CN111796704B - 电子设备 - Google Patents
电子设备 Download PDFInfo
- Publication number
- CN111796704B CN111796704B CN202010263646.4A CN202010263646A CN111796704B CN 111796704 B CN111796704 B CN 111796704B CN 202010263646 A CN202010263646 A CN 202010263646A CN 111796704 B CN111796704 B CN 111796704B
- Authority
- CN
- China
- Prior art keywords
- sensing
- pattern
- insulating layer
- pad
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 141
- 238000009413 insulation Methods 0.000 description 29
- 239000010408 film Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 10
- 239000010409 thin film Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 102100024607 DNA topoisomerase 1 Human genes 0.000 description 6
- 101000830681 Homo sapiens DNA topoisomerase 1 Proteins 0.000 description 6
- 102100023116 Sodium/nucleoside cotransporter 1 Human genes 0.000 description 6
- 102100021541 Sodium/nucleoside cotransporter 2 Human genes 0.000 description 6
- 102100021470 Solute carrier family 28 member 3 Human genes 0.000 description 6
- 102100033587 DNA topoisomerase 2-alpha Human genes 0.000 description 5
- 101000801505 Homo sapiens DNA topoisomerase 2-alpha Proteins 0.000 description 5
- 101000685663 Homo sapiens Sodium/nucleoside cotransporter 1 Proteins 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 101000821827 Homo sapiens Sodium/nucleoside cotransporter 2 Proteins 0.000 description 4
- 101000822028 Homo sapiens Solute carrier family 28 member 3 Proteins 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 101710123669 Sodium/nucleoside cotransporter 2 Proteins 0.000 description 2
- 101710186856 Solute carrier family 28 member 3 Proteins 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 101710123675 Sodium/nucleoside cotransporter 1 Proteins 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Position Input By Displaying (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0040903 | 2019-04-08 | ||
| KR1020190040903A KR102657174B1 (ko) | 2019-04-08 | 2019-04-08 | 전자 패널 및 이의 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111796704A CN111796704A (zh) | 2020-10-20 |
| CN111796704B true CN111796704B (zh) | 2023-12-01 |
Family
ID=72662970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010263646.4A Active CN111796704B (zh) | 2019-04-08 | 2020-04-07 | 电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11355447B2 (ko) |
| KR (1) | KR102657174B1 (ko) |
| CN (1) | CN111796704B (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210104281A (ko) * | 2020-02-17 | 2021-08-25 | 삼성디스플레이 주식회사 | 입력감지유닛 및 입력감지유닛을 포함하는 표시장치 |
| CN112510015B (zh) * | 2020-11-30 | 2024-02-20 | 武汉天马微电子有限公司 | 显示面板以及电子设备 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231835A (zh) * | 2016-12-12 | 2018-06-29 | 三星显示有限公司 | 显示模块 |
| CN109471550A (zh) * | 2017-09-08 | 2019-03-15 | 三星显示有限公司 | 电子装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI288428B (en) * | 2004-01-21 | 2007-10-11 | Seiko Epson Corp | Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment |
| TW200844827A (en) * | 2007-05-11 | 2008-11-16 | Sense Pad Tech Co Ltd | Transparent touch panel device |
| JP2009231766A (ja) * | 2008-03-25 | 2009-10-08 | Toshiba Corp | マーク形成方法 |
| KR101082293B1 (ko) | 2009-09-04 | 2011-11-09 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 |
| US20150076665A1 (en) * | 2013-09-18 | 2015-03-19 | United Microelectronics Corp. | Alignment mark structure |
| KR102610026B1 (ko) * | 2016-06-30 | 2023-12-06 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
| US10474295B2 (en) * | 2016-11-10 | 2019-11-12 | Samsung Display Co., Ltd. | Display device including sensor and auxiliary sensor parts |
| KR20180070218A (ko) | 2016-12-16 | 2018-06-26 | 엘지디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| KR20180110924A (ko) | 2017-03-30 | 2018-10-11 | 동우 화인켐 주식회사 | Oled 패널 및 이를 포함하는 화상 표시 장치 |
| KR102377527B1 (ko) * | 2017-09-01 | 2022-03-24 | 삼성디스플레이 주식회사 | 입력감지유닛 및 이를 구비한 표시장치 |
| KR102322135B1 (ko) * | 2017-09-15 | 2021-11-08 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법 |
| KR102380046B1 (ko) * | 2017-09-22 | 2022-03-30 | 삼성디스플레이 주식회사 | 전자 패널 및 이의 제조 방법 |
| JP2019191239A (ja) * | 2018-04-19 | 2019-10-31 | シャープ株式会社 | 表示パネル |
| US11018089B2 (en) * | 2019-01-08 | 2021-05-25 | Innolux Corporation | Display devices and methods for manufacturing the same |
-
2019
- 2019-04-08 KR KR1020190040903A patent/KR102657174B1/ko active IP Right Grant
-
2020
- 2020-03-06 US US16/812,192 patent/US11355447B2/en active Active
- 2020-04-07 CN CN202010263646.4A patent/CN111796704B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231835A (zh) * | 2016-12-12 | 2018-06-29 | 三星显示有限公司 | 显示模块 |
| CN109471550A (zh) * | 2017-09-08 | 2019-03-15 | 三星显示有限公司 | 电子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US11355447B2 (en) | 2022-06-07 |
| KR20200118930A (ko) | 2020-10-19 |
| KR102657174B1 (ko) | 2024-04-15 |
| CN111796704A (zh) | 2020-10-20 |
| US20200319729A1 (en) | 2020-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11249588B2 (en) | Display apparatus | |
| US11018205B2 (en) | Organic light emitting display module and organic light emitting display device having the same | |
| US20230418403A1 (en) | Display apparatus | |
| US10725353B2 (en) | Display device | |
| KR20190036008A (ko) | 전자패널, 표시장치, 및 그 제조 방법 | |
| US11194432B2 (en) | Display device | |
| US11557640B2 (en) | Circuit board and display device including the same | |
| US11275474B2 (en) | Electronic panel and display device including the same | |
| CN111796704B (zh) | 电子设备 | |
| US11169633B2 (en) | Display apparatus | |
| KR20230171913A (ko) | 표시장치 | |
| KR102122857B1 (ko) | 유기발광 표시모듈 및 이를 포함하는 유기발광 표시장치 | |
| KR20210149269A (ko) | 표시장치 및 이의 제조 방법 | |
| KR20210005368A (ko) | 표시장치 | |
| CN220326173U (zh) | 显示装置 | |
| US11916283B2 (en) | Compacted antenna module with improved performance for electronic device | |
| CN219068848U (zh) | 显示面板和显示装置 | |
| KR20210091867A (ko) | 표시 장치 | |
| KR20200071714A (ko) | 유기발광 표시모듈 및 이를 포함하는 유기발광 표시장치 | |
| CN117460342A (zh) | 显示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |