CN111768716A - Spliced display screen - Google Patents
Spliced display screen Download PDFInfo
- Publication number
- CN111768716A CN111768716A CN202010628083.4A CN202010628083A CN111768716A CN 111768716 A CN111768716 A CN 111768716A CN 202010628083 A CN202010628083 A CN 202010628083A CN 111768716 A CN111768716 A CN 111768716A
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- display screen
- pads
- tiled display
- panels
- panel
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a tiled display screen, tiled display screen includes a plurality of panels and a plurality of cover brilliant film, and each panel is including the display surface and the back of relative setting, follows the display surface towards the direction at the back is first direction, and each cover brilliant film is including relative first surface and the second surface that sets up, follows the first surface orientation the direction on second surface is the second direction, one cover brilliant film clamp is located every two adjacent between the panel, first direction and second direction are perpendicular. The flip chip film is clamped between every two adjacent panels, so that the space occupied by insufficient bending of the flip chip film is reduced, the width of a bonding area is further reduced, and the splicing seam between every two adjacent panels is further reduced.
Description
Technical Field
The application relates to the technical field of display, in particular to a spliced display screen.
Background
At present, the conventional display screen needs to input signals required by the panel into the panel through a die set process of bonding a chip on film or a flexible circuit board. In panel design, signal lines in a plane are usually bundled through a sector area and concentrated to a small binding area, and then a chip on film or a flexible circuit board is bound to the binding area to form electrical connection between a printed circuit board and a glass substrate, so that the width of a bonding area is usually large. Furthermore, when the bonding area is too large, the appearance grade of the display screen can be influenced, and if the bonding area is used for splicing the screen, obvious splicing seams can be generated, so that the splicing display effect is influenced. Because the substrate polyimide of the chip on film or the flexible circuit board has good rebound resilience and is not easy to bend, the abutted seams can be increased, and the splicing display effect is influenced.
Disclosure of Invention
The application provides a tiled display screen to reduce the concatenation seam between the tiled display screen.
The application provides a tiled display screen, include:
the display panel comprises a plurality of panels, a plurality of first display panels and a plurality of second display panels, wherein each panel comprises a display surface and a back surface, the display surfaces are arranged oppositely, the back surface is arranged oppositely, and the direction from the display surface to the back surface is a first direction; and
each of the flip chips comprises a first surface and a second surface which is arranged oppositely, the direction along the first surface and towards the second surface is a second direction, one flip chip is clamped between every two adjacent panels, and the first direction is vertical to the second direction.
In the tiled display screen that this application provided, tiled display screen still includes the glue film, the glue film bond in between panel and the cover brilliant film.
In the tiled display screen provided by the application, the distance between every two adjacent panels is 0.1 mm-0.6 mm.
In the tiled display screen provided by the application, the thickness of the flip chip film is 0.1 mm-0.6 mm.
In the tiled display screen that this application provided, tiled display screen still includes a plurality of metal cords, a plurality of metal cords are connected the panel with cover the brilliant film.
In the tiled display screen that this application provided, each the display surface of panel includes first side, first side includes a plurality of first pads, the cover brilliant film is close to one side of display surface includes a plurality of second pads, first pad with the second pad one-to-one sets up, the metal wire is connected first pad with the second pad.
In the tiled display screen that this application provided, each the display surface of panel includes first side and second side, first side with the adjacent setting in second side, first side includes a plurality of first pads, the second side includes a plurality of third pads, the cover brilliant film is close to one side of display surface has a plurality of second pads, the second pad respectively with first pad with third pad one-to-one sets up, first pad with the second pad passes through the metal wire is connected, the third pad with the second pad passes through the metal wire is connected.
In the tiled display screen that this application provided, tiled display screen still includes the sealing compound layer, the sealing compound layer covers chip on film with the panel.
In the tiled display screen that this application provided, the tiled display screen still includes emitting diode, the emitting diode array set up in each the display surface of panel.
In the tiled display screen provided by the application, the length of the first bonding pad, the length of the second bonding pad and the length of the third bonding pad are 1-99 micrometers.
The application provides a tiled display screen, tiled display screen includes a plurality of panels and a plurality of cover film, and each panel includes the relative display surface that sets up and the back that sets up relatively with it, follows the display surface to the direction on the back is first direction, and each cover film includes relative first surface and the second surface that sets up, follows the first surface orientation the direction on second surface is the second direction, one cover film presss from both sides and locates every two adjacent between the panel, first direction and second direction are perpendicular. The flip chip film is clamped between every two adjacent panels, so that the space occupied by insufficient bending of the flip chip film is reduced, the width of a bonding area is further reduced, and the splicing seam between every two adjacent panels is further reduced.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a first top view of a tiled display screen provided herein.
Fig. 2 is a cross-sectional view of the tiled display screen provided by the present application along line AB.
Fig. 3 is a second top view of the tiled display screen provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and fig. 2, fig. 1 is a first top view of a tiled display screen provided in the present application. Fig. 2 is a cross-sectional view of the tiled display screen provided by the present application along line AB. The present application provides a tiled display screen 10. The tiled display screen 10 includes a plurality of panels 100 and a plurality of flip-chip films 200.
Each panel 100 includes an oppositely disposed display surface 110 and an oppositely disposed back surface 120. The direction along the display surface 110 towards the back surface 120 is a first direction 101. The distance D between every two adjacent panels 100 is 0.1 mm-0.6 mm. Specifically, the distance D between each two adjacent panels 100 may be 0.2 mm, 0.3 mm, 0.5 mm, or the like. The display surface 110 of each of the panels 100 includes a first side 111. The first side 111 comprises a number of first pads 130. A length L of the first pad 1301Is 1 micron to 99 microns. Specifically, the length L of the first pad 1301And may be 5 microns, 20 microns, 60 microns, 80 microns, or the like.
In another embodiment, the tiled display screen 10 further includes light emitting diodes 300. The array of light emitting diodes 300 is disposed on the display surface 110 of each of the panels 100.
Each flip-chip film 200 includes a first surface 210 and an oppositely disposed second surface 220. Facing along the first surface 210The second surface 220 is oriented in a second direction 201. One of the flip-chip films 200 is sandwiched between every two adjacent panels 100. The first direction 101 is perpendicular to the second direction 201. The thickness T of the flip chip film 200 is 0.1 mm-0.6 mm. Specifically, the thickness T of the chip on film 200 may be 0.2 mm, 0.3 mm, 0.5 mm, or the like. The flip-chip film 200 includes a plurality of second pads 230 on a side thereof adjacent to the display surface 110. The first pads 130 and the second pads 230 are disposed in a one-to-one correspondence. A length L of the second pad 2302Is 1 micron to 99 microns. Specifically, the length L of the second pad 2302And may be 5 microns, 20 microns, 60 microns, 80 microns, or the like.
In another embodiment, the tiled display screen 10 further includes a glue layer 400. The adhesive layer 400 is adhered between the panel 100 and the flip chip package 200.
In the application, the flip chip film is bonded between the gaps of every two adjacent panels through the adhesive layer, so that the space occupied by insufficient bending of the flip chip film is reduced, the width of a bonding area is further reduced, and the splicing gaps between every two adjacent panels are further reduced.
In another embodiment, the tiled display screen 10 further includes a plurality of metal lines 500. Each of the metal lines 500 is electrically connected to the first pad 130 and the second pad 230.
In this application, will cover brilliant film and panel lug connection through the metal wire, with drive signal input in the face, and then drive panel normal work, avoided adopting the technology that cover brilliant film or flexible circuit board bound to, because of the pixel on the concatenation display screen is less, adopt metal wire connection cover brilliant film and panel, can compatible pixel resolution ratio range's position precision.
In another embodiment, the tiled display screen 100 further includes an adhesive sealant layer 600. The sealant layer 600 covers the flip chip 200 and the panel 100.
Referring to fig. 3, fig. 3 is a second top view of the tiled display screen provided in the present application. Fig. 3 is different from fig. 1 in that: the display surface 110 of each of the panels 100 also includes a second side 112. The first side 111 is disposed adjacent to the second side 112. The second side 112 includes a number of third pads 140. The second pads 230 are disposed in one-to-one correspondence with the first pads 130 and the third pads 140, respectively. The third pad 140 and the second pad 230 are connected by the metal line 500. The other structures are the same as those in fig. 1, and are not described again here.
The spliced display screen can be a mini light-emitting diode spliced display screen or a miniature light-emitting diode spliced display screen.
The application provides a tiled display screen, tiled display screen includes a plurality of panels and a plurality of cover brilliant film, and each panel including relative display surface that sets up and with the back, follow the display surface to the direction at the back is first direction, and each cover brilliant film includes relative first surface and the second surface that sets up, follows the first surface orientation the direction on second surface is the second direction, one cover brilliant film clamp is located every two adjacent between the panel, first direction and second direction are perpendicular. The flip chip film is clamped between every two adjacent panels, so that the space occupied by insufficient bending of the flip chip film is reduced, the width of a bonding area is further reduced, and the splicing seam between every two adjacent panels is further reduced.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A tiled display screen, comprising:
the display panel comprises a plurality of panels, a plurality of first display panels and a plurality of second display panels, wherein each panel comprises a display surface and a back surface, the display surfaces are arranged oppositely, the back surface is arranged oppositely, and the direction from the display surface to the back surface is a first direction; and
each of the flip chips comprises a first surface and a second surface which is arranged oppositely, the direction along the first surface and towards the second surface is a second direction, one flip chip is clamped between every two adjacent panels, and the first direction is vertical to the second direction.
2. The tiled display screen of claim 1, further comprising a glue layer, the glue layer being bonded between the panel and the flip-chip.
3. The tiled display screen of claim 1, wherein the distance between each two adjacent panels is 0.1 mm to 0.6 mm.
4. The tiled display screen of claim 1, wherein the thickness of the flip-chip film is 0.1 mm to 0.6 mm.
5. The tiled display screen of claim 1, wherein the tiled display screen further comprises a plurality of metal lines, the plurality of metal lines connecting the panel and the flip-chip.
6. The tiled display screen of claim 5, wherein the display surface of each of the panels includes a first side, the first side includes a plurality of first pads, one side of the flip-chip on film near the display surface includes a plurality of second pads, the first pads and the second pads are disposed in a one-to-one correspondence, and the metal lines connect the first pads and the second pads.
7. The tiled display screen of claim 5, wherein the display surface of each of the panels includes a first side and a second side, the first side is disposed adjacent to the second side, the first side includes a plurality of first pads, the second side includes a plurality of third pads, one side of the chip on film near the display surface has a plurality of second pads, the second pads are disposed in one-to-one correspondence with the first pads and the third pads, respectively, the first pads are connected to the second pads through the metal lines, and the third pads are connected to the second pads through the metal lines.
8. The tiled display screen of claim 1, wherein the tiled display screen further comprises an adhesive layer covering the flip-chip film and the panel.
9. The tiled display screen of claim 1, wherein the tiled display screen further comprises light emitting diodes, the array of light emitting diodes being disposed on the display surface of each of the panels.
10. The tiled display screen of claim 7, wherein the length of the first pad, the length of the second pad, and the length of the third pad are 1-99 microns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010628083.4A CN111768716B (en) | 2020-07-02 | 2020-07-02 | Spliced display screen |
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CN202010628083.4A CN111768716B (en) | 2020-07-02 | 2020-07-02 | Spliced display screen |
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CN111768716A true CN111768716A (en) | 2020-10-13 |
CN111768716B CN111768716B (en) | 2022-05-27 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113075808A (en) * | 2021-03-17 | 2021-07-06 | Tcl华星光电技术有限公司 | Splicing display panel and display device |
CN113112925A (en) * | 2021-04-16 | 2021-07-13 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen and manufacturing method thereof |
CN113539120A (en) * | 2021-07-29 | 2021-10-22 | 深圳市华星光电半导体显示技术有限公司 | Tiled display device |
CN113593424A (en) * | 2021-07-30 | 2021-11-02 | Tcl华星光电技术有限公司 | Splicing display panel and display device |
US20220017786A1 (en) * | 2018-12-06 | 2022-01-20 | Appotronics Corporation Limited | Screen splicing structure and method for forming screen splicing structure |
CN114141162A (en) * | 2021-12-07 | 2022-03-04 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
CN114397781A (en) * | 2021-12-21 | 2022-04-26 | 苏州华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
CN114550603A (en) * | 2022-02-24 | 2022-05-27 | 北京京东方显示技术有限公司 | Spliced screen, manufacturing method of spliced screen and display device |
CN114740653A (en) * | 2022-03-21 | 2022-07-12 | 惠科股份有限公司 | Backlight source, backlight module and display device |
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CN210181979U (en) * | 2019-07-23 | 2020-03-24 | 云南索特科技有限公司 | Detachable liquid crystal splicing screen |
WO2020114227A1 (en) * | 2018-12-06 | 2020-06-11 | 深圳光峰科技股份有限公司 | Screen splicing structure and formation method therefor |
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CN106842711A (en) * | 2017-03-29 | 2017-06-13 | 韩玉君 | Display structure and integrated morphology for eliminating FPD platen edge piece |
CN108777114A (en) * | 2018-06-26 | 2018-11-09 | 上海中航光电子有限公司 | Display panel and its manufacturing method, display device and mosaic screen |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US11905442B2 (en) * | 2018-12-06 | 2024-02-20 | Appotronics Corporation Limited | Screen splicing structure and method for forming screen splicing structure |
US20220017786A1 (en) * | 2018-12-06 | 2022-01-20 | Appotronics Corporation Limited | Screen splicing structure and method for forming screen splicing structure |
CN113075808A (en) * | 2021-03-17 | 2021-07-06 | Tcl华星光电技术有限公司 | Splicing display panel and display device |
CN113112925A (en) * | 2021-04-16 | 2021-07-13 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen and manufacturing method thereof |
CN113112925B (en) * | 2021-04-16 | 2022-04-26 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen and manufacturing method thereof |
US11991841B2 (en) | 2021-04-16 | 2024-05-21 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Splicing display screen and manufacturing method thereof |
CN113539120A (en) * | 2021-07-29 | 2021-10-22 | 深圳市华星光电半导体显示技术有限公司 | Tiled display device |
CN113593424A (en) * | 2021-07-30 | 2021-11-02 | Tcl华星光电技术有限公司 | Splicing display panel and display device |
CN114141162A (en) * | 2021-12-07 | 2022-03-04 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
CN114141162B (en) * | 2021-12-07 | 2024-03-15 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
WO2023102953A1 (en) * | 2021-12-07 | 2023-06-15 | 惠州华星光电显示有限公司 | Display screen tiling method and tiled display screen |
CN114397781A (en) * | 2021-12-21 | 2022-04-26 | 苏州华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
CN114550603A (en) * | 2022-02-24 | 2022-05-27 | 北京京东方显示技术有限公司 | Spliced screen, manufacturing method of spliced screen and display device |
CN114550603B (en) * | 2022-02-24 | 2024-03-01 | 北京京东方显示技术有限公司 | Spliced screen, manufacturing method of spliced screen and display device |
CN114740653B (en) * | 2022-03-21 | 2023-05-16 | 惠科股份有限公司 | Backlight source, backlight module and display device |
CN114740653A (en) * | 2022-03-21 | 2022-07-12 | 惠科股份有限公司 | Backlight source, backlight module and display device |
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