CN111710629A - Wafer centering mechanism - Google Patents
Wafer centering mechanism Download PDFInfo
- Publication number
- CN111710629A CN111710629A CN202010580882.9A CN202010580882A CN111710629A CN 111710629 A CN111710629 A CN 111710629A CN 202010580882 A CN202010580882 A CN 202010580882A CN 111710629 A CN111710629 A CN 111710629A
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- ring
- plate
- centering mechanism
- shielding
- wafer centering
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- 230000007246 mechanism Effects 0.000 title claims abstract description 22
- 230000001276 controlling effect Effects 0.000 claims abstract description 22
- 230000001105 regulatory effect Effects 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 9
- 241000883990 Flabellum Species 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000033228 biological regulation Effects 0.000 claims description 2
- 210000002583 cell-derived microparticle Anatomy 0.000 claims 3
- 230000000903 blocking effect Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 8
- 230000008859 change Effects 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000639 Spring steel Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005375 photometry Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer centering mechanism, which comprises a screen plate, a centering table, a central hole, a bottom disc, a mounting box, a rotating disc, a control handle, a key board and a regulating component, wherein the regulating component is optimally arranged, the position of a transmission rod is simply controlled by using an external control handle and the rotating disc, so that the included angle of a hinge point between hinges is changed, the position change of a blocking part on a detection lamp is further indirectly controlled, the structure is simple, an irradiation source is efficiently blocked, the imaging radius of a detection light source is controlled, and the using effect is good; through optimizing and having set up the ring piece of shielding and controlling group, simple and easy first semi-ring, separation ring piece cooperation structure are driven at L frame piece and are rotated, can utilize simple and easy first semi-ring, the cooperation of second semi-ring to separate local light source and upwards transmit, and inside cooperation structure cooperation is effectual.
Description
Technical Field
The invention relates to the field of semiconductor part positioning, in particular to a wafer centering mechanism.
Background
The wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystal material and has a circular shape, and the substrate material includes silicon, germanium, GaAs, InP, GaN, and the like.
When using, because the lamp body that needs control wafer center and the sending out of probe lamp shines, and in the wafer testing process that lasts, photometry radius size is fixed, is difficult to high-efficient separation irradiation source control and detects the light source and is like the radius, and inside cooperation structure cooperation effect is general.
Disclosure of Invention
Technical problem to be solved
Accordingly, to address the above-mentioned deficiencies, the present invention provides a wafer centering mechanism.
(II) technical scheme
The invention is realized in such a way that a wafer centering mechanism is constructed, the device comprises a screen plate, a centering table, a central hole, a bottom disc, an installation box, a rotating disc, a control handle, a key plate and a regulating and controlling assembly, the screen plate is embedded and installed on the right side surface of the installation box, the center of the centering table is provided with the central hole in a penetrating way, the bottom end of the centering table is fixedly installed on the bottom disc, the rotating disc is rotatably installed on the side surface of the installation box, the control handle is fixedly installed on the rotating disc in a fastening way, the key plate is embedded and installed on the side surface of the installation box, the regulating and controlling assembly is installed in the installation box, the regulating and controlling assembly comprises a frame plate, a transmission rod, an inclined rod, a shell, a shielding and controlling ring assembly, a triangular plate, a detection lamp, a spring, a square plate, a thick rod, a lamp circuit plate, a hollow groove, the inclined rod is connected with the triangular plate through a hinge, a hollow groove is fixedly installed on the shell, a heat dissipation fan is fixedly installed on the hollow groove, the shielding and control ring assembly is rotatably connected with the frame plate, the detection lamp is nested on the left side of the lamp circuit board, the spring is elastically connected with the square plate, and the square plate is connected with the thick rod through a hinge.
Preferably, the shielding and controlling ring component comprises an L-shaped frame piece, a first half ring, a blocking ring piece and a second half ring, the L-shaped frame piece is fixedly connected to the outer side end of the first half ring in an inserting mode, the blocking ring piece is installed on the inner side of the first half ring in a bonding mode, the first half ring and the second half ring are identical in structure, and the center of the blocking ring piece vertically corresponds to the center hole.
Preferably, the heat dissipation fan includes the fan outer body, flabellum and driving motor, fixed mounting has driving motor on the fan outer body, driving motor side fastening mounting has the flabellum, the fan outer body is located the mounting box side.
Preferably, the number of the springs is two, and the springs are mounted on the inner wall of the shell in an erected mode.
Preferably, the two sides of the frame plate are fixedly arranged on the shell, and the outer body of the lamp circuit board is of a cuboid structure.
Preferably, round holes are prefabricated at four corner positions of the screen plate, and the radius of the central hole is larger than two centimeters.
Preferably, the set square is provided with three angular points, and the three angular points are respectively connected with the diagonal rods, the shielding and control ring assembly and the square plate through hinges.
Preferably, the mounting box is sequentially provided with a centering table, a bottom disc and a regulating and controlling assembly from the top end to the bottom end.
Preferably, the transmission rod is made of aluminum alloy, and is light in weight and high in hardness.
Preferably, the spring is made of spring steel, and the elastic potential energy is large.
(III) advantageous effects
Compared with the prior art, the invention provides a wafer centering mechanism, which has the following beneficial effects:
the method has the advantages that: according to the wafer centering mechanism, the adjusting and controlling assembly is optimally arranged, the position of the transmission rod is simply controlled by the external control handle and the rotating disc, so that the included angle of the hinged points between the hinged parts is changed, the position change of the blocking part on the detection lamp is further indirectly controlled, the structure is simple, the irradiation source is efficiently blocked, the imaging radius of the detection light source is controlled, and the using effect is good.
The method has the advantages that: according to the wafer centering mechanism, the shielding and controlling ring pieces are optimally arranged, the simple matching structure of the first half ring and the shielding ring piece is driven to rotate on the L-shaped frame piece, the simple matching structure of the first half ring and the shielding ring piece can be used for preventing a local light source from being transmitted upwards, and the matching effect of the internal matching structure is good.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the installation position of the regulating assembly of the present invention;
FIG. 3 is a schematic top view of the regulating assembly of the present invention;
FIG. 4 is a schematic view of a shielding assembly ring according to the present invention;
fig. 5 is a schematic perspective view of a heat dissipation fan according to the present invention.
Wherein: the device comprises a screen plate-1, a centering table-2, a central hole-3, a bottom disc-4, a mounting box-5, a rotating disc-6, a control handle-7, a key board-8, a regulating component-9, a frame plate-901, a transmission rod-902, an inclined rod-903, a shell-904, a shielding control group ring component-905, a triangular plate-906, a detection lamp-907, a spring-908, a square plate-909, a thick rod-910, a lamp road plate-911, a hollow groove-912, a heat dissipation fan-913, an L frame sheet-9051, a first half ring-9052, a blocking ring sheet-9053, a second half ring-9054, a fan outer body-9131, fan blades-9132 and a driving motor-9133.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 5, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, the invention provides a wafer centering mechanism by improvement, which comprises a mesh plate 1, a centering table 2, a central hole 3, a bottom disc 4, a mounting box 5, a rotating disc 6, a control handle 7, a key plate 8 and a regulating and controlling assembly 9 (as shown in fig. 2). The net plate 1 is embedded and installed on the right side surface of the installation box 5. A central hole 3 is arranged in the center of the centering table 2 in a penetrating way. The bottom end of the centering table 2 is fixedly arranged on the bottom disc 4. A rotating disc 6 is rotatably arranged on the side surface of the mounting box 5. A control handle 7 is fixedly arranged on the rotating disc 6. The keypad 8 is nested on the side surface of the mounting box 5. The regulation and control assembly 9 is arranged inside the mounting box 5.
Referring to fig. 3, the adjusting and controlling assembly 9 includes a frame plate 901, a transmission rod 902, an inclined rod 903, a housing 904, a shielding ring 905, a triangle 906, a detection lamp 907, a spring 908, a square plate 909, a thick rod 910, a lamp panel 911, a hollow 912, and a heat dissipating fan 913. A transmission rod 902 is slidably mounted on the frame plate 901, the left side of the transmission rod 902 is fixedly connected with the rotating disc 6, and the inclined rod 903 is hinged with the triangular plate 906. A hollow groove 912 is fixedly installed on the housing 904, and a heat dissipation fan 913 is fixedly installed on the hollow groove 912. The shielding and controlling ring 905 is rotatably connected with the frame plate 901, so that the shielding and controlling ring 905 can be driven by the triangle 906 to rotate at a local position on the frame plate 901. The probe light 907 is nested to the left of the light board 911. The spring 908 is resiliently coupled to the square plate 909 to facilitate resilient engagement for use. The square plate 909 is hinged to the thick bar 910.
Further, as shown in fig. 4, the blocking group ring 905 includes an L-shaped frame piece 9051, a first half ring 9052, a blocking ring piece 9053 and a second half ring 9054, the L-shaped frame piece 9051 is inserted and fixed to an outer side end of the first half ring 9052, the blocking ring piece 9053 is bonded and installed on an inner side of the first half ring 9052, the first half ring 9052 and the second half ring 9054 have the same structure, and a center of the blocking ring piece 9053 vertically corresponds to the central hole 3.
Further, as shown in fig. 5, the heat dissipation fan 913 includes an outer body 9131, a fan blade 9132 and a driving motor 9133, a driving motor 9133 is fixedly mounted on the outer body 9131, a fan blade 9132 is fixedly mounted at a side end of the driving motor 9133, and the outer body 9131 is located at a side end of the mounting box 5.
Further, referring back to fig. 3, the two springs 908 are installed on the inner wall of the housing 904, so that the auxiliary effect is good.
Further, referring back to fig. 3, two sides of the frame plate 901 are fixedly mounted on the housing 904, and the outer body of the lamp circuit board 911 is a rectangular parallelepiped structure.
Furthermore, round holes are prefabricated at four corner positions of the screen plate 1, and the radius of the central hole 3 is larger than two centimeters, so that the screen plate is convenient to assemble, install and use in a matched mode.
Further, referring back to fig. 3, the triangle 906 has three corner points, and the three corner points are respectively hinged to the diagonal rod 903, the shielding ring 905, and the square plate 909.
Further, referring back to fig. 2, the mounting box 5 is provided with a centering table 2, a bottom disc 4 and a regulating assembly 9 in sequence from the top end to the bottom end.
Further, the transmission rod 902 is made of aluminum alloy, and has light weight and high hardness.
Further, the spring 908 is made of spring steel, and has high elastic potential energy.
The invention provides a wafer centering mechanism through improvement, and the working principle is as follows;
firstly, when in use, the same power supply is switched on, the keys on the key board 8 are controlled to be pressed, the sheet body structure for placing the wafer is aligned to the central hole 3, and the detection is carried out by utilizing the detection lamp 907 on the lamp circuit board 911 in the regulating and controlling assembly 9;
secondly, when the radius of the upward output lamp beam of the detection lamp 907 needs to be adjusted, the control handle 7 is manually pulled, the control handle 7 drives the rotating disc 6 to move outwards, and the transmission rod 902 fixedly connected to the right side of the rotating disc 6 stably slides on the frame plate 901;
thirdly, when the transmission rod 902 is displaced, the inclined rod 903 is hinged with the triangular plate 906, and then the hinge systems where the triangular plate 906 is located are respectively affected with each other, namely the triangular plate 906 is hinged with the square plate 909, the square plate 909 is hinged with the thick rod 910, the thick rod 910 is hinged with the shielding group ring piece 905, and the L frame piece 9051 is hinged to drive the first half ring 9052, so that the position adjustment of the shielding ring piece 9053 on the first half ring 9052 is realized.
The invention provides a wafer centering mechanism through improvement, the position of a transmission rod 902 is simply controlled by an external control handle 7 and a rotating disc 6 through an optimized regulating and controlling assembly 9, so that the change of the included angle of hinge points between hinge parts can further indirectly control the change of the position of a blocking part on a detection lamp 907, the structure is simple, the irradiation source is efficiently blocked to control the imaging radius of a detection light source, and the using effect is good; through the optimized arrangement of the shielding and controlling ring assembly 905, the simple first half ring 9052 and the shielding ring 9053 are driven to rotate by the L-shaped frame piece 9051 in a matching structure, the simple first half ring 9052 and the simple second half ring 9054 can be used for being matched with a local light source to be prevented from being transmitted upwards, and the matching effect of the internal matching structure is good.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A wafer centering mechanism comprises a screen plate (1), a centering table (2), a center hole (3), a bottom disc (4), a mounting box (5), a rotating disc (6), a control handle (7) and a key plate (8), wherein the screen plate (1) is embedded in the right side face of the mounting box (5), the center hole (3) penetrates through the center of the centering table (2), the bottom end of the centering table (2) is fixedly mounted on the bottom disc (4), the rotating disc (6) is rotatably mounted on the side face of the mounting box (5), the control handle (7) is fixedly mounted on the rotating disc (6), and the key plate (8) is nested on the side face of the mounting box (5);
the method is characterized in that: also comprises a regulating component (9), the regulating component (9) is arranged in the mounting box (5), the adjusting and controlling component (9) comprises a frame plate (901), a transmission rod (902), an inclined rod (903), a shell (904), a shielding and controlling ring assembly (905), a triangular plate (906), a detection lamp (907), a spring (908), a square plate (909), a thick rod (910) and a lamp circuit board (911), the frame plate (901) is provided with the transfer rod (902) in a sliding way, the left side of the transfer rod (902) is fixedly connected with the rotating disc (6), the inclined rod (903) is hinged with the triangular plate (906), the shielding ring assembly (905) is rotationally connected with the frame plate (901), the detection lamp (907) is nested on the left side of the lamp circuit board (911), the spring (908) is elastically connected with the square plate (909), and the square plate (909) is hinged with the thick rod (910).
2. The wafer centering mechanism of claim 1, wherein: the regulation and control subassembly (9) still include fretwork groove (912) and heat dissipation fan (913), firm the installation is equipped with on casing (904) fretwork groove (912), firm the installation is equipped with on fretwork groove (912) heat dissipation fan (913).
3. The wafer centering mechanism of claim 2, wherein: the shielding and controlling ring assembly (905) comprises an L-shaped frame piece (9051), a first half ring (9052) and a second half ring (9054), the L-shaped frame piece (9051) is fixedly connected to the outer side end of the first half ring (9052) in an inserting mode, and the first half ring (9052) and the second half ring (9054) are identical in structure.
4. A wafer centering mechanism as claimed in claim 3, wherein: the shielding and controlling ring assembly (905) further comprises a shielding ring piece (9053), the shielding ring piece (9053) is mounted on the inner side of the first half ring (9052) in a bonding mode, and the center of the shielding ring piece (9053) vertically corresponds to the center hole (3).
5. The wafer centering mechanism of claim 2, wherein: heat dissipation fan (913) are including fan ectosome (9131), flabellum (9132) and driving motor (9133), fixed mounting has driving motor (9133) on fan ectosome (9131), driving motor (9133) side fastening mounting has flabellum (9132), fan ectosome (9131) are located mounting box (5) side.
6. The wafer centering mechanism of claim 2, wherein: the number of the springs (908) is two, and the springs are erected and installed on the inner wall of the shell (904).
7. The wafer centering mechanism of claim 2, wherein: the lamp holder plate (901) is fixedly arranged on the shell (904), and the outer body of the lamp circuit board (911) is of a cuboid structure.
8. The wafer centering mechanism of claim 2, wherein: round holes are prefabricated at four corner positions of the screen plate (1), and the radius of the central hole (3) is larger than two centimeters.
9. The wafer centering mechanism of claim 2, wherein: the triangular plate (906) is provided with three angular points, and the three angular points are respectively hinged with the diagonal rod (903), the shielding and controlling ring piece (905) and the square plate (909).
10. The wafer centering mechanism of claim 2, wherein: the mounting box (5) is sequentially provided with the centering table (2), the bottom disc (4) and the regulating and controlling assembly (9) from the top end to the bottom end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010580882.9A CN111710629B (en) | 2020-06-23 | 2020-06-23 | Wafer centering mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010580882.9A CN111710629B (en) | 2020-06-23 | 2020-06-23 | Wafer centering mechanism |
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| Publication Number | Publication Date |
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| CN111710629A true CN111710629A (en) | 2020-09-25 |
| CN111710629B CN111710629B (en) | 2024-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010580882.9A Active CN111710629B (en) | 2020-06-23 | 2020-06-23 | Wafer centering mechanism |
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| CN (1) | CN111710629B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770935A (en) * | 2020-12-18 | 2021-12-10 | 钟兴进 | Wafer centering structure and method |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766120A (en) * | 1993-08-26 | 1995-03-10 | Canon Inc | Surface position detector and fabrication of semiconductor employing it |
| US5506446A (en) * | 1994-04-14 | 1996-04-09 | Olin Corporation | Electronic package having improved wire bonding capability |
| JPH09311271A (en) * | 1996-05-20 | 1997-12-02 | ソニー株式会社 | Objective lens and optical pickup device |
| US6164894A (en) * | 1997-11-04 | 2000-12-26 | Cheng; David | Method and apparatus for integrated wafer handling and testing |
| US20030076586A1 (en) * | 1999-04-09 | 2003-04-24 | Istvan Kovacs | Apparatus for the improvement of the optical qualities of optical microscopes |
| FR2839894A1 (en) * | 2002-05-21 | 2003-11-28 | Chabunda Christophe Mwanza | Integrated radiotherapy equipment for obtaining instant diagnostic images, comprises five sources of photon beams on rotating frames and six sources of photon beams on fixed porticos |
| JP2004319559A (en) * | 2003-04-11 | 2004-11-11 | Tokyo Electron Ltd | Method and equipment for treating substrate |
| TW200427839A (en) * | 2003-06-11 | 2004-12-16 | Neupro Technology Co Ltd | Method of microwave-assisted protein array fabrication and full automatic protein array system |
| KR20060018494A (en) * | 2004-08-24 | 2006-03-02 | 에이펫(주) | Aligning puck and aligning apparatus of wafer for semi-conductor using thereof |
| JP2007006299A (en) * | 2005-06-27 | 2007-01-11 | Hiroshi Kinoshita | Image display application equipment system, image display application equipment, the equipment body, remote manipulation controller for the equipment body, dummy display device attachable to and detachable from the equipment body, display device attachable to and detachable from the equipment body and additional communication device attachable to and detachable from the equipment body |
| JP2008010791A (en) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Works Ltd | Light-emitting device |
| US20100316242A1 (en) * | 2007-11-21 | 2010-12-16 | Audio Pixels Ltd. | Digital speaker apparatus |
| KR20140056074A (en) * | 2012-10-31 | 2014-05-09 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing apparatus and polishing method |
| CN203659814U (en) * | 2013-11-14 | 2014-06-18 | 中芯国际集成电路制造(北京)有限公司 | Wafer edge defect detection device |
| CN108777919A (en) * | 2018-04-23 | 2018-11-09 | 蔡宝凤 | A kind of quick paster apparatus of LED |
| CN212380393U (en) * | 2020-06-23 | 2021-01-19 | 芯米(厦门)半导体设备有限公司 | Wafer centering mechanism |
-
2020
- 2020-06-23 CN CN202010580882.9A patent/CN111710629B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766120A (en) * | 1993-08-26 | 1995-03-10 | Canon Inc | Surface position detector and fabrication of semiconductor employing it |
| US5506446A (en) * | 1994-04-14 | 1996-04-09 | Olin Corporation | Electronic package having improved wire bonding capability |
| JPH09311271A (en) * | 1996-05-20 | 1997-12-02 | ソニー株式会社 | Objective lens and optical pickup device |
| US6164894A (en) * | 1997-11-04 | 2000-12-26 | Cheng; David | Method and apparatus for integrated wafer handling and testing |
| US20030076586A1 (en) * | 1999-04-09 | 2003-04-24 | Istvan Kovacs | Apparatus for the improvement of the optical qualities of optical microscopes |
| FR2839894A1 (en) * | 2002-05-21 | 2003-11-28 | Chabunda Christophe Mwanza | Integrated radiotherapy equipment for obtaining instant diagnostic images, comprises five sources of photon beams on rotating frames and six sources of photon beams on fixed porticos |
| JP2004319559A (en) * | 2003-04-11 | 2004-11-11 | Tokyo Electron Ltd | Method and equipment for treating substrate |
| TW200427839A (en) * | 2003-06-11 | 2004-12-16 | Neupro Technology Co Ltd | Method of microwave-assisted protein array fabrication and full automatic protein array system |
| KR20060018494A (en) * | 2004-08-24 | 2006-03-02 | 에이펫(주) | Aligning puck and aligning apparatus of wafer for semi-conductor using thereof |
| JP2007006299A (en) * | 2005-06-27 | 2007-01-11 | Hiroshi Kinoshita | Image display application equipment system, image display application equipment, the equipment body, remote manipulation controller for the equipment body, dummy display device attachable to and detachable from the equipment body, display device attachable to and detachable from the equipment body and additional communication device attachable to and detachable from the equipment body |
| JP2008010791A (en) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Works Ltd | Light-emitting device |
| US20100316242A1 (en) * | 2007-11-21 | 2010-12-16 | Audio Pixels Ltd. | Digital speaker apparatus |
| KR20140056074A (en) * | 2012-10-31 | 2014-05-09 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing apparatus and polishing method |
| CN203659814U (en) * | 2013-11-14 | 2014-06-18 | 中芯国际集成电路制造(北京)有限公司 | Wafer edge defect detection device |
| CN108777919A (en) * | 2018-04-23 | 2018-11-09 | 蔡宝凤 | A kind of quick paster apparatus of LED |
| CN212380393U (en) * | 2020-06-23 | 2021-01-19 | 芯米(厦门)半导体设备有限公司 | Wafer centering mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770935A (en) * | 2020-12-18 | 2021-12-10 | 钟兴进 | Wafer centering structure and method |
| CN113770935B (en) * | 2020-12-18 | 2022-12-06 | 钟兴进 | Wafer centering structure and method |
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| CN111710629B (en) | 2024-07-09 |
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