CN111740037B - Fingerprint identification laminating device - Google Patents

Fingerprint identification laminating device Download PDF

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Publication number
CN111740037B
CN111740037B CN202010700722.3A CN202010700722A CN111740037B CN 111740037 B CN111740037 B CN 111740037B CN 202010700722 A CN202010700722 A CN 202010700722A CN 111740037 B CN111740037 B CN 111740037B
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China
Prior art keywords
oled
laminating
bonding
oca
axis module
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CN202010700722.3A
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Chinese (zh)
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CN111740037A (en
Inventor
黄奕宏
韩宁宁
秦超
尹国伟
杨杰
庄庆波
刘驰
陈锦杰
蒋长洪
段元发
胡凯
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Shenzhen Sking Intelligent Equipment Co Ltd
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Shenzhen Sking Intelligent Equipment Co Ltd
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Priority to CN202010700722.3A priority Critical patent/CN111740037B/en
Publication of CN111740037A publication Critical patent/CN111740037A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention relates to the technical field of bonding processing, and discloses a fingerprint identification bonding device which comprises a bonding loading and unloading carrying arm, an OLED loading carrying arm, an OLED bonding upper vacuum cavity, an OLED bonding lower vacuum cavity and an OLED receiving platform, wherein the OLED loading carrying arm moves an OLED screen to the OLED receiving platform, the OLED receiving platform moves the OLED screen into the OLED bonding upper vacuum cavity, and the bonding loading and unloading carrying arm moves an IC chip to the OLED bonding lower vacuum cavity; through utilizing laminating unloading arm, OLED material loading arm, OLED laminating vacuum cavity and OLED accept the platform down, the laminating process of whole OLED and IC chip is very high-efficient.

Description

Fingerprint identification laminating device
Technical Field
The invention relates to the technical field of laminating processing, in particular to a fingerprint identification laminating device.
Background
Along with the increase of demands of touch screen electronic products such as mobile phones, the security of the touch screen electronic products is more and more important, while the fingerprint identification technology is a biological identification technology, and the fingerprint identification system is a set of pattern identification systems comprising fingerprint image acquisition, processing, feature extraction and comparison peer-to-peer modules; the fingerprint identification technology is gradually becoming the mainstream on touch screen electronic products in places needing personnel identity confirmation, such as access control systems, attendance checking systems, notebook computers, internal processing of banks, bank payment and the like.
At present, the automatic laminating machine for fingerprint identification mainly comprises an OLED (organic light emitting diode) feeding machine, a soft laminating machine, an IC (integrated circuit) film tearing machine, a vacuum cavity laminating machine and a finished product blanking machine.
In the prior art, an efficient fingerprint identification laminating device is lacked.
Disclosure of Invention
The invention aims to provide a fingerprint identification laminating device, and aims to provide an efficient fingerprint identification laminating device.
The invention discloses a fingerprint identification laminating device, which comprises a laminating upper and lower carrying arm, an OLED feeding carrying arm, an OLED laminating upper vacuum cavity, an OLED laminating lower vacuum cavity and an OLED carrying platform, wherein the OLED feeding carrying arm moves an OLED screen to the OLED carrying platform, the OLED carrying platform moves the OLED screen into the OLED laminating upper vacuum cavity, the laminating upper and lower carrying arm moves an IC chip to the OLED laminating lower vacuum cavity, an OLED and an IC alignment assembly are respectively aligned with the IC chip and the OLED screen, the OLED upper vacuum cavity and the OLED lower vacuum cavity are respectively moved to laminating positions, the OLED upper vacuum cavity and the OLED lower vacuum cavity are laminated, the OLED and the IC chip are laminated to form a finished product, the upper vacuum cavity moves the finished product to the laminating upper and lower carrying arm, and the laminating upper and lower carrying arm is subjected to blanking.
Further, the OLED material loading arm includes OLED subsides material loading Z axle module, OLED subsides material loading X axle module, OLED subsides material loading R axle module, OLED subsides material loading sucking disc, OLED subsides material loading portal frame, OLED subsides material loading X axle module with OLED subsides material loading portal frame is connected, OLED subsides material loading sucking disc with OLED subsides material loading R axle module is connected, OLED subsides material loading R axle module with OLED subsides material loading Z axle module is connected, OLED subsides material loading Z axle module, OLED subsides material loading X axle module order about OLED subsides material loading sucking disc to remove in X axis direction and Z axis direction, OLED subsides material loading R axle module order about OLED subsides material loading sucking disc is rotatory.
Further, the OLED and IC alignment assembly comprises an OLED upper alignment assembly, the OLED supporting platform comprises an OLED supporting vacuum chuck, an OLED supporting photoelectric sensor, an OLED supporting bottom plate and an OLED supporting Y-axis module, the OLED supporting vacuum chuck is connected with the OLED supporting bottom plate, the OLED upper alignment assembly is connected with the OLED supporting bottom plate, the OLED supporting photoelectric sensor is connected with the OLED supporting bottom plate, the OLED supporting Y-axis module controls the OLED supporting bottom plate to move back and forth in the Y-axis direction, the OLED supporting photoelectric sensor and the OLED upper alignment assembly control the position of the OLED supporting bottom plate, and the OLED supporting vacuum chuck adsorbs an OLED screen.
Further, the laminating feeding and discharging arm comprises an IC laminating feeding assembly, the OLED and the IC aligning assembly comprise an IC lower aligning assembly, the IC laminating feeding assembly comprises an IC laminating lifting cylinder, an IC laminating rotary cylinder, an IC laminating feeding suction nozzle and an IC laminating interval X-axis module, the IC laminating interval X-axis module is connected with the IC laminating lifting cylinder, the IC laminating rotary cylinder is connected with the IC laminating lifting cylinder, the IC laminating feeding suction nozzle is in pneumatic connection with the IC laminating rotary cylinder, the IC laminating lifting cylinder is in driving of the IC chip to rotate or lift, and the IC laminating interval X-axis module is in driving of the IC laminating lifting cylinder and the IC laminating rotary cylinder moves on the X-axis laminating discharging support.
Further, the laminating is gone up unloading and is moved the arm and include finished product laminating unloading subassembly, finished product laminating unloading subassembly includes finished product unloading support, finished product laminating interval X axle module and finished product unloading Z axle module, the finished product unloading support with finished product unloading Z axle module is connected, finished product unloading Z axle module with finished product laminating interval X axle module is connected, finished product laminating interval X axle module is in X axle laminating unloading support is gone up to remove.
Further, the OLED laminating vacuum cavity comprises an OLED laminating pressure cylinder, an OLED laminating lower jig and an OLED laminating XXY platform, the OLED laminating pressure cylinder is connected with the OLED laminating XXY platform, the upper surface of the OLED laminating XXY platform is sunken to form a lower vacuum cavity, the OLED laminating lower jig is positioned in the lower vacuum cavity, the lower vacuum cavity is in pneumatic connection with the OLED laminating pressure cylinder, and the IC chip is placed on the OLED laminating lower jig.
Further, the OLED laminating lower vacuum cavity comprises an OLED laminating transfer Y-axis module, the OLED laminating XXY platform is connected with the OLED laminating transfer Y-axis module, and the OLED laminating transfer Y-axis module drives the OLED laminating transfer Y-axis module to move in the Y-axis direction.
Further, the OLED laminating upper vacuum cavity comprises an OLED laminating upper platform and an OLED upper laminating jig, wherein the OLED upper laminating jig is connected with the OLED laminating upper platform and is arranged downwards.
Further, an upper vacuum cavity is formed on the lower surface of the OLED bonding upper platform, and the OLED bonding jig is located in the upper vacuum cavity.
Further, the vacuum cavity on the OLED laminating comprises an upper Z-axis module on the OLED laminating, the upper OLED laminating platform is connected with the upper Z-axis module on the OLED laminating, the upper Z-axis module on the OLED laminating is connected with a laminating portal frame, and the upper Z-axis module on the OLED laminating drives the upper OLED laminating platform to move up and down in the Z-axis direction.
Compared with the prior art, the fingerprint identification laminating device provided by the invention has the advantages that the laminating upper and lower material carrying arms, the OLED laminating upper vacuum cavity, the OLED laminating lower vacuum cavity and the OLED bearing platform are utilized, and the whole laminating process of the OLED and the IC chip is very efficient.
Drawings
FIG. 1 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
fig. 2 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
Fig. 3 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
Fig. 4 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
fig. 5 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
fig. 6 is a schematic perspective view of an automatic fingerprint identification laminating machine provided by the invention;
FIG. 7 is a schematic perspective view of an OLED lift structure provided by the present invention;
FIG. 8 is a schematic perspective view of an OCA cage assembly provided by the present invention;
FIG. 9 is a schematic perspective view of an OLED take-out assembly provided by the present invention;
FIG. 10 is a schematic perspective view of an OCA cartridge assembly provided by the present invention;
FIG. 11 is a schematic perspective view of an OCA light film tearing assembly provided by the invention;
FIG. 12 is a perspective view of a peel-off patch feed structure provided by the present invention;
FIG. 13 is a schematic perspective view of an OLED tear film assembly provided by the present invention;
fig. 14 is a schematic perspective view of an OLED flip loading manipulator provided by the present invention;
fig. 15 is a schematic perspective view of a CG conforming gantry arm assembly provided by the present invention;
Fig. 16 is a schematic perspective view of an IC loading arm provided by the present invention;
FIG. 17 is a schematic perspective view of a tear film arm on an IC provided by the present invention;
FIG. 18 is a schematic perspective view of an IC lower tear film arm provided by the present invention;
FIG. 19 is a schematic side view of a tear film arm on an OLED provided by the present invention;
FIG. 20 is a schematic perspective view of a bonded loading and unloading arm provided by the invention;
FIG. 21 is a schematic perspective view of an OLED attached to a vacuum chamber provided by the present invention;
FIG. 22 is a schematic perspective view of an OLED receiving platform provided by the present invention;
FIG. 23 is a schematic perspective view of a vacuum chamber under OLED bonding provided by the present invention;
Fig. 24 is a schematic perspective view of an NG slinger assembly provided by the present invention;
FIG. 25 is a perspective view of a finished transfer platform assembly provided by the present invention;
Fig. 26 is a schematic perspective view of a single layer TRAY mobile stage provided by the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The implementation of the present invention will be described in detail below with reference to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
Referring to fig. 1-26, a preferred embodiment of the present invention is provided.
The fingerprint identification laminating device that this embodiment provided for be used for laminating OLED screen and IC chip and unloading finished product.
The automatic laminating machine for fingerprint identification comprises an OLED feeding and film tearing structure, an OLED overturning and transferring structure, an easy-to-tear laminating and feeding structure 16, an OCA lamination feeding structure, an OCA film tearing structure, an OLED and OCA laminating structure, an OLED and OCA film tearing structure, an IC chip feeding device, a finished product unloading and recycling structure and a fingerprint identification laminating device, wherein the OLED feeding and film tearing structure, the OLED overturning and transferring structure are used for tearing films from an OLED screen and transferring, the OCA lamination feeding structure, the easy-to-tear laminating and feeding structure 16, the OCA film tearing structure are used for feeding OCA and tearing films of OCA, the OLED and OCA laminating structure, the OLED and OCA film tearing structure are used for laminating an OLED screen to be packaged, the IC chip feeding device is used for feeding an IC chip, the OLED screen to be packaged and the IC chip are moved to the fingerprint identification laminating device, and the IC chip are recycled by the finished product unloading and recycling structure after forming a finished product.
Utilize OLED material loading dyestripping structure, OLED upset and transfer structure, easily tear subsides feed structure 16, OCA lamination feed structure, OCA dyestripping structure, OLED and OCA laminating structure, OLED and OCA dyestripping structure, IC chip loading attachment, finished product unloading recovery structure, fingerprint identification laminating device can automated processing and laminating OLED and IC chip, greatly reduced process time and cost, very convenient.
The OLED feeding and film tearing structure comprises an OLED real TRAY feeding conveyor belt 19, a single-layer TRAY moving carrier 22, an OLED empty TRAY discharging conveyor belt 18, an OLED lifting structure 11, an OLED material taking assembly 12, an OLED film tearing platform assembly 14 and an OLED film tearing assembly 15, wherein the OLED real TRAY feeding conveyor belt 19 conveys a TRAY disc loaded with an OLED screen, the single-layer TRAY moving carrier 22 moves the single-layer TRAY disc and lifts to a material taking position of the OLED material taking assembly 12 through the OLED lifting structure 11, and after the OLED material taking assembly 12 takes materials from the single-layer TRAY disc, the single-layer TRAY disc moves to the OLED empty TRAY discharging conveyor belt 18 through a transfer carrier 17 for discharging; the OLED material taking assembly 12 takes the OLED screen to the OLED film tearing platform assembly 14, the OLED screen is placed on the OLED film tearing platform assembly 14, and the OLED film tearing assembly 15 tears the OLED screen.
OCA lamination feeding structure material loading OCA to and OLED upset material loading manipulator material loading OLED screen, OCA lamination feeding structure remove OLED and OCA laminating structure, and OCA tears the membrane that the membrane structure was torn with easily tearing to paste feeding structure 16 combination and tear OCA's membrane, and OLED is removed to OLED and OCA laminating structure, OLED and OCA laminating OCA and OLED screen.
OLED and OCA dyestripping structure includes OLED transfer platform 32, on the OLED tear film arm 33, under the OLED tear film arm 34 and OLED transfer platform 35, and OLED transfer platform 32 shifts the OLED screen to on the OLED tear film arm 33, after tearing the upper surface film of OLED screen, OLED transfer platform 32 removes the OLED screen to under the OLED tear film arm 34 tear the membrane of OCA, and OLED screen removes to in the OLED transfer platform 35 and transfer.
The IC chip feeding device comprises an IC chip feeding structure and an IC chip dyestripping transfer structure, wherein the IC chip feeding structure comprises an IC feeding arm 38 and an IC overturning assembly 39, the IC feeding arm 38 is used for feeding an IC chip, the IC overturning assembly 39 is used for overturning the IC chip, and the IC chip dyestripping transfer structure is used for tearing and cleaning the IC chip.
The finished product unloading recovery structure includes the empty TRAY unloading conveyer belt of IC, the real TRAY material loading conveyer belt of IC, NG throws material subassembly 51, IC and gets subassembly and IC and move and carry the platform subassembly, the empty TRAY unloading conveyer belt of IC, the real TRAY material loading conveyer belt of IC and IC get subassembly and connect gradually, the real TRAY dish that has the finished product is transported to the real TRAY material loading conveyer belt of IC, the IC gets the subassembly and takes off the finished product from the TRAY dish, unqualified in the finished product is thrown through NG throws material subassembly 51 after being scanned by the IC and gets the subassembly and throw material subassembly, the empty TRAY dish is removed to the empty TRAY of IC unloading conveyer belt, the IC is got the subassembly and is moved the finished product and move to IC and move and carry the platform subassembly.
The fingerprint identification laminating device comprises a laminating upper and lower carrying arm 49, an OLED loading carrying arm 46, an OLED laminating upper vacuum cavity 50, an OLED laminating lower vacuum cavity 45 and an OLED receiving platform 47, wherein the OLED loading carrying arm 46 moves an OLED screen to the OLED receiving platform 47, the OLED receiving platform 47 moves the OLED screen into the OLED laminating upper vacuum cavity 50, the laminating upper and lower carrying arm 49 moves an IC chip to the OLED laminating lower vacuum cavity 45, the OLED and the IC counterpoint assembly counterpoint IC chip and the OLED screen, the OLED upper vacuum cavity and the OLED lower vacuum cavity are laminated, and the OLED is laminated with the IC chip.
The easy-to-tear paste feeding structure 16 comprises an easy-to-tear paste feeding component 71, a waste film collecting component 73, a guide component 74 and an easy-to-tear paste air cylinder component 72, wherein the easy-to-tear paste feeding component 71 is fed, the easy-to-tear paste air cylinder component 72 drives the easy-to-tear paste to flow to the waste film collecting component 73 through the guide component 74, and the easy-to-tear paste is driven by the easy-to-tear paste air cylinder component 72 to provide OCA (optical code image) film tearing structure easy-to-tear paste.
OLED and OCA laminating structure includes CG laminating longmen arm assembly 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, and CG laminating longmen arm assembly 29 is connected with OCA box with a net subassembly 30, and OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm assembly 29 order about OCA box with a net subassembly 30 laminating OCA and OLED screen.
OCA lamination feeding structure includes OCA magazine subassembly 27, OCA material loading correction transfer subassembly, OCA butt joint material loading manipulator 26, and OCA magazine subassembly 27 supplies, and OCA material loading correction transfer subassembly material loading just corrects OCA, and OCA butt joint material loading manipulator 26 removes OCA to OCA dyestripping structure and tears the membrane after removing to OCA box with a net subassembly 30 and laminate.
Through utilizing OCA magazine subassembly 27, OCA material loading correction transfer subassembly, OCA butt joint material loading manipulator 26, OCA magazine subassembly 27 supplies, and OCA material loading correction transfer subassembly material loading just corrects OCA, and OCA butt joint material loading manipulator 26 removes OCA to OCA dyestripping structure and tears the membrane after removing to OCA box with a net subassembly 30 and laminate, and whole process is very efficient.
OCA lamination feeding structure includes OCA magazine subassembly 27, OCA material loading correction transfer subassembly, OCA butt joint material loading manipulator 26, and OCA magazine subassembly 27 supplies, and OCA material loading correction transfer subassembly material loading just corrects OCA, and OCA butt joint material loading manipulator 26 removes OCA to OCA dyestripping structure and tears the membrane after removing to OCA box with a net subassembly 30 and laminate.
The OCA magazine assembly 27 comprises an OCA discharging bottom plate 62, a first receiving bottom plate 63, a second receiving bottom plate 64, a rotary cylinder connected with the second receiving bottom plate 64 and a plurality of support columns, wherein the support columns support and are connected with the first receiving bottom plate 63 and the second receiving bottom plate 64, the OCA discharging bottom plate 62 is connected with the first receiving bottom plate 63, the rotary cylinder drives the first receiving bottom plate 63 and the second receiving bottom plate 64 to rotate, the OCA discharging bottom plate 62 is driven, and the OCA feeding correction transfer assembly corrects the OCA butt joint feeding manipulator 26 to take materials; a stepper motor 65 is also arranged between the first receiving bottom plate 63 and the second receiving bottom plate 64, and the stepper motor 65 pushes the OCA discharging bottom plate 62 to move upwards.
OCA material loading correction transfer subassembly includes OCA material loading module, OCA correction transfer module, and OCA material loading module absorbs OCA and removes to OCA correction transfer module, and OCA correction transfer module corrects and transfer OCA position.
The OCA feeding module comprises an OCA feeding suction nozzle, an OCA shaking cylinder, an OCA feeding guide rail and an OCA feeding portal frame, wherein the OCA feeding guide rail is arranged on the OCA feeding portal frame, the OCA shaking cylinder is movably connected with the OCA feeding guide rail through a mounting plate, the OCA shaking cylinder is connected with the OCA feeding suction nozzle, and the OCA feeding suction nozzle absorbs OCA; the OCA material loading module still includes the ion fan, and the ion fan removes static on the OCA, and the ion fan is connected with OCA material loading portal frame.
The OCA correction transfer module comprises an OCA transfer suction nozzle, an OCA transfer guide rail, an OCA transfer cylinder and an OCA vacuum plate, wherein the OCA transfer cylinder is connected with the OCA transfer suction nozzle, and the OCA transfer cylinder is in sliding connection with the OCA transfer guide rail; the OCA transfer cylinder is connected with the OCA transfer suction nozzle through a handle, and the OCA transfer suction nozzle sucks OCA onto the OCA vacuum plate.
The OCA correction transfer module still includes OCA correction guide rail, OCA correction board, OCA connecting piece and OCA correction X to the module, and OCA transfer suction nozzle absorbs OCA to OCA vacuum plate on after, OCA correction board assists the direction of correcting OCA, and OCA correction X is to the module drive OCA correction board and OCA vacuum plate fine setting removal, and OCA correction X is to the module with OCA connecting piece connection, OCA connecting piece and OCA correction guide rail sliding connection.
The OCA correction transfer module further comprises an OCA correction cylinder, and the OCA correction cylinder is pneumatically connected with the OCA correction X-direction module; the OCA correction guide rail is provided with a buffer which prevents the OCA connecting piece from moving out of the OCA correction guide rail.
The OLED feeding and film tearing structure comprises an OLED real TRAY feeding conveyor belt 19, a single-layer TRAY moving carrier 22, an OLED empty TRAY discharging conveyor belt 18, an OLED lifting structure 11, an OLED material taking assembly 12, an OLED film tearing platform assembly 14 and an OLED film tearing assembly 15, wherein the OLED real TRAY feeding conveyor belt 19 conveys a TRAY disc loaded with an OLED screen, the single-layer TRAY moving carrier 22 moves the single-layer TRAY disc and lifts to a material taking position of the OLED material taking assembly 12 through the OLED lifting structure 11, and after the OLED material taking assembly 12 takes materials from the single-layer TRAY disc, the single-layer TRAY disc moves to the OLED empty TRAY discharging conveyor belt 18 through a transfer carrier 17 for discharging; the OLED material taking assembly 12 takes the OLED screen to the OLED film tearing platform assembly 14, the OLED screen is placed on the OLED film tearing platform assembly 14, and the OLED film tearing assembly 15 tears the OLED screen.
The OLED screen is fed and films on the OLED screen are torn off through the OLED real TRAY feeding conveyor belt 19, the single-layer TRAY movable carrier 22, the OLED empty TRAY blanking conveyor belt 18, the OLED lifting structure 11, the OLED taking component 12, the OLED film tearing platform component 14 and the OLED film tearing component 15, and the OLED screen is quite efficient.
The OLED real TRAY feeding conveyor belt 19 comprises an OLED conveyor, an OLED feeding guide rail, an OLED feeding belt, an OLED feeding support plate, an OLED feeding sensor and an OLED in-place sensor, wherein the OLED feeding belt is in sliding connection with the OLED feeding guide rail; an OLED feeding sensor and an OLED in-place sensor are arranged on the OLED feeding guide rail, the OLED feeding sensor senses the feeding of an OLED real TRAY disc, and when the OLED real TRAY disc passes through the OLED in-place sensor, the OLED in-place sensor sends out a signal; the OLED material loading backup pad supports OLED material loading guide rail.
The single-layer TRAY moving carrier 22 comprises a single-layer guide rail, a single-layer motor 120, a single-layer transmission shaft and a single-layer moving component 119, wherein the single-layer moving component 119 is connected with the single-layer guide rail, and the single-layer transmission shaft drives the single-layer guide rails on the left side and the right side to move synchronously; the monolayer transfer assembly 119 comprises a monolayer sensor, a monolayer cylinder 121 and a TRAY workpiece, wherein the monolayer cylinder 121 drives the TRAY workpiece to move along the center of a monolayer guide rail on the left side and the right side, and the monolayer sensor senses that a TRAY disk is separated from or contacted with the TRAY workpiece.
The OLED lifting structure 11 comprises an OLED guide bar, an OLED lifting guide rail 55, an OLED support mounting plate, an OLED lifting base plate 54, an OLED lifting sensor and a TRAY support plate 53, wherein the OLED support mounting plate and the OLED guide bar are connected with the OLED lifting base plate 54, the TRAY support plate 53 is slidably connected with the OLED lifting guide rail 55, the TRAY support plate 53 is lifted or lowered on the OLED lifting guide rail 55 with a TRAY, and when the TRAY support plate 53 is sensed by the OLED lifting sensor, the OLED lifting guide rail 55 is not moved any more.
The OLED taking assembly 12 comprises an OLED taking structure 59, an OLED taking portal frame, an OLED taking Y-direction module 61 and an OLED taking Z-direction module 60, wherein the OLED taking structure 59 is connected with the OLED taking portal frame, the OLED taking Y-direction module 61 is connected with the OLED taking structure 59, the OLED taking Z-direction module 60 is connected with the OLED taking structure 59, and the OLED taking Y-direction module 61 drives the OLED taking structure 59 to move in the Y direction; the OLED reclaiming structure 59 includes an OLED reclaiming nozzle, and the OLED reclaiming Z-direction module 60 drives the OLED reclaiming nozzle to move up and down in the Z-direction, and the OLED reclaiming structure 59, the OLED reclaiming Y-direction module 61, and the OLED reclaiming Z-direction module 60 move back and forth on the OLED reclaiming gantry.
The OLED dyestripping platform assembly 14 comprises an OLED vacuum jig plate, an OLED platform guide rail and an OLED platform cylinder, wherein the OLED platform cylinder is pneumatically connected with the OLED vacuum jig plate, and the OLED vacuum jig plate is connected with the OLED platform guide rail through an OLED platform connector.
The OLED dyestripping assembly 15 comprises an OLED dyestripping portal frame structure and OLED dyestripping clamping jaws, wherein the OLED dyestripping clamping jaws are connected with the OLED dyestripping portal frame structure, and the OLED dyestripping clamping jaws clamp films on an OLED screen after clamping easy-to-tear patches from the easy-to-tear patch feeding structure 16.
OLED dyestripping portal frame structure includes OLED dyestripping Z to module 76, OLED dyestripping X to module, OLED dyestripping guide rail, OLED dyestripping connecting piece, and OLED dyestripping X is to the module with OLED dyestripping guide rail connection, OLED dyestripping Z to module 76 with OLED dyestripping connecting piece connection, OLED dyestripping connecting piece and OLED dyestripping guide rail connection, OLED dyestripping clamping jaw and OLED dyestripping connecting piece connection.
The OLED tear film assembly 15 further includes an OLED tear film jaw cylinder 75 and an OLED tear film servo motor that controls the OLED tear film jaw cylinder 75 to drive the OLED tear film jaws to open and close.
OLED material loading dyestripping structure still includes direction welding frame 20, and direction welding frame 20 is including direction panel beating, section bar support and connecting plate, direction panel beating and section bar support and connecting plate fixed connection, and the transportation of the empty TRAY dish of OLED or the real TRAY dish of OLED is led to the direction panel beating.
The OLED overturning and transferring structure comprises an OLED overturning mechanical arm 31 and an OLED loading and transferring assembly 28, wherein the OLED overturning mechanical arm 31 is connected with the OLED loading and transferring assembly 28, and after the OLED screen is overturned by the OLED overturning mechanical arm 31, the OLED loading and transferring assembly 28 transfers the OLED screen.
Through utilizing OLED upset manipulator 31 and OLED material loading to move and carry the subassembly 28, OLED upset manipulator 31 is connected with OLED material loading and is moved and carry the subassembly 28, and OLED upset manipulator 31 is with OLED screen upset back, and OLED material loading moves and carries the subassembly 28 and moves the OLED screen, and whole process is very high-efficient.
The OLED flipping robot 31 includes an OLED flipping floor 84, an OLED flipping mounting plate 83, an OLED flipping nozzle, an OLED flipping prong 81, and an OLED flipping micro-joint 82, the OLED flipping mounting plate 83 is fixedly connected with the OLED flipping floor 84, the OLED flipping prong 81 is connected with the OLED flipping mounting plate 83, the OLED flipping nozzle and the OLED flipping micro-joint 82 are connected with the OLED flipping prong 81, and the OLED flipping prong 81 is flipped by the flipping stepper motor 65.
The plurality of OLED flip-up suction nozzles are arranged on the OLED flip-up fork 81 at intervals, and the plurality of OLED flip-up micro-connectors 82 are arranged on the OLED flip-up fork 81 at intervals; the bottom plate is provided with a turnover cylinder which is in pneumatic connection with the OLED turnover suction nozzle.
The turnover mounting plate is provided with a turnover bearing seat 79, and the turnover bearing seat 79 is connected with a turnover stepping motor 65 and an OLED turnover fork 81; the code scanner 80 is arranged on the turnover mounting plate, and the code scanner 80 is connected with the turnover mounting plate through the turnover mounting frame and is arranged at the upper end of the mounting plate.
The turnover sensor 85 is arranged on the turnover mounting plate, the turnover sensor 85 and the turnover bearing seat 79 are arranged at intervals, and the turnover sensor 85 senses the turnover of the OLED screen.
The OLED loading transfer assembly 28 includes an OLED loading transfer linear motor, an OLED loading transfer support, an OLED loading transfer bus plate, and an OLED loading transfer nozzle bar, where the OLED loading transfer nozzle bar is connected to the OLED loading transfer support, the OLED loading transfer bus plate is connected to the OLED loading transfer support, the OLED loading transfer support is connected to the OLED loading transfer base plate, and the OLED loading transfer base plate is connected to the OLED loading transfer linear motor.
The OLED loading transfer assembly 28 includes an OLED loading transfer cylinder that is pneumatically connected to the OLED loading transfer nozzle bar and that is connected to the OLED loading transfer bracket.
The OLED feed transfer assembly 28 includes OLED feed transfer rails, and an OLED feed transfer floor slidably coupled to the OLED feed transfer rails.
The easy tearing paste feeding structure comprises an easy tearing paste feeding assembly 71, a waste film collecting assembly 73, a guide assembly 74 and an easy tearing paste air cylinder assembly 72, wherein the easy tearing paste feeding assembly 71 is used for feeding, the easy tearing paste air cylinder assembly 72 drives the easy tearing paste to flow to the waste film collecting assembly 73 through the guide assembly 74, and the easy tearing paste is driven by the easy tearing paste air cylinder assembly 72 to provide OCA (organic light emitting diode) film tearing structure easy tearing paste.
Through utilizing easy tearing subsides material loading subassembly 71, receiving useless membrane module 73, direction subassembly 74 and easy tearing subsides cylinder subassembly 72, easy tearing subsides material loading subassembly 71 material loading, through direction subassembly 74, easy tearing subsides cylinder subassembly 72 order about easy tearing subsides flow direction and receive useless membrane module 73, and easy tearing subsides receive easy tearing subsides cylinder subassembly 72 order about to provide OCA dyestripping structure and easily tear subsides, whole process is very high-efficient.
The easy-tearing paste feeding structure comprises an easy-tearing paste mounting plate, the guide assembly 74 comprises a plurality of easy-tearing paste fixing columns, the easy-tearing paste feeding assembly 71 comprises an easy-tearing paste wheel disc, the easy-tearing paste wheel disc is rotatably connected with the easy-tearing paste mounting plate, and the easy-tearing paste fixing columns are fixedly connected with the easy-tearing paste mounting plate; the plurality of fixing columns are arranged on the upper surface of the mounting plate at intervals.
The lower surface of the easy-to-tear mounting plate is provided with easy-to-tear support columns which are arranged at four corners of the lower surface of the easy-to-tear mounting plate; one side of the easy-to-tear mounting plate is provided with a tensioning assembly, and the tensioning assembly is used for tensioning the easy-to-tear mounting plate.
The waste film collecting assembly 73 is arranged on the upper surface of the mounting plate, the waste film collecting assembly 73 comprises a waste film wheel disc, and the waste film wheel disc is easily torn and transferred to the waste film wheel disc after being used; the upper surface of mounting panel fixed connection cylinder subassembly.
The two cylinder assemblies are arranged among the plurality of easily-torn fixing columns at intervals; a magnetic powder controller is arranged on the lower surface of the mounting plate and used for controlling the easy-tearing wheel disc to rotate; the easy-to-tear wheel disc is connected with the magnetic powder controller rod piece.
OCA tears the membrane structure and tears light membrane subassembly 24 including OCA, OCA tears light membrane subassembly 24 including tearing light membrane X to module 70, tear light membrane Y to module 67, tear light membrane Z to module 69, tear light membrane connecting piece, OCA module mounting panel, tear light membrane servo motor 66, OCA tears light membrane cylinder 68 and OCA and tears light membrane clamping jaw, OCA tears light membrane clamping jaw and OCA and tears light membrane cylinder 68 and be connected, servo motor orders about OCA to tear light membrane cylinder 68 control OCA and tears light membrane clamping jaw and presss from both sides and put, tear light membrane connecting piece and tear light membrane servo motor 66 and be connected with tear light membrane Y to module 67, tear light membrane Y to module 67 and tear light membrane Z to module 69 and be connected, tear light membrane Z to module 69 and OCA module mounting panel, OCA module mounting panel is connected with tearing light membrane X to module 70, tear light membrane Y to module 67, tear light membrane Z to module 69 control OCA and tear light membrane clamping jaw and remove in X, Y, Z directions.
Through utilizing the OCA to tear light membrane subassembly 24, the OCA tears light membrane subassembly 24 including tearing light membrane X to module 70, tearing light membrane Y to module 67, tearing light membrane Z to module 69, tearing light membrane connecting piece, OCA module mounting panel, tear light membrane servo motor 66, OCA and tear light membrane cylinder 68 and OCA and tear light membrane clamping jaw and tear the membrane to the OCA, and whole process is very high-efficient.
The OCA film tearing structure comprises a small ear feeding assembly 25, the small ear feeding assembly 25 comprises an easy-tearing paste feeding structure 16 and a waste structure, and the easy-tearing paste feeding structure 16 is connected with the waste structure; the easy-to-tear paste feed structure 16 comprises an easy-to-tear paste mounting plate, and the waste structure comprises a waste box which is fixedly connected with the easy-to-tear paste mounting plate.
The small ear feed assembly 25 includes at least two waste cartridges arranged in parallel, with the OCA tearing the light film jaws throwing waste film on the OCA into the waste cartridges.
The waste box upper end is equipped with the waste box opening, and the waste box is equipped with the waste cavity, waste box opening intercommunication waste cavity.
The OCA light film tearing clamping jaws and the OCA light film tearing cylinder 68 are arranged on two sides of the light film tearing Y-direction module 67 in pairs; the light film tearing connecting piece comprises a light film tearing mounting frame, and OCA light film tearing clamping jaws and OCA light film tearing cylinders 68 are connected to two sides of the light film tearing mounting frame; the upper side part of the light film tearing mounting frame is fixedly connected with the light film tearing Y-direction module 67.
The light film tearing Y-direction module 67 comprises a light film tearing Y-direction extending frame and a light film tearing Y-direction servo motor arranged at the rear end of the light film tearing Y-direction extending frame, and the light film tearing Y-direction servo motor drives the light film tearing Y-direction extending frame to move back and forth in the Y-axis direction; be equipped with on the OCA module mounting panel and tear light membrane Z to calandria, tear and be equipped with the well through-hole of intercommunication electric wire in the light membrane Z to calandria.
The light-tearing film X-direction tube bank is arranged on the light-tearing film X-direction module 70, and a middle through hole for communicating wires is arranged in the light-tearing film X-direction tube bank.
OLED and OCA laminating structure includes CG laminating longmen arm assembly 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, and CG laminating longmen arm assembly 29 is connected with OCA box with a net subassembly 30, and OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm assembly 29 order about OCA box with a net subassembly 30 laminating OCA and OLED screen.
Through utilizing CG laminating longmen arm module 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, CG laminating longmen arm module 29 is connected with OCA box with a net subassembly 30, and OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm module 29 order about OCA box with a net subassembly 30 laminating OCA and OLED screen, and whole process is very high-efficient.
CG laminating longmen arm assembly 29 includes attached subassembly 86 on OLED laminating longmen frame and the OLED, attached subassembly 86 swing joint on OLED laminating longmen frame and the OLED, is equipped with the OLED laminating guide rail on the OLED laminating longmen frame, attached subassembly 86 and OLED laminating guide rail sliding connection on the OLED.
CG laminating gantry arm assembly 29 includes an OLED laminating X-direction module that drives OLED upper attachment assembly 86 back and forth on an OLED laminating rail.
An OLED-attachment sensor is provided on the OLED-attachment rail, which senses movement of the attachment assembly 86 on the OLED.
The OCA cage assembly 30 includes a pair of OCA laminating rails 58, a lower OCA laminating cage cavity 56, and OCA laminating rollers 57 disposed on the lower OCA laminating cage cavity 56, the OCA laminating rollers 57 driving the OCA to be fixedly disposed on the lower OCA laminating cage cavity 56, the lower OCA laminating cage cavity 56 being slidably connected with the pair of OCA laminating rails 58.
OCA laminating box with a net is formed with OCA lower chamber of depositing OCA on the cavity 56 under the OCA laminating gyro wheel 57 and OCA cavity wall fixed connection under the cavity.
Two OCA lower cavities are symmetrically formed in the OCA laminating box with a net lower cavity 56.
OCA counterpoint subassembly 23 is including OCA counterpoint base, OCA counterpoint installing support, OCA camera mounting panel and counterpoint CCD subassembly, and counterpoint CCD subassembly is connected with the OCA camera mounting panel, and the OCA camera mounting panel is connected with OCA counterpoint installing support, and OCA counterpoint installing support is connected with OCA counterpoint base.
The alignment CCD components and the OCA camera mounting plates are arranged on two sides of the central axis of the OCA alignment mounting bracket in pairs.
And the OCA contraposition ion fan is also connected to the OCA contraposition mounting bracket.
OLED and OCA dyestripping structure includes OLED transfer platform 32, on the OLED tear film arm 33, under the OLED tear film arm 34 and OLED transfer platform 35, and OLED transfer platform 32 shifts the OLED screen to on the OLED tear film arm 33, after tearing the upper surface film of OLED screen, OLED transfer platform 32 removes the OLED screen to under the OLED tear film arm 34 tear the membrane of OCA, and OLED screen removes to in the OLED transfer platform 35 and transfer.
Through utilizing OLED transfer platform 32, on the OLED tear film arm 33, under the OLED tear film arm 34 and OLED transfer platform 35, OLED transfer platform 32 shifts the OLED screen to on the OLED tear film arm 33, after tearing the upper surface membrane of OLED screen, OLED transfer platform 32 removes the OLED screen to under the OLED tear film arm 34 tear OCA's membrane, and OLED screen removes to in the OLED transfer platform 35 and transit, whole OLED and OCA tear film process is very high-efficient.
The OLED transfer platform 32 includes a transfer platform a and a transfer platform B, where the transfer platform a includes a transfer suction cup a, a transfer vacuum solenoid valve, and an IO adapter plate, and the transfer platform B includes a transfer placement plate, a transfer suction cup B, a transfer positioning block, a transfer correction block, and a vacuum pressure regulating valve; the transfer vacuum electromagnetic valve drives the transfer sucker A to adsorb the OLED screen, the IO adapter plate is electrically connected with the transfer vacuum electromagnetic valve, and the transfer vacuum electromagnetic valve is pneumatically connected with the transfer sucker A; the transfer sucker B, the transfer positioning block and the transfer correction block are arranged on the transfer placing plate, the OLED screen is positioned on the transfer placing plate through the transfer positioning block and the transfer correction block, and the vacuum pressure regulating valve is electrically connected with the transfer sucker.
The OLED transfer platform 32 includes an OLED transfer X-axis rail on which the transfer platform a and the transfer platform B are slidably connected.
The OLED upper tear film arm 33 comprises an OLED upper tear film portal frame, an OLED upper tear film cylinder 98, an OLED upper tear film top cylinder 9793, an OLED upper tear film clamping jaw, an upper tear film Y-axis module, an upper tear film transferring Z-axis module 99 and an upper tear film rotating Q-axis module 90, wherein the OLED upper tear film clamping jaw is fixedly connected with the OLED upper tear film cylinder 98, the OLED upper tear film top cylinder 9793, the upper tear film rotating Q-axis module 90 is movably connected with the OLED upper tear film clamping jaw through an upper tear film connecting piece, the upper tear film transferring Z-axis module 99 is connected with the upper tear film Y-axis module through an upper tear film connecting frame and the upper tear film rotating Q-axis module 90, the upper tear film Y-axis module and the upper tear film Y-axis module are connected with the OLED upper tear film portal frame, and the upper tear film Z-axis module 92 drive the OLED upper tear film cylinder 98, the OLED upper tear film top cylinder 9793 and the OLED upper tear film transferring clamping jaw to move in the Y-axis direction and the Z-axis direction respectively.
The IC chip feeding structure comprises an IC feeding arm 38, an IC overturning assembly 39 and an IC feeding bin 37, the IC feeding bin 37 carries an IC chip tray, the IC feeding arm 38 comprises an IC taking manipulator, the IC taking manipulator takes materials from the IC chip tray and moves to the IC overturning assembly 39, the IC overturning assembly 39 overturns IC chips, and the IC feeding bin 37, the IC feeding arm 38 and the IC overturning assembly 39 are sequentially connected.
Through utilizing IC material loading arm 38, IC upset subassembly 39 and IC material loading storehouse 37, IC material loading storehouse 37 carries the IC chip charging tray, and IC material loading arm 38 includes the IC and gets the manipulator, and the IC is got the manipulator and is got the material from the IC chip charging tray, and moves to IC upset subassembly 39, IC upset subassembly 39 upset IC chip, and whole IC material loading upset process is very efficient.
The IC loading bin 37 comprises an IC loading frame, an IC tray bearing plate and an IC loading lifting module, wherein the IC loading lifting module is fixedly connected with the IC loading frame, and the IC tray bearing plate is connected with the IC loading lifting module and is in sliding connection with the IC loading frame.
The IC feeding frame comprises a first feeding frame body, a second feeding frame body and a third feeding frame body, wherein the first feeding frame body, the third feeding frame body and the second feeding frame body are fixedly connected and arranged, a moving area is enclosed between the first feeding frame body, the second feeding frame body and the third feeding frame body, and the IC material tray bearing plate is arranged in the moving area.
The upper end of the second feeding frame body is provided with a feeding position detecting piece, and the feeding position detecting piece is used for detecting whether the movement of the IC tray bearing plate is in place or not.
The IC feeding arm 38 comprises an IC feeding tray X-axis module 87, an IC feeding R-axis module 89, an IC feeding Z-axis module, an IC feeding Y-axis module, an IC feeding X-axis module 88 and an IC feeding mounting chassis; the IC feeding tray X-axis module 87 and the IC feeding X-axis module 88 are connected with the IC feeding mounting chassis, the IC feeding Z-axis module is connected with the IC feeding X-axis module 88, the IC feeding Y-axis module is connected with the IC feeding Z-axis module, and the IC feeding Y-axis module is connected with the IC feeding R-axis module 89.
The IC chip dyestripping transfer structure comprises an IC upper dyestripping arm 40, an IC lower dyestripping arm, an IC transfer platform 41, an IC transfer arm 42, a PLASMA cleaning mechanism 43 and an IC initial alignment mechanism 44, wherein the IC upper dyestripping arm 40 and the IC lower dyestripping arm tear the IC chip, the IC transfer platform 41 stores the IC chip after dyestripping, the transfer arm moves the IC chip to the PLASMA cleaning mechanism 43 and the IC initial alignment mechanism 44, the PLASMA cleaning mechanism 43 cleans the IC chip, and the IC initial alignment mechanism 44 performs initial alignment on the IC chip.
The IC upper tear film arm 40 comprises an upper tear film X-axis module, an upper tear film Z-axis module 92, an upper tear film guide rail, an upper tear film rotating Q-axis module 90, an upper tear film clamping jaw cylinder 91 and an upper tear film jacking cylinder 93, wherein the upper tear film clamping jaw cylinder 91 and the upper tear film jacking cylinder 93 drive the upper tear film clamping jaw to clamp, the upper tear film rotating Q-axis module 90 is connected with the upper tear film clamping jaw cylinder 91, the upper tear film rotating Q-axis module 90 is connected with the upper tear film Z-axis module 92 through an upper tear film connecting frame, the upper tear film Z-axis module 92 is connected with the upper tear film X-axis module, the upper tear film X-axis module is connected with the upper tear film guide rail, the upper tear film Z-axis module 92 drives the upper tear film clamping jaw cylinder 91 and the upper tear film jacking cylinder 93 to move in the X-axis direction and the Z-axis direction, and the upper tear film rotating Q-axis module 90 drives the upper tear film cylinder 91 to rotate.
The finished product feeding and recycling structure comprises a finished product empty TRAY discharging conveyer belt 21, a finished product real TRAY feeding conveyer belt 13, a NG throwing component 51, a finished product taking component 52 and a finished product transferring platform component, wherein the finished product empty TRAY discharging conveyer belt 21, the finished product real TRAY feeding conveyer belt 13 and the finished product taking component 52 are sequentially connected, the finished product real TRAY feeding conveyer belt 13 conveys a TRAY disc with a finished product, the finished product taking component 52 takes off the finished product from the TRAY disc, disqualified products in the finished product are thrown by the NG throwing component 51 after being scanned by the finished product taking component 52, the finished product empty TRAY discharging conveyer belt 21 removes the empty TRAY disc, the finished product taking component 52 moves the finished product to the finished product transferring platform component, the finished product transferring platform transfers the finished product to a production line, and finished product discharging is carried out.
The finished product real TRAY feeding conveyor belt 13 comprises a finished product conveyor, a finished product feeding guide rail, a finished product feeding belt, a finished product feeding support plate, a finished product feeding sensor and a finished product in-place sensor, wherein the finished product feeding belt is in sliding connection with the finished product feeding guide rail; a finished product feeding sensor and a finished product in-place sensor are arranged on the finished product feeding guide rail, the finished product feeding sensor senses the feeding of a finished product real TRAY disc, and when the finished product real TRAY disc passes through the finished product in-place sensor, the finished product in-place sensor sends out a signal; the finished product feeding support plate supports the finished product feeding guide rail.
The NG material throwing component 51 comprises a finished product temporary storage platform 116, a finished product material throwing platform 115 and a finished product section bar bracket, wherein the finished product temporary storage platform 116 is fixedly connected with the finished product section bar bracket, and the finished product material throwing platform 115 is fixedly connected with the finished product section bar bracket.
The fingerprint identification laminating device comprises a laminating upper and lower carrying arm 49, an OLED loading carrying arm 46, an OLED laminating upper vacuum cavity 50, an OLED laminating lower vacuum cavity 45 and an OLED receiving platform 47, wherein the OLED loading carrying arm 46 moves an OLED screen to the OLED receiving platform 47, the OLED receiving platform 47 moves the OLED screen into the OLED laminating upper vacuum cavity 50, the laminating upper and lower carrying arm 49 moves an IC chip to the OLED laminating lower vacuum cavity 45, the OLED and the IC alignment assembly are respectively aligned with the IC chip and the OLED screen, the OLED upper vacuum cavity and the OLED lower vacuum cavity are respectively moved to laminating positions, the OLED upper vacuum cavity and the OLED lower vacuum cavity are laminated, the OLED and the IC chip are laminated to form a finished product, the upper vacuum cavity moves the finished product to the laminating upper and lower carrying arm 49, and the laminating upper and lower carrying arm 49 is subjected to blanking of the finished product.
By utilizing the bonding upper and lower load arms 49, the OLED load arms 46, the OLED bonding upper vacuum cavity 50, the OLED bonding lower vacuum cavity 45, and the OLED receiving platform 47, the entire bonding process of the OLED and IC chip is very efficient.
OLED material loading arm 46 includes OLED subsides material loading Z axle module, OLED subsides material loading X axle module, OLED subsides material loading R axle module, OLED subsides material loading sucking disc, OLED subsides material loading portal frame, OLED subsides material loading X axle module is connected with OLED subsides material loading portal frame, OLED subsides material loading sucking disc is connected with OLED subsides material loading R axle module, OLED subsides material loading R axle module is connected with OLED subsides material loading Z axle module, OLED subsides material loading X axle module drive OLED subsides material loading sucking disc in X axle direction and Z axle direction remove, OLED subsides material loading R axle module drive OLED subsides material loading sucking disc rotatory.
The OLED and IC alignment assembly comprises an OLED upper alignment assembly, the OLED receiving platform 47 comprises an OLED receiving vacuum chuck 108, an OLED receiving photoelectric sensor 110, an OLED receiving bottom plate and an OLED receiving Y-axis module 109, the OLED receiving vacuum chuck 108 is connected with the OLED receiving bottom plate, the OLED upper alignment assembly is connected with the OLED receiving bottom plate, the OLED receiving photoelectric sensor 110 is connected with the OLED receiving bottom plate, the OLED receiving Y-axis module 109 controls the OLED receiving bottom plate to move back and forth in the Y-axis direction, the OLED receiving photoelectric sensor 110 and the OLED upper alignment assembly control the position of the OLED receiving bottom plate, and the OLED receiving vacuum chuck 108 adsorbs an OLED screen.
The laminating feeding and discharging arm 49 comprises an IC laminating feeding assembly, the OLED and IC alignment assembly comprises an IC lower alignment assembly 48, the IC laminating feeding assembly comprises an IC laminating lifting cylinder, an IC laminating rotary cylinder, an IC laminating feeding suction nozzle 104 and an IC laminating interval X-axis module 102, the IC laminating interval X-axis module 102 is connected with the IC laminating lifting cylinder, the IC laminating rotary cylinder is connected with the IC laminating lifting cylinder in a pneumatic mode, the IC laminating feeding suction nozzle 104 is connected with the IC laminating rotary cylinder in a pneumatic mode, the IC laminating lifting cylinder and the IC laminating rotary cylinder drive the IC chip to rotate or lift, and the IC laminating interval X-axis module 102 drives the IC laminating lifting cylinder and the IC laminating rotary cylinder to move on the X-axis laminating blanking support.
The laminating feeding and discharging arm 49 comprises a finished product laminating and discharging assembly, the finished product laminating and discharging assembly comprises a finished product discharging support 105, a finished product laminating interval X-axis module 103 and a finished product discharging Z-axis module, the finished product discharging support 105 is connected with the finished product discharging Z-axis module, the finished product discharging Z-axis module is connected with the finished product laminating interval X-axis module 103, and the finished product laminating interval X-axis module 103 moves on the X-axis laminating and discharging support.
The OLED laminating lower vacuum cavity 45 comprises an OLED laminating pressure cylinder 114, an OLED laminating lower jig 111 and an OLED laminating XXY platform 112, wherein the OLED laminating pressure cylinder 114 is connected with the OLED laminating XXY platform 112, the upper surface of the OLED laminating XXY platform 112 is sunken to form a lower vacuum cavity, the OLED laminating lower jig 111 is positioned in the lower vacuum cavity, the lower vacuum cavity is pneumatically connected with the OLED laminating pressure cylinder 114, and an IC chip is placed on the OLED laminating lower jig 111; also, the OLED-bonded lower vacuum chamber 45 includes an OLED-bonded transfer Y-axis module 113, the OLED-bonded XXY platform 112 is connected to the OLED-bonded transfer Y-axis module 113, and the OLED-bonded transfer Y-axis module 113 drives the OLED-bonded transfer Y-axis module 113 to move in the Y-axis direction.
The OLED bonding upper vacuum cavity 50 comprises an OLED bonding upper platform 106 and an OLED bonding upper jig, wherein the OLED bonding upper jig is connected with the OLED bonding upper platform 106 and is arranged downwards; an upper vacuum cavity is formed on the lower surface of the OLED upper bonding platform 106, and an OLED upper bonding jig is located in the upper vacuum cavity.
The vacuum cavity 50 on the OLED laminating comprises a Z-axis module 107 on the OLED laminating, the Z-axis module 107 on the OLED laminating is connected with a laminating portal frame, and the Z-axis module 107 on the OLED laminating drives the Z-axis module 106 on the OLED laminating to move up and down in the Z-axis direction.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (7)

1. Fingerprint identification laminating device, its characterized in that, including laminating last unloading arm, OLED material loading arm, OLED laminate go up vacuum cavity, OLED laminate down vacuum cavity and OLED accept the platform, OLED material loading arm will OLED screen move to OLED accept the platform, OLED accept the platform will OLED screen move into OLED laminate go up vacuum cavity, laminate go up unloading arm move IC chip to OLED laminate down vacuum cavity, OLED and IC counterpoint subassembly respectively counterpoint IC chip and OLED screen, OLED laminate go up vacuum cavity and OLED laminate down vacuum cavity and respectively move to laminating position, OLED laminate down vacuum cavity and OLED, OLED with the IC chip laminate and form the finished product, go up vacuum cavity will the finished product moves to laminate go up unloading arm, laminate go up unloading arm unloading the finished product;
The OLED and IC alignment assembly comprises an OLED upper alignment assembly, the OLED supporting platform comprises an OLED supporting vacuum chuck, an OLED supporting photoelectric sensor, an OLED supporting bottom plate and an OLED supporting Y-axis module, the OLED supporting vacuum chuck is connected with the OLED supporting bottom plate, the OLED upper alignment assembly is connected with the OLED supporting bottom plate, the OLED supporting photoelectric sensor is connected with the OLED supporting bottom plate, the OLED supporting Y-axis module controls the OLED supporting bottom plate to move back and forth in the Y-axis direction, the OLED supporting photoelectric sensor and the OLED upper alignment assembly control the position of the OLED supporting bottom plate, and the OLED supporting vacuum chuck adsorbs an OLED screen;
The laminating feeding and discharging arm comprises an IC laminating feeding assembly, the OLED and IC alignment assembly comprises an IC lower alignment assembly, the IC laminating feeding assembly comprises an IC laminating lifting cylinder, an IC laminating rotary cylinder, an IC laminating feeding suction nozzle and an IC laminating interval X-axis module, the IC laminating interval X-axis module is connected with the IC laminating lifting cylinder, the IC laminating rotary cylinder is pneumatically connected with the IC laminating lifting cylinder, the IC laminating feeding suction nozzle is pneumatically connected with the IC laminating rotary cylinder, the IC laminating lifting cylinder and the IC laminating rotary cylinder drive the IC chip to rotate or lift, and the IC laminating interval X-axis module drives the IC laminating lifting cylinder and the IC laminating rotary cylinder to move on an X-axis laminating blanking bracket;
the OLED laminating vacuum cavity comprises an OLED laminating pressure cylinder, an OLED laminating lower jig and an OLED laminating XXY platform, wherein the OLED laminating pressure cylinder is connected with the OLED laminating XXY platform, the upper surface of the OLED laminating XXY platform is sunken to form a lower vacuum cavity, the OLED laminating lower jig is positioned in the lower vacuum cavity, the lower vacuum cavity is pneumatically connected with the OLED laminating pressure cylinder, and an IC chip is placed on the OLED laminating lower jig.
2. The fingerprint identification bonding device of claim 1, wherein the OLED feed boom comprises an OLED bonding feed Z-axis module, an OLED bonding feed X-axis module, an OLED bonding feed R-axis module, an OLED bonding feed suction cup, an OLED bonding feed gantry, the OLED bonding feed X-axis module is connected with the OLED bonding feed gantry, the OLED bonding feed suction cup is connected with the OLED bonding feed R-axis module, the OLED bonding feed R-axis module is connected with the OLED bonding feed Z-axis module, the OLED bonding feed X-axis module drive the OLED bonding feed suction cup to move in the X-axis direction and the Z-axis direction, and the OLED bonding feed R-axis module drive the OLED bonding feed suction cup to rotate.
3. The fingerprint identification laminating device of claim 1, wherein the laminating loading and unloading arm comprises a finished product laminating unloading assembly, the finished product laminating unloading assembly comprises a finished product unloading support, a finished product laminating interval X-axis module and a finished product unloading Z-axis module, the finished product unloading support is connected with the finished product unloading Z-axis module, the finished product unloading Z-axis module is connected with the finished product laminating interval X-axis module, and the finished product laminating interval X-axis module moves on the X-axis laminating unloading support.
4. The fingerprint identification bonding device according to claim 1, wherein the OLED-bonding lower vacuum cavity comprises an OLED-bonding transfer Y-axis module, the OLED-bonding XXY platform is connected with the OLED-bonding transfer Y-axis module, and the OLED-bonding transfer Y-axis module drives the OLED-bonding transfer Y-axis module to move in a Y-axis direction.
5. The fingerprint identification bonding device according to claim 4, wherein the upper vacuum cavity for bonding an OLED comprises an upper OLED bonding platform and an upper OLED bonding jig, wherein the upper OLED bonding jig is connected with the upper OLED bonding platform and is arranged downward.
6. The fingerprint identification bonding device according to claim 5 wherein an upper vacuum cavity is formed on a lower surface of the upper OLED bonding platform, and wherein the upper OLED bonding jig is positioned in the upper vacuum cavity.
7. The fingerprint identification bonding device according to claim 6, wherein the OLED-bonding upper vacuum cavity comprises an OLED-bonding upper Z-axis module, the OLED-bonding upper platform is connected with the OLED-bonding upper Z-axis module, the OLED-bonding upper Z-axis module is connected with a bonding portal frame, and the OLED-bonding upper Z-axis module drives the OLED-bonding upper platform to move up and down in a Z-axis direction.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN212625645U (en) * 2020-07-20 2021-02-26 深圳市深科达智能装备股份有限公司 Fingerprint identification laminating device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202049932U (en) * 2011-04-02 2011-11-23 东莞宏威数码机械有限公司 Vacuum aligning system
CN104015454B (en) * 2014-05-16 2016-06-15 深圳市深科达智能装备股份有限公司 Full-automatic laminating assembling intelligence production line
KR101720627B1 (en) * 2015-05-19 2017-03-28 주식회사 파인텍 High-speed and High-precision Apparatus for Bonding
CN205467789U (en) * 2016-01-29 2016-08-17 深圳市深科达智能装备股份有限公司 Automatic laminating equipment
CN109353106A (en) * 2018-12-13 2019-02-19 深圳市诺峰光电设备有限公司 A kind of vacuum abutted production line of double feedings and its attaching process
CN110126429A (en) * 2019-06-11 2019-08-16 深圳市深科达智能装备股份有限公司 Automation abutted equipment for liquid crystal display

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN212625645U (en) * 2020-07-20 2021-02-26 深圳市深科达智能装备股份有限公司 Fingerprint identification laminating device

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