CN111708130A

CN111708130A - Light emitting device and light transmitting/receiving module

Info

Publication number: CN111708130A
Application number: CN202010538264.8A
Authority: CN
Inventors: 马洪勇; 孙莉萍; 胡强高; 朱虎; 苏敬奎; 周日凯; 付永安; 胡毅; 罗勇
Original assignee: Accelink Technologies Co Ltd
Current assignee: Accelink Technologies Co Ltd
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2020-09-25

Abstract

The invention provides a light emitting device and a light receiving and transmitting module, wherein multiple paths of light beams emitted by a laser component in the light emitting device are input into a first light path conversion component to be converted into multiple paths of collimated light, the multiple paths of collimated light are input into a z-block component to be synthesized into a path of collimated light, and the path of collimated light is input into a second light path conversion component, is bent by 180 degrees and then is output and coupled into a collimator component; the collimator assembly comprises a collimator and a first connector, and the first connector is connected with the collimator through a first optical fiber. The light emitting device arranges the collimator assembly and other elements of the light emitting device in a layered manner, improves the space utilization rate of the light emitting device in the direction perpendicular to the light path, reduces the length of the light emitting device, has a more compact structure, and meets the requirements of circuit board arrangement. And the collimator is in flexible connection with the first connector, so that the problem of the alignment precision of the optical port is solved, and enough space is provided for the placement of the first optical fiber.

Description

Light emitting device and light transmitting/receiving module

Technical Field

The present invention relates to the field of optical communication technologies, and in particular, to an optical transmitter and an optical transceiver module.

Background

Optical modules are gradually evolving from 100Gbps to 400Gbps, and the IEEE and many MSA organizations have established PMD and module packaging standards for 400G optical modules in various application scenarios. The PMD layer adopts single wavelength 100Gb/s PAM4, and QSFP-DD packaging or OSFP packaging is the mainstream packaging technology of 400G optical modules. Compared with the 100G optical module, the 400G optical module has more complex circuits, needs a digital signal processor for signal processing, also needs various auxiliary circuits, and needs larger space when a circuit board is arranged; however, the volume standard of the 400G optical module after packaging is not increased, so that the sizes of the light emitting module and the light absorbing module need to be compressed to meet the standard size requirement of the existing circuit board after layout.

The optical devices in the optical module mostly adopt a COB packaging form. The common port of the common optical device package uses a space optical path, the package size can be reduced, but the optical port of the optical device cannot move under the condition, the optical device and the module circuit board need to be fixed very accurately, so that the module golden finger and the optical port can be ensured to be simultaneously installed in the module shell, and the assembly requirement is very high.

Disclosure of Invention

The invention provides a light emitting device and a light receiving and transmitting module, which aim to solve the technical problem that in the prior art, the size of the packaged light emitting device is large and circuit board distribution is difficult to complete.

In order to achieve the purpose, the technical scheme of the invention is realized as follows:

the invention provides a light emitting device, which comprises a collimator assembly, a laser assembly, a first light path conversion assembly, a z-block assembly and a second light path conversion assembly, wherein the laser assembly, the first light path conversion assembly, the z-block assembly and the second light path conversion assembly are sequentially arranged along a light path direction; the collimator assembly comprises a collimator and a first connector, wherein the first connector is connected with the collimator through a first optical fiber.

Further, the length of the first optical fiber is 15 mm-200 mm.

Further, the first light path conversion component comprises a plurality of aspheric lenses, and the aspheric lenses are arranged corresponding to the light beams emitted by the laser component.

Further, the second light path conversion component comprises a prism, and the main section of the prism is in an isosceles trapezoid shape or an isosceles triangle shape.

Furthermore, the second optical path conversion component comprises first optical glass and second optical glass, collimated light output from the z-block component is bent by 90 degrees after passing through the first optical glass, and then is bent by 90 degrees through the second optical glass so that the collimated light is output and coupled into the collimator component.

Further, the light emitting device further comprises a first substrate, and the laser component, the first optical path conversion component, the z-block component and the second optical path conversion component are all arranged on the first substrate; the first substrate comprises a first body made of tungsten copper and a second body made of kovar alloy, and the first body is connected with the second body in an embedded mode; the laser assembly is mounted on the first body, and the z-block assembly and the second optical path conversion assembly are mounted on the second body.

According to another aspect of the present invention, there is also provided an optical transceiver module, which includes a circuit board, a module housing, an optical receiver and the optical transmitter, wherein the circuit board is mounted on the module housing, and the optical receiver and the optical transmitter are respectively disposed on the circuit board.

Further, the laser assembly comprises a TEC refrigerator, a temperature detection component, a plurality of second substrates and a laser chip respectively mounted on each of the second substrates, and the second substrates are mounted on a cold surface of the TEC refrigerator; one end part of the second substrate is electrically connected with the circuit board, and the second substrate is electrically connected with the corresponding laser chip so as to enable the laser chip to be communicated with the circuit board; the temperature detection component is in contact with the second substrate and is electrically connected with the circuit board so as to detect the temperature of the laser chip and transmit a temperature signal to the circuit board.

Further, a heat sink portion is formed on the circuit board, and the laser assembly is arranged in the heat sink portion.

Furthermore, the end face of one side of the second substrate, which is connected with the circuit board, is butted on the side wall corresponding to the heat sink part.

Further, the upper surface of the second substrate and the upper surface of the circuit board are in the same plane.

Further, the laser assembly further comprises a cushion block arranged between the second substrate and the cold surface of the TEC refrigerator, the plurality of second substrates are respectively mounted on the cushion block, and the temperature detection component is arranged on the cushion block.

The light emitting device provided by the invention changes the light path structure of each element tiled along light in the existing light emitting device, and adopts the light path design of reciprocating upper and lower layers, so that the collimated light output by the z-block component is coupled into the collimator component after being bent by 180 degrees through the second light path conversion component, and the collimator component can be arranged above the laser component, the first light path conversion component and the z-block component, namely the collimator component and other elements of the light emitting device are arranged in a layered manner, the space utilization rate of the light emitting device in the direction vertical to the light path is improved, the length of the light emitting device is greatly reduced, the whole size of the light emitting device is reduced, the structure is more compact, and the requirements of circuit board distribution are met. In addition, the collimator is connected with the first connector through the first optical fiber, so that on one hand, a space optical path is prevented from being used as a public port, the requirement on the assembly precision between the light emitting device and the circuit board is lowered, the problem of the alignment precision of an optical port is solved, and the yield is improved; on the other hand, due to the layered arrangement of the light emitting device elements in the present invention, a sufficiently long first optical fiber can be used on the premise of satisfying the size standard of the optical device, providing a sufficient space for placing or coiling the first optical fiber.

Drawings

Fig. 1 is a schematic structural view of a light emitting device provided in an embodiment of the present invention;

FIG. 2 is a schematic diagram of the laser assembly shown in FIG. 1;

FIG. 3 is a diagram illustrating the reflection paths of light rays in a prism according to an embodiment of the present invention;

FIG. 4 is a diagram illustrating a reflection path of light in the first optical glass and the second optical glass according to an embodiment of the present invention;

FIG. 5 is a diagram illustrating another reflection path of light in the first optical glass and the second optical glass according to the embodiment of the present invention;

FIG. 6 is a diagram illustrating a further reflection path of light in the first optical glass and the second optical glass according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of an optical transceiver module according to an embodiment of the present invention;

fig. 8 is an enlarged schematic view of the light emitting device and the light receiving device shown in fig. 7 on a wiring board;

fig. 9 is a schematic view of the structure of the light receiving device shown in fig. 7.

Description of reference numerals:

1. a light emitting device; 2. a light receiving device; 3. a circuit board; 4. a module housing;

11. a first substrate; 111. a first body; 112. a second body;

12. a laser assembly; 1201. a laser chip; 1202. a second substrate; 1203. a temperature detection part; 1204. cushion blocks; 1205. a TEC refrigerator;

13. a first optical path conversion component; 14. a z-block component; 15. an optical isolator; 16. a second optical path conversion member; 161. a prism; 162. a first optical glass; 163. a second optical glass;

17. a collimator assembly; 171. a collimator; 172. a first optical fiber; 173. a first connector;

21. a transimpedance amplifier chip; 22. an array of detector chips; 23. an AWG chip; 24. a second optical fiber; 25. a second connector.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number or order of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Referring to fig. 1 to 3, in a first aspect of the embodiments of the present application, there is provided a light emitting device, including a collimator assembly 17, and a laser assembly 12, a first optical path conversion assembly 13, a z-block assembly 14, and a second optical path conversion assembly 16 that are sequentially arranged along an optical path direction, where multiple light beams emitted by the laser assembly 12 are input to the first optical path conversion assembly 13 to be converted into multiple collimated light beams, the multiple collimated light beams are input to the z-block assembly 14 to be synthesized into one collimated light beam, and the collimated light beam is input to the second optical path conversion assembly 16 and is output after being bent by 180 degrees and coupled into the collimator assembly 17; the collimator assembly 17 includes a collimator 171 and a first connector 173, and the first connector 173 is connected to the collimator 171 through a first optical fiber 172.

It can be understood that the first light path conversion component 13 converts the multiple light beams emitted by the laser component 12 into multiple collimated light beams, the z-block component 14 combines the multiple collimated light beams into one collimated light beam, the second light path conversion component 16 bends the multiple collimated light beams by 180 ° and outputs the bent collimated light beam, and finally the collimated light beam is coupled into the collimator component 17, and the collimator 171 and the first connector 173 are in soft connection through the first optical fiber 172. An optical isolator 15 is further disposed between the z-block component 14 and the second optical path conversion component 16, and is used for isolating backward transmission light in the optical path and preventing the backward transmission light from having adverse effects on the laser component 12.

In the prior art, a public port of optical device packaging generally adopts a spatial light path, although the packaging size can be reduced, an optical port cannot move, the precision of a circuit board and a laser component is required to be ensured, the precision of the light path and the optical port is also required to be ensured, and the assembly requirement is very high. If the optical device package uses the optical fiber as the common port, the optical port of the optical device can move, and the optical fiber can absorb the assembly tolerance between the golden finger and the optical port of the module, so that the positioning precision of the optical device on the module circuit board is not required to be high. However, using optical fibers as the common port generally results in a large package size and also in very limited winding space for the optical fibers within the module.

The light emitting device provided by the embodiment of the application changes the light path structure of each element tiled along light in the existing light emitting device, the light path design of upper and lower layers of round trip is adopted, the collimating light output by the z-block component 14 is coupled to the collimator component 17 after being bent by 180 degrees through the second light path conversion component 16, so that the collimator component 17 can be arranged on the laser component 12, the first light path conversion component 13 and the z-block component 14, namely, the collimator component 17 and other elements of the light emitting device 1 are arranged in a layered mode, the space utilization rate of the light emitting device in the direction perpendicular to the light path is improved, the length of the light emitting device 1 is greatly reduced, the whole size of the light emitting device is reduced, the structure is more compact, and the requirement of 3 boards of a circuit board is met.

In addition, the collimator 171 is connected with the first connector 173 through the first optical fiber 172, so that on one hand, a space optical path is avoided being used as a common port, the requirement on the assembly precision between the light emitting device 1 and the circuit board 3 is reduced, the problem of the alignment precision of an optical port is solved, and the yield is improved; on the other hand, due to the layered arrangement of the elements of the light emitting device 1 in the embodiment of the present application, the first optical fiber 172 can be used long enough to provide enough space for placing or coiling the first optical fiber 172 on the premise of satisfying the size standard of the light emitting device. Specifically, the length of the first optical fiber 172 is 15mm to 200 mm. The length of the first optical fiber 172 is within the above-mentioned length range, there is enough space to place or coil in the above-mentioned layered optical path, and the first connector 173 can be freely mounted on the snap structure of the module case 4 according to the structure of the optical transceiver module. The length of the first optical fiber 172 is too short to facilitate the connection between the light port of the collimator 171 and the first connector 173, and to facilitate the free installation of the first connector 173. The length of the first optical fiber 172 is too long, which requires a larger space for placing, is inconvenient to assemble, and is not favorable for reducing the overall size of the optical transceiver module.

It is understood that the first optical path conversion component 13 converts the multiple light beams into multiple collimated light beams, and in the embodiment of the present application, the first optical path conversion component 13 includes a plurality of aspheric lenses, and the aspheric lenses are disposed corresponding to the light beams emitted by the laser component 12. That is, each aspheric lens corresponds to one of the light beams, and converts the light beam into collimated light. The number of aspheric lenses is the same as the number of light beams. Specifically, the material of the aspherical lens is glass or silicon, and a glass material is preferable. In order to make the aspherical lens and other elements of the light emitting device 1 at the same height and to make the optical path smooth, a backing plate for raising the aspherical lens is provided below the aspherical lens, and the material of the backing plate is glass or ceramic, preferably glass. The backing plate is bonded with the non-spherical lens through glue.

In the embodiment of the present application, the z-block assembly 14 comprises 1 glass block having two parallel optical planes, and 4 filters, the first optical plane being located on the side close to the laser assembly 12. The 4 optical filters are respectively attached to the first optical plane of the glass block, and the center distance between two adjacent optical filters is consistent with the center distance between two adjacent laser chips 1201 of the laser assembly 12. The filter may transmit light of the current channel wavelength while reflecting light of other channel wavelengths. The incident angle of collimated light of the laser on the incident surface of the optical filter is 13.5 degrees, one part of the first optical plane of the glass block is plated with a reflecting film, the other part of the first optical plane of the glass block is plated with an antireflection film, the collimated light of each laser can be reflected back and forth between the second optical plane of the z-block component 14 and the optical filter of the next channel, and finally the collimated light of the four channels is synthesized into one channel. And the combined light beam is emitted out of the antireflection coating area of the second optical plane.

In some embodiments, the second optical path conversion member 16 includes a prism 161, and the main section of the prism 161 is an isosceles trapezoid or an isosceles triangle. The prism 161 bends the collimated light by 180 ° and outputs the collimated light, and in the embodiment of the present application, the collimated light may be realized by performing total reflection in the prism 161 for multiple times. That is, the prism 161 includes at least two reflecting surfaces that reflect collimated light. Specifically, in some embodiments, the main cross section of the prism 161 is an isosceles trapezoid as shown in fig. 3, the base angle is 45 °, and the collimated light incident on the prism 161 is reflected twice by total reflection and then exits the prism 161.

It can be understood that the prisms 161 are arranged at different angles and the collimated light is emitted at different heights, so that the height difference between the light entering the prisms 161 and the light exiting the prisms 161 is changed, but the two light rays are always kept parallel. In this case, the height of the light emitted from the prism 161 can be adjusted by adjusting the angle of the prism 161, so as to adjust the position of the collimator 171, and the first optical fiber 172 connecting the collimator 171 and the first connector 173 can avoid the position above the laser module 12, thereby preventing the chip of the laser module 12 from being damaged due to the contact between the first optical fiber 172 and the chip. In addition, a protective cover is provided over the elements of the light emitting device 1 for protecting the elements from damage during use.

In other embodiments, the second optical path conversion assembly 16 includes a first optical glass 162 and a second optical glass 163, and the collimated light output from the z-block assembly 14 is bent 90 ° behind the first optical glass 162 and then bent 90 ° through the second optical glass 163 so that the collimated light is output and coupled into the collimator assembly 17. The first optical glass 162 and the second optical glass 163 are fixed on the second body 112. Similarly, the embodiment of the present application bends collimated light by 180 ° and outputs the collimated light by the cooperation of the first optical glass 162 and the second optical glass 163, that is, by total reflection twice. Similarly, the position of the collimator 171 can be adjusted by adjusting the angle of the first optical glass 162 and the second optical glass 163 to adjust the difference in light height between the outgoing collimated light and the incoming collimated light.

For example, the main cross-sections of the first optical glass 162 and the second optical glass 163 may be square, referring to fig. 4, one side of each of the first optical glass 162 and the second optical glass 163 is plated with a total reflection film, the arrangement angles of the two optical glasses are 45 ° to the horizontal plane, referring to fig. 4, and the collimated light is reflected and bent by 90 ° through the side plated with the total reflection film. For another example, the main cross sections of the first optical glass 162 and the second optical glass 163 may be triangular, as shown in fig. 5 and 6. In the embodiment shown in fig. 5, the first optical glass 162 and the second optical glass 163 are both isosceles right-angle prisms, and the non-inclined surfaces of the two isosceles right-angle prisms are disposed opposite to each other, and the collimated light is totally reflected by the inclined surfaces of the isosceles right-angle prisms and then bent twice by 90 °. In this embodiment, neither the first optical glass 162 nor the second optical glass 163 needs to be coated with a reflective film. In the embodiment shown in fig. 6, the first optical glass 162 and the second optical glass 163 are also isosceles right-angle prisms, and total reflection films are respectively coated on the inclined surfaces of the two isosceles right-angle prisms, the inclined surfaces of the two isosceles right-angle prisms are oppositely disposed, and the collimated light is respectively reflected by the inclined surfaces of the isosceles right-angle prisms twice and then bent by 90 °.

In some embodiments, the light emitting device further comprises a first substrate 11, the laser assembly 12, the first optical path conversion assembly 13, the z-block assembly 14 and the second optical path conversion assembly 16 all disposed on the first substrate 11; the first substrate 11 includes a first body 111 made of tungsten copper and a second body 112 made of kovar alloy, and the first body 111 is connected with the second body 112 in an embedded manner; the laser assembly 12 is mounted on the first body 111 and the z-block assembly 14 and the second optical path conversion assembly 16 are mounted on the second body 112.

It is understood that the first substrate 11 is a carrier for each element of the light emitting device 1, and is made of a metal with high thermal conductivity and low thermal expansion coefficient. In the embodiment of the present application, the material of the first substrate 11 may be tungsten copper, or a combination of tungsten copper and kovar alloy. Each element of the light emitting device 1 is mounted on the first substrate 11 by means of glue bonding or laser welding to form a stable rigid structure, so that the light path in the light emitting device 1 is stable and the reliability is high.

Specifically, the first substrate 11 includes a first body 111 and a second body 112, the first body 111 is made of tungsten copper, the laser assembly 12 is mounted on the first body 111 made of tungsten copper, and the high thermal conductivity of the tungsten copper can smoothly transfer heat on the laser assembly 12 to the module housing 4 of the optical transceiver module in time. The second body 112 is made of kovar alloy, the z-block component 14 and the second optical path conversion component 16 are installed on the second body 112, and the z-block component 14 and the second optical path conversion component 16 are both made of optical glass materials and matched with the thermal expansion coefficient of the kovar alloy, so that the optical path is kept stable under high and low temperature changes.

It will be appreciated that the specific optical paths of the light emitting device 1 are: the four light beams emitted by the laser chip 1201 are converted into four collimated light beams after passing through the corresponding aspheric lenses, the four collimated light beams are combined into one collimated light beam after passing through the z-block assembly 14, and the collimated light beam is coupled into the first optical fiber 172 through the collimator 171 and then emitted to the outside through the first connector 173.

Referring to fig. 7 to 9, in a second aspect of the embodiments of the present application, an optical transceiver module is provided, which includes a circuit board 3, a module housing 4, an optical receiver 2 and the above-mentioned optical transmitter, wherein the circuit board 3 is mounted on the module housing 4, and the optical receiver 2 and the optical transmitter 1 are respectively disposed on the circuit board 3.

Referring to fig. 7, the module case 4 is provided with a positioning column and a fastening structure, and the circuit board 3 is assembled on the positioning column of the module case 4. The light receiving device 2 and the light emitting device 1 are mounted on the wiring board 3, respectively, and are electrically connected to the wiring board 3. The first substrate 11 of the light emitting device 1 is bonded to the wiring board 3 by glue or solder to form a stable hard connection. In addition, the first connector 173 of the light emitting device 1 is flexibly connected to the collimator 171 through the first optical fiber 172, so that the first connector 173 can be freely fixed to the snap structure of the module case 4. The optical transceiver module of the embodiment of the application has the advantages of compact structure and small overall size. The light emitting device 1 has the technical effects described in the embodiments of the present application, and thus the optical transceiver module having the light emitting device 1 also has corresponding technical effects, which are not described in detail herein.

Note that the distance between the collimator 171 in the light emitting device 1 and the first substrate 11 is smaller than the maximum height of the module case 4. So that the light emitting device 1 can be smoothly mounted in the module case 4.

In some embodiments, the laser assembly 12 includes a TEC cooler 1205, a temperature detection member 1203, a plurality of second substrates 1202, and a laser chip 1201 mounted on each of the second substrates 1202, respectively, the second substrates 1202 being mounted on a cold side of the TEC cooler 1205; one end portion of the second substrate 1202 is electrically connected to the wiring board 3 and the second substrate 1202 is electrically connected to the corresponding laser chip 1201 so that the laser chip 1201 communicates with the wiring board 3; the temperature detection member 1203 is in contact with the second substrate 1202 and electrically connected to the wiring board 3 to detect the temperature of the laser chip 1201 and transmit a temperature signal to the wiring board 3.

As can be understood, referring to fig. 2 and 8, the second substrate 1202 is provided with a high frequency circuit, the laser chip is attached to the second substrate 1202, and the contact surfaces of the two are bonded by the high thermal conductive glue. Specifically, in the embodiment of the present application, if there are 4 laser chips 1201, there are 4 corresponding second substrates 1202. The working wavelength of the 4-path laser chip 1201 is CWDM wavelength, and is 1271nm, 1291nm, 1311nm and 1331nm in sequence.

The second substrates 1202 are respectively mounted on the cold surfaces of the TEC refrigerators 1205, and the TEC refrigerators 1205 can be used to control the operating temperature of the laser chip 1201 within a suitable range, thereby ensuring the performance of the laser chip 1201. Specifically, the second substrate 1202 is made of aluminum nitride, and a gold-plated thin film circuit and a routing pad are disposed on the surface thereof; one end of the second substrate 1202 is connected to the corresponding laser chip 1201 mounted thereon and the other end is connected to the wiring board 3 by gold wire bonding, so that the circuits on the wiring board 3 are electrically connected to the laser chips 1201, respectively.

In the embodiment of the present application, the temperature detecting member 1203 may be a thermistor for detecting the temperature of the laser chip 1201 during operation. The thermistor is in contact with the second substrate 1202 to detect the temperature of the laser chip 1201, and the thermistor is electrically connected to the wiring board 3 to transmit a temperature signal of the laser chip 1201 detected by the thermistor to the wiring board 3.

In some embodiments, the wiring board 3 is formed with a heat sink portion in which the laser assembly 12 is disposed. As will be appreciated, with reference to fig. 8, the laser assembly 12 is disposed in the heat sink portion, which enables the upper surface of the second substrate 1202 of the laser assembly 12 to be flush, i.e., in the same plane, as the upper surface of the wiring board 3, thereby matching the height of the light emitting area of the laser chip 1201 with other optical elements in the light emitting device 1.

Further, an end face of the second substrate 1202 on the side connected to the wiring board 3 abuts on a side wall corresponding to the heat sink portion. Specifically, the upper surface of the circuit board 3 is provided with a routing bonding pad electrically connected with the laser component 12, and an RF bonding pad among the bonding pads is arranged at a position close to the heat sink portion. Referring to fig. 2, the second substrate 1202 of the laser assembly 12 is disposed adjacent to the corresponding side wall of the heat sink, and one end surface of the second substrate 1202 is abutted to the side wall, and the bonding pad on the second substrate 1202 is located on the side of the upper surface close to the circuit board 3, so that the length of the gold wire connection of the high-speed link between the circuit board 3 and the second substrate 1202 is the shortest, which is approximately within 0.4mm, and the degradation effect of the gold wire on the high-frequency signal is within an acceptable tolerance range.

In other embodiments, referring to fig. 2, the upper surface of the second substrate 1202 is in the same plane as the upper surface of the wiring board 3. In actual manufacturing, the height difference between the surface of the second substrate 1202 on which the high-frequency circuit is designed and the surface of the wiring board 3 is set to be within ± 0.15mm, and we can consider that both are located in the same plane. The upper surface of the second substrate 1202 and the upper surface of the wiring board 3 are in the same plane, which enables, on the one hand, the length of the gold wire connection of the high-speed link therebetween to be shorter, and on the other hand, the height of the light emitting region of the laser chip 1201 to be matched with other optical elements in the light emitting device 1.

In some embodiments, the laser assembly 12 further includes a spacer 1204 disposed between the second substrate 1202 and the cold side of the TEC cooler 1205, the plurality of second substrates 1202 being respectively mounted on the spacer 1204, and the temperature detecting member 1203 is disposed on the spacer 1204.

It is understood that the number of the pad 1204 may be one or more. When there are a plurality of spacers 1204, a second substrate 1202 is mounted on each spacer 1204. The second substrates 1202 are mounted on the pads 1204, respectively, so that the upper surfaces thereof are in the same plane as the upper surface of the circuit board 3. In the embodiment of the application, the cushion block 1204 is made of aluminum nitride, and the temperature detection component 1203, i.e., the thermistor, is also attached to the cushion block 1204 and is located at the center of the upper surface of the cushion block 1204; the substrates are respectively positioned at two sides of the thermistor. The thermistor actually measures the temperature of the spacer 1204, and since the second substrate 1202 and the spacer 1204 are made of the same material and have similar temperatures, the temperature measured by the thermistor can represent the operating temperature of the laser chip 1201 on the second substrate 1202. At this point, the pad 1204 is attached to the cold side of the TEC refrigerator 1205. The components of the laser assembly 12 form a layered stack, with the two contact surfaces being bonded together by highly thermally conductive glue. The spacer 1204 serves to elevate the laser chip 1201 so that the height of the light emitting region of the laser chip 1201 matches other optical elements in the light emitting device 1. In addition, a gold-plated thin film circuit and a routing bonding pad are arranged on the surface of the cushion block 1204, and the circuit between the circuit board 3 and the thermistor is connected through gold wire bonding.

In the embodiment of the present application, referring to fig. 9, the light receiving device 2 includes a transimpedance amplifier chip 21, a detector chip array 22, an AWG chip 23, and a second connector 25, where the AWG chip 23 and the second connector 25 are connected by a second optical fiber 24. Specifically, the transimpedance amplifier chip 21, the detector chip array 22, and the AWG chip 23 are bonded to the surface of the circuit board 3 by glue, thereby forming a COB structure. The second connector 25 is flexibly connected to the AWG chip 23 by the second optical fiber 24, so that the second connector 25 can be freely fixed on the snap structure of the module case 4.

The optical path of the light receiving device 2 is specifically: external light enters the second optical fiber 24 through the second connector 25, is coupled into the AWG chip 23 through the second optical fiber 24, and is subjected to optical demultiplexing in the AWG chip 23 to be divided into four paths of light; the waveguide of the outgoing end face of the AWG chip 23 is ground and polished to 40 ° to 44 °, the four outgoing lights are totally reflected at the outgoing end face, and the propagation direction of the outgoing light is turned by 90 ° and coupled into the detector chip array 22.

In the embodiment of the present application, the light emitting device 1 bends the light beam emitted by the laser component 12 by 180 degrees by using an isosceles triangle or isosceles trapezoid prism with a main cross-sectional base angle of the light path of 45 degrees; meanwhile, the height of the emergent position of the light beam can be adjusted by changing the placing angle of the prism, so that the light beam is parallel to the light beam emitted by the laser chip 1201 and is positioned at different heights after passing through the prism, the space in the height direction inside the light receiving and transmitting module can be fully utilized, each element occupies the space in the length direction inside the module as little as possible, and the whole size meets the board distribution requirement of the circuit board 3. In addition, the TEC refrigerator 1205 can control the temperature, so that the laser chip 1201 operates within a normal operating temperature range; the first substrate 11 below the TEC refrigerator 1205 is made of tungsten copper, and the heat of the hot surface of the TEC refrigerator 1205 can be transferred to the module case 4 in time by using the high thermal conductivity of the tungsten copper, and the first substrate 11 bonded to each optical element is made of kovar alloy, and is matched with the thermal expansion coefficient of the optical glass material, so that the optical path can be kept stable during high and low temperature changes. Furthermore, the RF pads on the circuit board 3 are disposed near the heat sink portion, and the second substrate 1202 has an end surface abutting against the side wall corresponding to the heat sink portion, the upper surface of the second substrate 1202 and the upper surface of the circuit board 3 near the heat sink portion are on the same plane, and the high frequency pads on the second substrate 1202 are disposed near the circuit board 3, so that the lengths of gold wires of the two pad members can be kept shortest, which is beneficial to the transmission of high frequency signals.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention, and all such changes or substitutions are included in the scope of the present invention. Moreover, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary to be able to be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A light emitting device, characterized by: the multi-path collimated light is input into the z-block component to be synthesized into one path of collimated light, and the path of collimated light is input into the second light path conversion component, bent by 180 degrees and then output and coupled into the collimator component; the collimator assembly comprises a collimator and a first connector, wherein the first connector is connected with the collimator through a first optical fiber.

2. The light emitting device of claim 1, wherein the first optical fiber has a length of 15mm to 200 mm.

3. The light emitting device according to claim 1, wherein the first optical path conversion member includes a plurality of aspherical lenses disposed in correspondence with the light beams emitted from the laser assembly.

4. The light emitting device according to claim 1, wherein the second optical path conversion member includes a prism having a main section in the shape of an isosceles trapezoid or an isosceles triangle.

5. The light emitting device of claim 1, wherein the second optical path conversion assembly comprises a first optical glass and a second optical glass, and wherein the collimated light output from the z-block assembly is bent 90 ° behind the first optical glass and then bent 90 ° through the second optical glass so that the collimated light is output and coupled into the collimator assembly.

6. The light emitting device of claim 1, further comprising a first substrate, the laser assembly, the first optical path conversion assembly, the z-block assembly, and the second optical path conversion assembly all disposed on the first substrate;

the first substrate comprises a first body made of tungsten copper and a second body made of kovar alloy, and the first body is connected with the second body in an embedded mode; the laser assembly is mounted on the first body, and the z-block assembly and the second optical path conversion assembly are mounted on the second body.

7. An optical transceiver module, comprising a circuit board, a module housing, an optical receiver and the optical transmitter of any one of claims 1 to 6, wherein the circuit board is mounted on the module housing, and the optical receiver and the optical transmitter are respectively disposed on the circuit board.

8. The optical transceiver module of claim 7, wherein the laser assembly comprises a TEC cooler, a temperature detection component, a plurality of second substrates, and a laser chip respectively mounted on each of the second substrates, the second substrates being mounted on a cold side of the TEC cooler;

one end part of the second substrate is electrically connected with the circuit board, and the second substrate is electrically connected with the corresponding laser chip so as to enable the laser chip to be communicated with the circuit board;

the temperature detection component is in contact with the second substrate and is electrically connected with the circuit board so as to detect the temperature of the laser chip and transmit a temperature signal to the circuit board.

9. The optical transceiver module of claim 8, wherein the circuit board has a heat sink portion formed thereon, the laser assembly being disposed within the heat sink portion.

10. The optical transceiver module of claim 9, wherein an end surface of the second substrate on a side connected to the circuit board is butted against a side wall corresponding to the heat sink portion.

11. The optical transceiver module of claim 9, wherein the upper surface of the second substrate is in the same plane as the upper surface of the circuit board.

12. The optical transceiver module of claim 11, wherein the laser assembly further comprises a spacer block disposed between the second substrate and the cold side of the TEC cooler, the second substrates are respectively mounted on the spacer block, and the temperature detecting member is disposed on the spacer block.