CN111757611A

CN111757611A - Mounting structure applied to miniLED and manufacturing method thereof

Info

Publication number: CN111757611A
Application number: CN202010507861.4A
Authority: CN
Inventors: 涂都; 李兵; 周江华
Original assignee: Shenzhen Longli Technology Co Ltd
Current assignee: Shenzhen Longli Technology Co Ltd
Priority date: 2020-06-05
Filing date: 2020-06-05
Publication date: 2020-10-09
Anticipated expiration: 2040-06-05
Also published as: CN111757611B

Abstract

The invention relates to a mounting structure applied to a miniLED and a manufacturing method thereof, relating to the technical field of display and comprising an FPC substrate, wherein the FPC substrate comprises bonding pads which are arranged in a matrix and have the same size and a circuit connected with the bonding pads, a screen plate is attached to the FPC substrate, a through hole which is matched with the bonding pads and is used for tin paste to fall into the bonding pads is formed in the screen plate, and the through hole is used for clamping the miniLED. The invention has the effects of facilitating accurate and stable welding of the miniLED on the FPC substrate.

Description

Mounting structure applied to miniLED and manufacturing method thereof

Technical Field

The invention relates to the technical field of display, in particular to a mounting structure applied to a miniLED and a manufacturing method thereof.

Background

A sub-millimeter light emitting diode (miniLED) as a direct type display backlight has many advantages such as high brightness, high contrast, capability of implementing local dimming display, flexible profile, and narrow frame, and is a focus of people. With the steady advance of 5G business, a larger broadband and a higher network speed can promote the continuous perfection and the rapid growth of an ultra-high-definition video industrial chain, the miniLED backlight display screen can achieve the display effect no matter from the image quality, the saturation and the contrast, the miniLED backlight display screen is used as a novel LED display technology derived on the basis of small-spacing LEDs, the number of electronic elements on the circuit board reaches up to ten thousand, and a screen printing method is generally adopted for manufacturing the circuit board with dense electronic elements.

The existing basic process for manufacturing the miniLED backlight source needs to go through the following steps:

s1, selecting an FPC substrate with a plurality of groups of bonding pads (two bonding pads in each group, one is an anode bonding pad, and the other is a cathode bonding pad), and horizontally placing the FPC substrate on an operation platform of the solder paste printer;

s2, moving a steel mesh on the solder paste printer (the mesh size on the steel mesh is matched with the size of the pad hole), so that the mesh on the steel mesh is aligned with the pad hole, and pressing the steel mesh on the surface of the FPC substrate;

s3, brushing solder paste on the surface of the steel mesh, and enabling a scraper to scrape the mesh plate back and forth so that the solder paste falls on the bonding pad through meshes on the steel mesh;

s4: die bonding, namely placing the miniLEDs on the bonding pads on the FPC substrate one at a time by using a manipulator, wherein positive and negative pins of a single miniLED are respectively placed on the corresponding positive and negative bonding pads;

s5: reflow soldering, the FPC substrate and the miniLED are placed in a reflow soldering machine, so that solder paste is positioned at a preset position of the bonding pad (for example, at the middle position of the bonding pad), and therefore the miniLED can be indirectly and tightly soldered with the FPC substrate.

In step S3, the solder paste drops onto the pad through the mesh of the steel mesh, but at the moment the steel mesh is separated from the FPC substrate, the solder paste on the steel mesh drops onto the FPC substrate instead of the pad area, that is, a part of the solder paste is on the surface of the PFC substrate instead of being completely in the pad while there is solder paste in the pad, and for this reason, in step S5, in the process of reflow soldering of the FPC substrate and the miniLED, a liquid (small water beads) formed by melting the solder paste on the outer edge of the pad may be connected to the solder paste in the pad, and once the traction force of the solder paste on the inner edge of the pad is too large, the solder paste in the pad may not be condensed in the center of the pad, and for this reason, when the manipulator places the miniLED on the center of the pad, the solder foot of the miniLED may have only a small amount of solder paste to solder.

The above prior art solutions have the following drawbacks: because the soldering paste can not accurate drop in the pad, and when being in the outer tin cream reflow soldering of pad, make the tin cream in the pad receive the outer tin cream's of pad traction force easily to can not be in the backward flow on the positive position of pad, to this, lead to only a small amount of tin cream to weld miniLED's leg, be unfavorable for miniLED and stabilize on the FPC base plate, miniLED receives external force when, takes place to drop easily.

Disclosure of Invention

In view of the defects in the prior art, one of the objectives of the present invention is to provide a mounting structure for miniLED, which has the effect of keeping the solder pad in the middle during solder reflow and indirectly improving the stability of the miniLED.

The above object of the present invention is achieved by the following technical solutions:

the utility model provides a be applied to miniLED's mounting structure and manufacturing method thereof, includes the FPC base plate, the FPC base plate contains and is the same pad of matrix arrangement size and has connected the circuit of pad, the laminating is provided with the otter board on the FPC base plate, set up on the otter board with just supply the tin cream of pad looks adaptation to fall into through-hole in the pad, the through-hole supplies miniLED card to go into.

Adopt above-mentioned technical scheme, when needs tin cream to fill on every group pad, through the through-hole that sets up, enable accurate the dropping in the pad of tin cream, and in the twinkling of an eye when the steel mesh breaks away from on the otter board loading end, also can avoid the tin cream to drop in non-pad area, to this, can guarantee the tin cream in the pad at the reflow soldering in-process, can not receive other external force and take place the skew, it is in the pad centre when having made things convenient for the tin cream reflow soldering in the pad, thereby make things convenient for miniLED's leg to stabilize the welding on the pad center, the contrast only condition that a part tin cream welded on the leg before, effectively improve miniLED's stability on the FPC base plate, it takes place because of the condition that external force breaks away from the pad easily to reduce miniLED.

The present invention in a preferred example may be further configured to: the screen plate bearing surface is symmetrically provided with side plates which are parallel to each other, and the miniLEDs are positioned in channels formed by the symmetrical side plates.

Adopt above-mentioned technical scheme, through the curb plate that sets up, can place the required membrane material of miniLED backlight unit, the membrane material is equipped with the multilayer and lays the miniLED that distributes at the display on the surface, and the membrane material through setting up can make the light picture that miniLED launched softer.

The present invention in a preferred example may be further configured to: the thickness of the screen plate is the same as that of the miniLED, and the light emitting surface of the miniLED protrudes out of the screen plate bearing surface.

Adopt above-mentioned technical scheme, on the market at present, with all miniLED welding back on the FPC base plate, because miniLED is very little, for preventing that miniLED from dropping easily, can have the whole FPC base plate side coating silica gel brush of miniLED, through coating on the miniLED surface one deck glue, just can be fine play the guard action to miniLED. Aiming at the problem that the miniLED is clamped in the through hole of the screen plate and only the light emitting surface of the miniLED is exposed out of the through hole, the falling-off condition of the miniLED caused by external touch can be effectively reduced, and compared with the existing mode of brushing silica gel, the method can effectively reduce the procedures of brushing silica gel and reduce the working procedures; in addition, the miniLED protrudes a little, namely, the miniLED light-emitting surface protrudes out of the screen plate, all light rays emitted by the miniLED can be utilized to the maximum extent, so that the light rays can be fully utilized, the cost loss is reduced, and the cost can be indirectly saved due to positive correlation between the brightness and the cost.

The present invention in a preferred example may be further configured to: the through holes are square holes with the same shape as the bonding pads, and the area of each square hole is larger than that of each group of bonding pads on the FPC substrate.

Adopt above-mentioned technical scheme, under the general condition, the pad, miniLED is squarely, therefore, the through-hole also is the design of square hole, on the one hand, be convenient for cooperate pad and miniLED, make miniLED can stabilize the card in the through-hole, on the other hand, it is many more than shearing the circular port easily far away in otter board shearing square hole, and under the same circumstances, the required otter board material of circular port is more, to this, the otter board that adopts the square hole can effectively save the resource, after all miniLED's numerous quantity, it is corresponding, the quantity in required shearing square hole also needs corresponding increase, namely the square hole is relative with the round hole, the square hole obviously can effectively save the resource of otter board, the material waste has been avoided.

The present invention in a preferred example may be further configured to: and a reflective layer is arranged on the surface of the screen plate.

Adopt above-mentioned technical scheme, the reflector layer that sets up can the reflection of light, increases luminance, and when miniLED used on cell-phone, computer and TV, through the reflector layer that sets up, enables light and becomes more even and soft to improve viewer's the experience degree of watching.

The present invention in a preferred example may be further configured to: the FPC substrate is adhered to the screen plate through an adhesive tape.

By adopting the technical scheme, the mode that the FPC substrate is fixed with the screen plate by using the adhesive tape is simple and effective, the screen plate can be tightly connected with the FPC substrate into a whole, and when the screen plate is a PC (personal computer) plate, the screen plate has the effects of heat insulation and light weight, so that the weight can be reduced, and the heating is convenient.

The second purpose of the invention is to provide a manufacturing method of a mounting structure applied to a miniLED, which has the effect of improving the effect of accurately welding the miniLED on the center of a pad solder paste.

The second purpose of the invention is realized by the following technical scheme:

s1: providing an FPC substrate, wherein the FPC substrate comprises more than one single group of welding pads;

s2, providing a screen plate;

s3, attaching the screen plate on the FPC substrate, and aligning each through hole on the screen plate with the corresponding single group of pads;

s4, assembling the screen and the FPC substrate into a whole;

and S5, filling solder paste into the through hole and enabling the solder paste to enter the bonding pad.

Through adopting above-mentioned technical scheme, FPC base plate self material is comparatively soft, through the otter board that sets up, can play the effect of support to the FPC base plate to can prevent that the FPC base plate from breaking. When miniLED uses on the backlight, what play the supporting role to the FPC base plate is the chase, the existence of chase, be difficult for miniLED heat dissipation, because miniLED is in large quantity, arrange and set up on the FPC base plate, when miniLED operating time is longer, just can produce a large amount of heats, because miniLED is direct to contact with the FPC base plate this moment, just can be with a large amount of heat transfer to the FPC base plate, to this, be unfavorable for the permanent use of FPC base plate. In this application, between FPC base plate and miniLED, be provided with the otter board, the existence of otter board can be regarded as heat sink material, can be before the heat transfer reaches the FPC base plate, on conducting most heat to the air, the mode on the FPC base plate is gushed in to the direct large tracts of land of contrast heat, can effectively accelerate the heat dissipation, improves the radiating effect.

Through the through-hole on the otter board, enable the tin cream and drop on the pad through the through-hole overwhelmingly, on the one hand, when having avoided the steel mesh to move away, a part of tin cream that drops is in the pad outside, indirectly causes the tin cream in the reflow soldering in-process pad not to be in the centre, and on the other hand, the existence of otter board can effectively prevent in the pad outside probably too much tin cream stretches to the pad to cause the reflow soldering in-process equally and can not make the tin cream in the pad be in the condition in the centre. Therefore through mutually supporting of otter board and through-hole, guaranteed that the solder paste reflow soldering process in the pad can be stably in the centre to make things convenient for miniLED's leg accurate and stable welding on the pad center, the contrast only partly condition of solder paste welding on the leg effectively improves miniLED's stability on the FPC base plate, also can reduce miniLED and break away from the condition emergence of pad because of external force easily.

The present invention in a preferred example may be further configured to: the size of the through holes is 0.03 x 0.03mm larger than that of each group of bonding pads.

Adopt above-mentioned technical scheme, the size of through-hole is 0.03mm more than the size of every group pad, to this, can guarantee that the tin cream is full of the pad, and simultaneously, welding area is big, also can make miniLED's leg welded more stable, and work as miniLED at the in-process of other part equipment of cooperation and removal, the thrust that can bear also can become bigger, and then can improve the firm degree of miniLED on the FPC base plate.

The present invention in a preferred example may be further configured to: the mesh plate is made of a PC board.

By adopting the technical scheme, the PC board is also called a polycarbonate board and a cappuccino board. The weak acid resistant is prepared by using polycarbonate as a main component and adopting a CO-EXTRUSION technology CO-EXTRUSION, and has the characteristics of high temperature resistance, high transparency, light weight, impact resistance, sound insulation, heat insulation, flame retardancy, ageing resistance and the like.

In summary, the invention includes the following beneficial technical effects that at least one of the mounting structures applied to the miniLED and the manufacturing method thereof:

the FPC base plate is soft, and the FPC base plate can be supported by the arranged screen plate and can be prevented from being broken. When miniLED uses on the backlight, play the chase that plays supporting role to the FPC base plate, the existence of chase, be difficult for miniLED heat dissipation, because miniLED is in large quantity, arrange and set up on the FPC base plate promptly, when miniLED operating time is longer, just can produce a large amount of heats, because miniLED is direct to contact with the FPC base plate this moment, just can be with a large amount of heat transfer to the FPC base plate, to this, be unfavorable for the permanent use of FPC base plate. In this application, between FPC base plate and miniLED, be provided with the otter board, the existence of otter board can be regarded as heat sink material, can be before the heat transfer reaches the FPC base plate, on conducting most heat to the air, the mode on the FPC base plate is gushed in to the direct large tracts of land of contrast heat, can effectively accelerate the heat dissipation, improves the radiating effect, and can play the supporting role to the FPC base plate.

Through the through-hole on the otter board, enable the tin cream and drop on the pad through the through-hole overwhelmingly, on the one hand, when having avoided the steel mesh to move away, a part of tin cream that drops is in the pad outside, indirectly causes the tin cream in the reflow soldering in-process pad not to be in the centre, and on the other hand, the existence of otter board also can effectively prevent in the pad that probably too much tin cream stretches to outside the pad to cause the reflow soldering in-process equally and can not make the tin cream in the pad be in the condition in the centre. Therefore, the screen plate is matched with the through hole, the solder paste reflow soldering process in the bonding pad can be stably in the middle, so that the welding leg of the miniLED is conveniently and accurately and stably welded on the center of the bonding pad, the stability of the miniLED on the FPC substrate is effectively improved compared with the condition that only a part of solder paste is welded on the welding leg, and the condition that the miniLED is easy to separate from the bonding pad due to external force can be reduced;

2. the induction system who sets up can detect miniLED and whether accurately place in the through-hole, in case miniLED does not accurately place when in the through-hole, solid brilliant machine output alarm signal to this, just can guarantee miniLED welding and put on pad central point, improves miniLED welding precision, reduces miniLED and leads to taking place the condition emergence that becomes flexible easily because of the welding is inaccurate.

Drawings

FIG. 1 is a side cross-sectional view of an FPC substrate and a screen plate according to the present invention;

FIG. 2 is a schematic diagram of the positions of the screen plate and the miniLED solder legs in the present invention;

FIG. 3 is a schematic view of the overall structure of the FPC substrate and the steel mesh in the present invention;

FIG. 4 is a schematic view showing the position of the steel mesh and solder paste according to the present invention;

fig. 5 is a schematic flow chart of a manufacturing method of the miniLED mounting structure according to the present invention.

Reference numerals: 1. an FPC substrate; 11. a pad; 12. an FPC circuit exposed end; 13. mounting a plate; 14. a strip-shaped opening; 2. a screen plate; 21. a through hole; 3. tin paste; 4. a miniLED; 5. a side plate; 6. a scraper; 7. and (5) a steel mesh.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1, a mounting structure for miniLED, a firm installation for miniLED4, when guaranteeing that miniLED4 receives external force, can not drop easily, it includes FPC base plate 1, otter board 2 and miniLED4, 2 sizes of otter board and PFC looks adaptations, and paste on FPC base plate 1 through the sticky tape, miniLED4 passes through solder paste 3 and welds on FPC base plate 1 through otter board 2, miniLED 4's thickness is whole the same with the thickness of otter board 2, when FPC base plate 1 circular telegram, miniLED4 sends brightly. In addition, the screen 2, the FPC substrate 1 and the miniLED4 can be called an integral light source of the backlight when they are assembled together with other backlight films, so as to form a finished miniLED4 backlight module.

As shown in fig. 2, the FPC substrate 1 includes pads 11 arranged in a matrix and having the same size and FPC line exposed ends 12 connected to the pads 11, the FPC line exposed ends 12 on the FPC substrate 1 are disposed on a side opposite to the screen 2, for this reason, heat dissipation is facilitated for components on the line, and the service life is prolonged, as shown in fig. 3, the pads 11 are provided with a plurality of groups, the plurality of groups of pads 11 are arranged in a matrix on the FPC substrate 1, each group of pads 11 includes an anode pad 11 and a cathode pad 11, and is adapted to anode and cathode pads of the miniLED4, in this embodiment, the anode pad 11 and the cathode pad 11 are disposed side by side and are square with the miniLED4, square through holes 21 are formed in the screen 2, the through holes 21 correspond to each group of pads 11 one to one, and the area of the square holes on the through holes 21 is larger than the area of each group of pads 11 on the FPC substrate. In other embodiments, the shape of the through hole 21 changes with the shape of the pad 11 and the miniLED4, and may be circular or other shapes.

As shown in fig. 3, in addition, the size of through-hole 21 just supplies miniLED4 to block into, but, when miniLED4 blocks into through-hole 21 in for miniLED4 light emitting surface protrusion in otter board 2 bearing surface, to this, when can make full use of miniLED4 light, can also play the effect of protection to miniLED4, prevent that miniLED4 from droing.

As shown in fig. 3, in order to further increase the brightness of the miniLED4, a reflective layer is disposed on the surface of the screen 2, in this embodiment, the reflective layer is made of a reflective material, and the color of the reflective layer is preferably white. In order to make the membrane material better match with the miniLED4, two parallel side plates 5 are symmetrically arranged on the bearing surface of the screen plate 2, the side plates 5 and the screen plate 2 are made of the same material and are made of a PC (polycarbonate) plate, and the PC plate has the characteristics of high temperature resistance, high transparency, light weight, impact resistance, sound insulation, heat insulation, flame resistance, ageing resistance and the like, and in other embodiments, the screen plate 2 and the side plates 5 can also be made of glass plates or other insulating and heat-dissipating materials. After tiling predetermined quantity's membrane material on miniLED4 according to actual need, utilize the viscose to make the both sides adhesion of membrane material on curb plate 5, to this, just enable the membrane material and stabilize between curb plate 5 to make things convenient for the membrane material to stabilize emission light.

As shown in fig. 4, a method for manufacturing a mounting structure for a miniLED includes the following steps:

as shown in fig. 3, the pads 11 are provided with a plurality of groups, the groups are arranged in a matrix, each group includes an anode pad 11 and a cathode pad 11, the anode pad 11, the cathode pad 11 correspond to the anode and the cathode of the miniLED4 leg, and the anode pad 11 and the cathode pad 11 are spaced apart from each other and are arranged side by side on the FPC board 1.

When the miniLED4 is soldered to the solder pad 11, the miniLED4 is turned on once the FPC wiring exposed end 12 on the FPC board 1 is connected. In addition, an installation plate 13 extends from one side of the FPC substrate 1, a strip-shaped opening 14 is formed in the installation plate 13, and the FPC substrate 1 can be indirectly driven to be installed in a matched mode with other equipment through the mutual matching of the screw and the strip-shaped opening 14.

S2, providing a screen plate;

as shown in fig. 3, the screen 2 having the same size as the plane of the FPC substrate 1 is designed, through holes 21 are formed in the screen 2 according to the area occupied by each group of pads 11 on the FPC substrate 1, the through holes 21 are distributed in the screen 2 in an array, and when the through holes 21 are aligned with each group of pads 11, a single through hole 21 corresponds to exactly one group of pads 11, in this embodiment, the size of the through hole 21 is 0.03 × 0.03mm larger than that of each group of pads 11, so that when solder paste 3 enters from the through hole 21, the solder paste 3 can be fully filled on the pads 11.

S3: attaching the screen plate to the FPC substrate, and aligning each through hole on the screen plate with the corresponding single group of pads;

each through hole is aligned with a single group of bonding pads, so that solder paste can fall on the bonding pads more accurately.

S4: assembling the screen plate and the FPC substrate into a whole;

the FPC substrate and the screen plate can be assembled into a finished product by using a tower buckle or a sticky tape or a viscose mode.

S5: and filling the through hole with solder paste, and enabling the solder paste to enter the bonding pad.

As shown in fig. 5, the assembled screen 2 and the FPC substrate 1 are placed on an operation table of a solder paste 3 printing machine, the steel mesh 7 is cleaned, the scraper 6 is installed, the steel mesh 7 is installed in the solder paste 3 printing machine, machine parameters are set according to the specification of the FPC substrate 1, so that meshes of the steel mesh 7 correspond to each bonding pad 11, the solder paste 3 is placed on the steel mesh 7, the solder paste 3 printing machine is started, the scraper 6 scrapes the solder paste 3 back and forth so that the solder paste 3 is filled on the bonding pads 11 through the through holes 21, when the scraper 6 works, the solder paste 3 on the steel mesh 7 enters the through holes 21 of the screen 2 attached to the FPC substrate 1 and then enters the bonding pads 11 in the through holes 21, and accordingly, most of the solder paste 3 can accurately fall on the bonding pads 11. In addition, the scraper 6 can scrape back and forth for many times, the number of times is limited to the amount of the solder paste 3, after the process is finished, the steel mesh 7 and the scraper 6 are taken down, the FPC substrate 1 and the screen plate 2 assembly are taken out for inspection, if unfilled through holes 21 are found, manual spot welding can be carried out, and the solder paste 3 on other welding pads 11 cannot be influenced.

Start solid brilliant machine for placing of manipulator on the solid brilliant machine one miniLED4 in each through-hole, in this process, can adopt induction system, induction system is used for detecting whether miniLED4 accurately places in the through-hole and output detected signal to solid brilliant machine, solid brilliant machine receives output alarm signal behind the detected signal, in case miniLED4 places when the position takes place the skew, solid brilliant machine output alarm signal, through this mode, just can ensure that the accurate placing of miniLED4 ability is in the through-hole. In this embodiment, the sensing device may be an image recognition module electrically connected to the die bonder.

S6: and reflow soldering, namely putting the FPC substrate and the miniLED4 into a reflow soldering machine, reflowing solder paste on the middle position of the bonding pad, and indirectly tightly soldering the leg of the miniLED4 on the bonding pad.

A luminous source comprises a miniLED and a mounting structure applied to the miniLED, wherein the miniLED is soldered on a bonding pad through a through hole, and at the moment, a cathode and an anode leg of the miniLED correspond to the bonding pad of the cathode and the anode.

The implementation principle of the above embodiment is as follows: when the miniLED4 needs to be welded on the bonding pads 11, the screen 2 is firstly installed on the FPC substrate 1, each through hole 21 on the screen 2 corresponds to each group of bonding pads 11 on the FPC substrate 1, the assembled screen 2 and the FPC substrate 1 are placed on an operation table of a solder paste 3 printing machine, the steel mesh 7 is cleaned, the scraper 6 is installed, the steel mesh 7 is installed in the solder paste 3 printing machine, machine parameters are set according to the specification of the FPC substrate 1, meshes of the steel mesh 7 correspond to each bonding pad 11, the solder paste 3 is placed on the steel mesh 7, the solder paste 3 printing machine is started, the scraper 6 is made to scrape the solder paste 3 back and forth, so that the solder paste 3 is filled on the bonding pads 11 through the through holes 21, a preset amount of the solder paste 3 is filled on the bonding pads 11 according to actual needs, and the solder paste 3 printing machine is stopped after the needs are.

Then the assembled product filled with the solder paste 3 is placed in a die bonder, the miniLED4 is sequentially placed into each through hole 21 of the screen plate 2 by a manipulator, the positive and negative electrode welding feet of the miniLED4 are placed on the corresponding positive and negative electrode welding pads 11, and finally the FPC substrate 1 and the miniLED4 are placed in a reflow soldering machine, so that the solder paste 3 reflows to the middle position of the welding pads 11, and the welding feet of the miniLED4 are indirectly and tightly soldered on the welding pads 11.

Mutually supporting through otter board 2 and through-hole 21, guaranteed that 3 reflow soldering processes of tin cream in the pad 11 can be stably in the centre to make things convenient for miniLED 4's the firm welding in pad 11 center, the contrast only has the condition of a part 3 welding of tin cream on the leg, effectively improves the stability of miniLED4 on FPC base plate 1, also can reduce miniLED4 and take place because of the condition that external force breaks away from pad 11 easily.

The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.

Claims

1. A mounting structure for miniLED, comprising: FPC base plate (1), FPC base plate (1) contains and is the same pad (11) of matrix arrangement size and has connected the circuit of pad (11), the laminating is provided with otter board (2) on FPC base plate (1), seted up on otter board (2) with just supply tin cream (3) of pad (11) looks adaptation to fall into through-hole (21) in pad (11), through-hole (21) supply miniLED (4) card to go into.

2. A mounting structure for a miniLED according to claim 1, wherein: the screen plate (2) bearing surface is symmetrically provided with side plates (5) which are parallel to each other, and the miniLED (4) is positioned in a channel formed by the symmetrical side plates (5).

3. The mounting structure for miniLED as claimed in claim 2, wherein the screen (2) has the same thickness as the miniLED (4), and the light emitting surface of the miniLED (4) protrudes from the screen (2) carrying surface.

4. A mounting structure for a miniLED according to claim 1, wherein the through-holes (21) are square holes having the same shape as the pads (11), and the square holes have an area larger than the area of each group of the pads (11) on the FPC substrate (1).

5. A mounting structure for a miniLED according to claim 2, characterized in that the surface of the screen (2) is provided with a reflective layer.

6. A mounting structure for a miniLED according to claim 1, wherein the FPC substrate (1) is attached to the screen (2) by an adhesive tape.

7. A manufacturing method of a mounting structure applied to a miniLED according to any one of claims 1 to 6, characterized by comprising the following steps:

s2, providing a screen plate;

s4, assembling the screen and the FPC substrate into a whole;

8. The method of manufacturing according to claim 7, wherein: the size of the through holes (21) is 0.03 x 0.03mm larger than that of each group of the bonding pads (11).

9. A method of manufacturing according to claim 7, wherein: the mesh plate (2) is made of a PC plate.

10. A luminous source, characterized in that it comprises a miniLED (4) and a mounting structure for a miniLED (4) according to claims 1 to 6 as described above, the miniLED (4) being soldered on a pad (11) of the mounting structure for a miniLED (4).