CN111687540A - Laser marking machine with special control by temperature change accommodation space of Z axle focusing - Google Patents

Laser marking machine with special control by temperature change accommodation space of Z axle focusing Download PDF

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Publication number
CN111687540A
CN111687540A CN202010525904.1A CN202010525904A CN111687540A CN 111687540 A CN111687540 A CN 111687540A CN 202010525904 A CN202010525904 A CN 202010525904A CN 111687540 A CN111687540 A CN 111687540A
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CN
China
Prior art keywords
temperature control
marking
laser
assembly
axis focusing
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Granted
Application number
CN202010525904.1A
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Chinese (zh)
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CN111687540B (en
Inventor
徐强
黄河森
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Guangzhou Xinke Laser Equipment Co ltd
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Guangzhou Xinke Laser Equipment Co ltd
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Priority to CN202010525904.1A priority Critical patent/CN111687540B/en
Publication of CN111687540A publication Critical patent/CN111687540A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a laser marking machine with a Z-axis focusing special temperature control accommodating space, which comprises a machine case, wherein a marking table is arranged at the bottom end of the machine case; an electrical cabinet is arranged on one side of the case, and a controller is arranged in the electrical cabinet; the top of the case is provided with a supporting mechanism, the supporting mechanism is provided with a marking assembly, the marking assembly comprises a marking box and a scanning head, one side of the marking box is obliquely provided with a reflecting assembly, and a laser and a temperature control chamber are arranged in the marking box; a Z-axis focusing assembly is arranged in the temperature control chamber, a rectangular through hole is formed in the front side surface of the temperature control chamber, a temperature control assembly is mounted on the rectangular through hole, and the temperature control assembly comprises a transmission block, a semiconductor refrigeration piece and a radiator; the semiconductor refrigerating sheet is connected with the controller; the temperature control accommodating space is internally provided with the temperature sensor, and the temperature sensor is connected with the controller.

Description

Laser marking machine with special control by temperature change accommodation space of Z axle focusing
Technical Field
The invention relates to the field of laser marking equipment, in particular to a laser marking machine with a Z-axis focusing special temperature control accommodating space.
Background
The laser marking machine is an optical, electromechanical integrated device integrating laser technology and computer technology. The laser marking technique is now being paid more attention to its application in domestic and foreign industries, and various new marking devices are coming into the way, and it replaces the traditional marking method with its unique advantages, and can print marks on the surfaces of various objects such as various mechanical parts, electronic components, integrated circuit modules, instruments, meters, etc.
In the working process of the laser marking machine, the focal length needs to be adjusted through the Z-axis focusing lens, but the Z-axis focusing lens generates much heat in the focusing process, if the Z-axis focusing lens cannot be effectively cooled, the working performance and the marking precision of the laser marking machine are affected, and the marking effect is not ideal; under the condition of using a high-power laser, the reliability of the laser marking machine is restricted and the possibility of further improving the power due to the fact that the temperature of the Z-axis focusing lens is too high, so that the temperature of the Z-axis focusing lens needs to be controlled, but application research for controlling the temperature of the Z-axis focusing lens is lacked in the prior art.
Therefore, it is necessary to provide a laser marking machine with a Z-axis focusing dedicated temperature control accommodating space, which is convenient to use, has good safety, and can perform temperature adjustment on a Z-axis focusing lens.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the laser marking machine which is convenient to use, good in safety and capable of adjusting the temperature of the Z-axis focusing lens and is provided with the Z-axis focusing special temperature control accommodating space.
In order to achieve the purpose of the invention, the technical scheme of the invention is realized as follows: a laser marking machine with a Z-axis focusing special temperature control accommodating space comprises a machine case, wherein a marking table for placing a marking object is arranged at the bottom end of the machine case; an electrical cabinet is arranged on one side of the case, and a controller is arranged in the electrical cabinet;
the top of the case is provided with a supporting mechanism, the top of the case is provided with a top plate, a mounting hole is formed in the top plate in the vertical direction, and the upper end of the supporting mechanism penetrates through the mounting hole and extends out of the case;
the supporting mechanism is provided with a marking assembly, the marking assembly comprises a marking box and a scanning head, and a laser and a temperature control chamber are arranged in the marking box; the scanning head is arranged close to the marking box and is in the same direction with the temperature control chamber; a reflecting component is obliquely arranged on one side of the marking box, which is far away from the scanning head, and the temperature control chamber is positioned between the scanning head and the reflecting component;
a temperature control accommodating space is formed in the temperature control chamber, and a Z-axis focusing assembly is arranged in the temperature control accommodating space; the Z-axis focusing assembly is connected with the controller and is used for adjusting the focal length of a light beam of incident laser to adapt to the fluctuation of different positions on the surface of the marking object;
a rectangular through hole is formed in the front side face of the temperature control chamber, and the rectangular through hole extends inwards along the horizontal direction to be communicated with the temperature control accommodating space;
the temperature control assembly is arranged on the mounting hole and comprises a conduction block, a semiconductor refrigeration piece and a radiator which are sequentially arranged from inside to outside; the cold end of the semiconductor refrigeration sheet is attached to the conduction block, and the hot end of the semiconductor refrigeration sheet is attached to the radiator; the semiconductor refrigerating sheet is connected with the controller; the transmission block is communicated with the temperature control accommodating space; the semiconductor refrigerating sheet transfers heat energy to the temperature control chamber through the conduction block;
the scanning head comprises a plurality of galvanometers and is used for changing the direction of the marking laser and enabling the marking laser to be emitted towards the marking table;
a temperature sensor for measuring the temperature of a temperature control room is arranged in the temperature control accommodating space, the temperature sensor is connected with the controller, and the controller controls the semiconductor refrigerating sheet to be turned on/off according to the temperature data of the temperature control room measured by the temperature sensor so as to adjust the temperature of the Z-axis focusing assembly;
marking laser is emitted from a laser, is reflected by the reflecting assembly in sequence and then enters the temperature control chamber, is focused by the Z-axis focusing assembly in the temperature control chamber and then enters the scanning head, and finally is marked on a marked object, so that marking operation is realized.
Preferably, a conduction block connecting sheet corresponding to the conduction block is arranged in the temperature control chamber, and the conduction block is fixed on the front side surface of the temperature control chamber through the conduction block connecting sheet; the conducting block connecting sheet is provided with a plurality of connecting holes.
Preferably, the heat sink comprises a first heat dissipation area and a second heat dissipation area, and the first heat dissipation area and the second heat dissipation area both comprise a plurality of heat dissipation fins uniformly distributed along the horizontal direction; a plurality of screw holes are formed between the first heat dissipation area and the second heat dissipation area, and the screw holes comprise a first screw hole and a second screw hole which are arranged on the left and right; first screw hole and second screw hole all run through along the horizontal direction both sides around the radiator.
Preferably, the left side and the right side of the conductive block are respectively provided with a first connecting part and a second connecting part which protrude outwards along the horizontal direction; both ends of the first connecting part and the second connecting part extend to the edges of the front end and the rear end of the conducting block along the thickness direction of the conducting block; the first connecting part is provided with a first connecting groove along the thickness direction of the conducting block; the second connecting portion is provided with a second connecting groove along the thickness direction of the conductive block.
Preferably, the reflection assembly further comprises a first reflection assembly, a connecting pipe and a second reflection assembly which are sequentially connected from back to front; the first reflection assembly comprises a first reflection lens and is used for changing the optical path of the marking laser; the first reflection assembly is arranged at the front end of the laser and is positioned on an emergent light path of marking laser; the second reflection assembly comprises a second reflection lens and is used for changing the light path of the marking laser reflected by the first reflection lens and enabling the marking laser to be incident to the Z-axis focusing assembly; the second reflection assembly is arranged at the right end of the Z-axis focusing assembly.
Preferably, the Z-axis focusing assembly comprises a base, a slide rail is arranged on the base along the laser light path direction, a support capable of sliding along the slide rail is arranged on the slide rail, and a focusing lens is arranged on the support; the Z-axis focusing assembly further comprises a swing motor directly or indirectly connected with the support, the swing motor is connected with the controller, and the swing motor drives the support to move back and forth along the direction of the sliding rail; and a focusing lens barrel is also arranged between the Z-axis focusing assembly and the scanning head.
Preferably, a circuit board and a plurality of cooling fans are arranged in the electrical cabinet, and a plurality of cooling holes are arranged on the electrical cabinet.
Preferably, the supporting mechanism comprises a connecting plate, a bearing plate and a rectangular outer cover which are sequentially arranged from top to bottom, and the lower surface of the connecting plate is connected with the bearing plate; the upper surface of the connecting plate is connected with a laser and a Z-axis focusing assembly; the supporting mechanism is fixed at the upper end of the case through a plurality of connecting rods, and the bearing plate is provided with connecting holes corresponding to the connecting rods; one end of the connecting rod penetrates through the mounting hole to be connected with the case, and the other end of the connecting rod penetrates through the connecting hole to be connected with the connecting plate; the supporting plate is provided with a laser emergent port corresponding to the scanning head, the laser emergent port penetrates through the supporting plate along the vertical direction, the supporting plate is also provided with a fixing part extending upwards along the laser emergent port, and the fixing part is connected with the bottom of the scanning head so as to fix the scanning head; the upper end of the rectangular outer cover penetrates through the mounting hole to be connected with the bearing plate.
Preferably, the bottom of the marking table is provided with an air draft mechanism, the air draft mechanism comprises a fan cover and an air draft pipe, the fan cover is of a square structure with a groove, the air draft pipe is arranged on the bottom corner of the fan cover and positioned on the outer side of the fan cover, and the air draft pipe is communicated with the groove inwards; and an air suction opening is formed in one side, close to the laser, of the case, and is communicated with the inside of the case.
Preferably, a water cooler is arranged on one side, close to the temperature control chamber, of the scanning head.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects: the invention provides a laser marking machine with a Z-axis focusing special temperature control accommodating space, wherein one side of a case is provided with an electric cabinet, and a controller is arranged in the electric cabinet; the supporting mechanism is provided with a marking assembly, the marking assembly comprises a marking box and a scanning head, and a laser and a temperature control chamber are arranged in the marking box; a temperature control accommodating space is formed in the temperature control chamber, and a Z-axis focusing assembly is arranged in the temperature control accommodating space; a rectangular through hole is formed in the front side face of the temperature control chamber, a temperature control assembly is mounted on the mounting hole, and the temperature control assembly is convenient to adjust the temperature in the temperature control chamber; the temperature control assembly comprises a conduction block, a semiconductor refrigeration piece and a radiator which are arranged in sequence from inside to outside; the cold end of the semiconductor refrigeration sheet is attached to the conduction block, and the hot end of the semiconductor refrigeration sheet is attached to the radiator; the semiconductor refrigerating sheet is connected with the controller; the semiconductor refrigerating sheet transfers heat energy with the temperature control chamber through the conduction block; a temperature sensor is arranged in the temperature control accommodating space and is connected with the controller; the temperature sensor is arranged to measure the temperature in the temperature control chamber conveniently; the Z-axis focusing assembly comprises a focusing lens, the focusing lens can generate a large amount of heat in the focusing process and emit the heat into the temperature control chamber, so that the temperature in the temperature control chamber is increased, the controller detects the temperature in the temperature control chamber through the temperature sensor, if the temperature is too high, the controller controls the semiconductor refrigerating sheet to work, the semiconductor refrigerating sheet transmits heat energy to the inside of the temperature control chamber, the temperature of the focusing lens is effectively adjusted, the phenomena that the marking effect of the laser marking machine is not ideal and accidents happen due to the fact that the temperature of the focusing lens is too high are avoided, and meanwhile the safety of the laser marking machine is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the laser marking machine of the present invention;
FIG. 2 is a front view of the laser marking machine of the present invention;
FIG. 3 is an oblique view of the laser marking machine of the present invention;
FIG. 4 is a schematic structural view of the marking assembly of the present invention;
FIG. 5 is a top view of the marking assembly of the present invention;
FIG. 6 is an exploded view of the temperature control assembly of the present invention;
FIG. 7 is a schematic structural diagram of a conductive block of the present invention;
FIG. 8 is a schematic structural view of a conductive block connecting pad of the present invention;
FIG. 9 is a top view of the heat sink of the present invention;
FIG. 10 is a schematic structural view of the support mechanism of the present invention;
FIG. 11 is a schematic view of the structure of the support plate of the present invention;
FIG. 12 is a schematic view of the connection plate and the connection rod of the present invention;
FIG. 13 is a schematic structural view of the air extracting mechanism of the present invention;
FIG. 14 is a schematic view of the Z-axis focusing assembly of the present invention;
FIG. 15 is a schematic view of the structure of the reflection assembly of the present invention;
FIG. 16 is a schematic structural view of the top plate of the present invention;
FIG. 17 is a functional schematic of the present invention;
the technical characteristics corresponding to the marks in the attached drawings are as follows: 1-chassis, 11-top plate, 111-mounting hole, 112-limit flange, 12-fixing plate, 2-supporting mechanism, 21-connecting plate, 22-supporting plate, 221-laser exit port, 222-fixing part, 223-connecting hole, 23-rectangular outer cover, 24-connecting rod, 3-marking component, 31-marking box, 311-laser, 312-temperature control room, 3121-temperature control accommodating space, 3122-Z axis focusing component, 3122 a-base, 3122 b-sliding rail, 3122 c-support, 3122 d-focusing lens, 3122 e-swinging motor, 3123-focusing lens cone, 3124-rectangular through hole, 313-temperature sensor, 32-scanning head, 321-water cooler, 4-reflecting component, 41 first reflection component, 411-first reflection lens, 42-second reflection component, 421-second reflection lens, 43-connecting pipe, 5-marking table, 6-electrical cabinet, 61-heat dissipation hole, 62-controller, 7-air draft mechanism, 71-fan housing, 711-groove, 72-air draft pipe, 8-air draft inlet, 9-temperature control component, 91-conducting block, 911-first connecting part, 9111-first connecting groove, 912-second connecting part, 9121-second connecting groove, 92-semiconductor sheet, 93-radiator, 931-first heat dissipation area, 932-second heat dissipation, 933-radiating fin, 934-first screw hole, 935-second screw hole, 94-conducting block connecting sheet, 941-connecting hole, 10-marking object.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 to 3, a laser marking machine with a Z-axis focusing dedicated temperature control accommodating space comprises a machine case 1, wherein a marking table 5 for placing a marking object is arranged at the bottom end of the machine case 1; an electrical cabinet 6 is arranged on one side of the case 1, and a circuit board (not shown in the drawing) and a controller 62 are arranged in the electrical cabinet 6; the circuit board is connected with the controller 62;
as shown in fig. 1 to 3, a plurality of heat dissipation fans (not shown in the drawings) are further disposed in the electrical cabinet 6, and a plurality of heat dissipation holes 61 are further disposed on the electrical cabinet 6. The arrangement of the heat dissipation fan and the heat dissipation hole 61 facilitates heat dissipation of the electrical cabinet 6.
As shown in fig. 1 to 5, a supporting mechanism 2 is arranged at the top of the chassis 1, a marking assembly 3 is arranged on the supporting mechanism 2, the marking assembly 3 includes a marking box 31 and a scanning head 32, and a laser 311 and a temperature control chamber 312 are arranged in the marking box 31; the scanning head 32 is arranged next to the marking box 31 and in the same direction as the temperature controlled chamber 312;
as shown in fig. 1, 3 and 16, a top plate 11 is disposed on the top of the chassis 1, a mounting hole 111 is disposed on the top plate 11 along the vertical direction, and the upper end of the supporting mechanism 2 passes through the mounting hole 111 and extends out of the chassis 1. The structure enables the supporting mechanism 2 to protrude out of the upper end face of the case 1, so that the marking assembly is convenient to mount.
As shown in fig. 10 and 11, the supporting mechanism 2 includes a connecting plate 21, a supporting plate 22 and a rectangular outer cover 23, which are sequentially arranged from top to bottom, and the lower surface of the connecting plate 21 is connected with the supporting plate 22; the upper surface of the connecting plate 21 is connected with the bottom of the marking box 31; the supporting plate 22 is provided with a laser exit port 221 corresponding to the scanning head 32, the laser exit port 221 penetrates through the supporting plate 22 along the vertical direction, the supporting plate 22 is further provided with a fixing part 222 extending upwards along the laser exit port 221, and the fixing part 222 is connected with the bottom of the scanning head 32 to fix the scanning head 32; the upper end of the rectangular outer cover 23 passes through the mounting hole 111 to be connected with the supporting plate 22.
As shown in fig. 16, the lower end edge of the mounting hole 111 is provided with a limiting flange 112 extending inwards; the limiting flange 112 is connected with the bottom of the rectangular outer cover 23 to limit the downward movement of the rectangular outer cover 23.
As shown in fig. 10 and 12, the supporting mechanism 2 is fixed to the upper end of the chassis 1 by a plurality of connecting rods 24, and the supporting plate 22 is provided with connecting holes 223 corresponding to the plurality of connecting rods 24; one end of the connecting rod 24 passes through the mounting hole 111 to be connected with the case 1, and the other end passes through the connecting hole 223 to be connected with the connecting plate 21.
As shown in fig. 10 and 12, a fixing plate 12 is disposed inside the cabinet 1, and the lower ends of the plurality of connecting rods 24 are connected to the fixing plate 12.
As shown in fig. 1, 2, 4 and 14, a temperature control accommodating space 3121 is provided inside the temperature control chamber 312, and a Z-axis focusing assembly 3122 is provided inside the temperature control accommodating space 3121; the Z-axis focusing assembly 3122 is connected to the controller; the laser marking device is used for adjusting the focal length of a light beam of incident laser to adapt to the fluctuation of different positions on the surface of a marking object; the Z-axis focusing assembly 3122 includes a base 3122a, a support 3122c, and a focusing lens 3122 d; a sliding rail 3122b extending along the laser light path is disposed on the base 3122a, the support 3122c is disposed on the sliding rail 3122b and can slide along the sliding rail 3122b, and the focusing lens 3122d is disposed on the support 3122 c; the Z-axis focusing assembly 3122 further comprises a swing motor 3122e directly or indirectly connected with the support 3122c, the swing motor 3122e is connected with the controller; under the control of the controller 62, the swing motor 3122e drives the support 3122c to reciprocate along the direction of the slide rail 3122b, so as to adjust the focal length of the incident laser beam to adapt to the fluctuation of the surface of the marking object at different positions;
as shown in fig. 2 and 6, a rectangular through hole 3124 is provided on the front side of the temperature controlled compartment 312, and the rectangular through hole 3124 extends inward along the horizontal direction to communicate with the temperature controlled accommodating space 3121; the rectangular through hole 3124 is provided with a temperature control assembly 9, the temperature control assembly 9 comprises a conductive block 91, a semiconductor refrigeration sheet 92 and a radiator 93 which are arranged in sequence from inside to outside; the cold end of the semiconductor refrigeration sheet 92 is attached to the conductive block 91, and the hot end of the semiconductor refrigeration sheet is attached to the radiator 93; the semiconductor chilling plate 92 is connected with the controller 62; the conduction block 91 is communicated with the temperature control accommodating space 3121; the semiconductor cooling fins 92 transfer heat energy to the temperature control chamber 312 through the conductive blocks 92, so as to adjust the temperature in the temperature control chamber 312.
As shown in fig. 6 and 8, a conducting block connecting piece 94 corresponding to the conducting block 91 is arranged in the temperature controlled chamber 1, and the conducting block 91 is fixed on the front side surface of the temperature controlled chamber 1 through the conducting block connecting piece 94; the conductive block connecting piece 94 is provided with a plurality of connecting holes 941. The setting of connecting hole 941 is convenient for conduction block connection piece 94 is installed in control by temperature change room 1, is convenient for simultaneously conduction block connection piece 94 connects conduction block 91.
As shown in fig. 9, the heat sink 93 includes a first heat dissipation region 931 and a second heat dissipation region 932, and each of the first heat dissipation region 931 and the second heat dissipation region 932 includes a plurality of heat dissipation fins 933 uniformly distributed in a horizontal direction; the heat sink 933 is arranged to facilitate heat dissipation of the hot end of the semiconductor cooling plate 92.
As shown in fig. 9, a plurality of screw holes are formed between the first heat dissipating area 931 and the second heat dissipating area 932, and the screw holes include a first screw hole 934 and a second screw hole 935 that are disposed left and right; the first screw holes 934 and the second screw holes 935 penetrate both the front and rear sides of the heat sink 93 along the horizontal direction. The provision of the first and second screw holes 934 and 935 facilitates the connection of the heat sink 93 with the conductive block 91.
As shown in fig. 7, the left and right sides of the conductive block 91 are respectively provided with a first connection portion 911 and a second connection portion 912 protruding outward in the horizontal direction; both ends of the first connection portion 911 and the second connection portion 912 extend to the front and rear end edges of the conductive block 91 in the thickness direction of the conductive block 91; the first connecting portion 911 is provided with a first connecting groove 9111 along the thickness direction of the conductive block 91; the second connecting portion 312 is provided with a second connecting groove 9121 along the thickness direction of the conductive block 91. The arrangement of the first connecting portion 911, the second connecting portion 912, the first connecting groove 9111 and the second connecting groove 9121 facilitates the connection of the conducting block 91 with the heat sink 93 and the conducting block connecting sheet 94, so that the temperature control assembly 9 is fixed on the temperature control chamber 1.
As shown in fig. 17, a temperature sensor 313 for measuring the temperature of the temperature controlled compartment 312 is disposed in the temperature controlled accommodating space 3121, the temperature sensor 313 is connected to the controller 62, and the controller 62 controls the semiconductor cooling plate 92 to open/close according to the temperature data of the temperature controlled compartment 312 measured by the temperature sensor 313, so as to adjust the temperature of the Z-axis focusing assembly; specifically, the focusing lens 3122d of the Z-axis focusing assembly 3122 generates a large amount of heat during the focusing process and dissipates the heat into the temperature-controlled chamber 312, so that the temperature of the temperature-controlled chamber 312 rises, the controller 62 detects the temperature in the temperature-controlled chamber 312 through the temperature sensor 313, if the temperature is too high, the controller 62 controls the semiconductor chilling plate 92 to operate, the semiconductor chilling plate 92 transfers heat energy to the inside of the temperature-controlled chamber 1, so as to cool the focusing lens 3122d, so that the focusing lens 3122d operates within a proper temperature range, the occurrence of an undesirable marking effect and an accident of the laser marking machine due to the too high temperature of the focusing lens 3122d is avoided, and the safety of the present invention is improved.
As shown in fig. 1, 2, 4, 5 and 15, a reflection assembly 4 is obliquely disposed on a side of the marking box 31 away from the scanning head 32, and the temperature control chamber 312 is disposed between the scanning head 32 and the reflection assembly 4. The reflection assembly 4 comprises a first reflection assembly 41, a connecting pipe 43 and a second reflection assembly 42 which are sequentially connected from back to front, wherein the first reflection assembly 41 comprises a first reflection lens 411 which is used for changing the optical path of the marking laser; the first reflection assembly 41 is arranged at the front end of the laser 311 and is positioned on an emergent light path of marking laser; the second reflecting assembly 42 includes a second reflecting lens 421 for changing the optical path of the marking laser reflected by the first reflecting lens 411; the second reflection assembly 42 is arranged at the right end of the Z-axis focusing assembly 3122; the first reflection assembly 41 and the second reflection assembly 42 are arranged to facilitate adjustment of the optical path of the marking laser, so that the marking laser is focused by the Z-axis focusing assembly 3122 in the temperature control chamber 312 and then enters the scanning head 32.
As shown in fig. 4, a focusing lens tube 3123 is further disposed between the Z-axis focusing assembly 3122 and the scanning head 32, where the focusing lens tube 3123 includes a plurality of focusing lenses (not shown in the drawings), and specifically, the marking laser focused by the Z-axis focusing assembly 3122 is focused by the focusing lens 3122d and then enters the scanning head 32.
As shown in the figure, the scanning head 32 includes a plurality of galvanometers (not shown in the figure), the galvanometers include an X galvanometer and a Y galvanometer, and the X galvanometer and the Y galvanometer are used for changing the direction of the marking laser and enabling the marking laser to be emitted towards the marking table 5;
as shown in fig. 1, 2 and 13, an air draft mechanism 7 is arranged at the bottom of the marking table 5, the air draft mechanism 7 includes a fan cover 71 and an air draft pipe 72, the fan cover 71 is a square structure with a groove 711, the air draft pipe 72 is arranged at a bottom corner of the fan cover 71 and is located outside the fan cover 71, and the air draft pipe 72 is communicated with the groove 711 inwards; the setting of this structure is convenient for make and is beaten the mark thing and adsorb on beating mark platform 5, and the mark effect is beaten in the reinforcing.
As shown in fig. 3, an air suction opening 8 is formed in one side of the case close to the laser 311, the air suction opening 8 is communicated with the inside of the case 1, and the air suction opening 8 is connected with a suction fan in actual use, so that dust generated in the marking process can be conveniently sucked.
As shown in fig. 4, a water cooler 321 is disposed on a side of the scan head 32 close to the Z-axis focusing assembly 3122; the setting of water cooler 321 is convenient for do scan head 32 dispels the heat, prevents that scan head 32 from beating the mark effect because of the high temperature, influence.
Marking laser is emitted from the laser 311, is reflected by the first reflecting lens 411 and the second reflecting lens 421 in sequence and then enters the temperature control chamber, is focused by the Z-axis focusing component 3122 in the temperature control chamber and then enters the scanning head 32, and finally is marked on a marked object, so that marking operation is realized.
The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims; variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims (10)

1. A laser marking machine with a Z-axis focusing special temperature control accommodating space is characterized by comprising a machine case, wherein a marking table for placing a marking object is arranged at the bottom end of the machine case; an electrical cabinet is arranged on one side of the case, and a controller is arranged in the electrical cabinet;
the top of the case is provided with a supporting mechanism, the top of the case is provided with a top plate, a mounting hole is formed in the top plate in the vertical direction, and the upper end of the supporting mechanism penetrates through the mounting hole and extends out of the case;
the supporting mechanism is provided with a marking assembly, the marking assembly comprises a marking box and a scanning head, and a laser and a temperature control chamber are arranged in the marking box; the scanning head is arranged close to the marking box and is in the same direction with the temperature control chamber; a reflecting component is obliquely arranged on one side of the marking box, which is far away from the scanning head, and the temperature control chamber is positioned between the scanning head and the reflecting component;
a temperature control accommodating space is formed in the temperature control chamber, and a Z-axis focusing assembly is arranged in the temperature control accommodating space; the Z-axis focusing assembly is connected with the controller and is used for adjusting the focal length of a light beam of incident laser to adapt to the fluctuation of different positions on the surface of the marking object;
a rectangular through hole is formed in the front side face of the temperature control chamber, and the rectangular through hole extends inwards along the horizontal direction to be communicated with the temperature control accommodating space;
the temperature control assembly is arranged on the mounting hole and comprises a conduction block, a semiconductor refrigeration piece and a radiator which are sequentially arranged from inside to outside; the cold end of the semiconductor refrigeration sheet is attached to the conduction block, and the hot end of the semiconductor refrigeration sheet is attached to the radiator; the semiconductor refrigerating sheet is connected with the controller; the transmission block is communicated with the temperature control accommodating space; the semiconductor refrigerating sheet transfers heat energy to the temperature control chamber through the conduction block;
the scanning head comprises a plurality of galvanometers and is used for changing the direction of the marking laser and enabling the marking laser to be emitted towards the marking table;
a temperature sensor for measuring the temperature of a temperature control room is arranged in the temperature control accommodating space, the temperature sensor is connected with the controller, and the controller controls the semiconductor refrigerating sheet to be turned on/off according to the temperature data of the temperature control room measured by the temperature sensor so as to adjust the temperature of the Z-axis focusing assembly;
marking laser is emitted from a laser, is reflected by the reflecting assembly in sequence and then enters the temperature control chamber, is focused by the Z-axis focusing assembly in the temperature control chamber and then enters the scanning head, and finally is marked on a marked object, so that marking operation is realized.
2. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: a conduction block connecting sheet corresponding to the conduction block is arranged in the temperature control chamber, and the conduction block is fixed on the front side surface of the temperature control chamber through the conduction block connecting sheet; the conducting block connecting sheet is provided with a plurality of connecting holes.
3. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the radiator comprises a first radiating area and a second radiating area, and the first radiating area and the second radiating area respectively comprise a plurality of radiating fins which are uniformly distributed along the horizontal direction; a plurality of screw holes are formed between the first heat dissipation area and the second heat dissipation area, and the screw holes comprise a first screw hole and a second screw hole which are arranged on the left and right; first screw hole and second screw hole all run through along the horizontal direction both sides around the radiator.
4. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the left side and the right side of the transmission block are respectively provided with a first connecting part and a second connecting part which protrude outwards along the horizontal direction; both ends of the first connecting part and the second connecting part extend to the edges of the front end and the rear end of the conducting block along the thickness direction of the conducting block; the first connecting part is provided with a first connecting groove along the thickness direction of the conducting block; the second connecting portion is provided with a second connecting groove along the thickness direction of the conductive block.
5. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the reflection assembly comprises a first reflection assembly, a connecting pipe and a second reflection assembly which are sequentially connected from back to front; the first reflection assembly comprises a first reflection lens and is used for changing the optical path of the marking laser; the first reflection assembly is arranged at the front end of the laser and is positioned on an emergent light path of marking laser; the second reflection assembly comprises a second reflection lens and is used for changing the light path of the marking laser reflected by the first reflection lens and enabling the marking laser to be incident to the Z-axis focusing assembly; the second reflection assembly is arranged at the right end of the Z-axis focusing assembly.
6. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the Z-axis focusing assembly comprises a base, a slide rail is arranged on the base along the direction of a laser light path, a support capable of sliding along the slide rail is arranged on the slide rail, and a focusing lens is arranged on the support; the Z-axis focusing assembly further comprises a swing motor directly or indirectly connected with the support, the swing motor is connected with the controller, and the swing motor drives the support to move back and forth along the direction of the sliding rail; and a focusing lens barrel is also arranged between the Z-axis focusing assembly and the scanning head.
7. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the electric cabinet is internally provided with a circuit board and a plurality of heat dissipation fans, and the electric cabinet is provided with a plurality of heat dissipation holes.
8. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the supporting mechanism comprises a connecting plate, a bearing plate and a rectangular outer cover which are sequentially arranged from top to bottom, and the lower surface of the connecting plate is connected with the bearing plate; the upper surface of the connecting plate is connected with a laser and a Z-axis focusing assembly; the supporting mechanism is fixed at the upper end of the case through a plurality of connecting rods, and the bearing plate is provided with connecting holes corresponding to the connecting rods; one end of the connecting rod penetrates through the mounting hole to be connected with the case, and the other end of the connecting rod penetrates through the connecting hole to be connected with the connecting plate; the supporting plate is provided with a laser emergent port corresponding to the scanning head, the laser emergent port penetrates through the supporting plate along the vertical direction, the supporting plate is also provided with a fixing part extending upwards along the laser emergent port, and the fixing part is connected with the bottom of the scanning head so as to fix the scanning head; the upper end of the rectangular outer cover penetrates through the mounting hole to be connected with the bearing plate.
9. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: the air draft mechanism is arranged at the bottom of the marking table and comprises a fan cover and an air draft pipe, the fan cover is of a square structure with a groove, the air draft pipe is arranged on the bottom corner of the fan cover and positioned on the outer side of the fan cover, and the air draft pipe is communicated with the groove inwards; and an air suction opening is formed in one side, close to the laser, of the case, and is communicated with the inside of the case.
10. The laser marking machine provided with the Z-axis focusing special temperature control accommodating space is characterized in that: and a water cooler is arranged on one side, close to the temperature control chamber, of the scanning head.
CN202010525904.1A 2020-06-10 2020-06-10 Laser marking machine with special control by temperature change accommodation space of Z axle focusing Active CN111687540B (en)

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CN113427119A (en) * 2021-06-15 2021-09-24 太原理工大学 Laser rust cleaning device with air duct purging mechanism
CN115189222A (en) * 2022-09-08 2022-10-14 北京融为科技有限公司 Laser transceiver with high-reliability temperature control structure and optical telescope

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CN109759693A (en) * 2019-03-14 2019-05-17 广州新可激光设备有限公司 A kind of twin-laser marking equipment of optimization
CN111037106A (en) * 2019-12-31 2020-04-21 广州新可激光设备有限公司 Z-axis motion control system and method of laser processing equipment

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CN207464464U (en) * 2017-11-21 2018-06-08 武汉华工激光工程有限责任公司 A kind of large format 3D ultraviolet laser marking machines
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CN115189222A (en) * 2022-09-08 2022-10-14 北京融为科技有限公司 Laser transceiver with high-reliability temperature control structure and optical telescope
CN115189222B (en) * 2022-09-08 2022-12-20 北京融为科技有限公司 Laser transceiver with high-reliability temperature control structure and optical telescope

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