CN111761418A - Cathode roller precision grinding and polishing method - Google Patents
Cathode roller precision grinding and polishing method Download PDFInfo
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- CN111761418A CN111761418A CN202010428167.3A CN202010428167A CN111761418A CN 111761418 A CN111761418 A CN 111761418A CN 202010428167 A CN202010428167 A CN 202010428167A CN 111761418 A CN111761418 A CN 111761418A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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Abstract
The invention discloses a cathode roller precision grinding and polishing method, which comprises the following steps: the grinding environment is closed and dustless, and the polishing wheel is soaked in pure water; sequentially carrying out surface coarse grinding by adopting a polishing wheel with the granularity of 60 meshes and a polishing wheel with the granularity of 120 meshes; sequentially carrying out surface finish grinding by adopting a polishing wheel with the granularity of 320 meshes and a polishing wheel with the granularity of 600 meshes; cleaning the surface of the finely ground cathode roll; adopting a polishing wheel with the granularity of 800 meshes and a polishing wheel with the granularity of 1000 meshes to perform surface finish polishing on the cathode roller in sequence; and cleaning the surface of the cathode roller. The cathode roller formed by the process has the surface roughness below 0.2 mu m, a certain mirror surface effect, long production running period and compact product crystals.
Description
Technical Field
The invention relates to the field of grinding and polishing, in particular to a cathode roller precision grinding and polishing method.
Background
The lithium electrolytic copper foil is a main material of a lithium ion battery negative current collector, and indexes such as thickness, uniformity, physical properties and surface properties of the lithium electrolytic copper foil directly influence indexes such as cycle performance and energy density of the lithium ion battery. The surface of the cathode roller is the only matrix for the crystal growth of the copper foil, and the quality of the roller surface has a direct relation with the apparent quality of the smooth surface of the copper foil and has an indirect influence on the internal quality of the copper foil and the micro-morphology of the rough surface, so the surface polishing quality and the cleanliness of the cathode roller are key links of the production of the copper foil.
The traditional grinding and polishing process is divided into two types, one type uses pure water as polishing solution, adopts PVA polishing wheels with different granularities (320 meshes, 600 meshes and 800 meshes) as working media, and carries out grinding and polishing under different pressures and different rotating speeds, although the method can achieve certain effects of smooth and clean surface and low roughness of a cathode roller, in the copper foil production process, the problems of quick roller surface oxidation, short operation life, thick copper foil crystals, difficult cleaning of fine abrasive materials attached to the roller surface and the like mainly exist; the other method is to take an aqueous solution consisting of organic matters as a chemical polishing solution, soak a cathode roller in the aqueous solution, polish the surface by adopting a polishing brush with 1000-mesh abrasive materials, and grind and polish the surface under certain pressure and rotating speed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a cathode roller precision grinding and polishing method.
The invention is realized by the following technical scheme.
A cathode roller precision grinding and polishing method is characterized by comprising the following steps:
(1) placing a grinding bed in a closed dust-free environment, soaking polishing wheels with the granularity of 60 meshes, 120 meshes, 320 meshes, 600 meshes, 800 meshes and 1000 meshes by using pure water until the polishing wheels are thoroughly soaked, and placing a cathode roller to be treated on a cathode roller rotating frame;
(2) adopting a soaked polishing wheel with the granularity of 60 meshes and a soaked polishing wheel with the granularity of 120 meshes to perform coarse surface grinding on the cathode roller in sequence;
(3) performing surface finish grinding on the cathode roller obtained in the step (2) by adopting a polishing wheel with the granularity of 320 meshes and a polishing wheel with the granularity of 600 meshes which are soaked in sequence;
(4) cleaning the surface of the cathode roller obtained in the step (3);
(5) performing surface finish polishing on the cathode roller obtained in the step (4) by adopting a soaked polishing wheel with the granularity of 800 meshes and a 1000-mesh polishing wheel in sequence;
(6) and (5) cleaning the surface of the cathode roller obtained in the step (5).
Further, the grinding pressure in the step (2) is 0.14MPa to 0.16MPa, the rotating speed of the cathode roller is 8r/min to 10r/min, the rotating speed of the polishing wheel is 350r/min to 450r/min, and the translation speed of the polishing wheel is 80mm/min to 100 mm/min.
Further, the grinding pressure in the step (3) is 0.12MPa to 0.14MPa, the rotating speed of the cathode roller is 8r/min to 10r/min, the rotating speed of the polishing wheel is 350r/min to 450r/min, and the translation speed of the polishing wheel is 70mm/min to 100 mm/min.
Further, the grinding pressure in the step (5) is 0.10MPa to 0.12MPa, the rotating speed of the cathode roller is 8r/min to 10r/min, the rotating speed of the polishing wheel is 350r/min to 450r/min, and the translation speed of the polishing wheel is 50mm/min to 60 mm/min.
Further, the surface cleaning in the step (4) and the step (6) are both as follows: and sequentially adopting scouring pad, sponge, detergent and dilute copper sulfate solution to clean the surface of the cathode roller.
Further, the diluted copper sulfate solution had a concentration (in mass%) of 20%.
Further, the conductivity of the pure water is less than or equal to 1.0 mu s/cm.
By adopting the method, the obtained cathode roller has no spiral trace, is uniform and soft in color and luster, fine in microstructure and smooth in surface roughness within 0.20 mu m, has a certain mirror surface effect, and provides high-quality conditions for a crystal growth matrix of the 6-8 mu m lithium electrolytic copper foil.
The invention has the beneficial technical effects that:
1. the invention adopts a closed dustproof grinding and polishing environment, can filter out dust and floating matters in the air in the space, and avoids the influence of the environment on the grinding and polishing quality;
2. according to the invention, a first coarse grinding process is formed by adopting polishing wheels with the granularity of 60 meshes and 120 meshes, so that most of oxide layers on the roll surface are effectively removed, the roundness of the cathode roll is corrected, and finally the approximate geometric shape and roughness of a titanium material are achieved;
3. according to the invention, a second fine grinding process is formed by using polishing wheels of 320 meshes and 600 meshes, so that the micro defects of surface bright lines, spiral marks and the like are effectively removed, and finally the most accurate geometric shape and fine crack depth are achieved;
4. according to the invention, a polishing wheel of 800 meshes and a polishing wheel of 1000 meshes are adopted to form a third fine polishing process, so that a broken ring layer left by fine grinding and coarse grinding is effectively removed, and finally, a cathode roller which has no spiral trace, uniform and soft color and fine microstructure is achieved;
5. the invention adopts soft scouring pad, absorbent sponge, detergent and copper sulfate solution to clean the surface of the cathode roller after fine grinding and polishing in sequence, and eliminates the abrasive powder particles on the surface.
6. The cathode roller formed by the process has the surface roughness below 0.20 mu m, a certain mirror surface effect, long production running period and compact product crystals.
Detailed Description
The present invention will be described in detail with reference to the following embodiments.
A cathode roller precision grinding and polishing method comprises the following steps:
(1) placing a grinding bed in a closed dust-free environment with air purification conditions, and soaking polishing wheels with the particle sizes of 60 meshes, 120 meshes, 320 meshes, 600 meshes, 800 meshes and 1000 meshes by pure water with the electric conductivity of less than or equal to 1.0 mu s/cm, wherein the polishing wheels are mainly formed by combining silicon carbide, diamond powder and thermosetting resin until the materials are thoroughly soaked; placing a cathode roller to be processed on a cathode roller rotating frame, installing a polishing wheel and locking a protective cover, and then running for 3-5 min in an idle load manner to confirm that the polishing wheel runs normally;
(2) and (3) carrying out surface coarse grinding on the cathode roller by using a 60-mesh polishing wheel and a 120-mesh polishing wheel which are soaked in sequence: the grinding pressure (working pressure between the polishing wheel and the cathode roller) is 0.14MPa to 0.16MPa, the rotating speed of the cathode roller is 8 to 10r/min, the rotating speed of the polishing wheel is 350 to 450r/min, and the translation speed of the polishing wheel is 80 to 100 mm/min; the pure water spraying position is adjusted to be the tangent position of the polishing wheel and the cathode roller, and the spraying direction and the polishing wheel are fedThe directions are consistent, and the water flow is 0.2-0.4 m3The travel times are 6-10; after coarse grinding, eliminating grinding powder particles and an oxide layer on the surface, and finally achieving the approximate geometric shape and roughness of the titanium material;
(3) and (3) performing surface finish grinding on the cathode roller obtained in the step (2) by using a polishing wheel with the granularity of 320 meshes and a polishing wheel with the granularity of 600 meshes which are soaked in sequence: the grinding pressure is 0.12MPa to 0.14MPa, the rotating speed of the cathode roller is 8r/min to 10r/min, the rotating speed of the polishing wheel is 350r/min to 450r/min, and the translation speed of the polishing wheel is 70mm/min to 100 mm/min; the pure water spraying position is adjusted to be the tangent of the polishing wheel and the cathode roller, the spraying direction is consistent with the feeding direction of the polishing wheel, and the water flow is 0.4-0.6 m3The travel times are 5-12;
(4) cleaning the surface of the cathode roller obtained in the step (3) by sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution, eliminating abrasive powder particles existing on the surface, effectively removing microscopic defects such as surface bright lines, spiral prints and the like, and finally achieving the most accurate geometric shape and fine crack depth;
(5) and (3) performing surface finish polishing on the cathode roller obtained in the step (4) by using a polishing wheel with the granularity of 800 meshes and a polishing wheel with the granularity of 1000 meshes which are soaked in the water in sequence: the grinding pressure is 0.10MPa to 0.12MPa, the rotating speed of the cathode roller is 8r/min to 10r/min, the rotating speed of the polishing wheel is 350r/min to 450r/min, and the translation speed of the polishing wheel is 50mm/min to 60 mm/min; the pure water spraying point is adjusted to be the tangent of the polishing wheel and the cathode roller, the spraying direction is consistent with the feeding direction of the polishing wheel, and the water flow is 0.5-0.7 m3The travel times are 4-6;
(6) and (3) sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution to clean the surface of the cathode roller obtained in the step (5), after the surface of the roller is dried, slightly coating a layer of dilute copper sulfate solution, along with crystallization and precipitation of copper sulfate on the surface of the roller, efficiently adsorbing granular impurities floating on the surface in copper sulfate crystals as nucleation media, and after the copper sulfate crystals are completely dried, cleaning the surface by adopting pure water.
Example 1
Placing the cathode roller to be processed on a cathode roller rotating frame, soaking each polishing wheel by pure water, installing the polishing wheels and locking a protective cover, and then running for 3min in an idle load manner to confirm that the polishing wheels run normally;
carrying out surface coarse grinding on the cathode roller by using polishing wheels with the granularity of 60 meshes and 120 meshes in sequence, setting the rotating speed of the cathode roller to be 8r/min, the rotating speed of the polishing wheels to be 350r/min and the translation speed of the polishing wheels to be 100 mm/min; grinding pressure of 0.16MPa, travel times of 10 times, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, spraying direction is consistent with the feeding direction of the polishing wheel, and water flow is 0.2m3/h；
Carrying out surface finish grinding on the cathode roller by using polishing wheels with the granularity of 320 meshes and 600 meshes in sequence, setting the rotating speed of the cathode roller to be 8r/min, the rotating speed of the polishing wheels to be 350r/min and the translation speed of the polishing wheels to be 100 mm/min; grinding pressure of 0.14MPa, travel times of 12 times, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, spraying direction is consistent with the feeding direction of the polishing wheel, and water flow is 0.4m3/h；
Sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution to clean the surface of the cathode roller, and eliminating abrasive powder particles on the surface;
sequentially carrying out surface fine polishing on the cathode roller by using polishing wheels with the granularity of 800 meshes and 1000 meshes, setting the rotating speed of the cathode roller to be 8r/min, the rotating speed of the polishing wheels to be 350r/min and the translation speed of the polishing wheels to be 60 mm/min; grinding pressure of 0.12MPa, travel times of 6 times, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, spraying direction is consistent with the feeding direction of the polishing wheel, and water flow is 0.5m3/h；
The surface of the cathode roller is cleaned by sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution, the roll surface of the cathode roller ground by the process has obvious spiral printing, and the surface roughness is 0.18 mu m.
Example 2
Placing the cathode roller to be processed on a cathode roller rotating frame, soaking each polishing wheel by pure water, installing the polishing wheels and locking a protective cover, and then running for 5min in an idle load manner to confirm that the polishing wheels run normally;
carrying out surface coarse grinding on the cathode roller by using polishing wheels with the granularity of 60 meshes and 120 meshes in sequence, setting the rotating speed of the cathode roller to be 9r/min, the rotating speed of the polishing wheels to be 400r/min and the translation speed of the polishing wheels to be 80 mm/min; grinding pressure of 0.14MPa, travel times of 6 times, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, spraying direction is consistent with the feeding direction of the polishing wheel, and water flow is 0.4m3/h；
Carrying out surface finish grinding on the cathode roller by using polishing wheels with the granularity of 320 meshes and 600 meshes in sequence, setting the rotating speed of the cathode roller to be 10r/min, the rotating speed of the polishing wheels to be 450r/min and the translation speed of the polishing wheels to be 70 mm/min; grinding pressure of 0.12MPa, 5 times of travel, adjusting the pure water spraying position to be the tangent of the polishing wheel and the cathode roller, wherein the spraying direction is consistent with the feeding direction of the polishing wheel, and the water flow is 0.5m3/h；
Sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution to clean the surface of the cathode roller, and eliminating abrasive powder particles on the surface;
sequentially carrying out surface fine polishing on the cathode roller by using polishing wheels with the granularity of 800 meshes and 1000 meshes, setting the rotating speed of the cathode roller to be 9r/min, the rotating speed of the polishing wheels to be 400r/min and the translation speed of the polishing wheels to be 50 mm/min; grinding pressure of 0.10MPa, 4 times of travel, adjusting the pure water spraying position to be the tangent of the polishing wheel and the cathode roller, wherein the spraying direction is consistent with the feeding direction of the polishing wheel, and the water flow is 0.7m3/h；
The cathode roller is cleaned by scouring pad, sponge, detergent and 20% dilute copper sulfate solution in sequence, the cathode roller after grinding by the process has no spiral trace, inconsistent color and luster, and the roughness value of the roller surface is 0.19 um.
EXAMPLE III
Placing the cathode roller to be processed on a cathode roller rotating frame, soaking each polishing wheel by pure water, installing the polishing wheels and locking a protective cover, and then running for 4min in no-load mode to confirm that the polishing wheels run normally;
using polishing wheels with the granularity of 60 meshes and 120 meshes to perform surface coarse grinding on the cathode roller in sequence, setting the rotating speed of the cathode roller to be 10r/min, and polishingThe rotating speed of the polishing wheel is 450r/min, and the translation speed of the polishing wheel is 80 mm/min; grinding pressure of 0.15MPa, travel times of 10 times, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, spraying direction is consistent with the feeding direction of the polishing wheel, and water flow is 0.3m3/h，
Sequentially carrying out surface fine grinding on the cathode roller by using polishing wheels with the granularity of 320 meshes and 600 meshes, setting the rotating speed of the cathode roller to be 9r/min and the rotating speed of the polishing wheel to be 450r/min, firstly, grinding the polishing wheel with the granularity of 320 meshes to be 0.13MPa, translating the polishing wheel to be 70mm/min and stroke times to be 10 times, under the condition that the rotating speed of the cathode roller and the rotating speed of the polishing wheel are not changed, then, grinding the polishing wheel with the granularity of 600 meshes to be 0.12MPa, translating the polishing wheel to be 70mm/min and stroke times to be 6 times, adjusting the pure water spraying position to be the tangent line of the polishing wheel and the cathode roller, wherein the spraying direction is consistent with the feeding3/h；
Sequentially adopting scouring pad, sponge, detergent and 20% dilute copper sulfate solution to clean the surface of the cathode roller, and eliminating abrasive powder particles on the surface;
carrying out surface finish grinding on the cathode roller by using polishing wheels with the granularity of 800 meshes and 1000 meshes in sequence, setting the rotating speed of the cathode roller to be 10r/min, the rotating speed of the polishing wheels to be 400r/min and the translation speed of the polishing wheels to be 55 mm/min; grinding pressure of 0.11MPa, 5 times of travel, adjusting pure water spraying position to be the tangent of the polishing wheel and the cathode roller, wherein the spraying direction is consistent with the feeding direction of the polishing wheel, and the water flow is 0.5m3/h；
The cathode roller is cleaned by scouring pad, sponge, detergent and 20% dilute copper sulfate solution in sequence, and the cathode roller ground by the process has no spiral trace, inconsistent color and luster and roll surface roughness value of 0.18 um.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention. It should be noted that other equivalent modifications can be made by those skilled in the art in light of the teachings of the present invention, and all such modifications can be made as are within the scope of the present invention.
Claims (7)
1. A cathode roller precision grinding and polishing method is characterized by comprising the following steps:
(1) placing a grinding bed in a closed dust-free environment, soaking polishing wheels with the granularity of 60 meshes, 120 meshes, 320 meshes, 600 meshes, 800 meshes and 1000 meshes by using pure water until the polishing wheels are thoroughly soaked, and placing a cathode roller to be treated on a cathode roller rotating frame;
(2) adopting a soaked polishing wheel with the granularity of 60 meshes and a soaked polishing wheel with the granularity of 120 meshes to perform coarse surface grinding on the cathode roller in sequence;
(3) performing surface finish grinding on the cathode roller obtained in the step (2) by adopting a polishing wheel with the granularity of 320 meshes and a polishing wheel with the granularity of 600 meshes which are soaked in sequence;
(4) cleaning the surface of the cathode roller obtained in the step (3);
(5) performing surface finish polishing on the cathode roller obtained in the step (4) by adopting a soaked polishing wheel with the granularity of 800 meshes and a 1000-mesh polishing wheel in sequence;
(6) and (5) cleaning the surface of the cathode roller obtained in the step (5).
2. The method according to claim 1, wherein the grinding pressure in step (2) is 0.14MPa to 0.16MPa, the rotating speed of the cathode roller is 8 to 10r/min, the rotating speed of the polishing wheel is 350 to 450r/min, and the translation speed of the polishing wheel is 80 to 100 mm/min.
3. The method according to claim 1, wherein the grinding pressure in step (3) is 0.12MPa to 0.14MPa, the rotating speed of the cathode roller is 8 to 10r/min, the rotating speed of the polishing wheel is 350 to 450r/min, and the translation speed of the polishing wheel is 70 to 100 mm/min.
4. The method according to claim 1, wherein the grinding pressure in the step (5) is 0.10MPa to 0.12MPa, the rotating speed of the cathode roller is 8 to 10r/min, the rotating speed of the polishing wheel is 350 to 450r/min, and the translation speed of the polishing wheel is 50 to 60 mm/min.
5. The method according to claim 1, wherein the step (4) and the step (6) of surface cleaning are both: and sequentially adopting scouring pad, sponge, detergent and dilute copper sulfate solution to clean the surface of the cathode roller.
6. The method of claim 5, wherein the diluted copper sulfate solution is at a concentration of 20%.
7. The method according to claim 1, wherein the pure water has an electrical conductivity of 1.0 μ s/cm or less.
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| CN202010428167.3A CN111761418A (en) | 2020-05-20 | 2020-05-20 | Cathode roller precision grinding and polishing method |
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Cited By (2)
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| CN113442008A (en) * | 2021-07-06 | 2021-09-28 | 江西鑫铂瑞科技有限公司 | Production method capable of improving grinding efficiency of cathode roller for electrolytic copper foil production |
| CN113478358A (en) * | 2021-06-25 | 2021-10-08 | 铜陵市华创新材料有限公司 | Cathode roll polishing process for reducing defects of 4.5 mu m copper foil |
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