CN111783281B - Optimization method for thickness of multilayer heat insulation medium - Google Patents

Optimization method for thickness of multilayer heat insulation medium Download PDF

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CN111783281B
CN111783281B CN202010536217.XA CN202010536217A CN111783281B CN 111783281 B CN111783281 B CN 111783281B CN 202010536217 A CN202010536217 A CN 202010536217A CN 111783281 B CN111783281 B CN 111783281B
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thickness
medium
temperature
skin
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CN111783281A (en
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祝宝龙
张然
甘有霖
程玉印
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Yongji Zhonghe Shandong Intelligent Technology Co ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • GPHYSICS
    • G16INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16CCOMPUTATIONAL CHEMISTRY; CHEMOINFORMATICS; COMPUTATIONAL MATERIALS SCIENCE
    • G16C60/00Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
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    • G06F2111/04Constraint-based CAD
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/06Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/10Numerical modelling
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00Details relating to the application field
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08Thermal analysis or thermal optimisation

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Abstract

The invention discloses a method for optimizing the thickness of a multilayer heat insulation medium, which comprises the following steps: for a given insulating material with n layers of medium, wherein n is a positive integer, according to the law of conservation of energy and the law of Fourier, a heat conduction model is built, and the following steps are that: selecting an ith layer thickness as an optimization target, constructing an index function, establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n, and the third step: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium. According to the invention, the optimal medium thickness is determined in a numerical experiment mode, so that the research and development cost is reduced, and the research and development period is shortened.

Description

Optimization method for thickness of multilayer heat insulation medium
Technical Field
The invention relates to the technical field of heat insulation materials, in particular to a method for optimizing the thickness of a multi-layer heat insulation medium.
Background
Insulation materials often consist of a variety of media, with the thickness of the different media having a significant impact on the performance and cost of the insulation material. The heat insulating material has wide application, and is classified into porous material, heat reflecting material and vacuum material. The former is insulated by the pores contained in the material itself, because the air or inert gas in the pores has low heat conductivity coefficient, such as foam material, fiber material and the like; the heat reflecting material has high reflecting coefficient and can reflect heat out, such as gold, silver, nickel, aluminum foil, metallized polyester, polyimide film, etc. The vacuum heat insulating material is insulated by utilizing the internal vacuum of the material to achieve the blocking convection. The aerospace industry has severe requirements on the weight and volume of the heat insulation material, and the heat insulation material has the properties of sound insulation, vibration reduction, corrosion resistance and the like. The need for insulation is not the same for various aircraft. Foam plastic, superfine glass wool, high silica wool and vacuum heat insulation boards are commonly used in the aircraft cabin and the cockpit for heat insulation.
Through mass search, the prior art with publication number of CN104732010A discloses a rapid optimization method of a multi-layer heat-proof structure, which can be used for rapid analysis and design of the heat-proof structure and belongs to the technical field of structural thermal analysis. 1) Establishing a one-dimensional heat transfer analysis finite element model for the heat-proof structure; 2) Applying initial conditions to the model obtained in step 1); 3) Applying boundary conditions to the model obtained in step 1); 4) Performing unit division on the finite element model obtained in the step 1) by adopting a finite element tool to obtain a unit model; 5) Calculating a heat transfer analysis model by adopting a finite element tool, and extracting the temperature of a shell; 6) Outputting the parameters used in the steps 1), 2) and 3) and the shell temperature parameters extracted in the step 5) to a document, and storing the parameters as a parameter file 1; 7) And checking whether the parameter file 1 meets the heat-proof design requirement. The method can rapidly complete the optimal design of the multi-layer heat-proof structure, and improves the working efficiency.
In summary, the existing method can only optimize the thickness of the coating, cannot optimize the thickness of any dielectric layer, has poor adaptability, and cannot set dynamic constraint conditions according to actual requirements, for example, the temperature of one side of the dielectric layer does not exceed m minutes in t time. In order to reduce the development cost and shorten the development period, a numerical experiment method is needed to optimize the thickness of the multi-layer heat insulation medium.
Disclosure of Invention
The invention aims to provide a method for optimizing the thickness of a multi-layer heat insulation medium, so as to solve the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: a method for optimizing the thickness of a multi-layer heat insulation medium comprises the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
and a third step of: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium.
Preferably, the heat insulating medium is composed of three layers of fabric material, respectively denoted as layer I, layer II and layer III, wherein the layer I is in contact with the external environment, an air gap exists between the layer III and the skin, and the gap is denoted as layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
Preferably, when the one-dimensional heat conduction model of the multilayer medium is established, the temperature at any point x in the medium of the I layer-IV layer is recorded as u (x, t) at the moment t, wherein x is the distance from the origin O, and the one-dimensional heat conduction model of the multilayer medium can be obtained according to a one-dimensional heat conduction equation of the uniform medium.
Preferably, when constructing the index function and creating the optimization problem, in order to optimize the thickness of layer II, the index function is customized, the time at which the temperature is greater than 44 ℃ is represented by T w, and the skin surface temperature after the end of the experiment is represented by T 5.
Preferably, when solving the optimization problem by using the pattern search method, the temperature of the outer side of the skin of the dummy is not higher than 47 ℃ and the time of higher than 44 ℃ is not higher than 5 minutes in the iterative process when working for 60 minutes. The correctness of the optimization result is verified from the side.
Compared with the prior art, the invention has the beneficial effects that: aiming at the problems that the existing method only can optimize the thickness of a coating, the thickness of any medium layer cannot be optimized, the method has poor adaptability, dynamic constraint conditions cannot be set according to actual requirements, such as the temperature of one side of a medium does not exceed m minutes in t time, and the like, the method can obtain the optimal thickness of an ith medium by establishing a heat conduction model and constructing an index function, and carrying out numerical solution on the optimization model based on a mode search method, so that the optimal medium thickness can be effectively determined, the research and development cost is reduced, and the research and development period is shortened.
Drawings
FIG. 1 is a schematic diagram of the main steps of the optimization method of the present invention;
FIG. 2 is a schematic diagram of the relationship between the external environment, the heat insulation medium and the human body space according to the present invention;
FIG. 3 is a schematic diagram of a one-dimensional thermal conduction model equation for a multi-layered medium according to the present invention;
FIG. 4 is a schematic diagram of a one-dimensional thermal conduction model equation II for a multi-layer medium according to the present invention;
FIG. 5 is a schematic diagram of a pattern search iteration process of the present invention;
FIG. 6 is a schematic view of skin surface temperature profile for an optimal thickness of layer II of the present invention;
Fig. 7 is a schematic diagram of main symbols and an explanatory diagram of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
An embodiment of the present invention provides:
Embodiment one:
Referring to fig. 1, a method for optimizing the thickness of a multi-layer heat insulation medium includes the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
and a third step of: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium.
Aiming at the problems that the existing method can only optimize the thickness of a coating, cannot optimize the thickness of any medium layer and has poor adaptability of the method, and cannot set dynamic constraint conditions according to actual demands, such as the temperature of one side of a medium does not exceed m minutes in t time, and the like, the method is improved, and the optimal thickness of an ith medium can be obtained by establishing a heat conduction model and constructing an index function of the medium, and carrying out numerical solution on an optimization model based on a mode search method.
Referring to fig. 2, the relationship between the external environment, the heat insulation medium and the human body space is specifically described; the heat insulating medium is composed of three layers of fabric materials and is respectively marked as a layer I, a layer II and a layer III, wherein the layer I is contacted with the external environment, an air gap exists between the layer III and the skin, and the gap is marked as a layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
Embodiment two:
Referring to fig. 2,3 and 4, when a one-dimensional heat conduction model of a multi-layer medium is established, at a time t, the temperature at any point x in the I-IV-layer medium is denoted as u (x, t), where x is the distance from the origin O, and according to a one-dimensional heat conduction equation of a uniform medium, a one-dimensional heat conduction model of the multi-layer medium can be obtained, as shown in fig. 3, The initial values and boundary conditions of equation one shown in FIG. 3 are shown in FIG. 4, where k 0 is the convective heat transfer coefficient of the external environment and the layer I surface, and k 5 is the convective heat transfer coefficient of the layer IV and the skin surface,/>Is a temperature distribution function at the initial time.
Embodiment III:
when constructing the index function and creating the optimization problem, in order to optimize the thickness of layer II, the index function is customized,
s.t.0.6<l2<25,(4),(5)
The time at which the temperature was greater than 44℃was denoted by T w, and the skin surface temperature after the end of the experiment was denoted by T 5. The last two are added because neither T w nor T 5 are optimization variables. Because it is difficult to constrain it, we incorporate it into the index term in a penalty function manner, converting it into a nonlinear optimization problem that only solves the domain constraint. (t w > 300) is a judgment statement whose value is:
Embodiment four:
Referring to fig. 5 and 6, when the optimization problem is solved by using the pattern search method, the temperature of the outer side of the skin of the dummy is not more than 47 ℃ and the time of the outer side of the skin of the dummy is not more than 44 ℃ for 5 minutes in the iterative process when the operation is performed for 60 minutes. The correctness of the optimization result is verified from the side.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (3)

1. The optimizing method of the thickness of the multi-layer heat insulation medium is characterized in that: the method comprises the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
Wherein the index function is:
s.t.0.6<l2<25,(4),(5),
l 2 is the thickness of the second layer material, T w is the time that the temperature is higher than 44 ℃, T 5 is the skin surface temperature after the experiment is finished, and the last two are added because T w and T 5 are not optimal variables, and because the constraint is difficult to carry out, the method of penalty function is adopted to incorporate the second layer material into an index term, the second layer material is converted into a nonlinear optimization problem only solving the domain constraint, and (T w > 300) is a judgment statement that the value is:
And a third step of: and (3) carrying out numerical solution on the optimized model based on a mode search method, wherein when the optimized model is solved by adopting the mode search method, the temperature of the outer side of the skin of the dummy is not more than 47 ℃ and the time of the outer side of the skin of the dummy is not more than 44 ℃ is not more than 5 minutes in the iterative process, and finally, the optimal thickness of the ith medium can be obtained.
2. A method for optimizing the thickness of a multi-layered insulating medium according to claim 1, characterized in that: the heat insulating material is formed by three layers of fabric materials and is respectively marked as a layer I, a layer II and a layer III, wherein the layer I is contacted with the external environment, an air gap exists between the layer III and the skin, and the gap is marked as a layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
3. A method for optimizing the thickness of a multi-layered insulating medium according to claim 1, characterized in that: at time t, the temperature at any point x in the I-IV medium is recorded as u (x, t), wherein x is the distance from the origin O, and a one-dimensional heat conduction model of the multilayer medium can be obtained according to a one-dimensional heat conduction equation of the uniform medium.
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