CN111673089A - Hard alloy vertical needle injection molding process for microwave chip packaging - Google Patents
Hard alloy vertical needle injection molding process for microwave chip packaging Download PDFInfo
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- CN111673089A CN111673089A CN202010421908.5A CN202010421908A CN111673089A CN 111673089 A CN111673089 A CN 111673089A CN 202010421908 A CN202010421908 A CN 202010421908A CN 111673089 A CN111673089 A CN 111673089A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
- B22F3/1021—Removal of binder or filler
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/067—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds comprising a particular metallic binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
The invention discloses a hard alloy vertical needle injection molding process for microwave chip packaging, which comprises the following steps of firstly, material design; step two, proportioning materials; step three, wet grinding the powder; step four, vacuum drying; step five, powder molding; step six, mixing and stirring; step seven, crushing the material; step eight, injection molding; step nine, degreasing the material; step ten, sintering the material; in the first step, the specification and the size of the chip designed by the user are observed according to the design of the material formula provided by the user; this microwave chip encapsulation is with carbide founds needle injection moulding technology adopts the computer to carry out virtual detection, avoids the unable operation of chip, and chip package base plate adopts the epoxy that fills silver to bond simultaneously, and the chip need not the preliminary treatment, and adopts carbide to found needle injection moulding, and greatly increased chip's abrasion resistance can not arouse the deformation and the fracture of chip, reduces user's intensity of labour simultaneously, avoids arousing user fatigue.
Description
Technical Field
The invention relates to the technical field of microwave chip packaging, in particular to a hard alloy vertical needle injection molding process for microwave chip packaging.
Background
Microwave chips are integrated circuits formed by manufacturing circuits on the surface of a semiconductor chip, which are also called thin film integrated circuits, and thick film integrated circuits are miniaturized circuits formed by integrating independent semiconductor equipment and passive components on a substrate or a circuit board; the traditional microwave chip packaging substrate is fixed by welding, the chip needs to be pretreated, time and labor are wasted, and materials are wasted; in view of these defects, it is necessary to design a cemented carbide vertical needle injection molding process for microwave chip packaging.
Disclosure of Invention
The invention aims to provide a hard alloy vertical needle injection molding process for microwave chip packaging, which aims to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: the injection molding process of the hard alloy vertical needle for packaging the microwave chip comprises the steps of firstly, designing materials; step two, proportioning materials; step three, wet grinding the powder; step four, vacuum drying; step five, powder molding; step six, mixing and stirring; step seven, crushing the material; step eight, injection molding; step nine, degreasing the material; step ten, sintering the material;
wherein in the first step, the material design comprises the following steps:
1) observing the specification and the size of a chip designed by a user according to the design of a material formula provided by the user; recording and storing in a computer;
2) drawing a model of chip parameters designed by a user by using a computer, and detecting the chip by using computer virtual light inspection;
in the second step, tungsten carbide, vanadium carbide, tantalum carbide, cobalt and other powder with the Fisher size of 0.3-6 microns are proportioned;
in the third step, putting the powder into a tiltable ball mill for wet milling for 48 hours;
in the fourth step, the powder after wet grinding is placed in a vacuum machine for low-temperature vacuum drying;
in the fifth step, the dried powder is added with forming agents such as paraffin, vegetable oil, stearic acid and the like according to a designed proportion;
in the sixth step, the mixture is repeatedly mixed for 3 times by using a mixing extruder with the temperature of 120 ℃;
in the seventh step, the mixture is cooled by using a crusher and is crushed into flowable particles;
in the eighth step, a high-precision micro injection molding machine and a high-precision injection mold are used for injection molding;
in the ninth step, the product blank after injection molding is put into a hydrogen degreasing furnace for degreasing;
and step ten, putting the degreased product into a HIP sintering furnace for sintering to obtain the packaged microwave chip.
According to the technical scheme, in the step one 2), the recorded data is stored in an archive room for subsequent comparison.
According to the technical scheme, in the second step, the tungsten carbide, the vanadium carbide, the tantalum carbide and the cobalt are mixed according to the ratio of 1: 2.
According to the technical scheme, in the third step, the ball milling media are absolute ethyl alcohol and hard alloy balls.
According to the technical scheme, in the fifth step, the paraffin, the vegetable oil, the stearic acid and other forming agents are mixed according to the ratio of 1: 2.
According to the technical scheme, in the step ten, the packaged microwave chip is tested, and the microwave chip which is unqualified in test is repaired.
Compared with the prior art, the invention has the following beneficial effects: this microwave chip packaging is with carbide founds needle injection moulding technology, adopt the computer to carry out virtual detection, avoid the unable operation of chip, chip packaging substrate adopts to use high-accuracy micro-injection molding machine and high-accuracy mould for injection moulding to carry out injection moulding simultaneously, the chip need not the preliminary treatment, time saving and labor saving, material saving, and adopt carbide to found needle injection moulding, greatly increased chip's wearing resistance, can not arouse the deformation and the fracture of chip, be difficult for the oxidation, reduce user's intensity of labour simultaneously, avoid arousing user fatigue, be favorable to user's production.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution:
the injection molding process of the hard alloy vertical needle for packaging the microwave chip comprises the steps of firstly, designing materials; step two, proportioning materials; step three, wet grinding the powder; step four, vacuum drying; step five, powder molding; step six, mixing and stirring; step seven, crushing the material; step eight, injection molding; step nine, degreasing the material; step ten, sintering the material;
wherein in the first step, the material design comprises the following steps:
1) observing the specification and the size of a chip designed by a user according to the design of a material formula provided by the user; recording and storing in a computer;
2) drawing a model by using a computer for chip parameters designed by a user, detecting the chip by using computer virtual light inspection, and storing recorded data in a file room for subsequent comparison;
in the second step, powder of tungsten carbide, vanadium carbide, tantalum carbide, cobalt and the like with the Fisher size of 0.3-6 microns is proportioned, and the tungsten carbide, the vanadium carbide, the tantalum carbide and the cobalt are proportioned according to the ratio of 1: 2;
in the third step, putting the powder into a tiltable ball mill for wet milling for 48 hours, wherein the ball milling media are absolute ethyl alcohol and hard alloy balls;
in the fourth step, the powder after wet grinding is placed in a vacuum machine for low-temperature vacuum drying;
adding a forming agent such as paraffin, vegetable oil and stearic acid into the dried powder according to a designed proportion, and mixing the paraffin, the vegetable oil and the forming agent such as stearic acid according to a ratio of 1: 2;
in the sixth step, the mixture is repeatedly mixed for 3 times by using a mixing extruder with the temperature of 120 ℃;
in the seventh step, the mixture is cooled by using a crusher and is crushed into flowable particles;
in the eighth step, a high-precision micro injection molding machine and a high-precision injection mold are used for injection molding;
in the ninth step, the product blank after injection molding is put into a hydrogen degreasing furnace for degreasing;
and step ten, placing the degreased product into a HIP sintering furnace for sintering to obtain a packaged microwave chip, testing the packaged microwave chip, and repairing the unqualified packaged microwave chip.
Based on the above, the invention has the advantages that the computer is adopted for virtual detection, the chip can be prevented from being incapable of running, meanwhile, the chip packaging substrate is subjected to injection molding by using the high-precision micro injection molding machine and the high-precision injection mold, the chip is not required to be pretreated, the time and the labor are saved, the material is saved, and the hard alloy vertical needle is adopted for injection molding, so that the wear resistance of the chip is greatly increased, the deformation and the fracture of the chip can not be caused, and the chip is not easy to oxidize.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The injection molding process of the hard alloy vertical needle for packaging the microwave chip comprises the steps of firstly, designing materials; step two, proportioning materials; step three, wet grinding the powder; step four, vacuum drying; step five, powder molding; step six, mixing and stirring; step seven, crushing the material; step eight, injection molding; step nine, degreasing the material; step ten, sintering the material; the method is characterized in that:
wherein in the first step, the material design comprises the following steps:
1) observing the specification and the size of a chip designed by a user according to the design of a material formula provided by the user; recording and storing in a computer;
2) drawing a model of chip parameters designed by a user by using a computer, and detecting the chip by using computer virtual light inspection;
in the second step, tungsten carbide, vanadium carbide, tantalum carbide, cobalt and other powder with the Fisher size of 0.3-6 microns are proportioned;
in the third step, putting the powder into a tiltable ball mill for wet milling for 48 hours;
in the fourth step, the powder after wet grinding is placed in a vacuum machine for low-temperature vacuum drying;
in the fifth step, the dried powder is added with forming agents such as paraffin, vegetable oil, stearic acid and the like according to a designed proportion;
in the sixth step, the mixture is repeatedly mixed for 3 times by using a mixing extruder with the temperature of 120 ℃;
in the seventh step, the mixture is cooled by using a crusher and is crushed into flowable particles;
in the eighth step, a high-precision micro injection molding machine and a high-precision injection mold are used for injection molding;
in the ninth step, the product blank after injection molding is put into a hydrogen degreasing furnace for degreasing;
and step ten, putting the degreased product into a HIP sintering furnace for sintering to obtain the packaged microwave chip.
2. The hard alloy vertical needle injection molding process for microwave chip packaging according to claim 1, characterized in that: in the step one 2), the recorded data is stored in an archive room for subsequent comparison.
3. The hard alloy vertical needle injection molding process for microwave chip packaging according to claim 1, characterized in that: in the second step, the tungsten carbide, the vanadium carbide, the tantalum carbide and the cobalt are mixed according to the ratio of 1: 2.
4. The hard alloy vertical needle injection molding process for microwave chip packaging according to claim 1, characterized in that: in the third step, the ball milling media are absolute ethyl alcohol and hard alloy balls.
5. The hard alloy vertical needle injection molding process for microwave chip packaging according to claim 1, characterized in that: in the fifth step, the ratio of the paraffin, the vegetable oil and the forming agent such as stearic acid is 1: 2.
6. The hard alloy vertical needle injection molding process for microwave chip packaging according to claim 1, characterized in that: in the step ten, the packaged microwave chip is tested, and the unqualified microwave chip is repaired.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421908.5A CN111673089A (en) | 2020-05-18 | 2020-05-18 | Hard alloy vertical needle injection molding process for microwave chip packaging |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010421908.5A CN111673089A (en) | 2020-05-18 | 2020-05-18 | Hard alloy vertical needle injection molding process for microwave chip packaging |
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| CN111673089A true CN111673089A (en) | 2020-09-18 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5296189A (en) * | 1992-04-28 | 1994-03-22 | International Business Machines Corporation | Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith |
| CN102256728A (en) * | 2008-12-18 | 2011-11-23 | 山高刀具公司 | Method of making cemented carbide products |
| CN107952965A (en) * | 2017-12-08 | 2018-04-24 | 北京有色金属研究总院 | Hexagonal red needle and the preparation method of syringe needle in a kind of plum blossom |
| CN108101541A (en) * | 2017-12-21 | 2018-06-01 | 洛阳名力科技开发有限公司 | A kind of ejection forming method of non-bond cemented carbide |
| CN109396451A (en) * | 2018-12-20 | 2019-03-01 | 赣州海盛硬质合金有限公司 | A kind of production technology of machining hard alloy bar |
-
2020
- 2020-05-18 CN CN202010421908.5A patent/CN111673089A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5296189A (en) * | 1992-04-28 | 1994-03-22 | International Business Machines Corporation | Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith |
| CN102256728A (en) * | 2008-12-18 | 2011-11-23 | 山高刀具公司 | Method of making cemented carbide products |
| CN107952965A (en) * | 2017-12-08 | 2018-04-24 | 北京有色金属研究总院 | Hexagonal red needle and the preparation method of syringe needle in a kind of plum blossom |
| CN108101541A (en) * | 2017-12-21 | 2018-06-01 | 洛阳名力科技开发有限公司 | A kind of ejection forming method of non-bond cemented carbide |
| CN109396451A (en) * | 2018-12-20 | 2019-03-01 | 赣州海盛硬质合金有限公司 | A kind of production technology of machining hard alloy bar |
Non-Patent Citations (1)
| Title |
|---|
| 熊刚: "《自动检测技术及仪表》", 30 November 2019, 机械工业出版社 * |
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