CN111669944A - 3D phase change superconducting radiator - Google Patents
3D phase change superconducting radiator Download PDFInfo
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- CN111669944A CN111669944A CN202010576372.4A CN202010576372A CN111669944A CN 111669944 A CN111669944 A CN 111669944A CN 202010576372 A CN202010576372 A CN 202010576372A CN 111669944 A CN111669944 A CN 111669944A
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- 238000001704 evaporation Methods 0.000 claims abstract description 76
- 230000008020 evaporation Effects 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000005452 bending Methods 0.000 claims description 16
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 5
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- 238000010521 absorption reaction Methods 0.000 description 8
- 238000005728 strengthening Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
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- 238000000465 moulding Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000001012 protector Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
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- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of heat pipe radiators, in particular to a 3D phase-change superconducting radiator, which solves the problems that the existing heat pipe radiator is poor in temperature uniformity and low in radiating efficiency, and the working environment temperature of nearby electronic components is easy to rise for a long time due to the fact that the layout of a heating end and a radiating end cannot be separately adjusted, so that the service life is influenced and the electronic components are damaged. The condenser comprises an evaporation chamber, a transmission pipe, a first bus bar, at least two branch pipelines and a second bus bar, wherein the evaporation chamber is internally provided with a cavity and filled with liquid working media for phase change heat exchange, the transmission pipe is communicated with the evaporation chamber, the first bus bar is communicated with the transmission pipe, the at least two branch pipelines are communicated with the first bus bar, the second bus bar is communicated with one end, far away from the first bus bar, of each branch pipeline, radiating fins are connected between every two adjacent branch pipelines, and the first bus bar, the branch pipelines, the second bus bar and the radiating fins form a block condenser far away from the evaporation chamber. The heating end and the radiating end of the invention are far away, which is beneficial to protecting electronic components.
Description
Technical Field
The invention relates to the technical field of heat pipe radiators, in particular to a 3D phase-change superconducting radiator.
Background
Along with the improvement of the requirement on the safety of the whole machine, the operation frequency of electronic components is higher and higher, the size is smaller and smaller, but the heat productivity is larger and larger, the water cooling system is large in size, the water pump has energy consumption, potential water leakage exists, hidden dangers such as system short circuit, electric leakage and even burning are caused, the safety of equipment is seriously threatened, and life and property threats are brought to users. The existing aluminum extrusion and forming relieved tooth technology can not meet the heat dissipation requirement of high heat flux far away, and along with the development of science and technology, the heat dissipation problem of electronic components is solved to a great extent in the appearance of the heat pipe radiator.
The heat pipe radiator consists of sealed pipe, wick and vapor passage, and the wick surrounds the sealed pipe and is soaked with volatile saturated liquid, which may be distilled water, ammonia, methanol, acetone, etc. When the heat pipe radiator operates, the evaporation section absorbs the heat generated by the heat source (power semiconductor device, etc.) to boil the liquid in the liquid absorption core pipe into vapor, the vapor with heat moves from the evaporation section to the cooling section of the heat pipe radiator, when the vapor transmits the heat to the cooling section, the vapor is condensed into liquid, the condensed liquid returns to the evaporation section through the capillary action of the liquid absorption core on the pipe wall, and the circulation process is repeated to continuously dissipate the heat.
The invention discloses an integral heat pipe radiator in the Chinese patent with the application publication number of CN103591819A, which can effectively solve the heat radiation problem of high-heating-density components in high-power electronic equipment. The heat pipe radiator is formed by integrating a flat heat pipe and a heat pipe radiator, the inner spaces of the flat heat pipe and the heat pipe radiator are mutually communicated, and a heat pipe working medium and steam thereof freely move between the flat heat pipe and the heat pipe radiator and transfer heat; the outer sides of the front panel and the rear panel of the flat heat pipe are used for mounting heating components, the inner sides of the front panel and the rear panel are provided with capillary grooves, reinforcing ribs penetrating through the front panel and the rear panel are arranged in the flat heat pipe for punching and mounting the components, the top of the flat heat pipe is provided with a connecting seat for mounting and fixing a heat pipe radiator, and the size of a heat pipe mounting hole on the connecting seat is matched with that; the heat pipe radiator consists of heat transfer heat pipes and sleeve fin type radiating fins, and can also adopt a series of spiral fin heat pipes with integrally formed heat pipe walls and radiating fins. Compared with the traditional heat dissipation device of the electronic equipment, the heat pipe radiator has the advantages of high heat dissipation efficiency, compact structure, light weight and the like.
However, the heat pipe radiator related to the prior art cannot separate the heating end from the radiating end, and when the radiating end is tightly connected with an electronic component requiring temperature control, the ambient temperature is improved, and the service life of the component is reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a 3D phase-change superconducting radiator, which has the advantages that: the radiating end is far away from the heated end, so that the radiating effect is good, and the electronic component is protected.
The purpose of the invention is realized by the following technical scheme:
A3D phase change superconducting radiator comprises an evaporation chamber, a transmission pipe, a first bus bar, at least two branch pipelines and a second bus bar, wherein the evaporation chamber is internally provided with a cavity and filled with liquid working media for phase change heat exchange, the transmission pipe is communicated with the evaporation chamber, the first bus bar is communicated with one end, far away from the evaporation chamber, of the transmission pipe, the at least two branch pipelines are communicated with the first bus bar, the second bus bar is communicated with one end, far away from the first bus bar, of the branch pipelines, radiating fins are connected between every two adjacent branch pipelines, the first bus bar, the branch pipelines, the second bus bar and the radiating fins form a block condenser far away from the evaporation chamber, and vacuumizing treatment is carried out inside the evaporation chamber.
By adopting the technical scheme, when the heat-generating device is used, the heat-generating source is tightly attached to the side surface of the evaporation chamber, the heat on the heat-generating source is transferred to the evaporation chamber, the liquid working medium in the evaporation chamber is gasified due to the heat absorption, and the steam leads the air pressure in the evaporation chamber to be increased, because the evaporation chamber and the interior of the condenser are vacuumized, the steam can quickly flow to the condenser along the transmission pipe, when the steam flows through the first bus-bar pipe and the branch pipe, the heat-radiating fins can radiate and cool the heat in the steam, the cooled steam flows into the second bus-bar pipe, the steam is cooled in the second bus-bar pipe, then enters the branch pipe through the second bus-bar pipe, is cooled and condensed into liquid through the heat-radiating fins again, enters the first bus-bar pipe and flows back into the evaporation chamber through the transmission pipe, the heat radiation is continuously performed in such a circulating way, the block condenser formed by the first bus-bar pipe, the, the condenser is far away from the heated end, so that the electronic components are protected, the situation that the temperature of the surrounding electronic components is high due to the fact that the distance between the heat dissipation end and the heated end is too close is avoided, and the electronic components are prevented from being damaged.
The invention is further configured to: the branch pipeline is flat, the flat side of the branch pipeline faces the radiating fins, and the radiating fins are welded with the flat side of the branch pipeline.
Through adopting above-mentioned technical scheme, the branch pipeline is established to the platykurtic and can be increased with radiating fin's area of contact, and then has improved the radiating effect, makes radiating fin can dispel the heat more fast.
The invention is further configured to: the radiating fins are arranged in a wave-shaped bending mode from the first bus bar to the second bus bar, and the wave amplitude of the wave bending of the radiating fins is more than twice of the wave length of the wave bending of the radiating fins.
By adopting the technical scheme, the welding area of the branch pipeline and the radiating fins can be increased by arranging the radiating fins into the wave shape, the radiating effect is further improved, and the surface area of the radiating fins is increased by arranging the wave amplitude of the wave bending of the radiating fins into more than two times of the wave length of the wave bending of the radiating fins, so that the radiating is carried out more quickly, and the radiating efficiency is improved.
The invention is further configured to: at least two conveying pipes are communicated between the first bus bar and the evaporation chamber.
Through adopting above-mentioned technical scheme, set up two at least transmission pipes and can accelerate the transmission efficiency of vapour, and then improved radiating efficiency to go the heat with dispelling more fast.
The invention is further configured to: the condenser and the evaporation chamber are combined in a 3D mode.
Through adopting above-mentioned technical scheme, condenser and evaporating chamber are established to 3D stereoscopic binding and are further made condenser and heating source keep away from, are favorable to improving the radiating effect, have also further avoided the heat that the condenser dispels to cause the interference to electronic components simultaneously.
The invention is further configured to: and a porous capillary body is arranged on the inner wall of one surface of the evaporation chamber, which is used for being attached to the heating source.
Through adopting above-mentioned technical scheme, when the heat transfer in the source that generates heat when the evaporating chamber, the heat can transmit to porous capillary on, porous capillary can effectively increase the heat exchange area with the interior liquid working medium contact of evaporating chamber to make the liquid working medium of absorption absorb the heat fast in the porous capillary, and the phase transition is gaseous, has improved the radiating efficiency, and porous capillary still has the imbibition ability simultaneously, makes the radiator have antigravity ability.
The invention is further configured to: the porous capillary body is formed by metal meshes in a superposition welding mode or by metal powder sintering mode, and pores which are communicated with each other are formed in the porous capillary body and on the surface of the porous capillary body.
By adopting the technical scheme, the heat exchange area between the porous capillary body and the liquid working medium can be increased through the pores, and the heat dissipation efficiency is further accelerated.
The invention is further configured to: and reinforcing ribs are connected between the inner walls of the evaporation chambers.
Through adopting above-mentioned technical scheme, the strengthening rib can improve the structural strength of evaporating chamber, avoids the evaporating chamber to warp impaired because of the pressure variation that inside liquid working medium phase transition produced to when the evaporating chamber of use operating mode needs great volume, the strengthening rib can make the evaporating chamber keep good structure steadiness, avoids the evaporating chamber atress to warp.
The invention is further configured to: and connecting protective pieces are connected between two end parts of the first bus bar and two end parts of the second bus bar, and the branch pipeline and the radiating fins are positioned between the two connecting protective pieces.
Through adopting above-mentioned technical scheme, connect and protect the piece and be used for protecting branch pipeline and radiating fin, can prevent that branch pipeline and radiating fin from receiving the collision and damaging, also can consolidate the connection of first busbar and second busbar simultaneously, improved the structural strength of condenser.
The invention is further configured to: the end part of the connecting protection piece is provided with a mounting hole.
By adopting the technical scheme, the mounting hole can be used for mounting a fan so as to conveniently cool the radiating fins and accelerate the radiating speed.
In summary, the invention includes at least one of the following beneficial technical effects:
the block condenser formed by the first bus bar, the branch pipeline, the second bus bar and the radiating fins has good radiating effect and high radiating efficiency, and is beneficial to protecting electronic components because the condenser is far away from the heated end, so that the situation that the temperature of the surrounding electronic components is higher due to the fact that the distance between the radiating end and the heated end is too close is avoided, and the electronic components are prevented from being damaged;
the branch pipelines are flat, so that the contact area between the branch pipelines and the radiating fins can be increased, the radiating effect is further improved, and the radiating fins can dissipate heat more quickly;
the wave amplitude of the wave bending of the radiating fins is set to be more than two times of the wave length of the wave bending of the radiating fins so as to increase the surface area of the radiating fins, so that the radiating can be carried out more quickly, and the radiating efficiency is improved;
the condenser and the evaporation chamber are combined in a 3D mode, so that the condenser is further far away from the heated end, the radiating effect is favorably improved, meanwhile, the interference of heat dissipated by the condenser on electronic components is further avoided, and the condenser is convenient to adapt to different installation spaces;
the arrangement of the porous capillary body can effectively increase the heat exchange area contacted with the liquid working medium in the evaporation chamber, so that the liquid working medium absorbed in the porous capillary body can quickly absorb heat and change the phase into gas, the integral heat dissipation capability can be improved, and meanwhile, the porous capillary body also has the liquid absorption capability, so that the radiator has the antigravity capability.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
fig. 3 is a schematic view of the structure of the condenser.
In the figure, 1, an evaporation chamber; 11. a porous wick; 12. reinforcing ribs; 2. a conveying pipe; 31. a first bus bar; 32. a branch pipeline; 33. a second bus bar; 34. a heat dissipating fin; 4. connecting a protective piece; 41. and (7) installing holes.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, a 3D phase-change superconducting radiator disclosed by the present invention includes an evaporation chamber 1 having a cavity therein and filled with a liquid working medium for phase-change heat exchange, a transmission pipe 2 communicated with the evaporation chamber 1, a first bus bar 31 communicated with one end of the transmission pipe 2 away from the evaporation chamber 1, at least two branch pipes 32 communicated with the first bus bar 31, and a second bus bar 33 having a cavity therein and communicated with one end of the branch pipe 32 away from the first bus bar 31. Radiating fins 34 are arranged between every two adjacent branch pipelines 32, the first bus bar 31, the branch pipelines 32, the second bus bar 33 and the radiating fins 34 form a block condenser far away from the evaporation chamber 1, the transmission pipe 2 and the condenser form a communicated 3D cavity heat transfer network system, the evaporation chamber 1 is filled with liquid working media, then high-vacuum-degree vacuumizing treatment is carried out on the liquid working media, welding and sealing are carried out, and negative pressure is formed inside the whole 3D cavity heat transfer network system formed by the evaporation chamber 1, the transmission pipe 2, the first bus bar 31, the branch pipelines 32 and the second bus bar 33.
When the heat-generating device is used, a heat-generating source is attached to an attachment surface of the evaporation chamber 1, heat on the heat-generating source is transferred to the evaporation chamber 1, a liquid working medium in the evaporation chamber 1 is gasified due to heat absorption, and the steam causes the air pressure in the evaporation chamber 1 to be increased.
The block condenser formed by the first bus bar 31, the branch pipeline 32, the second bus bar 33 and the radiating fins 34 has good radiating effect and high radiating efficiency, and because the condenser is far away from the heated end, the heat dissipated by the condenser is prevented from flowing back to the electronic components again, thereby being beneficial to protecting the electronic components, avoiding the situation that the temperature of the surrounding electronic components is higher due to the fact that the distance between the radiating end and the heated end is too close, and preventing the electronic components from being damaged. In addition, the heating end and the radiating end are communicated through the transmission pipe 2, so that the position of the heating end and the radiating end of the radiator can be conveniently adjusted along with the internal layout of the electronic component case according to working conditions, and the temperature control of the whole machine is facilitated.
Referring to fig. 2, the inner wall of the evaporation chamber 1 on the side for attaching the heat source is provided with a porous capillary body 11, the porous capillary body 11 is formed by overlapping, welding and molding a plurality of layers of metal wire mesh or by sintering and molding metal powder, in this embodiment, the porous capillary body 11 is formed by sintering copper powder, in other embodiments, the porous capillary body 11 can also be formed by sintering and molding stainless steel powder or aluminum powder or by welding/sintering and molding a plurality of layers of overlapping metal mesh. The evaporation chamber 1 with the porous capillary body 11 is in close contact with a heating source, the thermal contact resistance of a heat absorption area can be effectively controlled and reduced, when the heat of the heating source is transferred to the evaporation chamber 1, the heat can be transferred to the porous capillary body 11, the porous capillary body 11 can effectively increase the heat exchange area in contact with a liquid working medium in the evaporation chamber 1, so that the liquid working medium absorbed in the porous capillary body 11 can quickly absorb the heat and is changed into gas in a phase mode, the heat is quickly conducted to the radiating fins 34 on the condenser through the gasified working medium and exchanges heat with air, the heat is released to the surrounding environment, the working medium condenses and flows back to the porous capillary body 11 in the evaporation chamber 1 after releasing the heat, and a high-efficiency 3D circulation heat exchange system is formed.
The porous capillary body 11 is matched with the liquid working medium, so that the temperature of the chip Tcase of the electronic component can be effectively reduced, and the normal operation of the component is protected. In addition, the porous capillary body 11 in the evaporation chamber 1 enables the liquid working medium in the radiator to have the anti-gravity capacity, the installation mode of the transmission pipe 2 can be adjusted according to the working conditions during installation, the heated end can be used horizontally or vertically, and the installation and the use under multiple working conditions are facilitated.
Liquid working medium adopts insulating nature liquid in order guaranteeing the safety in utilization, and in this embodiment, liquid working medium is for fluoridizing the liquid, and it is good not only the radiating effect to fluoridize the liquid, has good insulating properties moreover, does not have the risk of electric leakage short circuit.
Referring to fig. 3, in order to increase the contact area between the branch pipes 32 and the heat dissipation fins 34 and improve the heat dissipation effect, in the present embodiment, the branch pipes 32 are formed in a flat shape, the flat sides of two adjacent branch pipes 32 are disposed opposite to each other and parallel to each other, and the flat side of each branch pipe 32 faces the heat dissipation fins 34.
The radiating fins 34 are arranged from the first bus bar 31 to the second bus bar 33 in a wave-shaped bending mode, the wave amplitude of the wave bending of the radiating fins 34 is more than twice of the wave length of the wave bending of the radiating fins 34, and the bending positions of the radiating fins 34 are welded with the flat sides of the branch pipeline 32. The wavy radiating fins 34 can increase the welding area between the branch pipeline 32 and the radiating fins 34, further improve the radiating effect, enable the radiating fins 34 to dissipate heat more quickly, and set the wave amplitude of the wavy bending of the radiating fins 34 to be more than twice of the wave length of the wavy bending of the radiating fins 34 to increase the surface area of the radiating fins 34, so as to dissipate heat more quickly and improve the radiating efficiency.
Referring to fig. 1, at least two transmission pipes 2 are communicated between the first bus bar 31 and the evaporation chamber 1, in this embodiment, the number of the transmission pipes 2 is two, and the two transmission pipes 2 are parallel to each other, and the transmission efficiency of the steam can be increased by arranging the two transmission pipes 2, so that the heat dissipation efficiency is improved, and the heat can be dissipated more quickly.
In this embodiment, the branch pipeline 32 is perpendicular to the transmission pipe 2, so that the block condenser formed by the first bus bar 31, the branch pipeline 32, the second bus bar 33 and the heat dissipation fins 34 is 3D combined with the evaporation chamber 1, that is, the condenser and the evaporation chamber 1 are not arranged on the same plane, so as to further keep the condenser away from the heated end, which is beneficial to improving the heat dissipation effect, and meanwhile, the performance of the electronic component is further prevented from being weakened because the heat dissipated by the condenser flows back to the electronic component.
Referring to fig. 2, the welded strengthening rib 12 in the evaporating chamber 1, the both ends of strengthening rib 12 weld respectively in the middle part of the attached face inner wall of 1 two of evaporating chamber, strengthening rib 12 can improve evaporating chamber 1's structural strength, avoid evaporating chamber 1 to warp impaired because of the pressure variation that inside liquid working medium phase transition produced, and when using the evaporating chamber 1 that the operating mode needs great volume, strengthening rib 12 can make evaporating chamber 1 keep good structural stability, avoid evaporating chamber 1 atress to warp.
Referring to fig. 1 and 3, a connection protector 4 is connected between both ends of the first bus bar 31 and both ends of the second bus bar 33, respectively, and the branch line pipe 32 and the heat radiating fin 34 are located between both connection protectors 4. The connection protector 4 is used for protecting the branch line pipe 32 and the heat radiating fins 34 to prevent the branch line pipe 32 and the heat radiating fins 34 from being damaged due to collision, and meanwhile, the connection between the first bus bar 31 and the second bus bar 33 can be reinforced, so that the structural strength of the condenser is improved.
Every two tip of connecting the fender part 4 all have been seted up a mounting hole 41, can use bolt or round pin axle and mounting hole 41 cooperation installation fan during the use, force the forced air cooling to radiating fin 34 through the fan to accelerate the radiating rate, because the inside intercommunication each other of condenser, the difference in temperature of each point still can keep within 5 ℃ on the condenser under forced air cooling's the condition.
The implementation principle of the embodiment is as follows: the transmission pipe 2 is arranged to enable the block condenser formed by the first bus bar 31, the branch pipe 32, the second bus bar 33 and the radiating fins 34 to be far away from the evaporation chamber 1 and the heating source, when the block condenser is used, the heating source is tightly attached to the attachment surface of the evaporation chamber 1, the heat on the heating source is transmitted to the evaporation chamber 1, the liquid working medium in the evaporation chamber 1 is gasified due to heat absorption, the air pressure in the evaporation chamber 1 is increased due to steam, the steam can rapidly flow to the condenser along the transmission pipe 2 because the inside of a 3D cavity heat transfer network system formed by the evaporation chamber 1, the transmission pipe 2, the first bus bar 31, the branch pipe 32 and the second bus bar 33 is vacuumized, when the steam flows through the first bus bar 31 and the branch pipe 32, the heat of the steam can be transmitted to the radiating fins 34 and exchanges heat with air, the heat is released to the surrounding environment, and part of the hotter steam flows to the second bus bar 33 through the branch pipe 32, the second collecting bar 33 is communicated with each branch pipeline 32 and uniformly distributes the heat of the steam in the branch pipelines 32, the steam enters the cold branch pipelines 32 through the second collecting bar 33 and then is cooled and condensed into liquid through the radiating fins 34 to enter the first collecting bar 31, and the liquid flows back to the porous capillary 11 of the evaporation chamber 1 through the transmission pipe 2, so that the circulation is performed continuously to dissipate the heat, and a closed-loop circulation system is formed. The block condenser formed by the first bus bar 31, the branch pipeline 32, the second bus bar 33 and the radiating fins 34 has good radiating effect and high radiating efficiency, and the condenser is far away from the heated end and the heating source, so that the damage of electronic components caused by the fact that heat dissipated by the condenser flows back to the electronic components again is avoided, and the protection of the electronic components is facilitated.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (10)
1. A3D phase transition superconductive heat sink which characterized in that: the heat exchanger comprises an evaporation chamber (1) which is internally provided with a cavity and is filled with liquid working medium for phase change heat exchange, a transmission pipe (2) communicated with the evaporation chamber (1), a first bus bar (31) communicated with one end of the transmission pipe (2) far away from the evaporation chamber (1), at least two branch pipelines (32) communicated with the first bus bar (31), and a second bus bar (33) communicated with one end of the branch pipeline (32) far away from the first bus bar (31), wherein heat radiating fins (34) are connected between every two adjacent branch pipelines (32), the first bus bar (31), the branch pipeline (32), the second bus bar (33) and the heat dissipation fins (34) form a block condenser which is far away from the evaporation chamber (1), and the inside of the evaporation chamber (1) is vacuumized.
2. The 3D phase change superconducting heat sink of claim 1, wherein: the branch pipeline (32) is flat, the flat side of the branch pipeline (32) faces the radiating fins (34), and the radiating fins (34) are welded with the flat side of the branch pipeline (32).
3. The 3D phase change superconducting heat sink of claim 2, wherein: the radiating fins (34) are arranged from the first bus bar (31) to the second bus bar (33) in a wave-shaped bending mode, and the wave amplitude of the wave bending of the radiating fins (34) is more than twice of the wave length of the wave bending of the radiating fins (34).
4. The 3D phase change superconducting heat sink of claim 1, wherein: at least two conveying pipes (2) are communicated between the first bus bar (31) and the evaporation chamber (1).
5. The 3D phase change superconducting heat sink of claim 4, wherein: the condenser and the evaporation chamber (1) are combined in a 3D mode.
6. The 3D phase change superconducting heat sink of claim 1, wherein: and a porous capillary body (11) is arranged on the inner wall of one surface of the evaporation chamber (1) for attaching the heating source.
7. The 3D phase change superconducting heat sink of claim 6, wherein: the porous capillary body (11) is formed by overlapping and welding metal nets or sintering metal powder, and pores which are communicated with each other are formed in the porous capillary body (11) and on the surface of the porous capillary body.
8. The 3D phase change superconducting heat sink of claim 1, wherein: and reinforcing ribs (12) are connected between the inner walls of the evaporation chambers (1).
9. The 3D phase change superconducting heat sink of claim 1, wherein: connecting protective pieces (4) are connected between two end parts of the first bus bar (31) and two end parts of the second bus bar (33), and the branch line pipe (32) and the radiating fin (34) are located between the two connecting protective pieces (4).
10. The 3D phase change superconducting heat sink of claim 8, wherein: the end part of the connecting protective piece (4) is provided with a mounting hole (41).
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