CN111694386A - Force calculation board protection device and temperature control method thereof - Google Patents
Force calculation board protection device and temperature control method thereof Download PDFInfo
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- CN111694386A CN111694386A CN202010522726.7A CN202010522726A CN111694386A CN 111694386 A CN111694386 A CN 111694386A CN 202010522726 A CN202010522726 A CN 202010522726A CN 111694386 A CN111694386 A CN 111694386A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a force calculation board protection device and a temperature control method thereof, belonging to the technical field of force calculation board safety, and comprising a control main board and an aluminum-based substrate force calculation board arranged on one side of the control main board, wherein the control main board is electrically connected with the force calculation board, a plurality of operation chips are arranged on the force calculation board, a temperature sensing element and an MOS (metal oxide semiconductor) switch are embedded on one side of each operation chip so as to monitor the temperature and control the on-off of the operation chip, the force calculation board is provided with an operation area and a pre-preparation area, a plurality of operation chips which are connected with and disconnected with the MOS switches are arranged in the operation area, a plurality of to-be-operated operation chips which are disconnected with the MOS switches are arranged in the pre-preparation area, and an MCU micro-controller is arranged in the control main board and is interconnected with the operation chips, the temperature sensing element. The invention solves the problem that the chip on the force calculation board is easy to burn out due to overhigh temperature in the operation process, and greatly improves the overall operation benefit and safety of the force calculation board.
Description
Technical Field
The invention belongs to the technical field of force calculation plate safety, and particularly relates to a force calculation plate protection device and a temperature control method thereof.
Background
The existing force calculation board structure adopts the mode that a plurality of high-density chips are arranged on the force calculation board to enhance the calculation speed and the benefit of the force calculation board, and the chips can generate a large amount of heat in the calculation process to cause the temperature of the chips to rise, so that the chips are easy to damage and even burn out, the force calculation board is difficult to normally operate, and the whole calculation benefit and the safety of the force calculation board are greatly influenced.
Disclosure of Invention
The invention provides a force calculation plate protection device and a temperature control method thereof, which solve the problems that the temperature of a chip on the existing force calculation plate is increased in the operation process, the chip is easy to burn out, and the overall operation benefit and the safety of the force calculation plate are influenced.
In order to achieve the purpose, the invention provides a force calculation board protection device which comprises a control main board and an aluminum base material force calculation board arranged on one side of the control main board, wherein the control main board is electrically connected with the force calculation board, a plurality of calculation chips are arranged on the force calculation board, a temperature sensing element and an MOS (metal oxide semiconductor) switch are embedded on one side of each calculation chip so as to monitor the temperature and control the on/off of the calculation chip, the force calculation board is provided with an operation area and a preparation area, a plurality of calculation chips which are switched on the MOS switches and a plurality of calculation chips which are switched off the MOS switches are arranged in the operation area, a plurality of to-be-operated calculation chips which are switched off the MOS switches are arranged in the preparation area, and an MCU micro controller is arranged in the control main board and is interconnected with the calculation chips, the temperature sensing element and the MOS switches.
Preferably, the control main board controls the MOS switch of the operation chip in the operation area to be turned off or turned on, and controls the MOS switch of the operation chip in the preparation area to be turned on.
Preferably, the operation chip with the MOS switch in the operation region turned off is operated by the operation chip with the MOS switch in the operation region.
Preferably, the operation chip with the MOS switch in the operation area turned off is operated by the operation chip with the MOS switch in the preparation area.
Preferably, the number of the operation chips in the operation area is at least 1 time of the number of the operation chips in the preparation area.
Preferably, the temperature sensing element comprises one of a platinum thermistor temperature sensing element, a thermocouple temperature sensing element or a thermistor temperature sensing element.
Preferably, the arithmetic chips on the arithmetic board are the same arithmetic chip.
In addition, in order to achieve the above object, the present invention further provides a temperature control method for a computing board, which is applied to the computing board protection device described in any one of the above, the method including:
an acquisition step: acquiring a force calculation board and a control main board, and electrically connecting the control main board with the force calculation board, wherein an MCU is arranged in the control main board;
the setting step: the force calculation board is embedded with a plurality of operation chips, one side of each operation chip is embedded with a temperature sensing element and an MOS switch, and the force calculation board comprises an operation area and a preparation area of the operation chip;
a monitoring step: monitoring the temperature of heat generated by the corresponding operation chip in the operation process by utilizing each temperature sensing element on the force calculation board; and
the control steps are as follows: when the temperature sensing element monitors that the temperature of the corresponding operation chip exceeds a preset temperature value, the MCU is triggered to control the MOS switch on the computation board to switch off the operation of one operation chip and/or switch on the operation of the other operation chip.
Preferably, the setting step includes:
a plurality of operation chips of the switched-on MOS switches and a plurality of operation chips of the switched-off MOS switches are arranged in the operation area, and a plurality of to-be-operated operation chips of the switched-off MOS switches are arranged in the preparation area.
Preferably, the controlling step includes:
when a certain temperature sensing element in the operation area monitors that the temperature of a corresponding operation chip exceeds a first preset temperature value, triggering the MCU to control the MOS switch to disconnect the operation of the corresponding operation chip, and starting another operation chip from the operation area to replace the operation of the operation chip;
when another temperature sensing element in the operation area monitors that the temperature of another corresponding operation chip exceeds a second preset temperature value, triggering the MCU to control the MOS switch to disconnect the operation of the other corresponding operation chip, and starting another operation chip from the preparation area to replace the operation of the other operation chip, wherein the second preset temperature value is greater than the first preset temperature value;
when the temperature of another temperature sensing element which is started to operate in the preparation area monitors another corresponding operation chip exceeds a third preset temperature value, the MCU micro controller is triggered to control the MOS switch to lock the operation of the operation chip so as to avoid burning loss of the computation force board, wherein the third preset temperature value is greater than a second preset temperature value.
The invention provides a force calculation board protection device and a temperature control method thereof.A temperature sensing element is arranged on the force calculation board and used for monitoring the temperature of a corresponding calculation chip so as to trigger an MCU (micro control unit) to control an MOS (metal oxide semiconductor) switch on or off the operation of the calculation chip on the force calculation board, thereby solving the problem that the chip on the force calculation board is easily burnt out due to overhigh temperature in the operation process, and greatly improving the overall operation benefit and safety of the force calculation board.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a flow chart of the structure of the force computing plate protection device of the present invention;
FIG. 2 is a schematic structural diagram of a force computing plate in the force computing plate protection device of the present invention;
FIG. 3 is a flow chart of a preferred embodiment of the temperature control method of the force calculation plate according to the present invention;
description of the drawings: 1. a control main board; 101. an MCU micro controller; 2. calculating the strength board; 201. an arithmetic chip; 3. an operation area; 301. a temperature sensing element; 302. a MOS switch; 4. a preparation area.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," "certain," "further," and the like in the description and claims of this application or in the foregoing drawings are used for distinguishing between different objects and not necessarily for describing a particular sequential order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The embodiment of the invention provides a computing board protection device, and referring to fig. 1 and fig. 2, the device comprises a control main board 1 and an aluminum-based substrate computing board 2 arranged on one side of the control main board 1, the control main board 1 is electrically connected with the computing board 2, a plurality of computing chips 201 are arranged on the computing board 2, a temperature sensing element 301 and an MOS switch 302 are embedded on one side of each computing chip 201 to monitor the temperature and control the on-off of the computing chip 201, the computing board 2 is provided with an operation area 3 and a preparation area 4, the operating chips 201 of the MOS switches 302 which are switched on and the computing chips 201 of the MOS switches 302 which are switched off are arranged in the operation area 3, the operating chips 201 of the MOS switches 302 which are switched off are arranged in the preparation area 4, an MCU microcontroller 101 is arranged in the control main board 1, the MCU microcontroller 101 and the computing chips 201 are arranged in the preparation area 1, The temperature-sensitive element 301 and the MOS switch 302 are interconnected.
In this embodiment, a control main board 1 is connected with a computation force board 2 and powered on, an MCU micro-controller 101 is arranged in the control main board 1, the computation force board 2 adopts an aluminum-based substrate PCB board with rapid heat dissipation, a plurality of computation chips 201 with high density and high computation rate are arranged on the computation force board 2, a temperature sensing element 301 and an MOS switch 302 are embedded on one side of each computation chip 201, the temperature sensing element 301 is used for sensing the heat temperature generated by the corresponding computation chip 201 in the operation process, the MOS switch 302 is used for switching on or off the operation of the corresponding computation chip 201, the computation force board 2 is burned out due to the over-high temperature of the computation chip 201 on the computation force board 2 under the control of the control main board 1, and the use benefit and safety of the computation force board 2 can be further improved.
The MCU microcontroller 101 integrates functions of Memory (Memory), counter (Timer), a/D conversion, data transmission, and recording, and can be controlled in different combinations for different applications. Such as mobile phones, PC peripherals, remote controls, automotive electronics, industrial stepper motors, robotic arm controls, etc., can see the silhouette of the MCU.
The MOS switch 302 is commonly called a mosfet or a MOS transistor, and is all called a metal Oxide Semiconductor type mosfet (metal Oxide Semiconductor Field Effect transistor). The principle is that the voltage supplied to the MOS tube by the mainboard 1 is controlled to conduct the circuit and connect the circuit, so that a switch 302 is formed to act. In a typical electronic circuit, a MOS switch 302 is often used to turn the circuit on or off.
Specifically, an operation area 3 and a preparation area 4 are arranged on the force computing board 2, the operation area 3 and the preparation area 4 both include a plurality of operation chips 201 and corresponding temperature sensing elements 301 and MOS switches 302, wherein the operation chip 201 with a plurality of MOS switches 302 being turned on and the operation chip 201 with a plurality of MOS switches 302 being turned off are arranged in the operation area 3, the operation chip 201 to be operated with a plurality of MOS switches 302 being turned off is arranged in the preparation area 4, the MOS switches 302 of the operation chips 201 in the operation area 3 are controlled by the control main board 1 to be turned on or off, and the MOS switches 302 of the operation chips 201 in the preparation area 4 are controlled to be turned on or off.
Further, the operation chip 201 in which the MOS switch 302 in the operation region 3 is turned off is operated by the operation chip 201 in which the MOS switch 302 in the operation region 3 is turned on.
In an optional embodiment, if a temperature of an operation chip 201 in the operation area 3 rises during the operation process, the operation chip 201 that is turned off by the corresponding MOS switch 302 avoids the operation chip 201 from affecting the calculation efficiency and burning out the operation chip 201 due to the overhigh temperature, and the control main board 1 controls a MOS switch 302 in the operation area 3 to turn on an operation chip 201 to supplement the operation of the operation chip 201 with the temperature rise.
Further, the operation chip 201 in which the MOS switch 302 in the operation area 3 is turned off is operated by the operation chip 201 in which the MOS switch 302 in the preliminary area 4 is turned on.
In another alternative embodiment, if the temperature of one of the operation chips 201 in the operation area 3 continues to increase during the operation process, the corresponding MOS switch 302 turns off the operation chip 201, and the control main board 1 controls one of the MOS switches 302 in the preparation area 4 to turn on one of the operation chips 201 to replace the operation of the operation chip 201 whose temperature continues to increase.
Further, the number of the operation chips 201 in the operation area 3 is at least 1 times of the number of the operation chips 201 in the preparation area 4.
In this embodiment, to ensure the benefit and the security of the performance board 2 during the operation process, the data of the operation chips 201 disposed on the performance board 2 is limited, which includes but is not limited to that the number of the operation chips 201 in the operation area 3 is at least 1 times the number of the operation chips 201 in the preparation area 4.
For example, the total number of the arithmetic chips 201 deployed on the force computing board 2 is 50, wherein 40 are deployed in the running area 3, and 10 are deployed in the preparation area 4. In the operation area 3, the control main board 1 is used for controlling 35 MOS switches 302 to switch on the corresponding operation chips 201, and 5 MOS switches 302 switch off the corresponding operation chips 201 to be started to operate; and the control main board 1 controls the 10 MOS switches 302 in the preparation area 4 to disconnect the operation of the corresponding operation chip 201.
Further, the temperature sensing element 301 includes one of a platinum thermistor temperature sensing element, a thermocouple temperature sensing element or a thermistor temperature sensing element, and preferably, a thermistor temperature sensing element is adopted in the present embodiment.
The platinum thermal resistor is designed and manufactured by utilizing the basic principle that the resistance value of a platinum wire changes along with the change of temperature, and the platinum thermal resistor is used as a temperature sensing element, has the types of armor type, assembly type, socket type and end surface thermal resistor, and is suitable for industries with small temperature errors or precision instruments.
The thermocouple temperature sensing element is mainly welded together through two different metal materials, the main temperature changes, then different electric potentials are generated at two ends, and the corresponding temperature change is obtained through the change of the electric potentials.
The thermistor is composed of metal oxide ceramics, and is a temperature sensing element with low cost and highest sensitivity. The temperature measuring range is small, about 50 to 200 ℃, the volume is small, the response time is fast, and the temperature measuring device is widely applied to a plurality of household appliances.
In summary, the present invention provides a computing force board protection device, wherein a temperature sensing element 301 is disposed on the computing force for monitoring the temperature of a corresponding computing chip 201, and a MOS switch 302 is used to turn off or turn on the operation of the corresponding computing chip 201, so that the control main board 1 controls the on/off of the MOS switch 302 according to the temperature of the temperature sensing element 301 to control the operation or stop of the computing chip 201. That is, a certain operation chip 201 has an excessively high temperature, the control main board 1 controls another operation chip 201 to start operation to replace the operation of the operation chip 201 having the excessively high temperature, thereby solving the problem that the operation chip 201 on the operation board 2 has an excessively high temperature and is easy to burn out the chip in the operation process, ensuring that a plurality of started high-density operation chips 201 can operate uninterruptedly, and greatly improving the overall operation benefit and safety of the operation board 2.
In addition, referring to fig. 3, a flow chart of a preferred embodiment of the temperature control method of the force calculation plate of the present invention is shown. In order to achieve the above object, the present invention further provides a temperature control method for a computing force plate, which is applied to the computing force plate protection device described in any one of the above items, and the method includes:
s1, obtaining a force calculation board 2 and a control main board 1, electrically connecting the control main board 1 with the force calculation board 2, wherein the MCU 101 is arranged in the control main board 1.
The MCU microcontroller 101 integrates functions such as Memory (Memory), counter (Timer), a/D conversion, data transmission, and recording, and can be controlled in different combinations for different applications. Such as mobile phones, PC peripherals, remote controls, automotive electronics, industrial stepper motors, robotic arm controls, etc., can see the silhouette of the MCU.
S2, embedding a plurality of operation chips 201 on the computation board 2, wherein a temperature sensing element 301 and an MOS switch 302 are embedded on one side of each operation chip 201, and the computation board 2 comprises an operation area 3 and a preparation area 4 of the operation chip 201.
The temperature sensing element 301 includes one of a platinum thermistor temperature sensing element, a thermocouple temperature sensing element, or a thermistor temperature sensing element, and preferably, a thermistor temperature sensing element is employed in the present embodiment.
The platinum thermal resistor is designed and manufactured by utilizing the basic principle that the resistance value of a platinum wire changes along with the change of temperature, and the platinum thermal resistor is used as a temperature sensing element, has the types of armor type, assembly type, socket type and end surface thermal resistor, and is suitable for industries with small temperature errors or precision instruments.
The thermocouple temperature sensing element is mainly welded together through two different metal materials, the main temperature changes, then different electric potentials are generated at two ends, and the corresponding temperature change is obtained through the change of the electric potentials.
The thermistor is composed of metal oxide ceramics, and is a temperature sensing element with low cost and highest sensitivity. The temperature measuring range is small, about 50 to 200 ℃, the volume is small, the response time is fast, and the temperature measuring device is widely applied to a plurality of household appliances.
The MOS switch 302 is commonly called a mosfet or a MOS transistor, and is all called a metal Oxide Semiconductor type mosfet (metal Oxide Semiconductor Field Effect transistor). The principle is that the circuit is conducted by controlling the voltage supplied to the MOS tube by the mainboard 1 to switch on the circuit, thereby forming a switching function. In a typical electronic circuit, a MOS switch 302 is often used to turn the circuit on or off.
Further, the step S2 includes:
a plurality of operation chips 201 of the switched-on MOS switches 302 and a plurality of operation chips 201 of the switched-off MOS switches 302 are arranged in the operation area 3, and a plurality of to-be-operated operation chips 201 of the switched-off MOS switches 302 are arranged in the preparation area 4.
In one embodiment, the total number of the computing chips 201 deployed on the computing board 2 is 50, wherein 40 are deployed in the running area 3, and 10 are deployed in the preparation area 4. In the operation area 3, the control main board 1 is used for controlling 35 MOS switches 302 to switch on the corresponding operation chips 201, and 5 MOS switches 302 switch off the corresponding operation chips 201 to be started to operate; in the preparation area 4, the control main board 1 controls the 10 MOS switches 302 in the preparation area 4 to disconnect the operation of the corresponding operation chip 201.
And S3, monitoring the temperature of the heat generated by the corresponding operation chip 201 in the operation process by using each temperature sensing element 301 on the computation board 2.
S4, when the temperature sensing element 301 detects that the temperature of the corresponding operation chip 201 exceeds a preset temperature value, the MCU 101 is triggered to control the MOS switch 302 on the computation board 2 to turn off the operation of one operation chip 201 and/or turn on the operation of another operation chip 201.
Further, the step S4 includes:
when a certain temperature sensing element 301 in the operation area 3 monitors that the temperature of the corresponding operation chip 201 exceeds a first preset temperature value (for example, the first preset temperature value is 85 ℃), triggering the MCU microcontroller 101 to control the MOS switch 302 to disconnect the operation of the corresponding operation chip 201, and starting another operation chip 201 from the operation area 3 to replace the operation of the operation chip 201;
when another temperature sensing element 301 in the operation area 3 monitors that the temperature of another corresponding operation chip 201 exceeds a second preset temperature value (for example, the second preset temperature value is 96 degrees, which is a common set critical point), triggering the MCU microcontroller 101 to control the MOS switch 302 to disconnect the operation of another corresponding operation chip 201, and starting another operation chip 201 from the preparation area 4 to replace the operation of another operation chip 201, where the second preset temperature value is greater than the first preset temperature value;
when another temperature sensing element 301 which is started to operate in the preparation area 4 monitors that the temperature of another corresponding operation chip 201 exceeds a third preset temperature value (for example, the third preset temperature value is 105 degrees), the MCU microcontroller 101 is triggered to control the MOS switch 302 to lock the operation of the operation chip 201, so as to avoid burning loss of the computation force plate 2, wherein the third preset temperature value is greater than the second preset temperature value.
It should be noted that, through experimental tests, when the temperature of the operation chip on the computation board reaches 125 degrees in the operation process, the computation chip will be directly burned out, and the computation board is damaged and is difficult to normally operate.
Firstly, electrically connecting an obtained force calculation board 2 with a control main board 1 with a built-in MCU (micro control unit) 101, embedding a plurality of operation chips 201 on the force calculation board 2, and embedding a temperature sensing element 301 and an MOS (metal oxide semiconductor) switch 302 on one side of each operation chip 201, wherein the force calculation board 2 comprises an operation area 3 and a preparation area 4 of the operation chip 201; each temperature sensing element 301 on the computation board 2 is used for monitoring whether the temperature of heat generated by the corresponding computation chip 201 in the operation process exceeds a preset temperature value, and the MCU micro controller 101 is triggered to control the MOS switch 302 on the computation board 2 to switch off the operation of one computation chip 201 and/or switch on the operation of another computation chip 201. Therefore, the problem that the operation chip 201 on the computation board 2 is easily burnt out due to overhigh temperature in the operation process is solved, uninterrupted operation of a plurality of started high-density operation chips 201 is ensured, and the overall operation benefit and the safety of the computation board 2 are greatly improved.
The technical principle of the present invention has been described above with reference to specific embodiments, which are merely preferred embodiments of the present invention. The protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. Other embodiments of the invention will occur to those skilled in the art without the exercise of inventive faculty, and such will fall within the scope of the invention.
Claims (10)
1. The utility model provides an arithmetic board protection device, its characterized in that, the device is in including control mainboard and setting the aluminium base substrate arithmetic board of control mainboard one side, control mainboard and arithmetic board electric connection, be equipped with a plurality of operation chips on the arithmetic board, each operation chip one side all inlays and is equipped with temperature sensing element and MOS switch to carry out temperature monitoring and on-off control to the operation chip, the arithmetic board is provided with operation district and pre-prepared area, be provided with a plurality of operation chips and a plurality of arithmetic chip that have disconnected MOS switch that have switched on the MOS switch in the operation district, be provided with a plurality of operation chips that wait to run of having disconnected MOS switch in the pre-prepared area, set up the MCU microcontroller in the control mainboard, MCU microcontroller and arithmetic chip, temperature sensing element and MOS switch interconnect.
2. The computing board protection device according to claim 1, wherein the control main board controls the MOS switches of the computing chips in the operating area to be turned off or on, and controls the MOS switches of the computing chips in the preparation area to be turned on.
3. The computing force board protection device according to claim 2, wherein the computing chip with the MOS switch in the operation region turned off is operated instead of the computing chip with the MOS switch in the operation region turned on.
4. The computing board protection device according to claim 2, wherein the computing chip with the MOS switch in the operation region turned off is operated instead of the computing chip with the MOS switch in the preliminary region turned on.
5. The computing board protection device of claim 1, wherein the number of compute chips in the run area is at least 1 times the number of compute chips in the preparation area.
6. The computing board protection device of claim 1, wherein the temperature-sensing element comprises one of a platinum thermistor temperature-sensing element, a thermocouple temperature-sensing element, or a thermistor temperature-sensing element.
7. The computing force board protection device of claim 1, wherein the computing chips on the computing force board are the same computing chip.
8. A computing board temperature control method applied to the computing board protection device of any one of claims 1 to 7, the method comprising:
an acquisition step: acquiring a force calculation board and a control main board, and electrically connecting the control main board with the force calculation board, wherein an MCU is arranged in the control main board;
the setting step: the force calculation board is embedded with a plurality of operation chips, one side of each operation chip is embedded with a temperature sensing element and an MOS switch, and the force calculation board comprises an operation area and a preparation area of the operation chip;
a monitoring step: monitoring the temperature of heat generated by the corresponding operation chip in the operation process by utilizing each temperature sensing element on the force calculation board; and
the control steps are as follows: when the temperature sensing element monitors that the temperature of the corresponding operation chip exceeds a preset temperature value, the MCU is triggered to control the MOS switch on the computation board to switch off the operation of one operation chip and/or switch on the operation of the other operation chip.
9. The computing board temperature control method according to claim 8, wherein the setting step comprises:
a plurality of operation chips of the switched-on MOS switches and a plurality of operation chips of the switched-off MOS switches are arranged in the operation area, and a plurality of to-be-operated operation chips of the switched-off MOS switches are arranged in the preparation area.
10. The computing board temperature control method according to claim 9, wherein the controlling step comprises:
when a certain temperature sensing element in the operation area monitors that the temperature of a corresponding operation chip exceeds a first preset temperature value, triggering the MCU to control the MOS switch to disconnect the operation of the corresponding operation chip, and starting another operation chip from the operation area to replace the operation of the operation chip;
when another temperature sensing element in the operation area monitors that the temperature of another corresponding operation chip exceeds a second preset temperature value, triggering the MCU to control the MOS switch to disconnect the operation of the other corresponding operation chip, and starting another operation chip from the preparation area to replace the operation of the other operation chip, wherein the second preset temperature value is greater than the first preset temperature value; and
when the temperature of another temperature sensing element which is started to operate in the preparation area monitors another corresponding operation chip exceeds a third preset temperature value, the MCU micro controller is triggered to control the MOS switch to lock the operation of the operation chip so as to avoid burning loss of the computation force board, wherein the third preset temperature value is greater than a second preset temperature value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010522726.7A CN111694386A (en) | 2020-06-10 | 2020-06-10 | Force calculation board protection device and temperature control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010522726.7A CN111694386A (en) | 2020-06-10 | 2020-06-10 | Force calculation board protection device and temperature control method thereof |
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| CN111694386A true CN111694386A (en) | 2020-09-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865739A (en) * | 2021-08-30 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Temperature detection device and server |
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2020
- 2020-06-10 CN CN202010522726.7A patent/CN111694386A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865739A (en) * | 2021-08-30 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Temperature detection device and server |
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