CN111716232B - Polishing method and device for fine structure - Google Patents
Polishing method and device for fine structure Download PDFInfo
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- CN111716232B CN111716232B CN202010492333.6A CN202010492333A CN111716232B CN 111716232 B CN111716232 B CN 111716232B CN 202010492333 A CN202010492333 A CN 202010492333A CN 111716232 B CN111716232 B CN 111716232B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/003—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor whereby the workpieces are mounted on a holder and are immersed in the abrasive material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing method and a device for a fine structure are realized based on a shear thickening and chemical composite effect, and the device comprises a polishing system, a polishing solution circulating device, a vibrating device and an angle adjusting device. The polishing solution circulating device is positioned below the polishing system, the vibrating device is positioned above the polishing system, and the angle adjusting device can adjust the vibrating inclination angle. The method utilizes chemical corrosion and the shear thickening effect of the non-Newtonian fluid polishing solution to realize corrosion polishing of the workpiece with the fine structure. The surface of a workpiece with a fine structure is corroded firstly, the polishing of the workpiece with the fine structure is realized by utilizing the shear thickening effect of polishing liquid under vertical/inclined vibration, and the highest efficiency polishing is realized by regulating and controlling the vibration inclination angle of the workpiece. The invention can realize the high-efficiency polishing of the workpiece with the micro-structure, overcomes the problem that the surface quality and the surface shape precision can not be considered simultaneously in the polishing process of the workpiece with the micro-structure, and can effectively eliminate the surface defect. The polished workpiece with fine structure has nanometer surface roughness and submicron surface precision.
Description
Technical Field
The invention belongs to the field of ultra-precision machining, relates to a polishing method and a polishing device for a fine structure, and particularly relates to a high-efficiency machining method and a high-efficiency machining device for optical structures, diffuse wave structures, micro-fluid structures and other fine structure forms.
Background
Due to the advantages and functions of the microstructure different from the traditional surface, the microstructure has wide application in the fields of optics, national defense, microfluid, surface engineering and the like. For example: the terahertz technology has great application prospect in the fields of communication, security inspection and the like, and a slow wave structure serving as a terahertz radiation source electric vacuum device is a typical fine structure; the Fresnel lens with a fine structure is adopted in the concentrating solar system, so that the light can be converted from a relatively large area to a relatively small area, the consumption of semiconductor materials in the photocell is effectively reduced, and the cost can be greatly saved; the micro-fluid chip with the micro-structure can realize the high-efficiency control of complex fluid under the micro-scale, and has wide application prospect in the fields of chemistry, medicine, life science and the like.
With the continuous progress of the scientific and technical level, the ultra-precise surface manufacturing is greatly developed in recent years under the great support of the nation. Polishing is an important part of the ultra-precision surface manufacturing process, usually as the final machining process. The surface with high surface shape precision, low surface roughness, low damage and even no damage can be obtained by polishing, and the development of a fine structure and ultra-precise manufacturing thereof is promoted.
The photoetching, etching and electro-deposition adopted by a Micro Electro Mechanical System (MEMS), a Focused Ion Beam (FIB) and the like can realize the manufacturing of a fine structure and keep better surface quality and surface shape precision. Although MEMS and FIB can manufacture a surface having a surface shape with satisfactory accuracy and surface quality, they cannot respond quickly to a demand due to their high cost, low efficiency, complicated process, and the like. For fine structures of several tens to several hundreds of micrometers, precision machining techniques such as cutting, grinding, etc. are considered a rational and efficient way. Foreign researchers [ E.Brinksmeier, and O.Riemer. "Deterministic Production of complex optical elements." International Journal of Production Engineering and Computers-Special Issue CAPP and Advances in Cutting Technology,2002,4(5):63-72 ] polished the microstructure workpiece 7 using taper pin and taper wheel type polishing tools and better maintained the surface finish and surface roughness of the microstructure. However, since the tool is sharp and is easily worn during polishing, the polishing tool needs to be frequently replaced to ensure the uniformity of material removal, even though the tool mark 23, the burr 22, and the like on the surface of the microstructure workpiece 7 exist after the machining. At present, no efficient and effective polishing method and device for fine structures have been proposed.
Patent CN201310275700.7 discloses a processing device based on a non-newtonian fluid shear thickening mechanism polishing method. The method utilizes the shear thickening effect of non-Newtonian fluid, namely the shear rate of the polishing solution 8 with a certain thickness on the surface of a workpiece is increased to generate the shear thickening effect when the polishing solution 8 rotates at a high speed, macroscopically shows that the viscosity is increased, the holding force of abrasive particles 19 is increased, and the micro-cutting effect of the abrasive particles 19 is utilized to realize material removal. The polishing solution 8 used in the method has certain flexibility, and can realize the processing of curved surfaces. Although the method has certain processing efficiency, the processing efficiency is improved to a limited extent, the polishing solution 8 in the rotating state can only process a single curved surface, the surface shape precision is not known, and the method is not suitable for polishing of a more complex structure.
Disclosure of Invention
Aiming at the defects that the method and the device can not give consideration to the surface shape precision and the surface quality of the micro-structure, the processing efficiency is low and the tool polishing exists. The invention provides a method and a device for vibratory polishing of a fine structure based on shear thickening and chemical composite effect, which have the advantages of surface quality and surface shape precision, simple structure and high processing efficiency for the first time. The invention can realize the high-efficiency polishing of the workpiece 7 with the micro-structure, overcome the problem that the surface quality and the surface shape precision can not be considered simultaneously in the polishing process of the micro-structure, and effectively eliminate the surface defect.
In order to achieve the above purpose, the invention provides the following technical scheme:
a polishing device with a fine structure is realized based on a shear thickening and chemical composite effect and comprises a polishing system, a polishing solution circulating device and a vibrating device. The polishing system is connected with the polishing solution circulating device, polishing solution used for generating shear thickening and chemical composite effects is arranged in the polishing system, flows out of the side face of the polishing system and enters the polishing solution circulating device through a pipeline, and enters the polishing system from the top of the other side face of the polishing system after passing through the polishing solution circulating device, so that the whole polishing solution circulating process is completed. The polishing system is internally provided with a rotating device and a stirring device, and the polishing system drives the polishing solution to rotate at a certain rotating speed and uniformly disperse the polishing solution. The workpiece is connected with the vibrating device and is immersed in the polishing solution, and the polishing solution is subjected to shear thickening in a mode of coupling the vibration of the workpiece and the rotation of the polishing solution, so that the vibration polishing of the surface of the workpiece is completed. Specifically, the method comprises the following steps:
the polishing device for the fine structure comprises a polishing system, a polishing solution circulating device, a vibrating device and an angle adjusting device.
The polishing system comprises a polishing solution 8, a rotating device and a stirring device 15. The polishing solution 8 is placed in a polishing pool. The rotating device comprises a rotating platform 9 and a stepping motor 14, wherein the rotating platform 9 is arranged at the bottom of the polishing pool and is driven to rotate by the stepping motor 14 to drive the polishing solution 8 to rotate at a certain rotating speed. The stirring device 15 is placed in the polishing tank and used for stirring the polishing solution 8 to uniformly disperse the polishing solution 8. The polishing system is connected with a polishing solution circulating device, and the polishing solution 8 flows out of the side surface of the bottom of the polishing pool and enters the polishing solution circulating device through a circulating pipeline 10.
The polishing solution circulating device is positioned below the polishing system and comprises a circulating pipeline 10, and a filtering device 11, a plunger pump 12 and a temperature adjusting device 13 which are sequentially communicated through the circulating pipeline 10. And two ends of the circulating pipeline 10 are respectively connected with the top and the bottom of two side surfaces of the polishing pool and are used for circulating the polishing solution 8. The polishing solution 8 flows out from the bottom of one side surface of the polishing pool, enters the polishing solution circulating device and then flows into the filtering device 11, and a large-particle filter screen and an automatic discharge port are arranged in the filtering device 11, so that large-particle abrasive dust and large-particle clusters 25 generated in the polishing process can be filtered. The filtering device 11 is connected with the plunger pump 12, and the plunger pump 12 provides power for the circular flow of the polishing solution 8, so that the continuous operation of the circular process is ensured. One side of the temperature adjusting device 13 is connected with the plunger pump 12, the other side of the temperature adjusting device is communicated with the top of the other side face of the polishing pool through the circulating pipeline 10, and the polishing liquid 8 enters the polishing pool from the top to complete the whole polishing liquid 8 circulating process. The temperature adjusting device 13 includes a temperature sensor and a temperature adjuster, and is configured to ensure that the temperature of the polishing solution 8 in the entire circulation system is constant, ensure that physical properties such as viscosity of the polishing solution 8 do not change, and ensure consistency of polishing conditions.
The vibration device is positioned above the polishing system and comprises a vibration controller 1, a vibration generator 2 and a piston rod 3, and the bottom of the vibration device is connected with the angle adjusting device. The vibration controller 1 is connected with the vibration generator 2 and used for adjusting amplitude and frequency and ensuring that the polishing solution 8 generates a shear thickening effect, the vibration generator 2 is positioned right above the polishing pool and is a power source of the vibration device, the bottom of the vibration generator 2 is connected with the piston rod 3, and the piston rod 3 is connected with the U-shaped block 4.
The angle adjusting device comprises a U-shaped block 4, a ratchet mechanism 5 and a workpiece clamp 6. The middle part of the upper end of the U-shaped block 4 is connected with the piston rod 3 through a screw, and the bottom of the U-shaped block 4 extends into the polishing solution 8 and is connected with the workpiece clamp 6 through the ratchet mechanism 5. The ratchet mechanism 5 can realize the angle adjustment of 0-90 degrees in the vertical direction, and the single angle adjustment of 15 degrees can be realized. The workpiece clamp 6 is fixedly connected with the microstructure workpiece 7 through a screw.
A polishing method for realizing a fine structure based on the polishing device utilizes the chemical corrosion effect and the shear thickening effect of the non-Newtonian fluid polishing solution 8 to realize the corrosion and polishing of a fine structure workpiece 7. The chemical substance added to the polishing liquid 8 first performs oxidation etching on the workpiece surface layer material to form an etching layer 20. Under the action of vibration, the relative speed of the workpiece and the polishing solution 8 is increased, the polishing solution 8 generates a shear thickening phenomenon, and the micro-cutting action of the abrasive particles 19 in the particle cluster 25 formed on the surface of the workpiece is utilized to remove the corrosion layer 20 on the surface of the workpiece. Under the vibration of the micro-structure workpiece 7 with certain amplitude and frequency, the particle cluster 25 continuously washes the corrosion layer 20 on the surface of the micro-structure workpiece 7, so that the surface material of the workpiece is continuously corroded and removed in a circulating manner. The polished microstructure workpiece 7 has a nano-scale surface roughness and a submicron-scale surface shape precision. The method specifically comprises the following steps:
firstly, preparing a polishing solution 8, ultrasonically mixing abrasive particles 19, a shear thickening phase, an oxidant, an organic acid and a preservative in deionized water according to a certain proportion, and adding a pH regulator into the uniformly mixed polishing solution 8 to regulate the pH value to 3-4. The angle adjusting device is fixed to the end of the vibrating device, and the microstructure workpiece 7 to be polished is fixed to the workpiece holder 6. The prepared polishing solution 8 is added into a polishing pool, and the microstructure workpiece 7 to be polished in a preset amplitude interval is always immersed in the polishing solution 8.
And secondly, starting the polishing solution circulating device to enable the polishing solution 8 to flow in from the top of the polishing pool and flow out from the bottom, and enabling the external polishing solution 8 to flow through the polishing solution circulating device.
And thirdly, starting the stepping motor 14 to enable the rotating platform 9 to rotate at a specified speed, and enabling the rotating platform 9 to drive the polishing solution 8 to rotate, so as to ensure that the workpiece 7 with the fine structure is contacted with the polishing solution 8 in a uniform state during polishing. Wherein, the rotating speed of the stepping motor 14 connected with the rotating platform 9 is set to be 10-20RPM according to the property of the polishing solution 8, thereby ensuring that the polishing process is not influenced.
And fourthly, adjusting the vibration device to a preset amplitude and frequency, and starting the vibration device. The microstructure workpiece 7 moves violently relative to the polishing solution 8, the surface of the microstructure workpiece 7 reacts with chemical substances in the polishing solution 8 rapidly under the action of high speed and high pressure, and an etching layer 20 is formed on the surface of the microstructure workpiece 7. The polishing solution 8 with a certain thickness on the surface of the microstructure workpiece 7 forms particle clusters 25 due to the shear thickening effect, and the micro-cutting effect of the abrasive particles 19 is utilized to realize the efficient and uniform removal of the corrosion layer 20 on the surface of the microstructure workpiece 7, so that the high-quality microstructure surface is obtained. Chemical substances and particle clusters 25 in the polishing solution 8 continuously erode and wash burrs 22, tool marks 23 and peaks 24 on the surface of the microstructure workpiece 7 during the vibration process, and efficient polishing of the surface of the microstructure workpiece 7 is achieved. The preset vibration frequency and the preset vibration amplitude of the vibration device are respectively set to be 25-35 Hz and 20-30 mm, and the shearing rate of the polishing solution 8 on the surface of the workpiece 7 with the fine structure is guaranteed to fall in a shearing and thickening interval.
Because the vibration direction and the fine structure direction are always parallel and the polishing liquid 8 has flexible characteristics, the polished fine structure workpiece 7 maintains good surface shape precision. Wherein, the optical fine structure workpiece 7 requires the surface shape precision to reach micron or submicron level; the micro-fluid chip or the die requires the surface shape precision to reach the micron level; high surface quality is achieved while good surface shape accuracy is maintained.
And fifthly, in the polishing process, the polishing solution circulating device filters the abrasive dust and the large particle cluster 25 generated in the polishing process.
Further, the polishing solution 8 for generating shear thickening and chemical composite effects comprises deionized water, a shear thickening phase, abrasive particles 19, an oxidizing agent, a pH regulator, an organic acid and a preservative, and the pH value is 3-4. The shear thickening phase is polyhydroxy polymer 18, and the mass fraction of the shear thickening phase is 30-40 wt%; the abrasive particles 19 are one or a combination of more of aluminum oxide, silicon carbide, diamond, cerium oxide and zirconium oxide, the particle size is 1-10 mu m, and the proportion is 20-25 wt%; the preservative is sodium benzoate, and the mass fraction of the sodium benzoate is 0.1-0.5 wt%; the oxidant is H2O2The mass fraction is 8 wt%; the pH regulator is NaOH with the mass fraction of 0.1 wt%. The organic acid is citric acid with the mass fraction of 0.5 wt%. The balance of deionized water.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention firstly provides a method for vibrating and polishing a fine structure based on shear thickening and chemical composite effect and verifies the feasibility of the method.
(2) The invention introduces chemical action, combines the vibration polishing method with the chemical action, and has adjustable inclination angle of the micro-structure workpiece and the polishing solution under the vibration action, thereby greatly improving the applicability of the device and the polishing efficiency of the micro-structure workpiece.
(3) The invention can effectively reduce the surface roughness of the workpiece to reach the nanometer level, and can obtain a low/no-damage surface while ensuring higher polishing efficiency under the multiple actions of the abrasive particles and the polyhydroxy polymer.
(4) Based on the advantages of the vibration polishing method, the device can effectively ensure the surface shape precision of the workpiece and realize the surface shape precision of submicron level. The polished workpiece with fine structure has nanometer surface roughness and submicron surface precision.
(5) The device has simple structure, high reliability and easy operation and maintenance.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2(a) is a schematic diagram of the apparatus for polishing a rectangular grating waveguide slow wave microstructure workpiece;
FIG. 2(b) is a schematic diagram of a rectangular grating waveguide slow wave microstructure workpiece.
FIG. 3(a) is a schematic view of the apparatus for polishing a V-groove microstructure workpiece;
fig. 3(b) is a schematic view of a V-groove microstructure workpiece.
FIG. 4(a) is a schematic view showing the surface of an unprocessed microstructure workpiece and the state of a polishing liquid;
FIG. 4(b) is a schematic view showing the surface of a workpiece and the state of a polishing liquid when the method polishes a microstructure workpiece;
FIG. 4(c) is a schematic view showing the surface of the microstructure workpiece after polishing and the state of the polishing liquid.
In the figure: 1, a vibration controller; 2 a vibrator; 3 a piston rod; 4U-shaped blocks; 5, a ratchet mechanism; 6, a workpiece clamp; 7 a microstructure workpiece; 8, polishing solution; 9, a rotating table; 10 a circulation pipeline; 11 a filtration device; 12 a plunger pump; 13 a temperature adjustment device; 14 a stepping motor; 15 a stirring device; 16 rectangular grid waveguide slow wave fine structure workpieces; 17V groove microstructure workpiece; 18 a polyhydroxy polymer; 19 abrasive grains; 20 etching the layer; 21 shearing the elastic layer; 22 burrs; 23 tooling marks; 24 convex peaks; 25 particle clusters.
Detailed Description
The principle and technical solution of the present invention will be described in detail and fully with reference to the following embodiments and accompanying drawings. The described embodiments are only some, not all embodiments of the invention. Based on the following embodiments, other embodiments obtained by persons of ordinary skill in the art without any creative effort belong to the protection scope of the invention.
The abrasive grains 19, the microstructure workpieces 7, and the microstructure workpiece holder 6 in the present invention were all ultrasonically cleaned in ethanol for 10min and dried at 70 ℃ for 30min before the experiment.
Example 1:
referring to fig. 1, 2(a), 2(b), 4(a), 4(b) and 4(c), the apparatus shown in fig. 1 is used to perform shear thickening and chemical co-polishing on a workpiece 16 with a slow-wave microstructure of a rectangular-grating waveguide. The workpiece 16 with the rectangular grid waveguide slow wave fine structure is a core part of an electric vacuum device of a terahertz radiation source, the structural length period of the workpiece is 50 mu m, the workpiece has a high aspect ratio, and the width and the depth of a rectangular groove of the workpiece are respectively 25 mu m and 60 mu m.
The device for vibratory polishing of the rectangular-grid waveguide slow-wave microstructure workpiece 16 based on the shear thickening and chemical composite effect comprises a polishing system, a polishing solution circulating device, a vibrating device and an angle adjusting device.
The polishing system comprises a polishing solution 8, a rotating device and a stirring device 15. The rotary table 9 is driven by a stepping motor 14, and the rotary table 9 drives the polishing solution 8 to rotate so as to promote the circulation of the polishing solution 8 in the polishing system. The stirring device 15 is disposed in the polishing system for uniform dispersion of the polishing liquid 8.
The polishing solution circulating device comprises a circulating pipeline 10, a filtering device 11, a plunger pump 12 and a temperature adjusting device 13. The polishing solution 8 flows out from the bottom of the polishing system and enters a filtering device 11 through a circulating pipeline 10, a large-particle filter screen and an automatic discharge port are arranged in the filtering device 11, abrasive dust and large-particle clusters 25 can be filtered, and the filtering device 11 is connected with a plunger pump 12. The plunger pump 12 is connected to a thermostat 13. The temperature adjusting device 13 is used for controlling the temperature of the polishing solution 8, and ensures that the polishing solution 8 has stable physical properties at a constant temperature. A temperature conditioning device 13 is attached to the top of the polishing system and completes the circulation of the polishing slurry 8.
The vibration device comprises a vibration controller 1, a vibration generator 2 and a piston rod 3. The vibration controller 1 can adjust the amplitude and frequency to ensure the polishing solution 8 to generate a shear thickening effect, the vibration generator 2 is a power source of the vibration device, and the piston rod 3 is used for connecting the clamp and the workpiece.
The angle adjusting device comprises a U-shaped block 4, a ratchet mechanism 5 and a workpiece clamp 6. The upper end of the U-shaped block 4 is connected with the piston rod 3 through a screw, and the lower end of the U-shaped block 4 is connected with the workpiece clamp 6 through the ratchet mechanism 5. The rectangular grid waveguide slow wave microstructure workpiece 16 is fixed on the workpiece clamp 6 through a screw, and the ratchet mechanism 5 is adjusted to enable the rectangular grid waveguide slow wave microstructure workpiece 16 to incline to form an included angle of 30 degrees with the vertical direction.
The method for vibratory polishing of the rectangular grid waveguide slow wave microstructure workpiece 16 based on the shear thickening and chemical compound effect comprises the following steps:
first, preparing a polishing solution 8, mixing 23 wt% of alumina abrasive grains with the grain diameter of 5 mu m, 35 wt% of polyhydroxy polymer 18 and 8 wt% of H2O20.5 wt% of citric acid and 0.5 wt% of preservative sodium benzoate are mixed in deionized water and are subjected to ultrasonic homogenization, and 0.1 wt% of NaOH is added into the uniformly mixed polishing solution 8 to adjust the pH value to 3.5. The angle adjusting device is fixed at the tail end of the vibrating device, the U-shaped block 4, the ratchet mechanism 5 and the workpiece clamp 6 are sequentially connected, and the rectangular grid waveguide slow wave fine structure workpiece 16 is fixed on the workpiece clamp 6. The ratchet mechanism 5 is adjusted until the rectangular grid waveguide slow wave microstructure workpiece 16 is inclined to form an included angle of 30 degrees with the vertical direction. And adding the prepared polishing solution 8 into a polishing system, and adjusting the rectangular grid waveguide slow wave fine structure workpiece 16 to be always immersed in the polishing solution 8.
And secondly, starting the polishing solution circulating device, enabling the polishing solution 8 with the shear thickening effect to flow in from the top of the polishing system and flow out from the bottom, and enabling the external polishing solution 8 to flow through the polishing solution circulating device.
And thirdly, starting the rotating device, starting the stepping motor 14, enabling the rotating platform 9 to rotate at a slow speed, and enabling the rotating platform 9 to drive the polishing solution 8 to rotate, so as to ensure that the workpiece 16 with the rectangular grid waveguide slow wave fine structure is contacted with the polishing solution 8 in a uniform state during polishing.
Fourthly, adjusting the amplitude of the vibration controller 1 to be 25mm and the frequency to be 30Hz, and starting the vibration device. The rectangular grid waveguide slow wave microstructure workpiece 16 moves violently relative to the polishing solution 8, the surface of the rectangular grid waveguide slow wave microstructure workpiece 16 reacts with chemical substances in the polishing solution 8 rapidly under the action of high speed and high pressure, and an erosion layer 20 is formed on the surface of the workpiece. The polishing solution 8 with a certain thickness on the surface of the rectangular-gate waveguide slow-wave microstructure workpiece 16 forms a shear elastic layer 21 due to a shear thickening effect, particle clusters 25 are arranged in the shear elastic layer 21, and the micro-cutting effect of the abrasive particles 19 is utilized to efficiently and uniformly remove the corrosion layer 20 on the surface of the rectangular-gate waveguide slow-wave microstructure workpiece 16, so that a high-quality microstructure surface is obtained. In the vibration process, chemical substances and particle clusters 25 in the polishing solution 8 continuously corrode and scour burrs 22, tool marks 23 and peaks 24 on the surface of the rectangular-gate-waveguide slow-wave microstructure workpiece 16, so that efficient polishing of the rectangular-gate-waveguide slow-wave microstructure workpiece 16 is realized. Due to the fact that the vibration direction and the direction of the rectangular grid waveguide slow wave fine structure are always parallel and the flexible characteristic of the elastic layer 21 is cut, the polished rectangular grid waveguide slow wave fine structure workpiece 16 keeps good surface shape accuracy.
And fifthly, in the polishing process, the polishing solution circulating device can filter abrasive dust and large particle clusters 25 generated in the polishing process.
Example 2:
referring to fig. 1, 3(a), 3(b), 4(a), 4(b), 4(c), shear thickening polishing of the V-groove microstructure workpiece 17 is carried out using the apparatus shown in fig. 1. The V-groove microstructure workpiece 17 is used in a fiber optic connector for precise alignment of the core pitch between optical fibers with a length period of 250 μm and a V-groove valley depth of 100 μm. The structure is similar to that of the device in the embodiment 1, and the device comprises a polishing system, a polishing solution circulating device, a vibrating device and an angle adjusting device. In contrast, the apparatus for vibratory polishing of the V-groove microstructure workpiece 17 based on the shear thickening and chemical composite effect adjusts the workpiece to the vertical direction at the time of polishing. The method for vibration polishing the V-groove microstructure workpiece 17 based on the shear thickening and chemical compound effect comprises the following steps:
first, preparing a polishing solution 8, mixing 23 wt% of alumina abrasive grains with the grain diameter of 5 mu m, 35 wt% of polyhydroxy polymer 18 and 8 wt% of H2O20.5 wt% of citric acid and 0.5 wt% of preservative sodium benzoate are mixed in deionized water and are subjected to ultrasonic homogenization, and 0.1 wt% of NaOH is added into the uniformly mixed polishing solution 8 to adjust the pH value to 3.5. The angle adjusting device is fixed at the tail end of the vibrating device, the U-shaped block 4, the ratchet mechanism 5 and the workpiece clamp 6 are sequentially connected, and the V-groove microstructure workpiece 17 is fixed on the workpiece clamp 6. The adjustment ratchet mechanism 5 brings the V-groove microstructure workpiece 17 to the vertical direction and fixes. Adding the prepared polishing solution 8 into a polishing pool, and adjusting the V-groove microstructure workpiece 17 to be always immersed in the polishing solution 8。
Steps 2-5 are similar to the polishing method for the rectangular grid waveguide slow wave microstructure workpiece 16.
The device adopts a vibration method to polish based on the composite effect of shear thickening and chemistry, has a simple structure, is easy to maintain, and can realize the high-efficiency polishing of micro-structure workpieces such as small-area planes, V-shaped grooves, slow-wave structures, micro-fluid structures and the like. The introduction of chemical action can accelerate the rapid corrosion and removal of burrs, tool marks and peaks on the surface of a micro-structural workpiece. Based on the advantages of the method with adjustable vibration and angle, the problem that the surface quality and the surface shape precision cannot be considered in the polishing process of the microstructure tool is solved, and the polished microstructure workpiece can reach the nanometer surface roughness and the submicron surface shape precision.
The above-mentioned embodiments only express the embodiments of the present invention, but not should be understood as the limitation of the scope of the invention patent, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these all fall into the protection scope of the present invention.
Claims (4)
1. The polishing device for the fine structure is characterized by comprising a polishing system, a polishing solution circulating device and a vibrating device; the polishing system is connected with the polishing solution circulating device, polishing solution for generating shear thickening and chemical composite effects is arranged in the polishing system, flows out of the side face of the polishing system and enters the polishing solution circulating device through a pipeline, and enters the polishing system from the top of the other side face of the polishing system after passing through the polishing solution circulating device, so that the whole polishing solution circulating process is completed; a rotating device and a stirring device are arranged in the polishing system, and the polishing system drives the polishing solution to rotate at a certain rotating speed and uniformly disperse the polishing solution; the workpiece is connected with the vibrating device and is immersed in the polishing solution, and the polishing solution is subjected to shear thickening in a mode of coupling the vibration of the workpiece and the rotation of the polishing solution, so that the vibration polishing of the surface of the workpiece is completed;
the device comprises a polishing system, a polishing solution circulating device, a vibrating device and an angle adjusting device;
the polishing system comprises a polishing solution (8), a rotating device and a stirring device (15); the polishing solution (8) is arranged in a polishing pool; the rotating device comprises a rotating platform (9) and a stepping motor (14), the rotating platform (9) is arranged at the bottom of the polishing pool and is driven to rotate by the stepping motor (14) to drive the polishing solution (8) to rotate; the stirring device (15) is arranged in the polishing pool and is used for uniformly dispersing the polishing solution (8); the polishing system is connected with the polishing solution circulating device, and the polishing solution (8) flows out of the side surface of the bottom of the polishing pool and enters the polishing solution circulating device through a circulating pipeline (10);
the polishing solution circulating device is positioned below the polishing system and comprises a circulating pipeline (10), and a filtering device (11), a plunger pump (12) and a temperature adjusting device (13) which are sequentially communicated through the circulating pipeline (10); two ends of the circulating pipeline (10) are respectively connected with the top and the bottom of two side surfaces of the polishing pool and are used for circulating the polishing solution (8); the polishing solution (8) flows out from the bottom of one side face of the polishing pool, enters the polishing solution circulating device and then flows into the filtering device (11), and a large-particle filter screen and an automatic discharge port are arranged in the filtering device (11) and can filter large-particle abrasive dust and large-particle clusters (25) generated in the polishing process; one side of the plunger pump (12) is connected with the filtering device (11), the other side of the plunger pump is communicated with the top of the other side face of the polishing pool after passing through the temperature adjusting device (13), polishing liquid (8) enters the polishing pool from the top to complete the whole polishing liquid circulation process, wherein the plunger pump (12) provides power for the polishing liquid (8) to circularly flow; the temperature adjusting device (13) comprises a temperature sensor and a temperature adjuster and is used for ensuring the constant temperature of the polishing solution (8) in the whole circulating system and ensuring the consistency of polishing conditions;
the vibration device is positioned above the polishing system and comprises a vibration controller (1), a vibration generator (2) and a piston rod (3), and the bottom of the vibration device is connected with the angle adjusting device; the vibration controller (1) is connected with the vibration generator (2) and used for adjusting amplitude and frequency and ensuring that the polishing solution (8) generates a shear thickening effect, the vibration generator (2) is positioned right above the polishing pool and is a power source of the vibration device, and the bottom of the vibration generator (2) is connected with the piston rod (3);
the angle adjusting device comprises a U-shaped block (4), a ratchet mechanism (5) and a workpiece clamp (6); the middle part of the horizontal end of the U-shaped block (4) is connected with the bottom of the piston rod (3), the vertical end of the U-shaped block (4) extends into the polishing solution (8), and the bottom of the U-shaped block is connected with a workpiece clamp (6) through a ratchet mechanism (5); the ratchet mechanism (5) can realize the angle adjustment of 0-90 degrees with the vertical direction; the workpiece clamp (6) is fixedly connected with the micro-structure workpiece (7).
2. A microstructure polishing device according to claim 1, characterized in that the ratchet mechanism (5) is angularly adjustable by 15 ° in a single pass.
3. A polishing method for realizing a fine structure based on the polishing apparatus of claim 1 or 2, characterized in that the method is to realize the corrosion and polishing of a fine-structure workpiece (7) by using chemical corrosion and shear thickening effect of a non-newtonian fluid polishing liquid (8); firstly, oxidizing and corroding a workpiece surface layer material by chemical substances added into the polishing solution (8) to form a corrosion layer (20); under the action of vibration, the relative speed of the workpiece and the polishing solution (8) is increased, the polishing solution (8) generates a shear thickening phenomenon, and the micro-cutting action of abrasive particles (19) in a particle cluster (25) formed on the surface of the workpiece is utilized to remove a corrosion layer (20) on the surface of the workpiece; under the vibration of a micro-structure workpiece (7) with certain amplitude and frequency, the particle clusters (25) continuously scour the surface corrosion layer (20) of the micro-structure workpiece (7) to realize the continuous corrosion and removal of the surface material of the workpiece; the polished workpiece (7) with the micro structure has the nanometer surface roughness and the submicron surface precision; the method specifically comprises the following steps:
firstly, preparing polishing solution (8), ultrasonically mixing abrasive particles (19), a shear thickening phase, an oxidant, an organic acid and a preservative in deionized water according to a certain proportion, and adding a pH regulator into the uniformly mixed polishing solution (8) to regulate the pH value to 3-4; fixing an angle adjusting device at the tail end of a vibrating device, and fixing a micro-structure workpiece (7) to be polished on a workpiece clamp (6); adding polishing solution (8) into a polishing pool, and immersing a microstructure workpiece (7) to be polished in the polishing solution (8) in a preset amplitude interval all the time;
secondly, starting the polishing solution circulating device to enable the polishing solution (8) to flow in from the top of the polishing pool and flow out from the bottom, and enabling the external polishing solution (8) to flow through the polishing solution circulating device;
thirdly, starting a stepping motor (14) to enable the rotating table (9) to rotate at a specified speed, and enabling the rotating table (9) to drive the polishing solution (8) to rotate so as to ensure that the workpiece (7) with the fine structure is contacted with the polishing solution (8) in a uniform state during polishing; wherein the rotating speed of the stepping motor (14) is set to be 10-20RPM according to the property of the polishing solution (8);
fourthly, adjusting the vibration device to a preset amplitude and frequency, and starting the vibration device; the microstructure workpiece (7) moves violently relative to the polishing solution (8), the surface of the microstructure workpiece (7) reacts with chemical substances in the polishing solution (8) rapidly under the action of high speed and high pressure, and a corrosion layer (20) is formed on the surface of the microstructure workpiece (7); the polishing solution (8) on the surface of the micro-structure workpiece (7) forms particle clusters (25) due to the shear thickening effect, and the micro-cutting effect of the abrasive particles (19) is utilized to realize the efficient and uniform removal of the corrosion layer (20) on the surface of the micro-structure workpiece (7), so that the high-quality micro-structure surface is obtained; chemical substances and particle clusters (25) in the polishing solution (8) continuously corrode and scour burrs (22), tool marks (23) and convex peaks (24) on the surface of the workpiece (7) with the fine structure in the vibration process, so that the surface of the workpiece (7) with the fine structure is efficiently polished; wherein the preset vibration frequency and amplitude of the vibration device are respectively set to be 25-35 Hz and 20-30 mm;
and fifthly, in the polishing process, the polishing solution circulating device filters abrasive dust and large particle clusters (25) generated in the polishing process.
4. A polishing method according to claim 3, characterized in that in the polishing liquid (8), the shear thickening phase is a polyhydroxy polymer (19) with a mass fraction of 30 to 40 wt%; the abrasive particles (19) are one or a combination of more of aluminum oxide, silicon carbide, diamond, cerium oxide and zirconium oxide, the particle size is 1-10 mu m, and the proportion is 20-25 wt%; the preservative is sodium benzoate, and the mass fraction of the sodium benzoate is 0.1-0.5 wt%; the oxidant is H2O2The mass fraction is 8 wt%; the pH regulator is NaOH with the mass fraction of 0.1 wt%; the organic acidSelecting citric acid with the mass fraction of 0.5 wt%; the balance of deionized water.
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|---|---|---|---|---|
| CN113103070B (en) * | 2021-03-05 | 2022-07-26 | 华南理工大学 | Method for machining microgrooves by shearing, thickening and abrasive flow combined grinding |
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| CN114800238A (en) * | 2022-05-11 | 2022-07-29 | 北京博海康源医疗器械有限公司 | Method and device for removing burrs of micro scalpel through shear thickening |
| CN114800057A (en) * | 2022-05-11 | 2022-07-29 | 浙江工业大学 | Polishing device based on non-Newtonian fluid film shearing mechanism |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201005101Y (en) * | 2007-03-21 | 2008-01-16 | 王先进 | Arrangement for installing eyeglasses on the hat edge |
| CN101417401B (en) * | 2008-11-28 | 2010-08-11 | 太原理工大学 | Complicated surface optical finishing processing device and technique |
| CN101844320B (en) * | 2010-06-07 | 2011-09-14 | 湖南大学 | Precise high-efficiency polishing method and device for curved surface parts |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN205148034U (en) * | 2015-10-20 | 2016-04-13 | 浙江工业大学 | Workpiece surface polishing burring processingequipment based on shear -thickening mechanism |
| CN106466802A (en) * | 2015-08-18 | 2017-03-01 | 昆山纳诺新材料科技有限公司 | Polishing system based on non-Newtonian fluid and its finishing method |
| CN111216031A (en) * | 2020-02-26 | 2020-06-02 | 西南交通大学 | Ultraprecise flexible chemical mechanical polishing device and method for micro bearing core element |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1067656A (en) * | 1965-12-22 | 1967-05-03 | Wissenchaftlich Tech Zentrum A | Method for the abrasive treatment of workpieces |
| US20070056358A1 (en) * | 2005-09-12 | 2007-03-15 | Liu James Z | Micro-rheometer |
| CN101104244A (en) * | 2006-07-10 | 2008-01-16 | 宁波工程学院 | Ultrasonic magnetic-granular composite milling method and its device |
-
2020
- 2020-06-03 CN CN202010492333.6A patent/CN111716232B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201005101Y (en) * | 2007-03-21 | 2008-01-16 | 王先进 | Arrangement for installing eyeglasses on the hat edge |
| CN101417401B (en) * | 2008-11-28 | 2010-08-11 | 太原理工大学 | Complicated surface optical finishing processing device and technique |
| CN101844320B (en) * | 2010-06-07 | 2011-09-14 | 湖南大学 | Precise high-efficiency polishing method and device for curved surface parts |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN106466802A (en) * | 2015-08-18 | 2017-03-01 | 昆山纳诺新材料科技有限公司 | Polishing system based on non-Newtonian fluid and its finishing method |
| CN205148034U (en) * | 2015-10-20 | 2016-04-13 | 浙江工业大学 | Workpiece surface polishing burring processingequipment based on shear -thickening mechanism |
| CN111216031A (en) * | 2020-02-26 | 2020-06-02 | 西南交通大学 | Ultraprecise flexible chemical mechanical polishing device and method for micro bearing core element |
Non-Patent Citations (1)
| Title |
|---|
| 圆柱表面声波辅助剪切增稠抛光优化实验研究;戴伟涛;《表面技术》;20160220;188-193 * |
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