CN111711908A - Miniature microphone dust keeper and MEMS microphone - Google Patents
Miniature microphone dust keeper and MEMS microphone Download PDFInfo
- Publication number
- CN111711908A CN111711908A CN202010621357.7A CN202010621357A CN111711908A CN 111711908 A CN111711908 A CN 111711908A CN 202010621357 A CN202010621357 A CN 202010621357A CN 111711908 A CN111711908 A CN 111711908A
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- Prior art keywords
- protective layer
- microphone
- miniature microphone
- hole
- dust keeper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000428 dust Substances 0.000 title claims description 12
- 239000011241 protective layer Substances 0.000 claims abstract description 44
- 230000001681 protective effect Effects 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000001914 filtration Methods 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 15
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 35
- 239000010408 film Substances 0.000 description 34
- 230000008646 thermal stress Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention provides a miniature microphone dustproof device and an MEMS (micro-electromechanical systems) microphone, wherein the miniature microphone dustproof device comprises a supporting carrier and an entering protective film arranged on the supporting carrier; wherein the support carrier is formed with a through hole, and the entry protection film covers the through hole; the entrance protective film comprises a first protective layer arranged on the support carrier and a second protective layer fixed on the first protective layer, wherein the first protective layer and the second protective layer are made of different materials. The invention can effectively solve the problem that the film structure on the existing miniature microphone dustproof device is bent under the high-temperature environment.
Description
Technical Field
The invention relates to the technical field of miniature microphone dust prevention, in particular to a miniature microphone dust prevention device and an MEMS (micro-electromechanical systems) microphone.
Background
In order to prevent the chip inside the microphone from being affected by external powder, particles and moisture, and therefore reduce the service life of the microphone, in general, a miniature microphone dust-proof device needs to be designed at a communication position (such as a sound hole) between the inside of the microphone and the outside, and the microphone chip is separated from the outside environment through the miniature microphone dust-proof device, so that the microphone chip is protected.
However, the conventional microphone micro microphone dust-proof device generally comprises a carrier and a thin film structure disposed on the carrier, wherein the carrier is generally a polymer product, and the thin film structure is generally a metal product, and because CTE mismatch (coefficient of thermal expansion) of the two materials is generated, the polymer is deformed at a high temperature during the installation process of the microphone dust-proof device, especially during the heat treatment process, and the functional structure is bent at room temperature. Moreover, the interior of the micro-microphone dust-proof device (mainly at the interface of the materials) generates strong thermal stress, and for the thin film structure (protective film), the thermal stress can cause the thin film structure to buckle and cause uncontrollable deformation, and further cause irregular wrinkles on meshes on the thin film structure, thereby reducing the use effect and prolonging the service life.
In view of the above technical problems, a method for preventing buckling of a thin film structure in a high temperature environment is needed.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a micro microphone dust-proof device and an MEMS microphone, so as to solve the problem that the thin film structure on the conventional micro microphone dust-proof device is bent under a high temperature environment.
The miniature microphone dustproof device provided by the embodiment of the invention comprises a support carrier and an entering protective film arranged on the support carrier; wherein the support carrier is formed with a through hole, and the entry protection film covers the through hole; the entrance protective film comprises a first protective layer arranged on the support carrier and a second protective layer fixed on the first protective layer, wherein the first protective layer and the second protective layer are made of different materials.
In addition, it is preferable that the entrance protection film further includes a third protection layer provided on the second protection layer, and the third protection layer is made of a material different from that of the second protection layer.
In addition, it is preferable that the support carrier is a polymer product, the first protective layer is a metal product, the second protective layer is a polymer product, and the third protective layer is a metal product.
In addition, it is preferable that the support carrier is a polymer product, the first protective layer is a polymer product, the second protective layer is a metal product, and the third protective layer is a polymer product.
In addition, it is preferable that the thicknesses of any two layers of the first protective layer, the second protective layer, and the third protective layer are the same or different.
In addition, it is preferable that the first protective layer includes a connection portion and a filter portion, and the filter portion is connected to the support carrier through the connection portion; and the filtering part corresponds to the upper and lower positions of the through hole.
In addition, preferably, the cross sections of the filtering part and the through hole are both circular structures; and the meshes on the filtering part are in a circular, polygonal or special-shaped structure.
In addition, it is preferable that the mesh on the filter part has a honeycomb topology; and,
each regular hexagon in the honeycomb topological structure is formed by six regular triangle topologies.
Furthermore, it is preferable that the filter portion is made of a material having a hydrophobic property.
In another aspect, the present invention further provides a MEMS microphone, which includes a substrate, a housing, a MEMS chip, and the above-mentioned micro microphone dust-proof device; a packaging structure is formed between the substrate and the shell, and the MEMS chip is arranged on the substrate in the packaging structure; and the substrate is provided with a sound hole corresponding to the upper position and the lower position of the MEMS chip, and the miniature microphone dustproof device is arranged outside the sound hole or between the sound hole and the MEMS chip.
According to the technical scheme, the micro microphone dustproof device provided by the invention has the advantages that the entering protective film is arranged into a multilayer structure, so that the uncontrollable deformation of the metal/polymer film on the functional structure can be effectively reduced; furthermore, by using materials with different CTE's on each layer, thermal stress can be controlled; in addition, the filter part is arranged on the first protective layer, so that external powder and particles can be effectively prevented from entering the microphone to influence the performance of the microphone chip; in addition, by making the filter part of a material having hydrophobic properties, a waterproof effect of the filter part can be achieved, thereby protecting the microphone chip inside the microphone.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
fig. 1(a) is a front sectional view of a dust-proof device for a micro microphone according to an embodiment of the present invention;
fig. 1(b) is a front sectional view of a dust-proof device for a micro microphone according to another embodiment of the present invention;
fig. 2 is a top view of a dust-proof device for a micro microphone according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of a filter portion according to an embodiment of the present invention;
fig. 4(a) is a front sectional view of a microphone according to an embodiment of the present invention;
fig. 4(b) is a front sectional view of a microphone according to another embodiment of the present invention.
Wherein the reference numerals include: the structure comprises a support carrier 11, an access protection film 12, a first protection layer 121, a second protection layer 122, a third protection layer 123, a connecting part 124, a filtering part 125, a substrate 13, a MEMS chip 14, a shell 15, an acoustic hole 16, a honeycomb topological structure 17 and a through hole 18.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
To describe the structure of the miniature microphone dust-proof device of the present invention in detail, specific embodiments of the present invention will be described below with reference to the accompanying drawings.
Fig. 1(a) and 1(b) respectively show the front cross-sectional structure of a miniature microphone dust-proof device provided by two embodiments of the present invention, and as can be seen from fig. 1(a) and 1(b), the miniature microphone dust-proof device provided by the present invention comprises a supporting carrier 11 for supporting and an entrance protection film 12 arranged on the supporting carrier 11, wherein the entrance protection film 12 allows air to pass through but blocks external powder, particles and the like from passing through; the support carrier 11 is a hollow structure, i.e., a through hole 18 is formed in the center, and the through hole 18 is covered by the protective film 12 in a plan view; further, the entrance protection film 12 includes a first protection layer 121 provided on the support carrier 11 (shown in fig. 1 (a)) or inside the support 11 (shown in fig. 1 (b)) and a second protection layer 122 fixed on the first protection layer 121 (shown in fig. 1 (a)), or fixed on the first protection layer 121 and the support carrier 11 (shown in fig. 1 (b)); the first passivation layer 121 and the second passivation layer 122 are made of different materials.
According to the invention, the entering protective film 12 is designed into a multilayer structure consisting of a plurality of protective layers, so that the matching degree of the entering protective film 12 can be obviously improved on the premise of ensuring that the entering protective film 12 has a stronger filtering effect, and the entering protective film 12 has smaller internal thermal stress, and in addition, the uncontrollable deformation of the entering protective film 12 on the functional structure can be further reduced and the curvature of the entering protective film 12 can be effectively controlled by manufacturing the protective layers by using different materials.
In addition, in order to further reduce the thermal stress entering the interior of the protection film 12, the entering protection film 12 may further include a third protection layer 123 disposed on the second protection layer 122, the third protection layer 123 is made of a material different from that of the second protection layer 122, and by designing the entering protection film 12 to have a layered structure including at least two protection layers, the thermal stress entering the interior of the protection film can be further balanced, and the layers entering the protection film 12 are prevented from buckling.
Specifically, the support carrier 11 may be designed as a polymer piece, the first protection layer 121 as a metal piece, the second protection layer 122 as a polymer piece, and the third protection layer 123 as a metal piece; further, the metal part may be a liquid metal part; it should be noted that, from a microscopic view, the three protective layers have a certain gap therebetween, and since the metal and the polymer have different thermal expansion coefficients, thermal stress entering between the layers of the protective film can be effectively controlled.
On the other hand, the supporting carrier 11 may also be designed as a polymer product, the first protection layer 121 is designed as a polymer product, the second protection layer 122 is designed as a metal product, and the third protection layer 123 is designed as a polymer product, because the supporting carrier 11 is a polymer product and the first protection layer 121 needs to be fixedly connected with the supporting carrier 11, the design of the first protection layer 121 as a polymer product can reduce the thermal stress between the first protection layer 121 and the supporting carrier 11, and prevent the first protection layer 121 from buckling at a high temperature. Further, the metal part may be a liquid metal (amorphous alloy) part to improve strength, hardness and toughness.
In addition, the thicknesses of any two of the first protective layer 121, the second protective layer 122, and the third protective layer 123 are the same or different, and it should be noted that the thicknesses of the respective layers may be determined according to actual needs (meeting filtering requirements), and by designing the respective thicknesses for each layer, the thermal stress entering the protective film can be effectively controlled.
The entry protection film 12 may cover one end of the through hole 18, or may be provided in the through hole 18, for example, at the center in the depth direction of the through hole 18 so as to cover the through hole 18 in a plan view. In the case of the structure in which the entry protection film 12 covers one end of the through hole 18 of the support carrier 11, the accurate assembly direction can be easily recognized in the process of assembling the micro microphone dust-proofing device to the substrate of the microphone. When the structure that the entering protective film 12 is arranged in the through hole 18 is adopted, in the process of assembling the micro microphone dustproof device on the substrate of the microphone, the installation direction does not need to be distinguished, the efficiency of the assembling process can be improved, and the entering protective film 12 is positioned in the through hole 18, so that the entering protective film 12 can be prevented from being damaged due to the fact that the entering protective film 12 is contacted in the assembling process and the transporting process. In the following description, a structure in which the entry protection film 12 covers one end of the through hole 18 will be described as an example.
In addition, fig. 2 shows a top view structure of the dust-proof device for the miniature microphone according to the embodiment of the present invention, as can be seen from fig. 2, the first protective layer 121 includes a connecting portion 124 for connection and a filtering portion 125 for filtering external powder and particles, and the filtering portion 125 is connected to the supporting carrier 11 through the connecting portion 124; the filter 125 is vertically aligned with the through hole 18. In the actual operation process, outside sound signals enter the microphone through the filter part 125, and outside powder, particles and the like are blocked outside the microphone by the filter part 125, so that the dustproof effect is achieved.
Specifically, since the sound hole 16 of the microphone is generally circular in structure, in order to achieve the fitting between the micro microphone dust-proof device and the sound hole 16, the cross sections of the filter portion 125 and the through hole 18 may be circular; in addition, the filter unit 125 is provided with a mesh having a circular, polygonal or irregular structure, thereby achieving a desired filtering effect.
More specifically, fig. 3 shows a partial enlarged structure of the filter portion 125 provided by the embodiment of the present invention, and as can be seen from fig. 3, the mesh on the filter portion 125 is a honeycomb topology 17; and, each regular hexagon within the cellular topology 17 is formed by six regular triangle topologies. By adopting the design, the filter part 125 can be firmer on the premise of ensuring the filtering effect of the filter part 125, and the service life of the dustproof device of the miniature microphone can be further prolonged.
In addition, in order to prevent external moisture from entering the microphone through the filter 125 and damaging the microphone chip 14, the filter 125 may be made of a material having a hydrophobic property.
In addition, fig. 4(a) and 4(b) respectively show the front cross-sectional structures of MEMS microphones provided by two embodiments of the present invention, and as can be seen from fig. 4(a) and 4(b), the present invention further provides a MEMS microphone, which includes a substrate 13 for carrying a chip, a protective housing 15, a MEMS chip 14, and the above-mentioned micro microphone dust-proof device; wherein, an encapsulation structure is formed between the substrate 13 and the housing 15, and the MEMS chip 14 is disposed on the substrate 13 (fig. 4(a)) or on the protective film 12 (fig. 4(b)) within the encapsulation structure; moreover, the substrate 13 is provided with the sound hole 16 corresponding to the upper and lower positions of the MEMS chip 14, and the micro microphone dust-proof device is disposed outside the sound hole 16 or between the sound hole 16 and the MEMS chip 14 as long as the function of covering the sound hole 16 by the micro microphone dust-proof device is satisfied.
Specifically, when the miniature microphone dust-proof device is disposed between the sound hole 16 and the MEMS chip 14, the miniature microphone dust-proof device may be disposed between the sound hole 16 and the MEMS chip 14 by connecting the support carrier 11 with the substrate 13; also, the entrance protection film 12 is disposed between the acoustic hole 16 and the MEMS chip 14.
In this way, a channel formed by the sound hole 16 and the through hole 18 is formed, through which external sound signals enter the inside of the microphone, and external powder, particles and moisture are blocked by the filter 125 in the channel, so that the MEMS chip 14 inside the housing 15 is protected.
As can be seen from the above embodiments, the dust-proof device for a miniature microphone according to the present invention has at least the following advantages:
1. by arranging the access protective film into a multilayer structure, uncontrollable deformation of the metal/polymer film on the functional structure can be effectively reduced;
2. by using materials with different CTE's on each layer, thermal stress can be controlled;
3. the filter part is made of the hydrophobic material, so that the waterproof effect of the filter part can be realized, and a microphone chip in the microphone is protected;
4. the mesh on the filtering part is designed into a honeycomb topological structure, so that the filtering part is firmer on the premise of ensuring the filtering effect of the filtering part, and the service life of the dustproof device of the miniature microphone is prolonged.
The dust-proof device for a miniature microphone and the MEMS microphone according to the present invention have been described above by way of example with reference to the accompanying drawings. However, it will be understood by those skilled in the art that various modifications may be made to the above-described miniature microphone dust-proof device and MEMS microphone of the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (9)
1. A miniature microphone dust keeper, characterized by, including supporting the carrier and setting up entering the protective film on the said supporting the carrier; wherein,
the supporting carrier is provided with a through hole, and the access protective film covers the through hole; and,
the entering protective film comprises a first protective layer arranged on the supporting carrier and a second protective layer fixed on the first protective layer, wherein the first protective layer and the second protective layer are made of different materials.
2. The miniature microphone dust keeper of claim 1,
the entering protective film further comprises a third protective layer arranged on the second protective layer, and the third protective layer is made of a material different from that of the second protective layer.
3. The miniature microphone dust keeper of claim 2,
the supporting carrier is a polymer product, the first protective layer is a metal product, the second protective layer is a polymer product, and the third protective layer is a metal product.
4. The miniature microphone dust keeper of claim 2,
the support carrier is a polymer part, the first protective layer is a polymer part, the second protective layer is a metal part, and the third protective layer is a polymer part.
5. The miniature microphone dust keeper of claim 1,
the first protective layer comprises a connecting part and a filtering part, and the filtering part is connected with the support carrier through the connecting part; and,
the filtering part corresponds to the upper and lower positions of the through hole.
6. The miniature microphone dust keeper of claim 5,
the cross sections of the filtering part and the through hole are both circular structures; and,
the meshes on the filtering part are in a circular, polygonal or special-shaped structure.
7. The miniature microphone dust keeper of claim 6,
the meshes on the filtering part are in a honeycomb topological structure; and,
each regular hexagon in the honeycomb topological structure is formed by six regular triangle topologies.
8. The miniature microphone dust keeper of claim 7,
the filter portion is made of a material having hydrophobic properties.
9. A MEMS microphone comprising a substrate, a housing, a MEMS chip, and the miniature microphone dust-proof device of any one of claims 1 to 8; wherein,
a packaging structure is formed between the substrate and the shell, and the MEMS chip is arranged on the substrate in the packaging structure; and,
the substrate is provided with a sound hole corresponding to the upper position and the lower position of the MEMS chip, and the miniature microphone dustproof device is arranged outside the sound hole or between the sound hole and the MEMS chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621357.7A CN111711908A (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621357.7A CN111711908A (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111711908A true CN111711908A (en) | 2020-09-25 |
Family
ID=72545061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010621357.7A Pending CN111711908A (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111711908A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492477A (en) * | 2020-12-02 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN112492483A (en) * | 2020-12-02 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper, MEMS microphone and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101158354B1 (en) * | 2011-12-29 | 2012-06-22 | (주)다빛다인 | Microphone package |
| US20140299949A1 (en) * | 2009-05-11 | 2014-10-09 | Stmicroelectronics S.R.I. | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
| CN208540162U (en) * | 2018-02-11 | 2019-02-22 | 瑞声科技(新加坡)有限公司 | MEMS microphone |
| CN110972046A (en) * | 2019-12-31 | 2020-04-07 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN110978699A (en) * | 2019-11-14 | 2020-04-10 | 徐蕾 | Dustproof antifogging film and preparation method thereof |
-
2020
- 2020-06-30 CN CN202010621357.7A patent/CN111711908A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140299949A1 (en) * | 2009-05-11 | 2014-10-09 | Stmicroelectronics S.R.I. | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
| KR101158354B1 (en) * | 2011-12-29 | 2012-06-22 | (주)다빛다인 | Microphone package |
| CN208540162U (en) * | 2018-02-11 | 2019-02-22 | 瑞声科技(新加坡)有限公司 | MEMS microphone |
| CN110978699A (en) * | 2019-11-14 | 2020-04-10 | 徐蕾 | Dustproof antifogging film and preparation method thereof |
| CN110972046A (en) * | 2019-12-31 | 2020-04-07 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492477A (en) * | 2020-12-02 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN112492483A (en) * | 2020-12-02 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper, MEMS microphone and electronic equipment |
| CN112492483B (en) * | 2020-12-02 | 2022-08-16 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper, MEMS microphone and electronic equipment |
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Application publication date: 20200925 |