drive train unit 810 may include components in the electric vehicle 805 that generate or provide electrical energy to drive wheels or move the electric vehicle 805. The drive train unit 810 may be a component of an electric vehicle drive system. The electric vehicle drive system may transmit or provide power to different components of the electric vehicle 805. For example, an electric vehicle drive train may transmit power from the battery pack 810 or the drive train unit 810 to the axles or wheels of the electric vehicle 805.

The electric vehicle 805 may include an automated, semi-automated, or non-automated human operated vehicle. The electric vehicle 805 may include a hybrid vehicle that is operated by an on-board power source and gasoline or other power sources. Electric vehicle 805 may include automobiles, cars, trucks, buses, industrial vehicles, motorcycles, and other transportation vehicles. The electric vehicle 805 may include a chassis 4615 (sometimes referred to herein as a frame, an internal frame, or a support structure). The chassis 820 may support various components of the electric vehicle 805. The chassis 820 may span a front portion 825 (sometimes referred to herein as a hood or hood portion), a main body portion 830, and a rear portion 835 (sometimes referred to herein as a trunk portion) of the electric vehicle 805. The front portion 825 may include a portion of the electric vehicle 805 from the front bumper to a front wheel well of the electric vehicle 805. The main body portion 830 may include a portion of the electric vehicle 805 from a front wheel well to a rear wheel well of the electric vehicle 805. The rear portion 835 may include a portion of the electric vehicle 805 from a rear wheel well to a rear bumper of the electric vehicle 805.

The battery pack 810 may be mounted or placed within the electric vehicle 805. The battery pack 810 may include or be coupled with a power converter component. The power converter assembly may include an inverter module having three half bridge modules 815. The battery pack 810 may be mounted on the chassis 820 of the electric vehicle 805 in the front 825, the body portion 830 (shown in fig. 8), or the rear 835. The battery pack 810 may be coupled with first and second bus bars 840, 845 that are connected or otherwise electrically coupled with other electrical components of the electric vehicle 805 to provide power from the battery pack 810.

Fig. 9 provides a method 900 for forming a half-bridge module. The method 900 may include providing the half-bridge module 815(ACT 905). The half bridge module 815 may be a component of a power module or an inverter module of the battery pack 810 to power the electric vehicle 805. For example, the half-bridge module 815 may include multiple components to generate or provide power for the battery pack 810 of the electric vehicle 805. These components (e.g., switching device 305, capacitors, electrical components) may generate heat during operation of electric vehicle 805. The half-bridge module 815 may include one or more thermal interfaces 205 to provide heat dissipation, passive cooling, and/or active cooling to various components during operation of the electric vehicle 805.

The method 900 may include providing a thermal interface (ACT 905). A thermal interface 205 may be provided or disposed within the half-bridge module 815 to provide heat dissipation and/or active cooling to the electrical components within the half-bridge module. For example, the thermal interface 205 may be provided as a heat sink, a cooling plate, one or more cooling channels, or a combination of one or more of the following: a heat sink, a cold plate, or one or more cooling channels. The thermal interface 205 may be located within the half-bridge module 815 such that the thermal interface 205 is within a defined distance from or in contact with one or more electrical components of the half-bridge module 815. Contacting may include, but is not limited to, direct contact or contact through one or more intervening layers (e.g., adhesive layers, insulating layers). The intermediate layer may include, but is not limited to, one or more adhesive layers, and/or one or more insulating layers.

The method 900 may include forming a mating member (ACT 910). The mating member 220 may be formed to extend from the first side surface 210 of the thermal interface 205. For example, the mating feature 220 may be a component or extension of the thermal interface 205 and extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees from the surface of the first side surface 210 of the thermal interface 205. The mating member 220 may be formed of the same material as the thermal interface 205 or include the same material as the thermal interface 205. The mating member 220 may be integrally formed with the thermal interface 205 to form a single component. In an embodiment, the mating member 220 may be coupled to the first side surface 210 of the thermal interface 205, for example, by an adhesive layer or adhesive material. The mating member 220 may be coupled with the first side surface 210 such that the mating member 205 extends radially, perpendicularly, or at an angle in a range of 45 degrees to 135 degrees from the first side surface 210 of the thermal interface 205.

Locking features 230 may be formed in the ends of mating member 220. For example, a second end 260 opposite the first end 255 of the thermal interface 205 may be formed with the locking feature 230. The locking feature 230 may be formed to have a first edge 235 and a second edge 240. The locking feature 230 may be shaped to couple with or lock onto the

inner surfaces

170, 175 of the aperture 120 of the clamp 105. For example, the first edge 235 and the second edge 240 may be formed as indents, grooves, notches, or recesses formed in the locking feature 230 to receive, engage, and couple the

inner surfaces

170, 175 of the aperture 120 of the clamp 105. The locking feature 230 may be a component or extension of the thermal interface 205 and the mating member 220 and extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees from the second end 260 of the mating member 220. The locking feature 230 may be formed from the same material as the thermal interface 205 and the mating member 220, or comprise the same material as the thermal interface 205 and the mating member 220. The locking feature 230 may be integrally formed with the thermal interface 205 and the mating member 220 to form a single component. In embodiments, the locking feature 230 may be coupled to the second end 260 of the mating member 220, for example, by an adhesive layer or adhesive material. The locking feature 230 may be coupled with the second end 260 such that the locking feature 230 extends radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees from the surface of the second end 260 of the mating member 220.

The method 900 may include setting the first switching device 305(ACT 920). The first switching device 305 may be coupled with the first surface 245 of the thermal interface 205. The first switching device 305 may be coupled to the first surface 245 through an intermediate layer, such as, but not limited to, an adhesive layer and/or an insulating layer. For example, the second surface 315 of the first switching device 305 may be disposed or positioned in contact with an adhesive layer disposed on or applied to the first surface 245 of the thermal interface 205. The adhesive layer may couple the first switching device 305 with the first surface 245 of the thermal interface 205. The first switching device 305 may be located within a distance from the first surface 245 of the thermal interface 205 such that the thermal interface 205 may provide heat sinking, passive cooling, and/or active cooling to the first switching device 305. The distance may correspond to the thickness of one or more intermediate layers between the second surface 315 of the first switching device 305 and the first surface 245 of the thermal interface 205.

In an embodiment, the first switching device 305 may be directly coupled with the first surface 245 of the thermal interface 205. For example, the second surface 315 of the first switching device 305 is in contact with the first surface 245 of the thermal interface 205. In an embodiment, the second surface 315 of the first switching device 305 or the first surface 245 of the thermal interface 205 may include an adhesive material to couple the second surface 315 of the first switching device 305 with the first surface 245 of the thermal interface 205.

The method 900 may include setting the second switching device 305(ACT 925). The second switching device 305 may be coupled with the second surface 250 of the thermal interface 205. The second switching device 305 may be coupled to the second surface 250 through an intermediate layer, such as, but not limited to, an adhesive layer or an insulating layer. For example, the second surface 315 of the second switching device 305 may be disposed or positioned in contact with an adhesive layer disposed on or applied to the second surface 250 of the thermal interface 205. The adhesive layer may couple the second switching device 305 with the second surface 250 of the thermal interface 205. The second switching device 305 may be located within a distance from the second surface 250 of the thermal interface 205 such that the thermal interface 205 may provide heat sinking, passive cooling, and/or active cooling to the second switching device 305. The distance may correspond to the thickness of one or more intermediate layers between the second surface 315 of the second switching device 305 and the second surface 250 of the thermal interface 205.

In an embodiment, the second switching device 305 may be directly coupled with the second surface 250 of the thermal interface 205. For example, the second surface 315 of the second switching device 305 may be disposed or positioned in contact with the second surface 250 of the thermal interface 205. In an embodiment, the second surface 315 of the second switching device 305 or the second surface 250 of the thermal interface 205 may include an adhesive material to couple the second surface 315 of the second switching device 305 with the second surface 250 of the thermal interface 205. The provision of the second switching device 305 may be optional. For example, in an embodiment, a half-bridge module may include only a single switching device 35 coupled with the thermal interface 205.

The method 900 may include providing the gripper 105(ACT 930). The clamp 105 may be configured or formed with a first spring arm 110, a second spring arm 115, and an intermediate region 125. The clamp 105 may be formed with an intermediate region 125 located between the first spring arm 110 and the second spring arm 115. For example, the first spring arm 110 may include a first end 145 and a second end 140. The first end 145 may be coupled to or integrally formed with the first end 150 of the intermediate region 125. The second end 140 of the first spring arm 110 may correspond to an end or first end of the clamp 105. The second spring arm 115 may include a first end 160 and a second end 165. The first end 160 may be coupled to or integrally formed with the second end 155 of the intermediate region 125. The second end 165 of the second spring arm 115 may correspond to one end or a second end of the clamp 105.

The first and

second spring arms

110, 115 may be formed to extend radially, perpendicularly, or at an angle in the range of 45 degrees to 135 degrees relative to a surface (e.g., a top surface) of the intermediate region 125 of the clamp 105. In an embodiment, the first and

second spring arms

110, 115 may be formed to extend at the same angle relative to a surface (e.g., a top surface) of the intermediate region 125 of the clamp 105. The first and

second spring arms

110, 115 may be formed to have a straight shape, a curved shape, a gull-wing shape, an inverted gull-wing shape, or a shape having one or more curves or curves to allow the first and

second spring arms

110, 115 to apply a force or pressure to a surface of an object (e.g., a surface of a switching device, a surface of a thermal interface) to which the clamp 105 is coupled or in contact.

The clamp 105 may be formed to have a degree of flexibility to provide or apply pressure on the object (e.g., the switching device 305) when the clamp 105 is coupled with the corresponding object. For example, one or

more slots

130, 135 may be formed through or into the clamp 105 to provide a degree of flexibility and/or a defined level of pressure or force to the clamp 105 when the clamp 105 is activated or in an activated state. The

slots

130, 135 can be formed to allow or to be used to bend the clamp 105 or to apply a clamping pressure (e.g., force) to a surface of an object to which the clamp 105 is coupled or in contact.

In embodiments, the

slots

130, 135 may be formed longitudinally along the length of the clip 105, or such that the

slots

130, 135 extend from the first spring arm 110, through the intermediate region 125, and into the second spring arm 115. The first slot 130 and the second slot 135 may be formed to have the same size (e.g., length, width). The number of

slots

130, 135, the size and/or dimensions of the

slots

spring arms

110, 115 are to provide to a surface of an object to which the clamp 105 is coupled or in contact.

The method 900 may include forming the aperture 120(ACT 935). A hole, opening, or entry point corresponding to the aperture 120 may be formed through the intermediate region 125 of the clamp 105. The aperture 120 may be formed to receive, engage, or couple with the locking feature 230 of the mating member 220 of the thermal interface 205. For example, the apertures 120 may be formed in a variety of different shapes and/or with a range of sizes to receive locking features and/or mating members. The orifice 120 may be formed to have a circular, rectangular, or square shape. The shape of the aperture 120 may be selected based in part on the shape of the object (e.g., locking feature, mating member) to be connected or coupled with the aperture 120. The orifice 120 may be formed to have one or more

inner surfaces

170, 175. For example, the orifice 120 may be formed to have a first inner surface 170 and a second inner surface 175. The first and second

inner surfaces

170 and 175 may be formed to have straight edge surfaces or curved edge surfaces.

The method 900 may include mounting the clamp 105(ACT 940). The clamp 105 may be mounted or positioned within the half-bridge module. The clip 105 may be mounted proximate, adjacent, or near the thermal interface 205 and the first and/or second switching devices 305. For example, the clamp 105 may be mounted within a half-bridge module to couple the first and second switching devices 305 with the thermal interface 205. The clamp 105 may be mounted within the half-bridge module to compress or hold the first and second switching devices 305 in contact with or within a distance from the thermal interface 205 such that the thermal interface 205 provides heat sinking, passive cooling, and/or active cooling to the first and second switching devices 305. The clamp 105 may include a first state corresponding to an inactive state and a second state corresponding to an active state. The clamp 105 may be initially installed in a first state. The shape and/or geometry of the clamp 105 may be such that the clamp 105 is mounted within the half-bridge module in the first state without the use of a special tool, applicator or other form of mounting equipment. For example, the clamp 105 may be mounted in a first state using linear or lateral motion, such as, but not limited to, sliding or pushing the clamp 105 to a position proximate the thermal interface 205 and the first and/or second switching devices 305.

Method 900 may include providing a first spring arm 110(ACT 945). The first spring arm 110 of the clamp 105 may be located near, adjacent to, or within a distance from the first switching device 305. The first switching device 305 may be coupled with the thermal interface 205. The first spring arm 110 may be in a first state or an inactive state. For example, the first spring arm 110 may be positioned such that the first spring arm 110 does not apply a force to the first surface 310 of the first switching device 305 or applies a minimal force (e.g., contact but no clamping pressure) to the first surface 310 of the first switching device 305. The first spring arm 110 may be positioned such that portions of a surface of the first spring arm 110 are aligned to contact or press against the first surface 310 of the first switching device 305 in response to the clamp 105 transitioning from the first state to the second state (e.g., the activated state).

The method 900 may include providing a second spring arm 115(ACT 950). The second spring arm 115 of the clip 105 may be located near, adjacent to, or within a distance from the second surface 250 of the thermal interface or the second switching device 305. For example, in an embodiment having a single switching device 305, the second spring arm 115 may be in a first state or an inactive state. The second spring arms 115 may be positioned such that the second spring arms 115 do not apply a force to the second surface 250 of the thermal interface 205 or apply a minimal force (e.g., contact but no clamping pressure) to the second surface 250 of the thermal interface 205. The second spring arms 115 may be positioned such that portions of the surfaces of the second spring arms 115 are aligned to contact or compress the second surface 250 of the thermal interface 205 in response to the clip 105 transitioning from the first state to the second state (e.g., the activated state). In embodiments having the second switching device 305, the second spring arm 115 may be in a first state or an inactive state. The second spring arm 115 may be positioned such that the second spring arm 115 does not apply a force to the first surface 310 of the second switching device 305 or applies a minimal force (e.g., contact but no clamping pressure) to the first surface 310 of the second switching device 305. The second spring arm 115 may be positioned such that portions of a surface of the second spring arm 115 are aligned to contact or press against the first surface 310 of the second switching device 305 in response to the clip 105 transitioning from the first state to the second state (e.g., the activated state).

The method 900 may include transitioning the clamp 105 from the first state to the second state (ACT 955). The clip 105 may transition from the first state to the second state in response to a force applied by the mating member 220 of the thermal interface 205 to activate the clip 105. A linear force may be applied to the clamp 105 to push or move the clamp 105 such that the locking feature 230 of the mating member 220 contacts and engages the aperture 120 of the clamp 105. For example, the linear force may move the clamp 105 such that the locking feature 230 extends through the aperture 120 of the clamp 105 to couple the clamp 105 with the thermal interface 205. The first edge 235 may be coupled to the first inner surface 170 of the aperture 120 and the second edge 240 may be coupled to the second inner surface 175 of the aperture 120 to couple or lock the clip 105 with the thermal interface 205. First edge 235 may grip, wrap around, or engage first inner surface 170 of aperture 120, and second edge 240 may grip, wrap around, or engage second inner surface 175 of aperture 120. The first and second edges 234, 240 can exert or provide a locking force 710 on the first and second

inner surfaces

170, 175 of the aperture 120 to lock the locking feature 230 into the clip 105 or with the clip 105. In embodiments, the first edge 235 and the second edge 240 can provide a linear force, a lateral force, or press outward toward the first inner surface 170 and the second inner surface 175 to hold the clip 105 in place and couple with the thermal interface 205.

The clamp 105 may transition to the second state such that the first and second switching devices 305 are pressed, held, or positioned in contact with, near, adjacent to, or within a defined distance from the first surface 245 and the second surface 250 of the thermal interface 205 such that the thermal interface 205 provides heat dissipation, passive cooling, and/or active cooling to the first and second switching devices 305. In a second state (e.g., an activated state) of the clamp 105, the first spring arm 110 and the second spring arm 115 may apply a clamping force or press against the first and second switching devices 305, respectively, to hold the first and second switching devices 305 in contact with, proximate to, adjacent to, or within a defined distance from the first surface 245 and the second surface 250 of the thermal interface 205. The first spring arm 110 may be in contact with the first surface 310 of the first switching device 305 to compress or hold the first switching device 305 in contact with, near, adjacent to, or within a defined distance from the first surface 245 of the thermal interface 205. The second spring arm 115 may be in contact with the first surface 310 of the second switching device 305 to compress or hold the second switching device 305 in contact with, near, adjacent to, or within a defined distance from the second surface 250 of the thermal interface 205.

In an embodiment, the thermal interface 205 may include only a single switching device 305 coupled with the first surface 245 of the thermal interface 205. For example, the first spring arm 110 of the clip 105 may be located on, near, adjacent to, or in contact with the first surface 310 of the second switching device 305. The second spring arms 115 of the clip 105 may be positioned on, near, adjacent to, or in contact with the second surface 250 of the thermal interface 205. In a second state of the clamp 105, the second spring arm 115 may contact (e.g., directly contact) or touch the second surface 250 of the thermal interface 205 and apply the clamping force 705 to the second surface 250 of the thermal interface 205.

Fig. 11 provides a method 1100 for providing a half bridge module. The method 1100 may include providing a half-bridge module (ACT 1105). The half-bridge module may include a half-bridge module 815 that powers the electric vehicle 805. The half-bridge module 815 may include a thermal interface 205 having a first surface 245 and a second surface 250. The thermal interface 205 may include a mating member 220. The half-bridge module 815 may include a first switching device 305 having a first surface 310 and a second surface 315. The second surface 315 of the first switching device 305 may be disposed above the first surface 245 of the thermal interface 205. The half-bridge module 815 may include a clamp 105 having a first spring arm 110 and a second spring arm 115. The first spring arm 110 may be disposed proximate to the first surface 310 of the first switching device 305. The second spring arms 115 may be disposed proximate to the second surface 250 of the thermal interface 205. The clamp 105 may include an aperture 120 formed through the clamp 105 and between the first spring arm 110 and the second spring arm 115. The aperture 120 may be formed to receive a mating member 220 of the thermal interface 205. The clip 105 may change from the first state to the second state in response to contact from the mating member 220 of the thermal interface 205 to the clip 105 being greater than a force threshold.

Having now described some illustrative embodiments, it is apparent that the foregoing is illustrative and not limiting, having been presented by way of example. Features which are described herein in the context of separate embodiments may also be implemented in combination in a single embodiment or embodiment. Features which are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in various sub-combinations. References to embodiments or elements or acts of the systems and methods referred to herein in the singular may also encompass embodiments comprising a plurality of such elements, and any plural reference to any embodiment or element or act herein may also encompass embodiments comprising only a single element. References in the singular or plural form are not intended to limit the system or method of the present disclosure, its components, acts or elements to a single or plural configuration. References to being based on any action or element can include implementations in which the action or element is based, at least in part, on any action or element.

References to "or" may be construed as inclusive such that any term described using "or" may indicate any single, more than one, or all of the described terms. A reference to at least one of a conjunctive list of terms may be interpreted as inclusive or to indicate any of a single, more than one, and all of the described terms. For example, a reference to at least one of "a" and "B" may include only "a", only "B", and both "a" and "B". These references, used in connection with "including" or other open terms, may include additional items.

Where technical features in the drawings, detailed description or any claim are followed by reference signs, the reference signs have been included for the sole purpose of increasing the intelligibility of the drawings, detailed description and claims. Accordingly, the reference signs or their absence have no limiting effect on the scope of any claim element.

The systems and methods described herein may be embodied in other specific forms without departing from the characteristics of the invention. For example, the description of the positive and negative electrical characteristics may be reversed. For example, elements described as negative elements may alternatively be configured as positive elements, and elements described as positive elements may alternatively be configured as negative elements. Further description of relative parallel, perpendicular, vertical or other orientation or orientation includes variations within +/-10% or +/-10 degrees of purely vertical, parallel or perpendicular orientation. Unless expressly stated otherwise, reference to "about," "substantially," or other terms of degree includes a variation of +/-10% from a given measurement, unit or range. The coupling elements may be electrically, mechanically or physically coupled to each other directly or through intervening elements. The scope of the systems and methods described herein is, therefore, indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. A half-bridge module for powering an electric vehicle, comprising:

a thermal interface having a first surface and a second surface;

the thermal interface includes a mating member;

a first switching device having a first surface and a second surface, the second surface of the first switching device disposed over the first surface of the thermal interface;

a clamp having a first spring arm and a second spring arm;

the first spring arm is disposed proximate to the first surface of the first switching device;

the second spring arm is disposed proximate to the second surface of the thermal interface;

an aperture formed through the clamp, the aperture located between the first spring arm and the second spring arm; and

the aperture is formed to receive the mating member of the thermal interface, and the clip is configured to change from a first state to a second state in response to contact from the mating member of the thermal interface to the clip being greater than a force threshold.

2. The half bridge module of claim 1, comprising:

the thermal interface includes at least one of: a heat sink, a cold plate, one or more cooling channels.

3. The half bridge module of claim 1, comprising:

the first switching device includes at least one of a semiconductor device or a discrete switching device.

4. The half bridge module of claim 1, comprising:

the first switching device includes a transistor.

5. The half bridge module of claim 1, comprising:

a second switching device having a first surface and a second surface;

the second surface of the second switching device is disposed over the second surface of the thermal interface; and

the second spring arm is disposed proximate to the first surface of the second switching device.

6. The half bridge module of claim 1, comprising:

the first state of the clamp corresponds to an inactive state; and

the second state of the clip corresponds to an activated state, wherein in the activated state the clip holds the first switching device in contact with the thermal interface.

7. The half bridge module of claim 1, comprising

The clip transitions from the first state to the second state in response to the mating member of the thermal interface applying a first level of force to the aperture of the clip, thereby connecting the clip to the first switching device and the thermal interface.

8. The half bridge module of claim 1, comprising:

the first spring arm provides a first level of force to the first surface of the first switching device when the clamp is in the first state; and

when the clamp is in the second state, the first spring arm provides a second level of force to the first surface of the first switching device, the second level of force being greater than the first level of force.

9. The half bridge module of claim 1, comprising:

the second spring arm providing a first level of force to the second surface of the thermal interface when the clip is in the first state; and

when the clip is in the second state, the second spring arm provides a second level of force to the second surface of the thermal interface, the second level of force being greater than the first level of force.

10. The half bridge module of claim 1, comprising:

the thermal interface has a first side surface and a second side surface;

the first and second side surfaces are located between the first surface of the thermal interface and the second surface of the thermal interface; and

the mating member extends from the first side surface to connect to the aperture of the clamp.

11. The half bridge module of claim 1, comprising:

the jig includes:

the first spring arm has a first end and a second end;

the second spring arm has a first end and a second end;

a middle region having a first end and a second end, the first end of the middle region being connected with the first end of the first spring arm and the second end of the middle region being connected with the first end of the second spring arm, thereby forming the clip; and

the aperture is formed through the intermediate region of the clamp.

12. The half bridge module of claim 11, comprising:

the first spring arm extends from the middle region at a first angle;

the second spring arm extends from the intermediate region at the first angle, an

The first spring arm is disposed in parallel with the second spring arm.

13. The half bridge module of claim 1, comprising:

the mating member has a first end and a second end;

the first end of the mating member is coupled with a first side surface of the thermal interface; and

the second end of the mating member includes a locking feature shaped to lock the mating member to the aperture of the clamp.

14. The half bridge module of claim 1, comprising:

the mating member has a locking feature configured to extend through the aperture of the clamp, an

The locking feature comprises a first edge coupled with a first inner surface of the aperture; and

the locking feature includes a second edge coupled with a second inner surface of the aperture.

15. The half bridge module of claim 1, comprising

The mating member having a locking feature configured to extend through the aperture of the clamp; and

the locking feature exerts a force on a first inner surface of the aperture of the clamp and a second inner surface of the aperture of the clamp is coupled with the mating member.

16. A method of forming a half-bridge module for powering an electric vehicle, comprising:

forming a half-bridge module to power an electric vehicle, the forming the half-bridge module comprising:

providing a thermal interface having a first surface and a second surface;

a mating member forming the thermal interface;

providing a first switching device having a first surface and a second surface, the second surface of the first switching device being located above the first surface of the thermal interface;

providing a clamp having a first spring arm and a second spring arm;

forming an aperture through the clamp and between the first spring arm and the second spring arm;

disposing the first spring arm proximate the first surface of the first switching device;

disposing the second spring arm proximate the second surface of the thermal interface; and

the aperture is formed to receive the mating member of the thermal interface and the clip changes from a first state to a second state in response to contact from the mating member of the thermal interface to the clip being greater than a force threshold.

17. The method of claim 16, comprising:

providing a second switching device having a first surface and a second surface;

disposing the second surface of the second switching device over the second surface of the thermal interface; and

positioning the second spring arm proximate the first surface of the second switching device.

18. The method of claim 16, comprising:

applying a first level of force to the first surface of the first switching device by the first spring arm when the clamp is in the first state; and

applying a second level of force to the first surface of the first switching device by the first spring arm when the clamp is in the second state, the second level of force being greater than the first level of force.

19. The method of claim 16, comprising:

applying a first level of force to the second surface of the thermal interface by the second spring arm when the clip is in the first state; and

applying a second level of force to the second surface of the thermal interface by the second spring arm when the clip is in the second state, the second level of force being greater than the first level of force.

20. An electric vehicle comprising:

a half-bridge module that powers the electric vehicle, comprising:

a thermal interface having a first surface and a second surface;

the thermal interface includes a mating member;

a clamp having a first spring arm and a second spring arm;

the clamp having an aperture formed therethrough and between the first and second spring arms; and

21. The electric vehicle according to claim 20, comprising:

a second switching device having a first surface and a second surface;

the second surface of the second switching device is disposed over the second surface of the thermal interface;

the second spring arm is proximate to the first surface of the second switching device;

when the clamp is in the first state, the first spring arm applies a first level of force to the first surface of the first switching device;

when the clamp is in the second state, the first spring arm provides a second level of force to the first surface of the first switching device, the second level of force being greater than the first level of force;

the second spring arm provides a first level of force to the first surface of the second switching device when the clamp is in the first state; and

when the clamp is in the second state, the second spring arm provides a second level of force to the first surface of the second switching device, the second level of force being greater than the first level of force.