CN111723591B

CN111723591B - Wafer ID reading device

Info

Publication number: CN111723591B
Application number: CN202010440485.1A
Authority: CN
Inventors: 陈夏薇; 郭剑飞; 姚建强; 陈思乡
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2020-05-22
Filing date: 2020-05-22
Publication date: 2021-03-30
Anticipated expiration: 2040-05-22
Also published as: CN111723591A

Abstract

The invention relates to a wafer ID reading device, which comprises a first light source, a second light source, a first light reflecting component corresponding to the first light source, a second light reflecting component corresponding to the second light source, a selection component and an imaging component, wherein: the first light source and the second light source have opposite light emitting directions so as to respectively irradiate light to two sides of the wafer; the first light reflecting component can reflect light reflected by the surface of one side of the wafer to the imaging component; the second light reflecting component can reflect the light reflected by the surface of the other side of the wafer to the imaging component; the selection assembly comprises a movable part, the movable part is movably arranged on the wafer ID reading device and can selectively reflect light reflected by one of the first light reflecting assembly and the second light reflecting assembly to the imaging assembly, the wafer ID reading device does not need to turn over a wafer in the whole wafer ID reading process, and the operation is simple.

Description

Wafer ID reading device

Technical Field

The invention relates to the technical field of integrated circuit testing, in particular to a wafer ID reading device.

Background

Wafers refer to silicon chips used in the fabrication of silicon semiconductor integrated circuits, each wafer having a number, i.e., a wafer ID (wafer ID), which is typically printed on the front or back side of the wafer. In the manufacturing process of forming semiconductor devices, integrated circuits, LCD panels, etc., there are hundreds of processing equipment corresponding to a large number of manufacturing processes. In these manufacturing processes, the wafers must be transferred between the processing machines by transfer equipment such as a robot. Therefore, in order to track the flow direction of the wafer and record the related information (such as the test result) of the wafer, the wafer ID needs to be identified.

Currently, most of the wafer ID reading devices disclosed in the related art are single-side reading devices, that is, the camera can only read the image of the front side or the back side of the wafer, and when the wafer ID reading device is used, it is necessary to adaptively turn the wafer so that the side printed with the wafer ID faces the camera, which takes a long time. However, some reading devices are equipped with two sets of cameras and two corresponding sets of illumination systems, which have high requirements on the size of the used space and high cost.

Disclosure of Invention

In view of the above, there is a need to provide a wafer ID reading apparatus capable of selectively reading a wafer ID in response to a wafer placement condition through a set of imaging systems without turning the wafer during the wafer ID reading process.

A wafer ID reading device comprises a first light source, a second light source, a first light reflecting component corresponding to the first light source, a second light reflecting component corresponding to the second light source, a selecting component and an imaging component, wherein:

the first light source and the second light source have opposite light emitting directions so as to respectively irradiate light to two sides of the wafer;

the first light reflecting component can reflect light reflected by the surface of one side of the wafer to the imaging component;

the second light reflecting component can reflect the light reflected by the surface of the other side of the wafer to the imaging component;

the selection assembly comprises a movable part, the movable part is movably arranged on the wafer ID reading device and can selectively reflect the light reflected by one of the first light reflecting assembly and the second light reflecting assembly to the imaging assembly.

In one embodiment, the movable member includes a bezel that is translatable to block light reflected by one of the first and second light reflecting assemblies and to allow light reflected by the other to be reflected toward the imaging assembly.

In one embodiment, the wafer ID reading apparatus further includes a half mirror, and the light reflected by the first reflective component and the light reflected by the second reflective component both pass through the half mirror.

In one embodiment, the first reflective assembly includes a first reflective mirror, a second reflective mirror and a third reflective mirror, light reflected by a surface of one side of the wafer sequentially passes through the first reflective mirror, the second reflective mirror and the third reflective mirror and then enters the half-mirror, and part of the light reflected by the half-mirror is projected to the imaging assembly; and the second light reflecting assembly comprises a fourth light reflecting mirror and a fifth light reflecting mirror, light reflected by the surface of the other side of the wafer sequentially passes through the fourth light reflecting mirror and the fifth light reflecting mirror and then enters the semi-transparent semi-reflecting mirror, and partial light transmitted by the semi-transparent semi-reflecting mirror is projected to the imaging assembly.

In one embodiment, all of the reflectors in the first and second light reflecting assemblies are provided as 45 degree reflectors, and

the first reflective mirror and the second reflective mirror are oppositely arranged left and right along the width direction of the wafer;

the second reflector and the third reflector are oppositely arranged up and down along the thickness direction of the wafer;

the third reflector and the semi-transparent and semi-reflective mirror are oppositely arranged on the left and right sides of the mirror surface along the width direction of the wafer;

the first reflective mirror and the fourth reflective mirror are arranged oppositely up and down along the thickness direction of the wafer;

and the fourth reflective mirror and the fifth reflective mirror are oppositely arranged left and right along the width direction of the wafer.

In one embodiment, the selection assembly further comprises a drive assembly for driving the translation of the shutter, the drive assembly being configured as a linear actuator.

In one embodiment, the wafer ID reading apparatus further includes a base, the first reflective component, the second reflective component and the selection component are all mounted on the base, the base is further provided with a chute extending along a translation direction of the baffle, and the baffle has a connection portion extending from the chute and connected to the driving component.

In one embodiment, the movable member includes a rotatable mirror, and the first reflecting assembly includes a first reflecting mirror that reflects the light reflected by the one side surface of the wafer to the rotatable mirror; and

the second reflecting assembly comprises a fourth reflecting mirror, and the fourth reflecting mirror reflects the light rays reflected by the surface of the other side of the wafer to the rotatable reflecting mirror;

the rotatable reflector can rotate within a preset angle range so as to selectively project the light rays reflected by the first reflector or the fourth reflector to the imaging assembly.

Further, the inclination angle of the mirror surface of the first reflecting mirror or the fourth reflecting mirror is the same as the inclination angle of the reflecting surface of the rotatable reflecting mirror.

In one embodiment, the imaging assembly includes a CCD sensor and a lens.

In the wafer ID reading device, the wafer ID can be conveniently acquired by the imaging assembly, the wafer does not need to be turned over in the whole wafer ID reading process, and the operation is simple.

Drawings

FIG. 1 is a view from one perspective of a wafer ID reading apparatus according to a first embodiment;

FIG. 2 is another perspective view of the wafer ID reading apparatus of FIG. 1;

FIG. 3 is a diagram illustrating a light propagation path of the wafer ID reading apparatus according to the first embodiment when reading the wafer ID on one surface of the wafer;

FIG. 4 is a diagram illustrating a light propagation path of the wafer ID reading apparatus according to the first embodiment when reading the wafer ID on the other side surface of the wafer;

FIG. 5 is a diagram illustrating a light propagation path of a wafer I reading apparatus according to a second embodiment when reading a wafer ID on a surface of a wafer;

fig. 6 is a diagram illustrating a light propagation path of a wafer I reading apparatus according to a second embodiment when reading a wafer ID on the other side surface of the wafer.

Description of the reference numerals

1. A first light source; 2. a second light source; 3. a first light reflecting component; 30. a first reflective mirror; 31. a second reflective mirror; 32. a third reflective mirror; 4. a second light reflecting component; 40. a fourth reflective mirror; 41. a fifth reflective mirror; 5. selecting a component; 50. a baffle plate; 51. a drive assembly; 52. a rotatable mirror; 6. an imaging assembly; 60. a CCD sensor; 61. a lens; 7. a semi-transparent semi-reflective mirror; 8. a base; 80. a chute.

Detailed Description

Referring to fig. 1 to 2, a wafer ID reading apparatus according to an embodiment of the present invention includes a first light source 1, a second light source 2, and a first reflective member 3 and a second reflective member 4 corresponding to the first light source 1 and the second light source 2, respectively, and further includes a selecting member 5 and an imaging member 6.

Wherein:

the light emitting directions of the first light source 1 and the second light source 2 are opposite to each other so as to respectively irradiate light to two sides of the wafer;

the first reflecting component 3 is used for reflecting the light on one side surface of the wafer, and the second reflecting component 4 is used for reflecting the light on the other side surface of the wafer;

the selecting assembly 5 includes a movable member movably disposed in the wafer ID reading apparatus and capable of selecting one of the first reflector 3 and the second reflector 4 to reflect the light reflected by the one of the reflectors into the imaging assembly 6.

In this way, before the wafer enters the wafer ID reading device, it is known which side surface is provided with the wafer ID, so when the wafer is placed into the wafer ID reading device by a transfer device such as a robot, one of the first reflecting member 3 and the second reflecting member 4 can be selected by the selecting member 5, so that the light reflected by the side surface where the wafer ID is located can be reflected into the imaging member 6. Therefore, the wafer ID can be conveniently acquired by the imaging assembly 6, the wafer does not need to be turned over in the whole wafer ID reading process, and the operation is simple. When the first and second

light sources

1 and 2 can be independently turned on or off, the first and second

light sources

1 and 2 may be selectively turned on and off in cooperation with the selection of the two light reflecting members.

In the first illustrated embodiment, the movable member in the selection assembly 5 is a shutter 50, and the shutter 50 is capable of translating within the wafer ID reader to block light reflected by one of the first and

second reflectors

3, 4 and allow light reflected by the other to be reflected to the imaging assembly. In some embodiments, the selection assembly 5 may further include a driving assembly 51 for driving the baffle 50 to translate, and the driving assembly 51 may be a linear actuator, such as a linear motor, an air cylinder, or the like. In the embodiment, the baffle 50 cuts off one of the light paths, so that the implementation mode is simple and reliable, and the light reflecting component is not required to be designed in a complicated manner.

Further, the wafer ID reading apparatus may further include a half mirror 7, and both the light reflected by the first reflective member 3 and the light reflected by the second reflective member 4 pass through the half mirror 7. The half mirror 7 can transmit a part of light and reflect the other part of light, so that when the light reflected by the first light reflecting component 3 and the second light reflecting component 4 passes through the half mirror 7, the half mirror 7 enables the transmitted light or the reflected light to enter the imaging component 6. Taking the optical paths shown in fig. 3 and 4 as an example, when the wafer ID is disposed on the upper surface of the wafer, the reflected light beam propagates through the first reflective component 3, and when the light beam passes through the half mirror 7, a part of the reflected light beam enters the imaging component 6 and is used to obtain an image of the wafer ID; on the contrary, when the wafer ID is disposed on the lower surface of the wafer, the reflected light beam propagates through the second reflective component 4, and when the light beam passes through the half mirror 7, the transmitted light beam partially enters the imaging component 6 to obtain an image of the wafer ID.

In some embodiments, the first light reflecting assembly 3 includes a first reflecting mirror 30, a second reflecting mirror 31, and a third reflecting mirror 32. Referring to fig. 3, the light reflected by the surface of one side of the wafer sequentially passes through the first reflective mirror 30, the second reflective mirror 31, and the third reflective mirror 32, and then enters the half mirror 7, and a part of the light reflected by the half mirror 7 is projected into the imaging assembly 6.

Referring to fig. 4, the second reflective assembly 4 includes a fourth reflective mirror 40 and a fifth reflective mirror 41, light reflected by the other surface of the wafer sequentially passes through the fourth reflective mirror 40 and the fifth reflective mirror 41 and then enters the half mirror 7, and a part of the light transmitted by the half mirror 7 is projected into the imaging assembly 6.

All the reflectors in the first reflecting assembly 3 and the second reflecting assembly 4 are 45-degree reflectors, and the first reflector 30 and the second reflector 31 are oppositely arranged left and right along the width direction of the wafer; the second reflector 31 and the third reflector 32 are arranged oppositely up and down along the thickness direction of the wafer; along the width direction of the wafer, the third reflector 32 and the half-mirror 7 are arranged oppositely from left to right; the first reflective mirror 30 and the fourth reflective mirror 40 are arranged oppositely up and down along the thickness direction of the wafer; the fourth mirror 40 and the fifth mirror 41 are disposed to face each other in the width direction of the wafer.

The wafer ID reading apparatus may further include a base 8, and the first reflective element 3, the second reflective element 4 and the selection element 5 may be mounted on the base 8. Further, referring to fig. 2, the base 8 is further provided with a sliding slot 80 extending along the translation direction of the baffle 50, one side of the baffle 50 is provided with a connecting portion, the connecting portion extends out of the sliding slot 80 and is connected to the driving assembly 51, so that when the driving assembly 51 drives the baffle 50 to perform the translation motion, the connecting portion on the baffle 50 slides in the sliding slot 80, and when the connecting portion abuts against the upper end wall or the lower end wall of the sliding slot 80, the baffle 50 moves to the stroke end.

The imaging assembly 6 includes a CCD sensor and a lens 61, but may alternatively be another type of imaging device. The first light source 1 and the second light source 2 are preferably selected to be LED light sources to transmit enough light to the wafer surface to improve the imaging quality of the wafer ID.

According to another variation of the selecting assembly 5, the present invention further provides a wafer ID reading assembly, referring to fig. 5 and 6, wherein the movable part of the selecting assembly 5 includes a rotatable reflector 52, the first reflecting assembly 3 includes a first reflector 30, and the second reflecting assembly 4 includes a fourth reflector 40, and the first reflector 30 and the fourth reflector 40 are capable of reflecting light reflected by both side surfaces of the wafer to the rotatable reflector 52, respectively. The rotatable mirror 52 is rotatable within a predetermined angular range to selectively project the light reflected by the first mirror 30 or the fourth mirror 40 to the imaging assembly 6. In this manner, when it is known on which side of the wafer ID is disposed, the rotatable mirror 52 may be rotated, thereby changing the direction in which light is received and transmitted by the rotatable mirror 52.

Further, the inclination angle of the mirror surface of one of the first reflecting mirror 30 and the fourth reflecting mirror 40 is the same as the inclination angle of the reflecting surface of the rotatable reflecting mirror 52, so that when the light reflected by the side surface on which the wafer ID is located enters one of the first reflecting mirror 30 and the fourth reflecting mirror 40, the angle of the rotatable reflecting mirror 52 needs to be adjusted, and when the wafer ID is on the other side surface, the light reflected by the side surface enters the other of the first reflecting mirror 30 and the fourth reflecting mirror 40, the angle of the rotatable reflecting mirror 52 does not need to be adjusted. The rotation of the rotatable mirror 52 may be achieved manually or by an automated device such as a motor. In this embodiment, the first and second

light reflecting members

3 and 4 are implemented as shown in the drawings, and the number of reflectors is reduced as compared to the previous embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A wafer ID reading apparatus comprising a first light source (1), a second light source (2), a first light reflecting component (3) corresponding to the first light source (1), a second light reflecting component (4) corresponding to the second light source (2), and an imaging component (6), characterized in that the wafer ID reading apparatus further comprises a selecting component (5) wherein:

the light emitting directions of the first light source (1) and the second light source (2) are opposite, so that light rays are respectively irradiated to two sides of the wafer;

the first light reflecting component (3) can reflect the light reflected by the surface of one side of the wafer to the imaging component (6);

the second light reflecting component (4) can reflect the light reflected by the surface of the other side of the wafer to the imaging component (6);

the selection assembly (5) comprises a movable part, the movable part is movably arranged on the wafer ID reading device and can selectively reflect the light reflected by one of the first light reflecting assembly (3) and the second light reflecting assembly (4) to the imaging assembly (6).

2. The wafer ID reading apparatus according to claim 1, wherein the movable member includes a shutter (50), the shutter (50) being translatable to a position blocking light reflected by one of the first and second light reflecting members (3, 4) and allowing light reflected by the other to be reflected to the imaging member (6).

3. The wafer ID reading apparatus according to claim 2, further comprising a half mirror (7), wherein the light reflected by the first reflective component (3) and the light reflected by the second reflective component (4) both pass through the half mirror (7).

4. The wafer ID reading apparatus according to claim 3, wherein the first reflective component (3) comprises a first reflective mirror (30), a second reflective mirror (31) and a third reflective mirror (32), the light reflected by the surface of one side of the wafer sequentially passes through the first reflective mirror (30), the second reflective mirror (31) and the third reflective mirror (32) and then enters the half mirror (7), and part of the light reflected by the half mirror (7) is projected to the imaging component (6); and

the second light reflecting assembly (4) comprises a fourth light reflecting mirror (40) and a fifth light reflecting mirror (41), light rays reflected by the surface of the other side of the wafer sequentially pass through the fourth light reflecting mirror (40) and the fifth light reflecting mirror (41) and then enter the half-transmitting and half-reflecting mirror (7), and partial light rays transmitted by the half-transmitting and half-reflecting mirror (7) are projected to the imaging assembly (6).

5. The wafer ID reading apparatus according to claim 4, wherein all the mirrors in the first and second light reflecting members (3, 4) are set as 45 degree mirrors, and

the first reflective mirror (30) and the second reflective mirror (31) are oppositely arranged left and right along the width direction of the wafer;

the second reflective mirror (31) and the third reflective mirror (32) are arranged oppositely up and down along the thickness direction of the wafer;

the third reflector (32) and the semi-transparent and semi-reflective mirror (7) are oppositely arranged on the left and right sides along the width direction of the wafer;

the first reflective mirror (30) and the fourth reflective mirror (40) are arranged oppositely up and down along the thickness direction of the wafer;

the fourth reflective mirror (40) and the fifth reflective mirror (41) are arranged in a left-right opposite manner along the width direction of the wafer.

6. The wafer ID reading apparatus according to claim 2, wherein the selection assembly (5) further comprises a driving assembly (51) for driving the shutter (50) to translate, the driving assembly (51) being configured as a linear actuator.

7. The wafer ID reading apparatus according to claim 6, further comprising a base (8), wherein the first reflective member (3), the second reflective member (4) and the selection member (5) are mounted on the base (8), the base (8) further defines a sliding slot (80) extending along a translation direction of the barrier (50), and the barrier (50) has a connecting portion extending from the sliding slot (80) and connected to the driving member (51).

8. The wafer ID reading apparatus according to claim 1, wherein the movable member includes a rotatable mirror (52), the first reflecting member (3) includes a first reflecting mirror (30), and the first reflecting mirror (30) reflects the light reflected from the one side surface of the wafer to the rotatable mirror (52); and

the second reflecting component (4) comprises a fourth reflecting mirror (40), and the fourth reflecting mirror (40) reflects the light rays reflected by the other side surface of the wafer to the rotatable reflecting mirror (52);

the rotatable reflector (52) can rotate within a preset angle range to selectively project the light reflected by the first reflector (30) or the fourth reflector (40) to the imaging assembly (6).

9. The wafer ID reading apparatus according to claim 8, wherein the first mirror (30) or the fourth mirror (40) has a mirror surface inclination angle identical to a reflection surface inclination angle of the rotatable mirror (52).

10. The wafer ID reading apparatus according to any of claims 1 to 9, wherein the imaging component (6) includes a CCD sensor (60) and a lens (61).