CN111698035A - Optical module emission assembly and colored light module - Google Patents
Optical module emission assembly and colored light module Download PDFInfo
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- CN111698035A CN111698035A CN202010573075.4A CN202010573075A CN111698035A CN 111698035 A CN111698035 A CN 111698035A CN 202010573075 A CN202010573075 A CN 202010573075A CN 111698035 A CN111698035 A CN 111698035A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 98
- 239000004065 semiconductor Substances 0.000 claims abstract description 44
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000008054 signal transmission Effects 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Semiconductor Lasers (AREA)
Abstract
The invention relates to the technical field of photoelectric conversion, and provides an optical module transmitting assembly and a colorful optical module, wherein the optical module transmitting assembly comprises: a laser for converting the electrical signal into an optical signal; further comprising: the temperature measuring device, the semiconductor refrigerator and the first controller; the laser, the temperature measuring device and the semiconductor refrigerator are all connected to the first controller; the temperature measuring device is used for: detecting the temperature of the laser to obtain a detected temperature, and feeding the detected temperature back to the first controller; the first controller is to: reading the detection temperature, and judging whether the detection temperature is in a preset temperature range; and when the detected temperature exceeds the preset temperature range, controlling the semiconductor refrigerator to work so that the detected temperature is in the preset temperature range. The technical scheme provided by the invention can enable the laser in the optical module transmitting assembly to always work in a specified temperature range, thereby avoiding signal interference among the color optical modules and improving the signal transmission quality.
Description
Technical Field
The invention relates to the technical field of photoelectric conversion, in particular to an optical module emitting assembly and a colored light module.
Background
The color optical module is a photoelectric converter in an optical multiplexing transmission link, and adopts a wavelength division multiplexing technology to multiplex optical signals with different wavelengths onto one optical fiber for transmission. Each colored light module specifically comprises an optical module transmitting assembly and an optical module receiving assembly, wherein the optical module transmitting assembly comprises a laser (or called a laser diode) which is used for converting an electric signal into an optical signal and transmitting the optical signal through an optical fiber; the optical module receiving assembly is used for converting optical signals sent by the optical fibers into electric signals.
In the current 5G fronthaul practical application, a plurality of color optical modules are connected in parallel to perform optical/electrical signal conversion and transmission. Because the temperature change of the laser in the optical module emitting assembly can cause the deviation of the working wavelength, when the temperature of the laser exceeds the specified working temperature due to the overlarge temperature change of the laser, the deviation of the working wavelength of the laser also exceeds the normal deviation, and then the mutual interference among optical signals sent by different lasers is caused, and the quality of the signals transmitted by each colored light module can be seriously influenced by the interference.
Disclosure of Invention
In view of the above, the present invention is directed to an optical module transmitter assembly and a color optical module, wherein a laser in the optical module transmitter assembly can always operate within a specified temperature range, so as to avoid signal interference between the color optical modules and improve signal transmission quality.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a light module transmitter assembly, the assembly comprising: a laser for converting the electrical signal into an optical signal; the assembly further comprises: the temperature measuring device, the semiconductor refrigerator and the first controller; the laser, the temperature measuring device and the semiconductor refrigerator are all connected to the first controller;
the temperature measuring device is used for: detecting the temperature of the laser to obtain a detected temperature, and feeding back the detected temperature to the first controller;
the first controller is to: reading the detection temperature, and judging whether the detection temperature is in a preset temperature range; and when the detected temperature exceeds the preset temperature range, controlling the semiconductor refrigerator to work so as to enable the detected temperature to be in the preset temperature range.
Further, when the detected temperature is within the preset temperature range, the first controller is further configured to:
and controlling the semiconductor refrigerator to be in a standby state.
Preferably, when the detected temperature exceeds the preset temperature range, controlling the semiconductor refrigerator to operate so that the detected temperature is within the preset temperature range includes:
when the detected temperature is larger than the maximum value of the preset temperature range, controlling the semiconductor refrigerator to cool so as to enable the detected temperature to be in the preset temperature range;
and when the detected temperature is smaller than the minimum value of the preset temperature range, controlling the semiconductor refrigerator to be heated so as to enable the detected temperature to be in the preset temperature range.
Further, the assembly further comprises: and the optical modulator is connected with the laser and used for modulating the received electric signal to obtain a modulated electric signal and taking the modulated electric signal as the input of the laser.
Further, the assembly further comprises: an optical power detector for detecting the light emission power of the laser; the optical power detector is connected to the first controller.
Preferably, the preset temperature range is as follows: [ T0-35 ℃, T0+35 ℃), wherein T0 is the preset standard operating temperature of the laser.
Preferably, the temperature measuring device is a thermistor.
Preferably, the first controller is an MCU.
Another objective of the present invention is to provide a color light module, which can make the laser in the emitting assembly of the light module always work in a specified temperature range, thereby avoiding signal interference between the color light modules and improving the signal transmission quality.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a colored light module, the module comprising:
a second controller, an optical module receiving assembly, and any one of the above optical module transmitting assemblies; the optical module receiving assembly and the optical module transmitting assembly are both connected to the second controller;
the optical module receiving assembly is used for converting the received optical signal into an electric signal.
Preferably, the second controller is a CPU.
According to the optical module transmitting assembly and the color optical module, the temperature measuring device is arranged to detect the temperature of the laser to obtain the detection temperature, the first controller is used for judging whether the detection temperature is within the preset temperature range, and when the detection temperature (namely the temperature of the laser) exceeds the preset temperature range, the semiconductor refrigerator is controlled to work, so that the temperature of the laser returns to the normal temperature range. Therefore, the technical scheme of the invention can enable the laser in the optical module transmitting assembly to work in a normal temperature range all the time, and prevent the wavelength offset of the laser from exceeding the normal offset, thereby avoiding the signal interference among the color optical modules and improving the signal transmission quality. In addition, when the temperature of the laser is in the preset temperature range, the semiconductor refrigerator is in a standby state, namely, the semiconductor refrigerator only starts to work when the temperature of the laser exceeds the preset temperature range, so that the power consumption of the whole color light module can be greatly reduced.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a first schematic structural diagram of an optical module transmitting assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an optical module transmitting assembly in the embodiment of the present invention;
FIG. 3 is a schematic diagram of a circuit structure of an optical module transmitting assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a color optical module according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating embodiments of the invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1, an optical module transmitting assembly provided in an embodiment of the present invention includes: a laser for converting the electrical signal into an optical signal; the assembly further comprises: the temperature measuring device, the semiconductor refrigerator and the first controller; the laser, the temperature measuring device and the semiconductor refrigerator are all connected to the first controller.
Wherein, the temperature measuring device is used for: detecting the temperature of the laser to obtain a detected temperature, and feeding back the detected temperature to the first controller; the first controller is to: reading the detection temperature, and judging whether the detection temperature is in a preset temperature range; and when the detected temperature exceeds the preset temperature range, controlling the semiconductor refrigerator to work so as to enable the detected temperature to be in the preset temperature range.
In order to reduce the power consumption of the light module emitting assembly, and further reduce the overall power consumption of the color light module, in this embodiment, when the detected temperature is within the preset temperature range, the first controller is further configured to: and controlling the semiconductor refrigerator to be in a standby state.
In this embodiment, when the detected temperature exceeds the preset temperature range, the semiconductor refrigerator is controlled to operate so that the detected temperature is within the preset temperature range, and the following method is specifically adopted:
when the detected temperature is larger than the maximum value of the preset temperature range, controlling the semiconductor refrigerator to cool so as to drive the laser to cool, so that the detected temperature is in the preset temperature range; and when the detection temperature is smaller than the minimum value of the preset temperature range, controlling the semiconductor refrigerator to heat up, and further driving the laser to heat up, so that the detection temperature is in the preset temperature range.
As shown in fig. 2 and 3, in the present embodiment, the assembly further includes: and the optical modulator is connected with the laser and used for modulating the received electric signal to obtain a modulated electric signal and taking the modulated electric signal as the input of the laser. In practical applications, the electrical signal received by the optical modulator is emitted by the host.
Further, the assembly further comprises: an optical power detector for detecting the light emission power of the laser; the optical power detector is connected to the first controller. The optical power detector feeds back the detected light emitting power of the laser to the first controller, and the first controller adjusts various parameters of the optical modulator, for example, the optical modulator modulates the electrical signal according to a preset or adjusted rate and format, so that the laser outputs an optical signal with a corresponding rate and format.
In the optical module transmitting assembly shown in fig. 3, a pin NTC + is a positive electrode of a thermistor NTC, and a pin NTC-is a negative electrode of the thermistor NTC; the pin TECP is the P pole of the semiconductor cooler TEC, and the pin TECN is the N pole of the semiconductor cooler TEC; the pin LD + is the anode of the laser LD, and the pin LD-is the cathode of the laser LD; pin MPD + is the positive pole of optical power detector MPD, and pin MPD-is the negative pole of optical power detector MPD. Wherein, the NTC-pin is connected with GND, and the other pins are respectively connected with the MCU according to corresponding signals. The thermistor NTC, the semiconductor cooler TEC, the laser LD and the optical power detector MPD in fig. 3 constitute a TO component, which is connected TO the MCU.
In this embodiment, the preset temperature range is as follows: [ T0-35 ℃, T0+35 ℃), wherein T0 is the preset standard operating temperature of the laser. In practical application, T0 is generally 50 ℃, that is, the preset temperature range is [15 ℃, 85 ℃), and most of the application environment temperatures satisfy the temperature range, so that the semiconductor refrigerator is in a standby state without working in most of the application scenarios, and thus, the power consumption of the emission assembly of the optical module, and even the entire color optical module, can be greatly reduced.
The reason why the above-mentioned preset temperature ranges are set to [ T0-35 ℃, T0+35 ℃) is that, in the industrial-grade operating temperature range (-40-85 ℃), the operating wavelength shift of the laser cannot exceed the range (± 6.5nm) required by the specification. As can be seen from the temperature wavelength characteristics of the laser LD, the variation of the wavelength of the laser LD with temperature is 0.1nm/1 deg.C, so that the temperature is from-40 to 85 deg.C, the variation of the wavelength of the laser LD is 12.5nm, and the variation of the wavelength of the laser LD is 6nm, i.e., the deviation of the wavelength is + -3 nm. Plus the deviation of the laser LD itself is + -3 nm, i.e., the variation is 6nm, the total wavelength variation of the laser LD is 18.5nm, which is beyond the range required by the specification + -6.5 nm, i.e., 13 nm. Therefore, a semiconductor cooler TEC is required to be added for control. In order to meet the requirement of wavelength deviation of 13nm, the semiconductor cooler TEC controls the wavelength deviation amount to be 13-6-7 nm, namely the control temperature fluctuates within 70 degrees. That is, the working range requirement of the laser LD wavelength can be satisfied as long as Tn is ensured to be T0 +/-35 ℃.
Preferably, the Temperature measuring device is a thermistor ntc (negative Temperature coefficient); the first controller is an MCU (micro controller Unit). The MCU is a small-sized CPU, and in this embodiment, the MCU is specifically responsible for detecting and controlling and managing various signals such as temperature signals, power signals, voltage signals, and current signals in the emitting assembly of the optical module.
In practical application, the optical module transmitting assembly further comprises a base, an adapter and the like, the optical module transmitting assembly is connected with the first controller MCU through the first flexible circuit board FPC, and the first controller MCU is arranged on the hard board PCB.
The working flow of the optical module transmitting component of the invention is described by combining the examples as follows:
the MCU learns the temperature of the NTC by detecting the voltage of the NTC and then learns the temperature of the laser LD. The MCU compares the obtained temperature of the laser LD with a preset temperature range (namely the normal working temperature range T0 +/-35 ℃ of the laser LD), and if the temperature T0-35 ℃ of the laser is more than or equal to Tn and less than or equal to T0+35 ℃, the MCU can be closed to supply control current to the semiconductor cooler TEC, so that the semiconductor cooler TEC is in a standby state, and the power consumption of the MCU and the power consumption of the whole color optical module are greatly reduced. If Tn is more than T0+35 ℃, then current in the NP direction (the direction from the N pole to the P pole) is added to the semiconductor cooler TEC, and as shown in FIG. 3, the semiconductor cooler TEC is cooled, so that the laser LD is cooled until Tn is less than or equal to T0+35 ℃; if Tn is less than T0-35 deg.C, current in PN direction (P pole to N pole) is applied to semiconductor cooler TEC to heat semiconductor cooler TEC, so that laser LD is heated until Tn is greater than T0-35 deg.C.
From the above, the temperature range of the semiconductor cooler TEC which does not work is T0-35 ℃ to T0+35 ℃, and when the T0 takes the value of 50 ℃, the temperature range of the semiconductor cooler TEC which does not work is 15 ℃ to 85 ℃, so that the overall power consumption of the color optical module is greatly reduced.
The present invention also provides a color optical module, as shown in fig. 4, the module includes: the optical module transmitting assembly comprises a second controller, an optical module receiving assembly and the optical module transmitting assembly in the embodiment; the optical module receiving assembly and the optical module transmitting assembly are both connected to the second controller; the optical module receiving assembly is used for converting the received optical signal into an electric signal.
Preferably, the second controller is a CPU. In this embodiment, the CPU is specifically responsible for detection, control and management of various signals, and coordinates normal operation of the optical module transmitting assembly and the optical module receiving assembly.
The optical module receiving assembly is composed of an Avalanche Photodiode (APD) and an electrical signal amplifier (TIA), wherein the APD is used for converting optical signals into electrical signals, and the TIA is used for amplifying the converted electrical signals.
The optical module receiving assembly further comprises a limiting amplifier LIA, and the limiting amplifier LIA is used for further amplifying the electric signal amplified by the electric signal amplifier TIA and then outputting the electric signal to a host. The host is the same device as the optical modulator in the optical module transmitting assembly when receiving the electric signal.
In practical application, the optical module receiving assembly further comprises a base, an adapter and the like.
According to the optical module transmitting assembly and the color optical module, the temperature measuring device is arranged to detect the temperature of the laser to obtain the detection temperature, the first controller is used for judging whether the detection temperature is within the preset temperature range, and when the detection temperature (namely the temperature of the laser) exceeds the preset temperature range, the semiconductor refrigerator is controlled to work, so that the temperature of the laser returns to the normal temperature range. Therefore, the technical scheme of the invention can enable the laser in the optical module transmitting assembly to work in a normal temperature range all the time, and prevent the wavelength offset of the laser from exceeding the normal offset, thereby avoiding the signal interference among the color optical modules and improving the signal transmission quality. In addition, when the temperature of the laser is in the preset temperature range, the semiconductor refrigerator is in a standby state, namely, the semiconductor refrigerator only starts to work when the temperature of the laser exceeds the preset temperature range, so that the power consumption of the whole color light module can be greatly reduced.
Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the embodiments of the present invention are not limited to the details of the above embodiments, and various simple modifications can be made to the technical solutions of the embodiments of the present invention within the technical idea of the embodiments of the present invention, and the simple modifications all belong to the protection scope of the embodiments of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention do not describe every possible combination.
Those skilled in the art will understand that all or part of the steps in the method according to the above embodiments may be implemented by a program, which is stored in a storage medium and includes several instructions to enable a single chip, a chip, or a processor (processor) to execute all or part of the steps in the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In addition, any combination of different implementation manners of the embodiments of the present invention can be performed, and the embodiments of the present invention should be considered as disclosed in the embodiments of the present invention as long as the combination does not depart from the idea of the embodiments of the present invention.
Claims (10)
1. A light module transmitter assembly comprising: a laser for converting the electrical signal into an optical signal; characterized in that said assembly further comprises: the temperature measuring device, the semiconductor refrigerator and the first controller; the laser, the temperature measuring device and the semiconductor refrigerator are all connected to the first controller;
the temperature measuring device is used for: detecting the temperature of the laser to obtain a detected temperature, and feeding back the detected temperature to the first controller;
the first controller is to: reading the detection temperature, and judging whether the detection temperature is in a preset temperature range; and when the detected temperature exceeds the preset temperature range, controlling the semiconductor refrigerator to work so as to enable the detected temperature to be in the preset temperature range.
2. The light module transmitter assembly of claim 1, wherein when the detected temperature is within the preset temperature range, the first controller is further configured to:
and controlling the semiconductor refrigerator to be in a standby state.
3. The optical module transmitter assembly as claimed in claim 1 or 2, wherein said controlling the semiconductor cooler to operate when the detected temperature is beyond the preset temperature range so that the detected temperature is within the preset temperature range comprises:
when the detected temperature is larger than the maximum value of the preset temperature range, controlling the semiconductor refrigerator to cool so as to enable the detected temperature to be in the preset temperature range;
and when the detected temperature is smaller than the minimum value of the preset temperature range, controlling the semiconductor refrigerator to be heated so as to enable the detected temperature to be in the preset temperature range.
4. The light module transmitter assembly of claim 1, wherein the assembly further comprises: and the optical modulator is connected with the laser and used for modulating the received electric signal to obtain a modulated electric signal and taking the modulated electric signal as the input of the laser.
5. The light module transmitter assembly of claim 4, wherein the assembly further comprises: an optical power detector for detecting the light emission power of the laser; the optical power detector is connected to the first controller.
6. The light module transmitter assembly of claim 1, wherein the predetermined temperature range is: [ T0-35 ℃, T0+35 ℃), wherein T0 is the preset standard operating temperature of the laser.
7. The optical module transmitter assembly of claim 1, wherein the temperature measuring device is a thermistor.
8. The light module transmitter assembly of claim 1, wherein the first controller is an MCU.
9. A color light module, the module comprising: a second controller, a light module receiving assembly, and a light module transmitting assembly of any of claims 1-8; the optical module receiving assembly and the optical module transmitting assembly are both connected to the second controller;
the optical module receiving assembly is used for converting the received optical signal into an electric signal.
10. The color light module of claim 9 wherein the second controller is a CPU.
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| CN202010573075.4A CN111698035A (en) | 2020-06-22 | 2020-06-22 | Optical module emission assembly and colored light module |
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| CN202010573075.4A CN111698035A (en) | 2020-06-22 | 2020-06-22 | Optical module emission assembly and colored light module |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005654A (en) * | 2004-06-17 | 2006-01-05 | Mitsubishi Electric Corp | Device and system for optical communication |
| US20090316741A1 (en) * | 2008-06-20 | 2009-12-24 | Fujitsu Limited | Temperature control apparatus and optical transmission device using same |
| WO2010139144A1 (en) * | 2009-06-05 | 2010-12-09 | 中兴通讯股份有限公司 | Optical module and control method thereof |
| US20160268771A1 (en) * | 2014-03-06 | 2016-09-15 | Huawei Technologies Co., Ltd. | Method, apparatus, optical component and optical network system for controlling operating temperature of optical component |
| CN205812013U (en) * | 2016-07-26 | 2016-12-14 | 成都成电光信科技股份有限公司 | A kind of multi-channel wide temperature RoF light emission module |
| CN108631874A (en) * | 2017-03-20 | 2018-10-09 | 日照市艾锐光电科技有限公司 | The OLT optical assemblies and optical module without refrigerator towards 10G-PON applications |
| CN209017047U (en) * | 2018-10-08 | 2019-06-21 | 杭州万隆光电设备股份有限公司 | Uplink burst mode optical sender with thermostatic control Wavelength tunable |
-
2020
- 2020-06-22 CN CN202010573075.4A patent/CN111698035A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005654A (en) * | 2004-06-17 | 2006-01-05 | Mitsubishi Electric Corp | Device and system for optical communication |
| US20090316741A1 (en) * | 2008-06-20 | 2009-12-24 | Fujitsu Limited | Temperature control apparatus and optical transmission device using same |
| WO2010139144A1 (en) * | 2009-06-05 | 2010-12-09 | 中兴通讯股份有限公司 | Optical module and control method thereof |
| US20160268771A1 (en) * | 2014-03-06 | 2016-09-15 | Huawei Technologies Co., Ltd. | Method, apparatus, optical component and optical network system for controlling operating temperature of optical component |
| CN205812013U (en) * | 2016-07-26 | 2016-12-14 | 成都成电光信科技股份有限公司 | A kind of multi-channel wide temperature RoF light emission module |
| CN108631874A (en) * | 2017-03-20 | 2018-10-09 | 日照市艾锐光电科技有限公司 | The OLT optical assemblies and optical module without refrigerator towards 10G-PON applications |
| CN209017047U (en) * | 2018-10-08 | 2019-06-21 | 杭州万隆光电设备股份有限公司 | Uplink burst mode optical sender with thermostatic control Wavelength tunable |
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Application publication date: 20200922 |