CN111725404B - Display panel and preparation method thereof - Google Patents
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- CN111725404B CN111725404B CN202010485592.6A CN202010485592A CN111725404B CN 111725404 B CN111725404 B CN 111725404B CN 202010485592 A CN202010485592 A CN 202010485592A CN 111725404 B CN111725404 B CN 111725404B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000002105 nanoparticle Substances 0.000 claims abstract description 37
- 239000004642 Polyimide Substances 0.000 claims abstract description 34
- 229920001721 polyimide Polymers 0.000 claims abstract description 34
- 230000004888 barrier function Effects 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 14
- 239000011259 mixed solution Substances 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000009210 therapy by ultrasound Methods 0.000 claims description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 230000032683 aging Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000011550 stock solution Substances 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 239000000377 silicon dioxide Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a display panel and a preparation method thereof. The display panel includes a substrate, a flexible substrate layer, and an inorganic barrier layer. The flexible substrate layer is arranged on one surface of the substrate. The inorganic barrier layer covers the surface of the inorganic barrier layer. Wherein the flexible substrate layer has transparent polyimide and inorganic nanoparticles therein.
Description
Technical Field
The invention relates to the field of display devices, in particular to a display panel and a preparation method thereof.
Background
With the continuous development of science and technology, the display technology field is continuously updated. The full-screen is used as a brand-new display, and due to the extremely high screen ratio, brand-new visual experience and sensory impact are brought to people, so that the full-screen is a competitive target of display manufacturers. Real comprehensive screen, display screen camera area does not carry out the trompil design promptly, and the camera is directly arranged in the screen below. However, for the camera, the camera is placed below the screen, which means that the light received by the camera passes through the whole panel, and currently, the mainstream panel is manufactured, and the light loss is large due to the stacking of a plurality of film layers, so that the camera cannot perfectly image.
Among them, yellow polyimide, which is resistant to high temperature and has a small thermal expansion coefficient (thermal expansion coefficient ≈ 3ppm/° c), is often used for a flexible layer for manufacturing a flexible OLED (organic light-Emitting Diode) device, but the visible short-wave transmittance of the yellow polyimide is very low, and the light transmittance of a camera under a screen cannot be satisfied. In order to ensure excellent imaging of a camera, more and more products are beginning to use transparent polyimide with higher transmittance. However, the structure of the transparent polyimide determines the larger thermal expansion coefficient (the thermal expansion coefficient is more than or equal to 20 ppm/DEG C), in practical application, as the back-end process has more high-temperature film formation and baking, the transparent polyimide and the upper layer film have larger thermal stress in the thermal process, and the flexible layer has buckling or the inorganic layer on the upper layer of the transparent polyimide has cracks and the like.
Disclosure of Invention
The invention aims to provide a display panel and a preparation method thereof, and aims to solve the problems that a flexible layer of an OLED device is easy to bend, an inorganic layer is easy to crack and fall off and the like in the prior art.
To achieve the above object, the present invention provides a display panel. The display panel includes a substrate, a flexible substrate layer, and an inorganic barrier layer. The flexible substrate layer is arranged on one surface of the substrate. The inorganic barrier layer covers the surface of the inorganic barrier layer. Wherein the flexible substrate layer has transparent polyimide and inorganic nanoparticles therein.
Further, the inorganic nanoparticles are nano-silica.
Further, the display panel further comprises a buffer layer, and the buffer layer is arranged on the inorganic barrier layer.
Further, the buffer layer has at least one of silicon oxide and silicon nitride therein.
Further, in the flexible substrate layer, the mass percentage of the transparent polyimide is 90-99%, and the mass percentage of the inorganic nanoparticles is 1-10%.
Further, the particle size of the inorganic nano-particles is 10-20 nm.
The invention also provides a preparation method of the display panel, which comprises the following steps:
a substrate is provided. And forming a flexible substrate layer and an inorganic barrier layer on the substrate. Wherein the material of the flexible substrate layer is provided with transparent polyimide and inorganic nano particles.
Further, the step of forming a flexible substrate layer and an inorganic barrier layer on the substrate comprises the following steps:
pretreatment of inorganic nanoparticles: adding an inorganic material and a silane coupling agent into an ethanol solution, carrying out ultrasonic treatment for 0.5-2 hours, and then aging, filtering and drying the mixture to obtain the inorganic nano-particles.
Inorganic nanoparticle composite transparent polyimide: and (2) putting the inorganic nano particles into a mixing tank in advance, then adding the transparent polyimide stock solution into the mixing tank, and uniformly dispersing the inorganic nano particles through ultrasonic treatment to obtain a mixed solution.
Film forming: coating the mixed solution on the substrate to form a liquid film, removing most of the solvent through a low-temperature vacuum drying method, and finally performing imidization at the temperature of 300-400 ℃ to obtain the flexible substrate layer and the inorganic barrier layer.
Further, the preparation method of the display panel further comprises the following steps of forming a buffer layer on the inorganic barrier layer: depositing one or more layers of inorganic material on the inorganic barrier layer by plasma enhanced chemical vapor deposition to form the buffer layer.
Further, in the material of the flexible substrate layer, the mass percentage of the transparent polyimide is 90-99%. The mass percentage of the inorganic nano-particles is 1-10%.
The invention has the advantages that:
the invention provides a display panel and a preparation method thereof, wherein inorganic nanoparticles are added in a flexible substrate layer of the display panel, the inorganic nanoparticles are used for increasing the rigidity of transparent polyimide in the flexible substrate layer, reducing the thermal expansion coefficient of the transparent polyimide, improving the molecular porosity of the transparent polyimide, avoiding the bending phenomenon of a film layer and preventing water and oxygen from permeating and corroding. And an inorganic barrier layer can be formed on the surface of the flexible substrate layer, so that the interface stress in the subsequent film forming process is reduced, and the surface of the film layer is prevented from cracking and falling off.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a layer structure of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic view of a preparation instrument according to an embodiment of the present invention.
A display panel 100;
a substrate 10; a flexible substrate layer 20;
a transparent polyimide 21; inorganic nanoparticles 22;
an inorganic barrier layer 30; a buffer layer 40;
a mixing tank 1; an ultrasonic generator 2;
and a spray head 3.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, which are included to demonstrate that the invention can be practiced, and to provide those skilled in the art with a complete description of the invention so that the technical content thereof will be more clear and readily understood. The present invention may be embodied in many different forms of embodiments and should not be construed as limited to the embodiments set forth herein.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components has been exaggerated in some places in the drawings where appropriate for clarity of illustration.
Furthermore, the following description of the various embodiments of the invention refers to the accompanying drawings that illustrate specific embodiments of the invention, by which the invention may be practiced. Directional phrases used in this disclosure, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer to the orientation of the appended drawings and are therefore used in a better and clearer sense of description and understanding of the present invention rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered limiting of the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
When certain components are described as being "on" another component, the components can be directly on the other component; there may also be an intermediate member disposed on the intermediate member and the intermediate member disposed on the other member. When an element is referred to as being "mounted to" or "connected to" another element, they may be directly "mounted to" or "connected to" the other element or indirectly "mounted to" or "connected to" the other element through an intermediate element.
The embodiment of the present invention provides a display device, which is an OLED (Organic Light-Emitting Diode) display device, and includes a display panel 100, where the display panel 100 is a flexible display panel 100, and the display device can provide a display screen and realize flexible bending display. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a notebook computer and the like.
As shown in fig. 1, the display panel 100 includes a substrate 10, a flexible substrate layer 20, an inorganic barrier layer 30, and a buffer layer 40.
The substrate 10 is an insulating substrate, and may be a material having stable properties such as glass and quartz.
The flexible substrate layer 20 is disposed on one surface of the substrate 10, and the flexible substrate layer 20 has transparent Polyimide 21 (CPI) and inorganic nanoparticles 22 therein, wherein the inorganic nanoparticles 22 may be nano-silica. The inorganic nanoparticles 22 have a particle size of 10 to 20 nanometers.
In the flexible substrate layer 20, the transparent polyimide 21 can solve the problem that yellow polyimide commonly used in the prior art has very low visible short-wave transmittance, and improve the light transmittance of under-screen shooting. However, since the thermal expansion coefficient of the transparent polyimide 21 is relatively large, cracking and other phenomena are likely to occur in subsequent high-temperature processes, the addition of the inorganic nanoparticles 22 can increase the rigidity of the transparent polyimide 21, effectively reduce the thermal expansion coefficient thereof, improve the molecular porosity thereof, avoid the curling phenomenon of the flexible substrate layer 20, and prevent water and oxygen from invading and corroding.
The inorganic barrier layer 30 covers the surface of the flexible substrate layer 20 and has silicon dioxide. The inorganic barrier layer 30 is formed on the surface of the flexible substrate layer 20 when the flexible substrate layer 20 is prepared, so that the interfacial stress generated during the preparation of the subsequent film layer is reduced, and the problems of cracking, falling off and the like of the film layer are prevented.
The buffer layer 40 is disposed on the inorganic barrier layer 30, and is prepared by a Plasma Enhanced Chemical Vapor Deposition (PECVD) method. The buffer layer 40 generally includes at least one of silicon nitride and silicon oxide. The buffer layer 40 is used to protect devices in the display panel 100 and reduce damage to the devices due to bumping during transportation.
The embodiment of the present invention further provides a method for manufacturing the display panel 100, where a manufacturing process of the method is shown in fig. 2, and the method includes the following steps:
step S10) provides a substrate 10: the substrate 10 is an insulating substrate, and may be a material having stable properties such as glass and quartz.
Step S20) forming a flexible substrate layer 20 and an inorganic barrier layer 30 on the substrate 10:
step S21) inorganic nanoparticle 22 pretreatment: inorganic material silicon dioxide powder and silane coupling agent are added into ethanol solution with the concentration of 95 percent and ultrasonic treatment is carried out for 1 hour. Then aging, filtering and drying are carried out on the inorganic nano particles to obtain the inorganic nano particles 22, namely nano silicon dioxide.
Step S22) inorganic nanoparticles 22 composite transparent polyimide 21: as shown in fig. 3, the nano silica is previously put into a mixing tank 1, and then a stock solution of transparent polyimide 21 is added into the mixing tank 1 by a pump. And then carrying out ultrasonic treatment by an ultrasonic generator to uniformly disperse the inorganic nanoparticles 22 to obtain a mixed solution. In the mixed solution, the mass percent of the transparent polyimide 21 is 90-99%, and the mass percent of the nano-silica is 1-10%, and this proportion range can avoid that the thermal expansion coefficient of the transparent polyimide 21 is not obviously reduced due to insufficient doping of the inorganic nano-particles 22, and can also avoid inorganic agglomeration due to excessive doping of the inorganic nano-particles 22.
Step S23) film formation: coating the mixed solution on the substrate 10 through a spray head to form a liquid film, removing most of the solvent in the liquid film through a low-temperature vacuum drying method, and finally performing imidization in an environment with the temperature of 300-400 ℃ to bond the nano-silica inside and on the surface of the liquid film to obtain the flexible substrate layer 20, wherein the nano-silica on the surface of the flexible substrate layer 20 forms the inorganic barrier layer 30.
Step S30) forming a buffer layer 40 on the inorganic barrier layer 30: the buffer layer 40 is formed by depositing one or more layers of inorganic materials on a surface of the inorganic barrier layer 30 by plasma enhanced chemical vapor deposition. Wherein, the inorganic material can be one or more of silicon nitride and silicon oxide.
The embodiment of the invention provides a display panel 100, which is characterized in that inorganic nanoparticles 22 are added in a flexible substrate layer 20, the rigidity of transparent polyimide 21 in the flexible substrate layer 20 is increased through the inorganic nanoparticles 22, the thermal expansion coefficient of the transparent polyimide is effectively reduced, the molecular porosity of the transparent polyimide is improved, the phenomenon of bending a film layer is avoided, and water and oxygen are prevented from invading and corroding. And an inorganic barrier layer 30 can be formed on the surface of the flexible substrate layer 20, so that the interface stress in the subsequent film forming process is reduced, the surface of the film layer is prevented from cracking and falling off, and the stability of the device is improved.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that various dependent claims and the features described herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (4)
1. A preparation method of a display panel is characterized by comprising the following steps:
providing a substrate;
forming a flexible substrate layer and an inorganic barrier layer on the substrate;
wherein the material of the flexible substrate layer is provided with transparent polyimide and inorganic nano particles;
the step of forming a flexible substrate layer and an inorganic barrier layer on the substrate comprises the following steps:
pretreating inorganic nano particles;
compounding the inorganic nano particles with transparent polyimide to obtain a mixed solution;
and coating the mixed solution on the substrate to form a liquid film, curing the liquid film, and simultaneously forming the flexible substrate layer and the inorganic barrier layer.
2. The method of manufacturing a display panel according to claim 1, wherein the step of forming a flexible substrate layer and an inorganic barrier layer on the substrate comprises the steps of:
pretreatment of inorganic nanoparticles: adding an inorganic material and a silane coupling agent into an ethanol solution, carrying out ultrasonic treatment for 0.5-2 hours, and then aging, filtering and drying the mixture to obtain the inorganic nano-particles;
inorganic nanoparticle composite transparent polyimide: putting the inorganic nano-particles into a mixing tank in advance, then adding a transparent polyimide stock solution into the mixing tank, and uniformly dispersing the inorganic nano-particles through ultrasonic treatment to obtain a mixed solution;
film forming: and coating the mixed solution on the substrate to form a liquid film, removing most of the solvent by a low-temperature vacuum drying method, and imidizing at the temperature of 300-400 ℃ to obtain the flexible substrate layer and the inorganic barrier layer.
3. The method for manufacturing a display panel according to claim 1, further comprising forming a buffer layer on the inorganic barrier layer: depositing one or more layers of inorganic material on the inorganic barrier layer by plasma enhanced chemical vapor deposition to form the buffer layer.
4. A method of manufacturing a display panel as claimed in claim 1, characterized in that, in the material of the flexible substrate layer,
the mass percentage of the transparent polyimide is 90-99%;
the mass percentage of the inorganic nano-particles is 1-10%.
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