CN111796461B - Liquid crystal display panel having a light shielding layer - Google Patents
Liquid crystal display panel having a light shielding layer Download PDFInfo
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- CN111796461B CN111796461B CN202010639873.2A CN202010639873A CN111796461B CN 111796461 B CN111796461 B CN 111796461B CN 202010639873 A CN202010639873 A CN 202010639873A CN 111796461 B CN111796461 B CN 111796461B
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- crystal display
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 57
- 238000002161 passivation Methods 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The embodiment of the application provides a liquid crystal display panel, the liquid crystal display panel includes the display region and is located the non-display region outside the display region in this application, binding region is defined in the non-display region, binding region is provided with the signal line that extends to the display region, the signal line passes through-hole and flip-chip film electric connection, the signal line surface is covered with the passivation layer, the passivation layer is including stereoplasm layer and the flexible layer that the stromatolite set up, the flexible layer array is provided with the slit, this slit runs through the flexible layer, in the stereoplasm layer is not etched, the in-process of extrusion, the flexible layer takes place to warp, fill the slit, both protection signal line, passivation layer department thickness in the binding region has been reduced again locally, the uneven problem of atress when having solved the pressfitting, the yield of metal line binding has been improved, and then liquid crystal display panel's performance and display quality are promoted.
Description
Technical Field
The application relates to the technical field of display, in particular to a liquid crystal display panel.
Background
The liquid crystal display panel is generally composed of a color film substrate, a thin film transistor substrate, liquid crystal sandwiched between the color film substrate and the thin film transistor substrate, and a sealing frame glue, and the working principle is that the rotation of liquid crystal molecules of a liquid crystal layer is controlled by applying driving voltage on two glass substrates, and the light of a backlight module is refracted to generate a picture.
The liquid crystal display panel is high definition display equipment, and when the liquid crystal display panel is in normal display, the surface of a pixel electrode needs flattening treatment, a PFA film layer is used for replacing a passivation layer so as to change the flatness of the surface of a lower film layer and prevent mutual interference of electric fields, in addition, a flip chip film is connected to an external lead area of the liquid crystal display panel through a lead wire, signals at an array end are exposed on the PFA film layer, and the signals are connected to the display panel through the external lead area in a pressing mode, so that a driving signal integrated on the flip chip film is conducted to the display panel through the external lead area, and the liquid crystal display panel is driven to display.
In the prior art, metal wires in the external lead area are combined, double-sided lamination is needed, the pressure is large, the film thickness of the PFA film layer is relatively thick, the PFA film layer is stressed unevenly when the pressure is applied, the film layer is easy to break, the yield of metal wire binding is affected, and the performance and quality of the liquid crystal display panel are affected.
Disclosure of Invention
The embodiment of the application provides a liquid crystal display panel, can solve among the prior art metal wire in the external lead area and combine, need two-sided pressfitting, pressure is great, and the thick ratio of film thickness of PFA rete is thicker, and the PFA rete atress is uneven when receiving pressure, and the rete is broken easily, influences the yield that the metal wire bound, and then influences liquid crystal display panel's performance and quality's problem.
In order to solve the problems, the technical scheme provided by the invention is as follows:
the embodiment of the application provides a liquid crystal display panel, which comprises a display area and a non-display area positioned outside the display area, wherein a binding area is defined in the non-display area, the binding area is provided with a signal wire extending to the display area, and the signal wire is electrically connected with a flip chip film through a through hole; the binding region comprises a substrate, the signal lines positioned on the substrate and a passivation layer covering the signal lines, wherein the passivation layer is arranged in a slit array shape.
In the liquid crystal display panel, a through hole is formed in the surface of the passivation layer, an ITO electrode is deposited on the surface of the through hole, the bottom of the ITO electrode is in telecommunication connection with the signal line, and at least one side of the ITO electrode extends out of the through hole and is electrically connected with the flip chip film.
In the liquid crystal display panel, the slits are symmetrically arranged on two sides of the through hole, and the slits are arranged perpendicular to the direction of the ITO electrode.
In the liquid crystal display panel of the present application, the slit is in a groove shape, and the width of the groove is in the range of 1um to 10 um.
In the liquid crystal display panel of the application, the passivation layer comprises a hard layer and a flexible layer which are arranged in a laminated mode, the material of the hard layer is one or more than one of silicon oxide, silicon nitride and silicon oxynitride, and the material of the flexible layer is one or more than one of tetrafluoroethylene, hexamethyldisiloxane, polyacrylate, polycarbonate and polystyrene.
In the liquid crystal display panel of the application, the slit penetrates through the flexible layer and is not etched to the hard layer.
In the liquid crystal display panel of the present application, the thickness of the flexible layer is in the range of 2 to 4 times the thickness of the hard layer.
In the liquid crystal display panel of the present application, the signal line includes a first signal line and a second signal line, wherein an insulating layer is provided between the first signal line and the second signal line.
In the liquid crystal display panel of the application, the first signal line and the second signal line are independent metal lines, wherein the metal lines comprise a single or several film layers of silver, copper, aluminum, molybdenum and titanium.
In the liquid crystal display panel of the application, the first signal line and the second signal line are respectively electrically connected with the ITO electrode; or, the first signal line is electrically connected with the second signal line through a via hole in the insulating layer, and the second signal line is electrically connected with the ITO electrode.
The beneficial effects are that: the embodiment of the application provides a liquid crystal display panel, the liquid crystal display panel includes the display region and is located the non-display region outside the display region in this application, binding region is defined in the non-display region, binding region is provided with the signal line that extends to the display region, the signal line passes through-hole and flip-chip film electric connection, the signal line surface is covered with the passivation layer, the passivation layer is including stereoplasm layer and the flexible layer that the stromatolite set up, the flexible layer array is provided with the slit, this slit runs through the flexible layer, in the stereoplasm layer is not etched, the in-process of extrusion, the flexible layer takes place to warp, fill the slit, both protection signal line, passivation layer department thickness in the binding region has been reduced again locally, the uneven problem of atress when having solved the pressfitting, the yield of metal line binding has been improved, and then liquid crystal display panel's performance and display quality are promoted.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic top view of a liquid crystal display panel according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a binding region film structure in a liquid crystal display panel according to an embodiment of the present application.
Fig. 3 and fig. 4 are schematic views of an ITO electrode structure in a bonding area of a liquid crystal display panel according to an embodiment of the present application.
Fig. 5 is a schematic top view of a passivation layer in a bonding area of a liquid crystal display panel according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a bonding area metal wire connection in a liquid crystal display panel according to an embodiment of the present application.
Fig. 7 is a schematic diagram illustrating bonding area wire bonding in a liquid crystal display panel according to an embodiment of the present application.
Fig. 8 is a schematic diagram of a passivation layer structure in a bonding area of a liquid crystal display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are denoted by the same reference numerals, and broken lines in the drawings indicate that they are not present in the structure, and only the shape and position of the structure are described. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
This application combines to the metal wire in the external lead wire region among the prior art, needs two-sided pressfitting, and pressure is great, and the thick ratio of film thickness of PFA rete is thicker, and PFA rete atress is uneven when receiving pressure, and the rete is broken the membrane easily, influences the yield that the metal wire was bound, and then influences liquid crystal display panel's performance and quality's problem, this application can solve this defect.
As shown in fig. 1 and 2, an embodiment of the present application provides a liquid crystal display panel 100, where the liquid crystal display panel 100 includes a display area 101 and a non-display area 102 located outside the display area 101, a bonding area 103 is defined in the non-display area 102, the bonding area 103 is provided with a signal line 205 extending to the display area, and the signal line 205 is electrically connected with a flip-chip film through a through hole; the binding area 103 comprises a substrate 201, a signal line 205 positioned on the substrate 201 and a passivation layer 206 covering the signal line 205, wherein the passivation layer 206 is arranged in an array shape of slits 207, the passivation layer 206 comprises a hard layer 2061 and a flexible layer 2062 which are arranged in a laminated manner, the slits 207 penetrate through the flexible layer 2062 and are not etched into the hard layer 2061, the signal line 205 in the array area is protected, the thickness of the passivation layer 206 in the binding area is locally reduced, the problem of uneven stress during lamination is solved, the binding yield of the signal line 205 and a flip-chip film is improved, and the performance and the display quality of the liquid crystal display panel are further improved.
Specifically, as shown in fig. 2, 3, and 4, the substrate 201 is preferably a transparent flexible polyimide material, and the signal line 205 includes a first signal line 202 and a second signal line 204, wherein an insulating layer 203 is provided between the first signal line 202 and the second signal line 204. The first signal line 202 and the second signal line 204 are each independent metal lines including a single or several film layers of silver, copper, aluminum, molybdenum, titanium. The first signal line 202 includes a sub signal line 2021, a sub signal line 2022, a sub signal line 2023, and a sub signal line 2024, the second signal line 204 includes a sub signal line 2041 and a sub signal line 2042, a distance between any two adjacent sub signal lines is greater than 6um, a via 2031 is disposed between the sub signal line 2021 and the sub signal line 2041, a via 2032 is disposed between the sub signal line 2023 and the sub signal line 2042, the sub signal line 2021 may be electrically connected with the sub signal line 2041 through the via 2031, the sub signal line 2023 may be electrically connected with the sub signal line 2042 through the via 2032, and the via 2031 and the via 2032 are located in the insulating layer 203. The passivation layer 206 is disposed on the signal line 205, the passivation layer 206 includes a hard layer 2061 and a flexible layer 2062 which are stacked, the hard layer 2061 is made of one or more combination materials selected from silicon oxide, silicon nitride and silicon oxynitride, the flexible layer 2062 is made of one or more combination materials selected from tetrafluoroethylene, hexamethyldisiloxane, polyacrylate, polycarbonate and polystyrene, the hard layer 2061 protects the signal line 205 from being scratched, and the flexible layer 2062 plays a role of buffering stress. The passivation layer 206 is provided with a through hole 2063 and a through hole 2064, the through hole 2063 and the through hole 2064 are respectively deposited with an ITO electrode 208 and an ITO electrode 209, the ITO electrode 208 is in a bent shape, the first lead 2081 and the second lead 2082 extend out of two sides of the through hole 2063, the passivation layer further comprises a horizontal portion 2083 and an inclined portion 2084, the inclined portion 2084 comprises a first inclined portion 20841 and a second inclined portion 20842, the first inclined portion 20841 and the second inclined portion 20842 are symmetrically arranged at two sides of the horizontal portion 2083, the horizontal portion 2083 is electrically connected with the signal wire 205, the ITO electrode 209 is in a bent shape, the first lead 2091 and the second lead 2092 extend out of two sides of the through hole 2064, the ITO electrode 208 further comprises a horizontal portion 2093 and an inclined portion 2094, the inclined portion 2094 comprises a first inclined portion 20941 and a second inclined portion 20942, the first inclined portion 20941 and the second inclined portion 20942 are symmetrically arranged at two sides of the horizontal portion 2093, the horizontal portion 2093 is electrically connected with the signal wire 205, namely the first signal wire 202 and the second signal wire 204 are electrically connected with the ITO electrode 202 or the first signal wire 204 and the second signal wire 204 are electrically connected with the signal wire 204 through the insulating layer, and the signal wire 204 is still electrically connected with the signal wire, and the signal wire is electrically connected with the signal wire 204, and the signal wire is still electrically connected with the signal wire and stable signal wire.
The first and second leads 2081, 2082 are connected to respective external drain terminals in the flip-chip film, and the first and second leads 2091, 2092 are connected to respective external drain terminals in the flip-chip film. Because the first lead and the second lead are attached to corresponding external leakage terminals in the flip chip film together in a pressing mode, the pressure is larger, the thickness of the flexible layer 2062 is 2 times to 4 times that of the hard layer 2061, the passivation layer 206 is thicker, slits 207 are arranged on the surface array of the passivation layer 206 for reducing uneven film thickness and stress, the slits 207 are in a groove shape, the width of the groove is 1um to 10 mu m, the flexible layer 2062 deforms in the pressing process, the slits 207 are filled, the signal wires 205 are protected, the thickness of the passivation layer 206 in a binding area is locally reduced, the problem of uneven stress during pressing is solved, the binding yield of metal wires is improved, and the performance and the display quality of the liquid crystal display panel are further improved.
As shown in fig. 5, in the embodiment of the present application, taking the ITO electrode 208 as an example, the first lead 2081 and the second lead 2082 at two ends of the ITO electrode 208 are tiled on the surface of the passivation layer 206, and the passivation layer 206 at the positions of the first lead 2081 and the second lead 2082 is provided with slits 207 at two sides of the through hole 2063, and the slits 207 are arranged perpendicular to the direction of the ITO electrode 208.
As shown in fig. 6, the embodiment of the present application provides a bonding area structure in a liquid crystal display panel, the liquid crystal display panel further includes a flip-chip film 302, the flip-chip film 302 includes a driving area and a plurality of external drain terminals located on the driving area, the driving area is used for setting a driving chip 3031 and a driving chip 3032, the external drain terminals include an external drain terminal 3021, an external drain terminal 3022, and an external drain terminal 3023, a first lead 2081, a first lead 2091, and a first lead 3011 are tiled on a surface of a passivation layer 206 in the bonding area 103, the first lead 2081 is electrically connected with a signal line 2051, the first lead 2091 is electrically connected with a signal line 2052, the first lead 3011 is electrically connected with the signal line 2053, the external drain terminal 3021 is electrically connected with the first lead 2081, the external drain terminal 3022 is electrically connected with the first lead 2091, the driving chip is electrically connected with the first lead 3011 through the external drain terminal and the first lead and the second lead, and the first lead and the second lead is electrically connected with the external drain terminal on the surface of the passivation layer 206. As shown in fig. 7, the pressing device 304 includes an upper pressing block 3041 and a lower pressing block 3042, and as the upper pressing block 3041 and the lower pressing block 3042 are folded, the first lead 2081 is attached to the external leakage terminal 3021, the first lead 2091 is attached to the external leakage terminal 3022, and the first lead 3011 is attached to the external leakage terminal 3023, so that the first lead and the second lead are bonded to the flip chip film.
As shown in fig. 8, in order to verify that the plurality of slits in the passivation layer in the present application have the effect of reducing the thickness of the film and improving the yield of metal wire bonding, the inventor selects a part of the structure of the liquid crystal display panel applied to the panel design, and uses a scanning electron microscope to analyze, compared with the passivation layer 206 in the display area 101, the thickness of the passivation layer 206 in the bonding area 103 after extrusion is reduced by 0.5um to 1um, the thickness of the local structure is reduced, the uneven thickness of the passivation layer 206 and the upper and lower areas is reduced, and the yield of bonding the first lead, the second lead and the external leakage terminal is improved.
The embodiment of the application provides a liquid crystal display panel, the liquid crystal display panel includes the display region and is located the non-display region outside the display region in this application, binding region is defined in the non-display region, binding region is provided with the signal line that extends to the display region, the signal line passes through-hole and flip-chip film electric connection, the signal line surface is covered with the passivation layer, the passivation layer is including stereoplasm layer and the flexible layer that the stromatolite set up, the flexible layer array is provided with the slit, this slit runs through the flexible layer, in the stereoplasm layer is not etched, the in-process of extrusion, the flexible layer takes place to warp, fill the slit, both protection signal line, passivation layer department thickness in the binding region has been reduced again locally, the uneven problem of atress when having solved the pressfitting, the yield of metal line binding has been improved, and then liquid crystal display panel's performance and display quality are promoted.
In summary, although the present invention has been described in terms of the preferred embodiments, the above-mentioned embodiments are not intended to limit the invention, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention, so that the scope of the invention is defined by the appended claims.
Claims (9)
1. The liquid crystal display panel is characterized by comprising a display area and a non-display area positioned outside the display area, wherein a binding area is defined in the non-display area, the binding area is provided with a signal wire extending to the display area, and the signal wire is electrically connected with a flip chip film through a through hole;
the binding region comprises a substrate, the signal lines positioned on the substrate and a passivation layer covering the signal lines, wherein the passivation layer is arranged in a slit array shape;
the passivation layer comprises a hard layer and a flexible layer which are arranged in a laminated mode, the slit penetrates through the flexible layer, the hard layer is not etched, and the flexible layer deforms and fills the slit in the process of extruding the passivation layer.
2. The liquid crystal display panel according to claim 1, wherein a through hole is provided on the surface of the passivation layer, and an ITO electrode is deposited on the surface of the through hole, wherein a bottom of the ITO electrode is in telecommunication connection with the signal line, and at least one side of the ITO electrode extends out of the through hole and is electrically connected with the flip chip film.
3. The liquid crystal display panel according to claim 2, wherein the slits are symmetrically disposed at both sides of the through hole, and the slits are arranged perpendicular to the direction of the ITO electrode.
4. A liquid crystal display panel according to claim 3, wherein the slit is in a groove shape, and the width of the groove is in the range of 1um to 10 μm.
5. The liquid crystal display panel according to claim 2, wherein the material of the hard layer is one or more of silicon oxide, silicon nitride, and silicon oxynitride, and the material of the flexible layer is one or more of tetrafluoroethylene, hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene.
6. The liquid crystal display panel according to claim 5, wherein the thickness of the flexible layer is in a range of 2 to 4 times the thickness of the hard layer.
7. The liquid crystal display panel according to claim 2, wherein the signal line includes a first signal line and a second signal line, wherein an insulating layer is provided between the first signal line and the second signal line.
8. The liquid crystal display panel according to claim 7, wherein the first signal line and the second signal line are each independent metal lines, wherein the metal lines include a single or several film layers of silver, copper, aluminum, molybdenum, titanium.
9. The liquid crystal display panel according to claim 8, wherein the first signal line and the second signal line are electrically connected to the ITO electrode, respectively; or, the first signal line is electrically connected with the second signal line through a via hole in the insulating layer, and the second signal line is electrically connected with the ITO electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010639873.2A CN111796461B (en) | 2020-07-06 | 2020-07-06 | Liquid crystal display panel having a light shielding layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010639873.2A CN111796461B (en) | 2020-07-06 | 2020-07-06 | Liquid crystal display panel having a light shielding layer |
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| Publication Number | Publication Date |
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| CN111796461A CN111796461A (en) | 2020-10-20 |
| CN111796461B true CN111796461B (en) | 2024-01-19 |
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| CN202010639873.2A Active CN111796461B (en) | 2020-07-06 | 2020-07-06 | Liquid crystal display panel having a light shielding layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112669702B (en) * | 2020-12-29 | 2022-07-29 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN114185210A (en) * | 2021-12-03 | 2022-03-15 | 武汉华星光电技术有限公司 | Array substrate and display panel |
| CN114994991B (en) * | 2022-06-20 | 2023-08-22 | 苏州华星光电技术有限公司 | Flip chip film and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040108443A (en) * | 2003-06-17 | 2004-12-24 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Panel using for Liquid Crystal Display Device |
| CN107121855A (en) * | 2017-07-04 | 2017-09-01 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, display device |
| CN110428731A (en) * | 2019-07-11 | 2019-11-08 | 武汉华星光电半导体显示技术有限公司 | The preparation method of display panel and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040108443A (en) * | 2003-06-17 | 2004-12-24 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Panel using for Liquid Crystal Display Device |
| CN107121855A (en) * | 2017-07-04 | 2017-09-01 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, display device |
| CN110428731A (en) * | 2019-07-11 | 2019-11-08 | 武汉华星光电半导体显示技术有限公司 | The preparation method of display panel and display panel |
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