CN111716574A

CN111716574A - Cutting device of wafer for chip manufacturing

Info

Publication number: CN111716574A
Application number: CN202010626748.8A
Authority: CN
Inventors: 罗浩
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2020-09-29

Abstract

The invention discloses a cutting device of a wafer for manufacturing a chip, which comprises a shell arranged in a hollow cuboid, wherein a feeding hole is formed in one side surface of the shell, a discharging hole is formed in the other symmetrical side surface of the shell, two groups of symmetrical material guide supporting plates are arranged on one side, close to the feeding hole, in the shell, right below the two groups of material guide supporting plates, a material pushing mechanism is fixed in the shell, a clamping mechanism is arranged above one side, away from the feeding hole, of the two groups of material guide supporting plates, a transverse cutting mechanism is arranged in the shell, facing the discharging hole, of the two groups of material guide supporting plates, a suction nozzle connected with a suction fan is arranged above the cutting position of the material guide supporting plates by the transverse cutting mechanism, the suction nozzle is arranged in an inclined mode, and a limiting and measuring mechanism for. The cutting device for the wafer for manufacturing the chip realizes automatic feeding and cutting of the wafer, enables the whole process to be automatic, and improves the processing efficiency of the wafer in the shell.

Description

Cutting device of wafer for chip manufacturing

Technical Field

The invention belongs to the technical field of chip manufacturing, and particularly relates to a cutting device of a wafer for chip manufacturing.

Background

The chip generally refers to a carrier of an integrated circuit, and is also a result of the integrated circuit after design, manufacture, packaging and testing, while the integrated circuit is the most important part of electronic equipment, and bears the functions of operation and storage, and the application range of the integrated circuit covers almost all electronic equipment for military industry and civil use. The silicon wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a silicon wafer because it has a circular shape. Various circuit element structures can be fabricated on silicon wafers to produce integrated circuit products with specific electrical functions, and thus are basic materials for the fabrication of integrated circuits and chips.

Silicon wafer need cut its processing when production is add man-hour, and current cutting device, its in-process to wafer cutting, the step of cutting is gone one-way operation by the manual work basically, and degree of automation is low, has leaded to holistic cutting inefficiency, has influenced the efficiency of processing, and the location accuracy when in addition to wafer cutting is poor, has influenced the precision of cutting.

Disclosure of Invention

The present invention is directed to a wafer dicing apparatus for chip manufacturing, so as to solve the problems of the background art.

In order to achieve the purpose, the invention provides the following technical scheme: a cutting device of a wafer for manufacturing a chip comprises a shell which is arranged in a hollow cuboid shape, a feeding hole is arranged on one side surface of the shell, a discharge port is arranged on the other symmetrical side surface, two groups of symmetrical guide supporting plates are arranged on one side of the interior of the shell body close to the feed port, a material pushing mechanism is fixed in the shell body right below the two groups of guide supporting plates, a clamping mechanism is arranged above one side of the two groups of guide supporting plates far away from the feed port, a transverse cutting mechanism is arranged in the shell body on one side of the two groups of guide supporting plates facing the discharge port, and a suction nozzle connected with a suction fan is arranged above the cutting position of the material guide supporting plate of the transverse cutting mechanism, the suction nozzle is obliquely arranged, a limiting and measuring mechanism for limiting the movement of the wafer is fixed on the inner wall of the shell right above the discharge port, and a conveying mechanism extending to the lower parts of the two groups of material guide supporting plates is installed in the discharge port;

two sets of the opposite sides of guide layer board set up to the arcwall face, and the top of two sets of guide layer boards all is equipped with the gliding slide that is used for pushing equipment through the inside roof fixed connection of two sets of first bracing pieces and casing, the interval between two sets of guide layer boards, suction fan fixed mounting is on the top of casing, and the inlet scoop of suction fan is linked together through branch pipe and the suction nozzle that induced drafts.

Preferably, the pushing mechanism comprises a second supporting rod, a first lead screw, a nut sliding block and a first electric push rod, wherein the second supporting rod is arranged under one end of each of the two groups of material guide supporting plates, the end of each of the two groups of material guide supporting plates is fixed, the first lead screw is arranged between the second supporting rod and the inner wall of the shell below the material inlet, the nut sliding block is sleeved on the first lead screw, and the first electric push rod is arranged on the top end face of the nut.

Preferably, the top end of the piston rod of the first electric push rod is fixedly connected with a push plate, the piston rod of the first electric push rod is arranged in a sliding way between the two groups of material guide supporting plates, and the push plate is of a disc-shaped structure.

Preferably, the clamping mechanism comprises side supporting plates vertically welded with the inner top wall of the shell, four groups of second lead screws installed between the side supporting plates and the inner wall of the shell at even intervals, clamping plates sleeved at two ends of each group of second lead screws and a driving mechanism for driving the multiple groups of second lead screws to synchronously rotate, threads at two ends of each second lead screw are opposite, and two groups of clamping plates on each second lead screw are provided with arc-shaped clamping grooves on opposite side faces.

Preferably, the driving mechanism comprises two groups of fixing plates welded on the side supporting plate, worms mounted on the two groups of fixing plates, a second motor fixedly mounted on one side of the fixing plates, and a plurality of groups of worm gears meshed with the worms, the second motor is a servo motor, and the worm gears are fixedly sleeved on one end, extending out of the side supporting plate, of each group of second lead screws respectively.

Preferably, the transverse cutting mechanism comprises a third electric push rod horizontally welded and fixed on the side wall inside the shell, a mounting seat mounted at the end part of a piston of the third electric push rod, and a cutting blade mounted on one side surface of the mounting seat, and the side surface of the cutting blade is tightly attached to the side surface of the material guide supporting plate.

Preferably, the limiting measurement mechanism comprises a second electric push rod welded on the side wall of the shell right above the discharge port and a limiting baffle connected with the end of a piston of the second electric push rod, and the limiting baffle faces the bottom end of the side face of the material guide supporting plate and is aligned to the side face of one group of material guide supporting plates, and a laser distance sensor is mounted on the limiting baffle.

Preferably, transport mechanism includes that one end is fixed at the intraoral conveyer belt of discharge gate, the other end both sides of conveyer belt are provided with the third branch with the casing internal fixation, just install the third motor on the inside diapire of casing, the pulley has been cup jointed on the spindle of third motor and the roll axle of one of them set of transfer roller in the conveyer belt, and is connected through the conveying belt transmission between two sets of pulleys.

The invention has the technical effects and advantages that: according to the cutting device for the wafer for manufacturing the chip, the two groups of material guide supporting plates, the material pushing mechanism, the transverse cutting mechanism, the clamping mechanism and the conveying mechanism are arranged in the shell, so that the rapid cutting of the wafer can be realized by the material pushing mechanism, the clamping mechanism, the transverse cutting mechanism and the conveying mechanism after the wafer enters the shell, and the wafer is led out of the shell, the automatic feeding and cutting of the wafer are realized, the processing efficiency of the wafer in the shell is improved, and the time is saved; in addition, the clamping mechanism works through the driving mechanism to realize clamping and fixing of a plurality of groups of clamping plates on the wafer at the same time, so that the stability during cutting is ensured, and the problem of poor cutting precision caused by shaking during cutting is effectively solved; in addition, a suction nozzle connected with a suction fan is arranged on one side of the cutting position, the suction nozzle is arranged in an inclined mode and faces the cutting position, interference of particles in impurities and air to work during cutting is avoided, and meanwhile chips generated by cutting can be rapidly collected.

Drawings

FIG. 1 is a cross-sectional view of the present invention;

FIG. 2 is a cross-sectional view taken in the direction A-A of FIG. 1 in accordance with the present invention;

FIG. 3 is a schematic structural view of a limit weighing mechanism of the present invention;

FIG. 4 is a front view of the drive mechanism of the present invention;

fig. 5 is a schematic diagram of the circuit connection of the present invention.

In the figure: 1. a housing; 2. a feed inlet; 3. a discharge port; 4. a material guiding supporting plate; 5. a first support bar; 6. a first lead screw; 7. a second support bar; 8. a first motor; 9. a nut slider; 10. a first electric push rod; 11. pushing the plate; 12. a splint; 13. a side support plate; 14. a second motor; 15. a second lead screw; 16. a conveyor belt; 17. a third motor; 18. a conveyor belt; 19. a suction fan; 20. an air suction branch pipe; 21. a suction nozzle; 22. a second electric push rod; 23. a third electric push rod; 24. a mounting seat; 25. a cutting blade; 26. a third support bar; 27. a limit baffle; 28. a laser distance sensor; 29. a worm; 30. a worm gear;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides a cutting device of a wafer for manufacturing a chip as shown in figures 1-5, which comprises a shell 1 which is arranged in a hollow cuboid, wherein a feed inlet 2 is arranged on one side surface of the shell 1, a discharge outlet 3 is arranged on the other symmetrical side surface, two groups of symmetrical material guide supporting plates 4 are arranged on one side of the interior of the shell 1 close to the feed inlet 2, a material pushing mechanism is fixed in the shell 1 under the two groups of material guide supporting plates 4, a clamping mechanism is arranged above one side of the two groups of material guide supporting plates 4 far away from the feed inlet 2, a transverse cutting mechanism is arranged in the shell 1 at one side of the two groups of material guide supporting plates 4 facing the discharge outlet 3, a suction nozzle 21 connected with a suction fan 19 is arranged above the cutting position of the material guide supporting plates 4 by the transverse cutting mechanism, the suction nozzle 21 is arranged in an inclined way, the opening faces the material guide supporting plates 4, and a limiting mechanism for limiting the movement of the wafer, and a conveying mechanism extending to the lower part of the two material guide supporting plates 4 is arranged in the discharge port 3;

two sets of guide layer board 4 is relative side sets up to the arcwall face, makes things convenient for putting into of wafer stick, and the top of two sets of guide layer boards 4 is all through the inside roof fixed connection of two sets of first branch poles 5 and casing 1, guarantees the stability of guide layer board 4, and two sets of guide layer boards 4 separate to be equipped with and are used for the gliding slide of pushing equipment, suction fan 19 fixed mounting is on the top of casing 1, and the inlet scoop of suction fan 19 is linked together through branch pipe 20 and suction nozzle 21 that induced drafts.

Concretely, pushing equipment is including setting up at two sets of guide layer boards 4 towards the fixed second branch 7 in 3 one ends under of discharge gate, set up the first lead screw 6 between second branch 7 and the 2 below shells 1 inner walls of feed inlet, cup joint the nut slider 9 on first lead screw 6 and install the first electric push rod 10 on nut slider 9 top end face, first lead screw 6 rotates the setting on second branch 7 and shells 1 inner wall, and still installs the first motor 8 of drive first lead screw 6 pivoted on the side of second branch 7, first motor 8 is servo motor this moment.

Specifically, the piston rod top fixedly connected with push pedal 11 of first electric push rod 10, and the piston rod of first electric push rod 10 slides in the slide between two sets of guide layer boards 4 and sets up, push pedal 11 is discoid structure, corresponds with the tip of wafer stick, drives the removal of wafer stick when conveniently sliding.

Specifically, clamping mechanism includes side branch board 13, the even interval of the perpendicular welded side branch board of inside roof 13 with casing 1 and installs four groups of second lead screw 15 between side branch board 13 and casing 1 inner wall, cup joints splint 12 and the synchronous pivoted actuating mechanism of drive multiunit second lead screw 15 at every group second lead screw 15 both ends, the both ends screw thread of second lead screw 15 is opposite, can make the splint 12 on every group second lead screw 15 remove opposite direction, and every group on the second lead screw 15 two sets of splint 12 side in opposite directions all are opened has curved double-layered groove, conveniently presss from both sides tight wafer stick.

Specifically, the driving mechanism comprises two groups of fixing plates welded on the side support plate 13, worms 29 mounted on the two groups of fixing plates, a second motor 14 fixedly mounted on one side of the fixing plates, and a plurality of worm gears 30 engaged with the worms 29, wherein the worms 29 are rotatably arranged between the two groups of fixing plates, one end of each worm gear is coaxially and fixedly connected with a crankshaft of the second motor 14, the second motor 14 is a servo motor, and the plurality of worm gears 30 are respectively and fixedly sleeved on one end of each group of second lead screws 15 extending out of the side support plate 13.

Specifically, the transverse cutting mechanism comprises a third electric push rod 23 horizontally welded and fixed on the inner side wall of the shell 1, a mounting seat 24 installed at the end part of a piston of the third electric push rod 23, and a cutting blade 25 installed on one side surface of the mounting seat 24, wherein the side surface of the cutting blade 25 is closely attached to the side surface of the material guiding supporting plate 4.

Specifically, the limiting measurement mechanism comprises a second electric push rod 22 welded on the side wall of the shell 1 right above the discharge port 3 and a limiting baffle 27 connected with the piston end of the second electric push rod 22, the limiting baffle 27 faces the bottom end of the side surface of the material guide supporting plate 4 and is aligned to the side surface of one group of material guide supporting plates 4, and a laser distance sensor 28 is installed on the limiting baffle 27, wherein the laser distance sensor 28 is a nano-scale laser distance sensor and can be produced by german west gram.

Specifically, transport mechanism includes that one end fixes the conveyer belt 16 in discharge gate 3, the other end both sides of conveyer belt 16 are provided with the inside fixed third branch 26 of casing 1, just install third motor 17 on the inside diapire of casing 1, the shaft of third motor 17 has cup jointed the belt pulley on with the roller of one of them set of transfer roller in the conveyer belt 16, and is connected through conveyer 18 transmission between two sets of belt pulleys.

Specifically, a control panel for driving elements of the housing 1 to work is further mounted on the outer side surface of the housing 1, the control panel is electrically connected with the laser distance sensor 28, the suction fan 19, the first electric push rod 10, the second electric push rod 22, the third electric push rod 23, the first motor 8, the second motor 14 and the third motor 17 respectively, the control panel is preferably a touch screen with a built-in STM series single chip microcomputer, and the built-in programs and circuit connections are all implemented by adopting the prior art

The working principle of the cutting device for the wafer for manufacturing the chip is that during cutting, the wafer is firstly placed into an arc-shaped side edge between two groups of guide supporting plates 4 from a feeding hole 2, then the wafer is pushed into a shell 1, then the work of a laser distance sensor 28 is started, the laser distance sensor 28 can sense the distance between a limit baffle 27 and the guide supporting plates 4, the cutting thickness is preset, then a second electric push rod 22 is controlled to slowly extend, when the sensing distance reaches the preset cutting thickness, a control panel controls the second electric push rod 22 to stop, meanwhile, a first electric push rod 10 is started to extend and extends to the upper side of the guide supporting plates 4 through a push plate 11, after the extension of the first electric push rod 10 is completed, a first motor 8 is started to rotate, the first lead screw 6 is driven to rotate by the rotation of the first motor 8, a nut slide block 9 slides on the first lead screw 6, the first electric push rod 10 and the slide plate are driven to move, at the moment, the push plate 11 pushes the wafer rods on the two groups of material guide supporting plates 4 to move until the wafer rods move to abut against the limit baffle 27, the first motor 8 stops rotating, the second motor 14 is started to rotate, the second motor 14 drives the second lead screws 15 to rotate through the worm 29 and the worm wheel 30, the clamping plates 12 on the second lead screws 15 move in opposite directions to clamp the wafer rods on the two groups of material guide supporting plates 4, after the clamping is completed, the second motor 14 is closed, the third motor 17, the cutting blade 25, the suction fan 19 and the third electric push rod 23 are started to work, the third motor 17 works to drive the conveyor belt 16 to rotate, the shell 1 is conveyed into the shell 1, the cutting blade 25 works and is matched with the extension of the third electric push rod 23 to move the cutting blade 25 to the wafer, the wafer rods are cut until the wafer rods are retracted after the cutting is completed, and meanwhile, the chips generated during the cutting and the particles in the air are absorbed by the suction fan 19 through the suction nozzle 21, when the third electric push rod 23 contracts, the second motor 14 starts to rotate reversely at the moment, after the clamping plate 12 loosens the wafer rod, the first motor 8 rotates here, the push plate 11 pushes the wafer to move here until the wafer contacts the limit baffle 27 again, and the process is circulated; meanwhile, the wafers cut each time all slide onto the conveyor 16, and are conveyed out of the housing 1 by the conveyor 16 and collected.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a cutting device of wafer for chip manufacture, is including casing (1) that is the setting of cavity cuboid, its characterized in that: the wafer cutting machine is characterized in that a feeding hole (2) is formed in one side face of the shell (1), a discharging hole (3) is formed in the other symmetrical side face of the shell, two symmetrical guide supporting plates (4) are arranged on one side, close to the feeding hole (2), of the interior of the shell (1) and are fixed with a material pushing mechanism, two guide supporting plates (4) are arranged above one side, away from the feeding hole (2), of the interior of the shell, a clamping mechanism is installed above the two guide supporting plates (4), a transverse cutting mechanism is installed in the shell (1) towards one side of the discharging hole (3), a suction nozzle (21) connected with a suction fan (19) is arranged above the cutting position of the guide supporting plates (4) of the transverse cutting mechanism, the suction nozzle (21) is obliquely arranged, and a limiting mechanism for limiting wafer movement is fixed on the inner wall of the shell (1) above the discharging hole (3), and a conveying mechanism extending to the lower part of the two material guide supporting plates (4) is arranged in the discharge port (3);

two sets of guide layer board (4) one side in opposite directions sets up to the arcwall face, and the top of two sets of guide layer boards (4) is all through the inside roof fixed connection of two sets of first branch poles (5) and casing (1), separates between two sets of guide layer boards (4) to be equipped with and is used for the gliding slide of pushing equipment, suction fan (19) fixed mounting is on the top of casing (1), and the inlet scoop of suction fan (19) is linked together through branch pipe (20) and suction nozzle (21) of induced drafting.

2. The apparatus for cutting a wafer for chip fabrication according to claim 1, wherein: the pushing mechanism comprises a second supporting rod (7) which is arranged under one end of the two groups of material guide supporting plates (4) and fixed towards the discharge port (3), a first lead screw (6) which is arranged between the second supporting rod (7) and the inner wall of the shell (1) below the feed port (2), a nut sliding block (9) which is sleeved on the first lead screw (6) and a first electric push rod (10) which is arranged on the top end face of the nut sliding block (9).

3. The apparatus for cutting a wafer for chip fabrication according to claim 2, wherein: the top end of a piston rod of the first electric push rod (10) is fixedly connected with a push plate (11), the piston rod of the first electric push rod (10) slides in a slide way between the two groups of material guide supporting plates (4), and the push plate (11) is of a disc-shaped structure.

4. The apparatus for cutting a wafer for chip fabrication according to claim 1, wherein: clamping mechanism includes side extension board (13) with the perpendicular welded of inside roof of casing (1), even interval installs four groups of second lead screw (15) between side extension board (13) and casing (1) inner wall, cup joints splint (12) at every group second lead screw (15) both ends and drive the synchronous pivoted actuating mechanism of multiunit second lead screw (15), the both ends screw thread of second lead screw (15) is opposite, and every group two sets of on second lead screw (15) splint (12) side in opposite directions all are opened has curved double-layered groove.

5. The apparatus for cutting a wafer for chip fabrication according to claim 4, wherein: the driving mechanism comprises two groups of fixing plates welded on the side support plate (13), worms (29) installed on the two groups of fixing plates, a second motor (14) fixedly installed on one side of the fixing plates and a plurality of groups of worm wheels (30) meshed with the worms (29), the second motor (14) is a servo motor, and the worm wheels (30) are fixedly sleeved on one end, extending out of the side support plate (13), of each group of second lead screws (15).

6. The apparatus for cutting a wafer for chip fabrication according to claim 1, wherein: the transverse cutting mechanism comprises a third electric push rod (23) horizontally welded and fixed on the inner side wall of the shell (1), a mounting seat (24) mounted at the end part of a piston of the third electric push rod (23) and a cutting blade (25) mounted on one side surface of the mounting seat (24), and the side surface of the cutting blade (25) is tightly attached to the side surface of the material guide supporting plate (4).

7. The apparatus for cutting a wafer for chip fabrication according to claim 1, wherein: the limiting measurement mechanism comprises a second electric push rod (22) welded on the side wall of the shell (1) right above the discharge port (3) and a limiting baffle plate (27) connected with the piston end of the second electric push rod (22), and a laser distance sensor (28) is installed at the position, facing the bottom end of the side face of the material guide supporting plate (4), of the limiting baffle plate (27) and aligned to the side face of one group of material guide supporting plates (4).

8. The apparatus for cutting a wafer for chip fabrication according to claim 1, wherein: conveying mechanism includes that one end fixes conveyer belt (16) in discharge gate (3), the other end both sides of conveyer belt (16) are provided with third branch (26) with casing (1) inside fixed, just install third motor (17) on the inside diapire of casing (1), the shaft of third motor (17) has cup jointed the belt pulley on the roller of one of them set of transfer roller in with conveyer belt (16), and is connected through conveyer belt (18) transmission between two sets of belt pulleys.