CN111669936A

CN111669936A - Composite assembly for thermal cooling of electronic components

Info

Publication number: CN111669936A
Application number: CN202010151802.8A
Authority: CN
Inventors: A.K.萨赫德夫; M.W.费尔布鲁格
Original assignee: GM Global Technology Operations LLC
Current assignee: GM Global Technology Operations LLC
Priority date: 2019-03-06
Filing date: 2020-03-06
Publication date: 2020-09-15
Also published as: DE102020103028A1

Abstract

The present invention relates to a composite assembly for thermal cooling of electronic components. An electronic assembly includes a composite cooling assembly and an electronic component. The composite cooling assembly includes a housing, a heat transfer fluid, and a heat transfer member. The housing includes a first material having a first thermal conductivity. The housing includes a fluid compartment and a channel. The channel is fluidly connected to the fluid compartment. A heat transfer fluid is disposed within the fluid compartment. The heat transfer member is at least partially disposed within the channel. The heat transfer member is fluidly sealed to the housing. The heat transfer member includes a second material having a second thermal conductivity greater than the first thermal conductivity. The heat transfer member defines a first surface in fluid communication with the heat transfer fluid and a second surface opposite the first surface. The electronic component is coupled to the second surface of the heat transfer element.

Description

Composite assembly for thermal cooling of electronic components

Introduction to the design reside in

This section provides background information related to the present disclosure and is not necessarily prior art.

Vehicles include various types of power electronics. Power electronics typically generate heat. Power electronics are desirably maintained within a predetermined temperature range to achieve optimum performance and maximize component life. One way to maintain the predetermined temperature range is to implement a cooling system to remove heat from the electronic components.

Disclosure of Invention

This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

The present disclosure relates to composite assemblies for thermal cooling of electronic components, electronic assemblies including composite cooling assemblies, and methods of manufacturing composite cooling assemblies and electronic assemblies.

In various aspects, the present disclosure provides a composite cooling assembly. The composite cooling assembly includes a housing and a heat transfer member. The housing includes a first material having a first thermal conductivity. The housing includes a channel in fluid communication with the fluid compartment. The fluid compartment is configured to contain a heat transfer fluid. The heat transfer member is at least partially disposed within the channel. The heat transfer member is sealed to the housing. The heat transfer member includes a second material having a second thermal conductivity greater than the first thermal conductivity. The heat transfer member defines a first surface in fluid communication with the fluid compartment and a second surface opposite the first surface.

In one aspect, the volume ratio of the first material to the second material is greater than or equal to about 1.

In one aspect, the heat transfer member further comprises a plurality of protrusions. A plurality of protrusions extend from the first surface into the fluid compartment.

In one aspect, the plurality of protrusions comprises a second material.

In one aspect, the plurality of protrusions are selected from the group consisting of: a plurality of pins, a plurality of fins, and combinations thereof.

In one aspect, the heat transfer member further comprises a third material. The third material comprises a phase change material.

In one aspect, a heat transfer member includes: a first portion comprising a first surface; a second portion comprising a second surface; and a third portion disposed between the first portion and the second portion. The first portion and the second portion each comprise a second material. The third portion includes a third material.

In one aspect, the third material is encapsulated by the second material.

In one aspect, the phase change material is selected from the group comprising: paraffin, non-paraffin organics, hydrated salts, metals or metal alloys, indium silver compounds, or combinations thereof.

In one aspect, the second thermal conductivity is greater than or equal to about 100 ℃.

In one aspect, the second material is selected from the group comprising: substantially pure copper, substantially pure aluminum, aluminum silicon alloys, aluminum manganese alloys, substantially pure silver, substantially pure magnesium, magnesium aluminum alloys, magnesium zinc alloys, magnesium manganese alloys, magnesium germanium alloys, or combinations thereof.

In one aspect, the first material includes one of a thermoplastic polymer and a thermoset polymer. The thermoplastic polymer is selected from the group comprising: polyethyleneimine (PEI), Polyamideimide (PAI), Polyamide (PA), Polyetheretherketone (PEEK), Polyetherketone (PEK), polyphenylene sulfide (PPS), Thermoplastic Polyurethane (TPU), polypropylene (PP), polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS), High Density Polyethylene (HDPE), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Polycarbonate (PC), Polyaryletherketone (PAEK), Polyetherketoneketone (PEKK), copolymers thereof, and combinations thereof. The thermosetting polymer is selected from the group comprising: benzoxazines, Bismaleimides (BMIs), cyanate esters, epoxies, Phenolics (PFs), polyacrylates, Polyimides (PIs), unsaturated polyesters, Polyurethanes (PURs), vinyl esters, silicones, polydicyclopentadiene (pdcpdps), copolymers thereof, and combinations thereof.

In one aspect, the first material comprises a metal selected from the group consisting of: aluminum alloys, magnesium alloys, zinc alloys, steel, and combinations thereof.

In one aspect, a portion of the heat transfer member protrudes from the channel such that the second surface of the heat transfer member is offset from the third surface of the housing.

In various aspects, an electronic assembly includes a composite cooling assembly and an electronic component. The composite cooling assembly includes a housing, a heat transfer fluid, and a heat transfer member. The housing includes a first material having a first thermal conductivity. The housing includes a fluid compartment and a channel. The channel is in fluid communication with the fluid compartment. A heat transfer fluid is disposed within the fluid compartment. The heat transfer member is at least partially disposed within the channel. The heat transfer member is sealed to the housing. The heat transfer member includes a second material having a second thermal conductivity greater than the first thermal conductivity. The heat transfer member defines a first surface in fluid communication with the heat transfer fluid and a second surface opposite the first surface. The electronic component is coupled to the second surface of the heat transfer component.

In one aspect, the electronic component comprises a solid state switch.

In one aspect, the electronic component further comprises a layer. The layer includes a thermal interface material. The layer is disposed between the electronic component and the second surface of the heat transfer component to couple the electronic component to the heat transfer component.

In one aspect, the heat transfer fluid is selected from the group consisting of: water, water and glycol mixtures, mineral oil, perfluoropolyether oils, polyphenylene ethers, and combinations thereof.

In one aspect, the volume ratio of the first material to the second material is greater than or equal to about 1. The first material includes one of a metal or a polymer. The metal is selected from the group comprising: aluminum a380, magnesium AM50, or combinations thereof. The polymer comprises nylon 6. The second material is selected from the group comprising: substantially pure copper, substantially pure aluminum, and combinations thereof.

In various aspects, the present disclosure provides a method of manufacturing a composite cooling assembly. The method includes placing a heat transfer member in a mold. The heat transfer member defines a first surface and a second surface opposite the first surface. The method also includes flowing a first material into the mold such that the first material engages a portion of the heat transfer member. The method also includes curing the first material to produce an enclosure including the first material. The housing includes a channel in fluid communication with the fluid compartment. The heat transfer member is at least partially disposed within the channel of the housing. The heat transfer member is coupled to the housing. The first surface of the heat transfer member is in fluid communication with the fluid compartment. The heat transfer member includes a second material. The first material has a first thermal conductivity and the second material has a second thermal conductivity greater than the first thermal conductivity.

The present invention provides the following technical solutions.

Technical solution 1. a composite cooling assembly, comprising:

a housing comprising a first material having a first thermal conductivity, the housing comprising a channel in fluid communication with a fluid compartment configured to contain a heat transfer fluid; and

a heat transfer member at least partially disposed within the channel and sealed to the housing, the heat transfer member comprising a second material having a second thermal conductivity greater than the first thermal conductivity, the heat transfer member defining a first surface in fluid communication with the fluid compartment.

The composite cooling assembly of claim 1, wherein a volume ratio of the first material to the second material is greater than or equal to about 1.

The composite cooling assembly of claim 1, wherein the heat transfer member further comprises a plurality of protrusions extending from the first surface into the fluid compartment.

Claim 4. the composite cooling assembly of claim 3, wherein the plurality of protrusions comprise the second material.

Claim 5. the composite cooling assembly of claim 3, wherein the plurality of protrusions are selected from the group consisting of: a plurality of pins, a plurality of fins, and combinations thereof.

The composite cooling assembly of claim 1, wherein the heat transfer component further comprises a third material comprising a phase change material.

The composite cooling assembly of claim 6, wherein the heat transfer member includes a second surface defining an opposite of the first surface, and includes: a first portion comprising the first surface; a second portion comprising the second surface; and a third portion disposed between the first portion and the second portion, the first portion and the second portion each comprising the second material, and the third portion comprising the third material.

Claim 8 the composite cooling assembly of claim 6, wherein the third material is encapsulated by the second material.

Claim 9. the composite cooling assembly of claim 6, wherein the phase change material is selected from the group consisting of: paraffin, non-paraffin organics, hydrated salts, metals or metal alloys, indium silver compounds, or combinations thereof.

The composite cooling assembly of claim 1, wherein the second thermal conductivity is greater than or equal to about 100 ℃.

Claim 11 the composite cooling assembly of claim 10, wherein the second material is selected from the group consisting of: substantially pure copper, substantially pure aluminum, aluminum silicon alloys, aluminum manganese alloys, substantially pure silver, substantially pure magnesium, magnesium aluminum alloys, magnesium zinc alloys, magnesium manganese alloys, magnesium germanium alloys, or combinations thereof.

The composite cooling assembly of claim 12, wherein the first material comprises one of:

(i) a thermoplastic polymer selected from the group comprising: polyethyleneimine (PEI), Polyamideimide (PAI), Polyamide (PA), Polyetheretherketone (PEEK), Polyetherketone (PEK), polyphenylene sulfide (PPS), Thermoplastic Polyurethane (TPU), polypropylene (PP), polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS), High Density Polyethylene (HDPE), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Polycarbonate (PC), Polyaryletherketone (PAEK), Polyetherketoneketone (PEKK), copolymers thereof, and combinations thereof; or

(ii) A thermosetting polymer selected from the group comprising: benzoxazines, Bismaleimides (BMIs), cyanate esters, epoxies, Phenolics (PFs), polyacrylates, Polyimides (PIs), unsaturated polyesters, Polyurethanes (PURs), vinyl esters, silicones, polydicyclopentadiene (pdcpdps), copolymers thereof, and combinations thereof.

The composite cooling assembly of claim 1, wherein the first material comprises a metal selected from the group consisting of: aluminum alloys, magnesium alloys, zinc alloys, steel, and combinations thereof.

The composite cooling assembly of claim 1, wherein the heat transfer member defines a second surface opposite the first surface and includes a portion of the heat transfer member protruding from the channel such that the second surface of the heat transfer member is offset from a third surface of the housing.

An electronic component according to claim 15, comprising:

a composite cooling assembly, comprising:

a housing comprising a first material having a first thermal conductivity, the housing comprising a fluid compartment and a channel in fluid communication with the fluid compartment;

a heat transfer fluid disposed within the fluid compartment; and

a heat transfer member at least partially disposed within the channel and sealed to the housing, the heat transfer member comprising a second material having a second thermal conductivity greater than the first thermal conductivity, the heat transfer member defining a first surface in fluid communication with the heat transfer fluid and a second surface opposite the first surface; and

an electronic component coupled to the second surface of the heat transfer element.

Claim 16. the electronic assembly of claim 15, wherein the electronic component comprises a solid state switch.

The electronic assembly of claim 15, further comprising a layer comprising a thermal interface material disposed between the electronic component and the second surface of the heat transfer member to couple the electronic component to the heat transfer member.

The electronic assembly of claim 18, wherein the heat transfer fluid is selected from the group consisting of: water, water and glycol mixtures, mineral oil, perfluoropolyether oils, polyphenylene ethers, and combinations thereof.

Technical solution 19. the electronic component according to claim 15, wherein:

a volume ratio of the first material to the second material is greater than or equal to about 1;

the first material comprises one of a metal selected from the group consisting of aluminum a380, magnesium AM50, or a combination thereof, or a polymer comprising nylon 6; and is

The second material is selected from the group comprising: substantially pure copper, substantially pure aluminum, and combinations thereof.

Solution 20. a method of manufacturing a composite cooling assembly, the method comprising:

placing a heat transfer member in a mold, the heat transfer member defining a first surface and a second surface opposite the first surface;

flowing a first material into the mold such that the first material engages a portion of the heat transfer member; and

curing the first material to produce a housing comprising the first material, the housing comprising a channel in fluid communication with a fluid compartment, the heat transfer member disposed at least partially within the channel of the housing and coupled to the housing, and the first surface of the heat transfer member in fluid communication with the fluid compartment, wherein:

the heat transfer member comprises a second material; and is

The first material has a first thermal conductivity and the second material has a second thermal conductivity greater than the first thermal conductivity.

Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

1A-1B relate to electronic assemblies according to various aspects of the present disclosure; FIG. 1A is a top exploded perspective view of an electronic assembly; FIG. 1B is a bottom exploded perspective view of the electronics assembly;

2A-2B relate to electronic assemblies according to various aspects of the present disclosure; FIG. 2A is a cross-sectional view of an electronic assembly; FIG. 2B is a perspective view of a heat transfer member of the electronic assembly;

FIG. 3 is a perspective view of another heat transfer member according to aspects of the present disclosure;

FIG. 4 is a cross-sectional view of another electronic assembly in accordance with aspects of the present disclosure;

FIG. 5 is a cross-sectional view of yet another electronic assembly in accordance with aspects of the present disclosure;

FIG. 6 is a cross-sectional view of yet another electronic assembly in accordance with aspects of the present disclosure; and

fig. 7 is a flow chart depicting a method of manufacturing the electronic assembly of fig. 2A.

Corresponding reference characters indicate corresponding parts throughout the several views of the drawings.

Detailed Description

The exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific compositions, components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may also be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, elements, compositions, steps, integers, operations, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Although the open-ended term "comprising" should be understood as a non-limiting term used to describe and claim various embodiments described herein, in certain aspects the term may instead be understood as a more limiting and restrictive term, such as "consisting of or" consisting essentially of. Thus, for any given embodiment that recites a composition, material, component, element, feature, integer, operation, and/or process step, the disclosure also specifically includes embodiments that consist of, or consist essentially of, such recited composition, material, component, element, feature, integer, operation, and/or process step. In the case of "consisting of", alternative embodiments exclude any additional compositions, materials, components, elements, features, integers, operations, and/or process steps, and in the case of "consisting essentially of", any additional compositions, materials, components, elements, features, integers, operations, and/or process steps that substantially affect the basic and novel features are excluded from such embodiments, but any compositions, materials, components, elements, features, integers, operations, and/or process steps that do not substantially affect the basic and novel features may be included in the embodiments.

Unless specifically identified as an order of execution, any method steps, processes, and operations described herein are not to be construed as necessarily requiring their execution in the particular order discussed or illustrated. It should also be understood that additional or alternative steps may be employed unless otherwise indicated.

When a component, element, or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element, or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between.. versus" directly between.. versus, "adjacent" versus "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Although the terms first, second, third, etc. may be used herein to describe various steps, elements, components, regions, layers and/or sections, these steps, elements, components, regions, layers and/or sections should not be limited by these terms unless otherwise specified. These terms may be only used to distinguish one step, element, component, region, layer or section from another step, element, component, region, layer or section. Terms such as "first," "second," and other numerical terms are used herein without implying a sequence or order unless explicitly stated otherwise by the context. Thus, a first step, element, component, region, layer or section discussed below could be termed a second step, element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially or temporally relative terms, such as "before", "after", "inside", "outside", "below", "lower", "above", "upper", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated for ease of description. Spatially and temporally relative terms may also be intended to encompass different orientations of the device or system in use or operation in addition to the orientation depicted in the figures.

Throughout this disclosure, numerical values represent approximate measures or limits of the range, to include minor deviations from the given values, as well as embodiments having about the mentioned values and those having exactly the mentioned values. Other than the working examples provided at the end of the detailed description, all numbers (e.g., of an amount or a condition) of a parameter in this specification (including the appended claims) are to be understood as modified in all instances by the term "about," whether or not "about" actually appears before the number. "about" means that the numerical value allows some slight imprecision (with some approach to exactness; approximately or reasonably close to the value; nearly). If the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least the variation that can result from ordinary methods of measuring and using such parameters. For example, "about" can include variations of less than or equal to 5%, optionally less than or equal to 4%, optionally less than or equal to 3%, optionally less than or equal to 2%, optionally less than or equal to 1%, optionally less than or equal to 0.5%, and in certain aspects, optionally less than or equal to 0.1%.

In addition, the disclosure of a range includes all values within the entire range and further divided ranges, including the endpoints and subranges given for the ranges.

Example embodiments will now be described more fully with reference to the accompanying drawings.

As mentioned above, electronic components typically generate heat during use. It may be desirable to provide cooling to electronic components to maintain them within a predetermined temperature range. Electronic components can have improved performance and longevity when operated within a predetermined temperature range. Some cooling assemblies include a high thermal conductivity enclosure containing a heat transfer fluid. The electronic components are coupled to a surface of the enclosure such that heat generated by the electronic components is transferred through the highly conductive enclosure into the heat transfer fluid.

In various aspects, the present disclosure provides a composite cooling assembly for providing thermal cooling of one or more electronic components. The composite cooling assembly includes a housing and a heat transfer member. The heat transfer member is at least partially disposed within the channel of the housing. The first surface of the heat transfer member is in thermal and fluid communication with a heat transfer fluid in the fluid compartment of the housing. The second surface of the heat transfer component is in thermal communication with the electronic component. The heat transfer member is formed of a high thermal conductivity material and is configured to absorb heat generated by the electronic component as the heat transfer fluid circulates away from the electronic component, into the heat transfer fluid, and away from the electronic assembly. The heat transfer member can transfer heat very efficiently. Thus, the housing may be formed from a variety of materials that need not be selected to have a high thermal conductivity. Rather, the housing material may be selected based on various other design considerations, such as availability, ease of manufacture, and/or suitability for environmental conditions, for example. Further, for example, the heat transfer member may be manufactured separately and subsequently joined to the housing, such as by overmolding or overmolding. In certain aspects, the heat transfer component may include a phase change material that may be encapsulated within a high thermal conductivity material to improve heat transfer characteristics. The present disclosure also provides an electronic assembly including the composite cooling assembly.

Referring to fig. 1A-1B, an electronic assembly 10 in accordance with various aspects of the present disclosure is provided. The electronic assembly 10 includes a composite cooling assembly 12 and a circuit board 14. The composite cooling assembly 12 includes a housing 16, a first heat transfer member 18, a second heat transfer member 20, and a heat transfer fluid (not shown, which will be described in more detail below).

The circuit board 14 includes a first electronic component 22 and a second electronic component 24 (collectively, "electronic components"). In various alternative aspects, the circuit board 14 may include a single electronic component, or more than two electronic components (not shown). The electronic components 22, 24 are physically and electrically coupled to the circuit board 14. When the electronic assembly 10 is in the assembled state, the first and second electronic components 22, 24 are in thermal communication with the first and second heat transfer members 18, 20 (collectively, "heat transfer members"), respectively. In certain aspects, the first and second electronic components 22, 24 are coupled to the first and second heat transfer members 18, 20, respectively.

The electronic components 22, 24 may generate heat during use. The electronic components 22, 24 are disposed in thermal contact with the heat transfer members 18, 20 such that heat generated by the electronic components 22, 24 is transferred into the heat transfer members 18, 20 and away from the electronic components 22, 24, thereby maintaining the temperature of the electronic components 22, 24 within a predetermined range. Maintaining the temperature of the electronic components 22, 24 within a predetermined range may extend the life of the electronic components 22, 24 and/or optimize the performance of the electronic components 22, 24.

The composite cooling assembly 12 may be formed from a variety of materials. The housing 16 includes a body 30 formed of a first material having a first thermal conductivity. In certain aspects, the housing consists essentially of the first material. The first heat transfer member 18 includes a second material having a second thermal conductivity. The second heat transfer member 20 includes a third material having a third thermal conductivity. The second and third materials may be the same or different.

The heat transfer members 18, 20 may generally be formed of one or more high thermal conductivity materials such that they may efficiently transfer heat away from the electronic components 22, 24. Efficient heat transfer in the heat transfer members 18, 20 facilitates the use of multiple first materials for the housing 16. Thus, the second and third thermal conductivities may each be greater than the first thermal conductivity.

In certain aspects, the first material of the housing 16 need not be selected based solely on heat transfer characteristics. For example, the first material may be selected based on availability, ease of manufacture, and/or suitability for environmental conditions, for example. In terms of environmental conditions, in certain aspects, such as when the electronic assembly 10 is to be used in an environment subject to frequent and/or high amplitude vibrations, the first material may have a sufficiently high stiffness to withstand the vibrations. In certain aspects, the electronic assembly 10 may be used in an environment subject to external heat (i.e., heat not generated by the electronic components 22, 24), such as under the hood of a vehicle. Thus, the first material may have a sufficiently high melting temperature to maintain its structural integrity under normal operating conditions. For example, the melting temperature may be a predetermined amount above the highest expected ambient temperature.

The first material may also be referred to as "housing material". The housing material may comprise a polymer, a reinforced polymer composite, or a metal. In certain aspects, for example, the metal can include an aluminum alloy (e.g., aluminum a380), a magnesium alloy (e.g., magnesium AM50), a zinc alloy, steel, or combinations thereof. In certain aspects, the metal may include aluminum a380, magnesium AM50, or a combination thereof. In one example, the metal includes aluminum a 380. In another example, the metal includes magnesium AM 50.

Suitable polymers include thermoplastic polymers and thermosetting polymers. The thermoplastic polymer may include: polyethyleneimine (PEI), Polyamideimide (PAI), Polyamide (PA) (e.g., nylons such as nylon 6, nylon 66, and/or nylon 12), Polyetheretherketone (PEEK), Polyetherketone (PEK), polyphenylene sulfide (PPS), Thermoplastic Polyurethane (TPU), polypropylene (PP), polycarbonate/acrylonitrile butadiene styrene (PC/ABS), High Density Polyethylene (HDPE), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Polycarbonate (PC), Polyaryletherketone (PAEK), Polyetherketoneketone (PEKK), copolymers thereof, and combinations thereof. In certain aspects, the thermoplastic polymer comprises nylon 6. In one example, the housing consists essentially of nylon 6. Thermosetting polymers may include: benzoxazines, Bismaleimides (BMIs), cyanate esters, epoxies, Phenolics (PFs), polyacrylates (acrylates), Polyimides (PIs), unsaturated polyesters, Polyurethanes (PURs), vinyl esters, silicones, polydicyclopentadiene (pdcpdds), copolymers thereof, and combinations thereof.

The polymer composite may include a polymer matrix formed from one or more resins as described above, and a reinforcing material such as a plurality of reinforcing fibers and/or particles. For example, suitable reinforcement materials include carbon fibers, glass fibers (e.g., fiberglass, quartz), basalt fibers, aramid fibers (e.g., KEVLAR, polyparaphenylene benzobisoxazole fibers (PBO)), polyethylene fibers (e.g., high strength Ultra High Molecular Weight (UHMW) polyethylene), polypropylene fibers (e.g., high strength polypropylene), natural fibers (e.g., cotton, flax, cellulose, spider silk), or combinations thereof.

The second and third materials may typically comprise a high thermal conductivity material. Because in some aspects the high thermal conductivity second and third materials are used only for the heat transfer members 18, 20, and not the entire enclosure 16, a variety of high thermal conductivity materials may be used. In contrast, when the entire enclosure is formed of a high thermal conductivity material, it may be difficult or impractical to use certain high thermal conductivity materials. For example, certain high thermal conductivity materials are difficult to cast or stamp in large and/or complex enclosures, but can be easily cast or stamped into heat transfer components, which can generally be smaller and have simpler geometries.

The high thermal conductivity materials can each have a thermal conductivity of greater than or equal to about 100W/(m-K), optionally greater than or equal to about 150W/(m-K), optionally greater than or equal to about 200W/(m-K), optionally greater than or equal to about 250W/(m-K), optionally greater than or equal to about 300W/(m-K), optionally greater than or equal to about 350W/(m-K), or optionally greater than or equal to about 400W/(m-K). The high thermal conductivity material may comprise a metallic and/or co-metallic (covetic) material. The high thermal conductivity material may be a substantially pure metal, meaning that the metallic material may be present with some minor components or impurities, provided they are present in an amount less than or equal to about 0.3 wt%, optionally less than or equal to about 0.2 wt%, optionally less than or equal to about 0.1 wt%, optionally less than or equal to about 0.05 wt%, and in certain variations optionally less than or equal to about 0.01 wt% of the metallic material.

In certain aspects, for example, the high conductivity metal can include copper (e.g., substantially pure copper having greater than or equal to about 99.7 wt% copper), silver (e.g., substantially pure silver having greater than or equal to about 99.7 wt% silver), substantially pure aluminum (e.g., greater than or equal to about 99.7 wt% aluminum), aluminum-silicon alloys (e.g., aluminum-silicon alloys having less than about 4 wt% silicon), aluminum-manganese alloys, substantially pure magnesium (e.g., greater than or equal to about 99.7 wt% magnesium), magnesium-aluminum alloys, magnesium-zinc alloys, magnesium-manganese alloys, magnesium-germanium alloys, or combinations thereof. In certain aspects, the high thermal conductivity metal comprises substantially pure copper, substantially pure aluminum, or a combination thereof. In one example, the high thermal conductivity metal comprises substantially pure copper. In one example, the high thermal conductivity metal comprises substantially pure aluminum. In one aspect, the high thermal conductivity alloy material may include carbon. In one aspect, the high thermal conductivity alloy material may include carbon nanotubes in aluminum, copper, silver, alloys thereof, or combinations thereof.

As described above, the effective heat transfer capability of the heat transfer members 18, 20 may facilitate the use of a variety of housing materials. Thus, when the heat transfer components 18, 20 are used in the composite cooling assembly 12, sufficient heat transfer away from the electronic components 22, 24 may be achieved without the use of an enclosure formed entirely of a high thermal conductivity material. In various aspects, the volume ratio of the first or housing material to the second or thermally conductive material can be greater than or equal to about 1, optionally greater than or equal to about 1.25, optionally greater than or equal to about 1.5, optionally greater than or equal to about 1.75, optionally greater than or equal to about 2, optionally greater than or equal to about 2.5, optionally greater than or equal to about 3, optionally greater than or equal to about 3.5, or optionally greater than or equal to about 4.

In certain aspects, and as will be described in greater detail below (e.g., see fig. 2A-6), the first heat transfer member 18 can further include a fourth material, and the second heat transfer member 20 can further include a fifth material. The fourth and fifth materials may be phase change materials ("PCM"). PCMs are capable of storing and releasing large amounts of latent heat. For example, the PCM may absorb heat to change from a first phase to a second phase. Thus, including one or more PCMs in the heat transfer components 18, 20 may facilitate efficient heat transfer away from the electronic components 22, 24. The PCM may be a solid-liquid PCM, or a solid-solid PCM.

In certain aspects, the PCM may have a phase transition temperature of greater than or equal to about-20 ℃ to less than or equal to about 500 ℃, optionally greater than or equal to about 50 ℃ to less than or equal to about 150 ℃, or optionally greater than or equal to about 120 ℃ to less than or equal to about 80 ℃. In one example, the phase transition temperature is about 100 ℃. In one aspect, the PCM may have a thermal conductivity of greater than or equal to about 0.05W/(m-K) to less than or equal to about 100W/(m-K), or optionally about 70W/(m-K), at about 25 ℃.

In various aspects, the PCM may be a solid-liquid PCM. For example, the solid-liquid PCM may include paraffin, non-paraffin organics, hydrated salts, metal alloys, indium-silver compounds, or combinations thereof. Suitable paraffins may have a phase transition temperature of greater than or equal to about-20 ℃ to less than or equal to about 100 ℃. For example, suitable non-paraffinic organics may have a temperature of greater than or equal to about 5 ℃ to less than or equal to about 120 ℃The phase transition temperature. For example, suitable hydrated salts can have a phase transition temperature of greater than or equal to about 0 ℃ to less than or equal to about 400 ℃. For example, suitable metals and metal alloys may have a phase transition temperature of greater than or equal to about 0 ℃ to less than or equal to about 400 ℃. In one example, the PCM includes paraffin wax having a thermal conductivity of about 0.2W/(m-K) at 20 ℃ and a phase transition temperature of about 55 ℃. In another example, the PCM includes In_0.97Ag_0.03Having a thermal conductivity of 70W/(m-K) at 20 ℃ and a phase transition temperature of about 143 ℃. For example, in various aspects, the PCM may be a solid-solid PCM including, for example, a polyol (e.g., pentaerythritol (C)₅H₁₂0₄) Trimethylolethane (C)₅H₁₂O₃) Neopentyl glycol (C)₅H₁₂0₂) Or a combination thereof.

The fourth and fifth materials may comprise the same PCM or different PCMs. In various aspects, the first heat transfer member 18 can consist essentially of the second material and the fourth material. In various alternative aspects, the first heat transfer member 18 can consist essentially of the second material. In various aspects, the second heat transfer member 20 can consist essentially of the third material and the fifth material. In various alternative aspects, the second heat transfer member 20 can consist essentially of the third material.

In certain aspects, the composite cooling assembly 12 consists essentially of the housing 16, the heat transfer members 18, 20, and the heat transfer fluid. In certain aspects, the composite cooling assembly 12 consists essentially of the housing 16 and the heat transfer members 18, 20. The composite cooling assembly 12 may consist essentially of the housing material (i.e., the first material), the high thermal conductivity material (i.e., the second and third materials), and the PCM (i.e., the fourth and fifth materials). In various alternative aspects, the composite cooling assembly 12 may consist essentially of the outer shell material (i.e., the first material) and the high thermal conductivity material (i.e., the second and third materials).

The electronic components 22, 24 may be selected from the group comprising: solid state switches, capacitors, inductors, resistors, energy storage devices (e.g., batteries and supercapacitors), or combinations thereof. In one example, the first electronic component 22 and the second electronic component 24 are both solid state switches. By way of example, solid state switches may include insulated gate bipolar transistors ("IGBTs"), silicon carbide (SiC) switches, gallium nitride (GaN) switches, and metal oxide semiconductor field effect transistors ("MOSFETs"). In various alternative aspects, the electronic assembly 10 may include a single electronic component, or more than two electronic components. For example, the electronic assembly may be used in a traction motor control module or an auxiliary power module of a vehicle. Those skilled in the art will appreciate that the electronic assembly 10 may be used in other automotive applications. The electronic assembly 10 may also be used in other vehicles, such as aircraft, watercraft, agricultural equipment, and/or recreational vehicles. Further, the electronic assembly 10 may be used in other applications, such as industrial equipment (e.g., forklifts), elevators, and unmanned aircraft, for example.

The body 30 of the housing includes a first side 34 and a second side 38 opposite the first side 34. The housing 16 also includes a fluid compartment 42. The fluid compartment 42 is disposed on the first side 34 of the body 30. The housing 16 may also include an electronics compartment 46. An electronics compartment 46 is disposed on the second side 38 of the body 30.

The main body 30 includes a bottom plate 50. The base plate 50 includes a first channel 54 and a second channel 58 (collectively "channels"). The channels 54, 58 extend between the fluid compartment 42 and the electronics compartment 46. The first and second heat transfer members 18, 20 are at least partially disposed within the first and second channels 54, 58, respectively. The first heat transfer member 18 and the second heat transfer member 20 are coupled to the body 30.

The first heat transfer member 18 includes a first pad 60. First pad 60 may be substantially planar. First pad 60 includes a first surface 62 in communication with fluid compartment 42 and a second surface 64 in communication with electronics compartment 46. In certain aspects, the first heat transfer member 18 may also include a first plurality of protrusions 66. Both first pad 60 and first plurality of protrusions 66 may comprise a second material. However, in certain alternative aspects, the first pad 60 and the first plurality of protrusions 66 may be formed from different high thermal conductivity materials. For example, the first plurality of protrusions 66 may include pins, fins, or a combination thereof. In various alternative aspects, the first heat transfer member 18 may include the first pad 60, but omit the first plurality of protrusions 66 (see, e.g., fig. 4 and 6).

The second heat transfer member 20 includes a second pad 68. The second pad 68 may be substantially planar. The second pad 68 includes a third surface 70 in communication with the fluid compartment 42 and a fourth surface 74 in communication with the electronics compartment 46. In certain aspects, the second heat transfer member 20 may include a second plurality of protrusions 76. Both the second pad 68 and the second plurality of protrusions 76 may comprise a third material. However, in certain alternative aspects, the second pad 68 and the second plurality of protrusions 76 may be formed of different high thermal conductivity materials. For example, the second plurality of protrusions 76 may include pins, fins, or a combination thereof. In various alternative aspects, the second heat transfer member 20 may include the second pad 68, but omit the second plurality of protrusions 76 (see, e.g., fig. 4 and 6).

As best shown in fig. 1B, the body 30 may include a first wall 78 extending from the floor 50 on the first side 34 of the body 30. The housing 16 may also include a first cover 80 that engages the first wall 78 to enclose and fluidly seal the fluid compartment 42. For example, the first cover 80 may be coupled to the body 30 by welding, brazing, friction stir welding, spin welding, adhesives, mechanical fasteners (e.g., screws, rivets), or combinations thereof. In certain aspects, the electronic assembly 10 may include one or more additional components to facilitate forming a fluid seal, such as a gasket (e.g., an O-ring).

The fluid compartment 42 may contain a heat transfer fluid (not shown). The heat transfer fluid may be a gas or a liquid. In certain aspects, the liquid heat transfer fluid may comprise, for example, water, a water and glycol mixture (e.g., 50/50 volume ratio water/glycol), oil (e.g., mineral oil such as baby oil, perfluoropolyether oil), polyphenylene ether, or a combination thereof. In certain aspects, for example, the gaseous heat transfer fluid may comprise helium. In various aspects, the electronic assembly 10 may further include a fluid inlet 84 and a fluid outlet 85 for circulating a heat transfer fluid through the fluid compartment 42.

A first plurality of protrusions 66 may extend from the first surface 62 of the first heat transfer member 18 into the heat transfer fluid. A second plurality of protrusions 76 may extend from the third surface 70 of the second heat transfer member 20 into the heat transfer fluid. The first and second pluralities of protrusions 66, 76 may increase the contact area between the heat transfer member 18, 20 and the heat transfer fluid as compared to a heat transfer member without protrusions. Accordingly, the first and second pluralities of protrusions 66, 76 may improve heat transfer between the heat transfer members 18, 20 and the heat transfer fluid.

The first surface 62 of the first heat transfer member 18 and the third surface 70 of the second heat transfer member 20 are in thermal communication with the heat transfer fluid in the fluid compartment 42. Thus, heat generated by the electronic components 22, 24 may be transferred through the heat transfer components 18, 20 and into the heat transfer fluid. The first surface 62 of the first heat transfer member 18 may be flush with the fifth surface 86 of the base plate 50. However, in various alternative aspects, a portion of the first heat transfer member 18 may be recessed within the first channel 54 such that the first surface 62 is offset from the fifth surface 86 in the first direction 87 (see, e.g., fig. 6). In various alternative aspects, a portion of the first heat transfer member 18 may protrude from the first channel 54 such that the first surface 62 is offset from the fifth surface 86 in a second direction 88 opposite the first direction 87 (see, e.g., fig. 4). The third surface 70 of the second heat transfer member 20 may be flush with the fifth surface 86 of the base plate 50. However, in various alternative aspects, a portion of the second heat transfer member 20 may be recessed within the second channel 58 such that the third surface 70 is offset from the fifth surface 86 in the first direction 87. In various alternative aspects, a portion of the second heat transfer member 20 can protrude relative to the base plate 50 such that the third surface 70 is offset from the fifth surface 86 in the second direction 88.

As best shown in fig. 1A, the body 30 may include a second wall 90 extending from the floor 50 on the second side 38 of the body 30. The circuit board 14 may be disposed within the electronics compartment 46 when the electronic assembly 10 is in an assembled state. A second cover 94 may engage the second wall 90 to enclose the electronics compartment 46. In certain aspects, a fluid seal may be formed between the second cover 94 and the second wall 90.

The first and second electronic components 22, 24 engage the first and second heat transfer members 18, 20, respectively, when the circuit board 14 is disposed within the electronics compartment 46. In certain aspects, the electronic components 22, 24 are coupled to the heat transfer components 18, 20. The electronic components 22, 24 may be coupled to the heat transfer components 18, 20 by a thermal interface material ("TIM"). In certain aspects, the thermal interface material may include, for example, greases, gels, and silicones, which may be filled with thermally conductive metal oxides.

A portion of the first heat transfer member 18 may protrude from the first channel 54 such that the second surface 64 is offset from the sixth surface 98 of the base plate 50 in the first direction 87. However, in various alternative aspects, the second surface 64 may be flush with the sixth surface 98. In various alternative aspects, a portion of the first heat transfer member 18 may be recessed into the first channel 54 such that the second surface 64 is offset relative to the sixth surface 98 in the second direction 88. A portion of the second heat transfer member 20 may be recessed into the second channel 58 such that the fourth surface 74 is offset in the second direction 88 relative to the sixth surface 98 of the base plate 50. However, in various alternative aspects, the fourth surface 74 may be flush with the sixth surface 98. In various alternative aspects, a portion of the second heat transfer member 20 may protrude from the second channel 58 such that the fourth surface 74 is offset from the sixth surface 98 in the first direction 87.

Referring to fig. 2A-2B, another electronic assembly 120 in accordance with various aspects of the present disclosure is provided. The electronic assembly 120 may include a composite cooling assembly 122 and an electronic component 124, which may be coupled to a circuit board (not shown). The composite cooling assembly 122 may include a housing 126, a heat transfer member 128, and a heat transfer fluid 130.

The housing 126 may include a body 132, a first cover 134, and a second cover 135. The body 132, the first cover 134, and the second cover 135 may all be formed from a first or shell material, such as the shell materials described above with reference to fig. 1A-1B. However, in various alternative aspects, the body 132, the first cover 134, and the second cover 135 can be formed from two or more different housing materials.

The body 132 may include a floor 136, first and

second walls

138, 139 extending from the floor 136, a fluid compartment 140, and an electronics compartment 141. The fluid compartment 140 may be at least partially defined by the floor 136 and the first wall 138. The electronics compartment 141 may be at least partially defined by the floor 136 and the second wall 139. The first lid 134 is coupled to the first wall 138 to enclose the fluid compartment 140. The first cap 134 may be fluidly sealed to the first wall 138. The heat transfer fluid 130 may be disposed within the fluid compartment 140. A second lid 135 is coupled to the second wall 139 to enclose the electronics compartment 141. The second cap 135 may be fluidly sealed to the second wall 139.

The heat transfer member 128 may include a pad 142 and a plurality of protrusions 144. The pad 142 may include a first portion 146, a second portion 148, and a third portion 150. The third portion 150 may be disposed between the first portion 146 and the second portion 148. The first portion 146, the second portion 148, and the plurality of protrusions 144 may be formed from a second material. The second material may be a high thermal conductivity material such as those described above. The third portion 150 may be formed of a third material. The third material may be a PCM, such as those described above. For example, the PCM may be a solid-solid PCM.

The heat transfer member 128 may be at least partially disposed in the channel 152 of the housing 126 and coupled to the housing 126. The heat transfer member 128 may be fluidly sealed to the housing 126 to prevent the heat transfer fluid 130 from leaking out of the electronic assembly 120. More specifically, the joint 154 may be disposed between the heat transfer member 128 and the housing 126. For example, the joint 154 may be formed by welding, brazing, friction stir welding, spin welding, adhesives. The fitting 154 may also include a gasket, such as an O-ring.

The heat transfer member 128 may include a first surface 156 and a second surface 158. The first surface 156 may be in communication with the heat transfer fluid 130. A plurality of protrusions 144 may extend from the first surface 156 into the heat transfer fluid 130. A portion of the heat transfer member 128 may protrude from the channel 152 into the fluid compartment 140 such that the first surface 156 is offset from the third surface 160 of the bottom plate 136 in a first direction 161.

A portion of the heat transfer member 128 may protrude from the channel 152 such that the second surface 158 is offset from the fourth surface 162 of the base plate 136 in a second direction 163 opposite the first direction 161. The electronic component 124 may be in thermal contact with the heat transfer component 128. In certain aspects, the electronic component 124 can be coupled to the heat transfer component 128. More specifically, the electronic component 124 may be coupled to the second surface 158 of the heat transfer component 128. For example, the electronic component 124 may be coupled to the second portion 148 of the heat transfer component 128 through a layer 164 including a TIM such as those described above.

In certain aspects, the electronic components 124 are potted or include a conformal coating 166 to provide resistance to shock and vibration, as well as a barrier against moisture and corrosive agents. The potting compound or coating 166 may comprise a non-conductive material. For example, the non-conductive material may be a resin (e.g., epoxy), a thermoset, a silicone rubber gel, or a combination thereof. In one example, the coating 166 covers at least a portion of an outer surface 167 of the electronic component 124.

The electronic component 120 may define a variety of different shapes and/or sizes. In certain aspects, the electronic assembly 120 defines a first dimension or housing thickness 170, a second dimension or housing width 171, a housing length (not shown), a third dimension or cover/wall thickness 172, a fourth dimension or fluid compartment depth 174, a fifth dimension or protrusion height 176, and a sixth dimension or pad thickness 178. The size and shape of electronic assembly 120 may be determined based at least in part on the size of electronic component 124 or circuit board, the heat generated by electronic component 124 (e.g., electronic components that generate more heat may require a greater fluid compartment depth 174 and/or a greater pin height 176), and/or packaging or structural requirements, for example. In one example, the electronics assembly 120 is used in an autonomous driving system computer ("ADSC"). In this example, the housing height 170 may be about 50mm, the housing width 171 may be about 500mm, the housing length may be about 450mm, the cover/wall thickness 172 may vary between about 1mm and about 6mm, the fluid compartment depth 174 may be about 6mm, the protrusion height 176 may be about 5mm, and the pad thickness may be about 15 mm.

Referring to fig. 3, another heat transfer member 190 is provided in accordance with various aspects of the present disclosure. The heat transfer member 190 includes a first or outer portion 192 and a second or inner portion 194. The inner portion 194 is enclosed within the outer portion 192. The outer portion 192 may be formed of a high thermal conductivity material such as those described above. Inner portion 194 may be formed from a PCM such as described above. In certain aspects, the PCM is a solid-liquid PCM.

Encapsulating the PCM in a high thermal conductivity material may be particularly useful for certain methods of manufacturing composite cooling assemblies. In various aspects, the heat transfer member 190 may be fabricated prior to fabricating and assembling the housing of the composite cooling assembly. For example, the heat transfer member 190 may be placed in a mold (not shown) and a shell may be formed around the heat transfer member 190, such as by overmolding or overmolding. The process of forming the shell may require sufficient heat to cause the PCM to change phase. When the PCM is encapsulated by a high thermal conductivity material, it may be feasible to use the shell manufacturing method as described above with solid-liquid PCM.

Referring to fig. 4, another electronic assembly 210 in accordance with various aspects of the present disclosure is provided. Unless otherwise noted, electronic component 210 may be similar to electronic component 120 of fig. 2A. Electronics assembly 210 may include a composite cooling assembly 212 and an electronic component 214. Composite cooling assembly 212 may include an enclosure 216, a heat transfer member 218, and a heat transfer fluid 220. The housing 216 includes a body 222 having a fluid compartment 224 and an electronics compartment 225, a first cover 226 enclosing the fluid compartment 224, and a second cover 227 enclosing the electronics compartment 225.

The heat transfer member 218 is at least partially disposed within the channel 228 of the body 222 and is coupled to the body 222. The heat transfer member 218 includes a first surface 230 and a second surface 232 opposite the first surface 230. The first surface 230 is in communication with the heat transfer fluid 220. A portion of the heat transfer member 218 may protrude from the channel 228 into the fluid compartment 224 such that the first surface 230 is offset in a direction 237 from a third surface 234 of a base plate 236 of the main body 222. The first surface 230 is substantially planar and free of protrusions.

The second surface 232 is substantially flush with the fourth surface 238 of the base plate 236. Electronic component 214 may be coupled to second surface 232 by layer 239. Layer 239 may include a TIM. The electronic component 214 may be sealed to the composite cooling assembly 212 by a coating 240. In certain aspects, the coating 240 may comprise an epoxy.

The heat transfer member 218 includes a first portion 241, a second portion 242, and a third portion 244 disposed between the first portion 241 and the second portion 242. The first portion 241 and the second portion 242 may be formed of a high thermal conductivity material such as described above. The third portion 244 may be formed of a PCM such as described above. In certain aspects, the PCM is a solid-solid PCM.

Referring to fig. 5, another electronic assembly 250 in accordance with various aspects of the present disclosure is provided. Unless otherwise noted, the electronic assembly may be similar to the electronic assembly 120 of fig. 2A. Electronics assembly 250 may include a composite cooling assembly 252 and an electronic component 254. Composite cooling assembly 252 may include an enclosure 256, a heat transfer member 258, and a heat transfer fluid 260. The housing 256 may include a main body 262 having a fluid compartment 264 and an electronics compartment 265, a first cover 266 cooperating with the main body 262 to enclose the fluid compartment 264, and a second cover 267 cooperating with the main body 262 to enclose the electronics compartment 265.

The heat transfer member 258 may be at least partially disposed within the channel 268 of the body 262. The heat transfer member 258 may include a first surface 269 and a second surface 270 opposite the first surface 269. The first surface 269 may be substantially flush with the third surface 272 of the floor 274 of the body 262. A plurality of protrusions 276 may extend from the first surface 269 into the heat transfer fluid 260 in the fluid compartment 264.

The second surface 270 may be substantially flush with a fourth surface 278 of the floor 274 of the body 262. The second surface 270 may define a cavity 280. The electronic component 254 may be at least partially disposed within the cavity 280. Electronic component 254 may be coupled to heat transfer component 258 by layer 281, which may include a TIM. More specifically, the cavity 280 may include a fifth surface 282. The fifth surface 282 may be recessed relative to the second surface 270 of the heat transfer member 258 and the fourth surface 278 of the bottom plate 274. In certain aspects, the sixth surface 284 of the electronic component 254 may be substantially flush with the second surface 270 of the heat-transfer component 258 and the fourth surface 278 of the bottom plate 274. Accordingly, the height 286 of the cavity 280 and the electronic component 254 may be substantially equal. The electronic component 254 may be sealed to the composite cooling assembly 252 by the coating 287. Coating 287 may include an epoxy.

The heat transfer member 258 may include a first portion 288, a second portion 290, and a third portion 292. The first portion 288 may include a first surface 269. The second portion 290 may include the second surface 270 and the cavity 280. The third portion 292 may be enclosed within the first portion 288. The first and second portions 288 and 290 may be formed of a high thermal conductivity material such as described above. The third portion 292 may be formed of a PCM such as described above. In certain aspects, the PCM may be a solid-liquid PCM.

Referring to fig. 6, another electronic assembly 310 in accordance with various aspects of the present disclosure is provided. Unless otherwise noted, the electronic component 310 may be similar to the electronic component 210 of fig. 4. The electronic assembly 310 may include a composite cooling assembly 312 and electronic components 314. The composite cooling assembly 312 may include a housing 316, a heat transfer member 318, and a heat transfer fluid 320. The housing 316 may include a lid 321 and a body 322, the body 322 having a fluid compartment 324 and an electronics compartment 325. In certain aspects, the fluid compartment 324 may be completely enclosed by the body 322 and without a separate cover.

The heat transfer member 318 is disposed within the channel 326 of the body 322 and coupled to the body 322. The heat transfer member 318 includes a first surface 328 and a second surface 330 opposite the first surface 328. A portion of the heat transfer member 318 may be recessed into the channel 326 such that the first surface 328 is offset in a direction 335 relative to the third surface 332 of the bottom plate 334 of the body 322. The first surface 328 is substantially planar and free of protrusions. A portion of the heat transfer member 318 may protrude from the channel 326 such that the second surface 330 is offset in a direction 335 from a fourth surface 336 of the base plate 334. The electronic component 314 is in thermal communication with a heat transfer component 318. Electronic component 314 may be coupled to second surface 330 of heat transfer component 318 through layer 337, which layer 337 may include a TIM. The electronic components 314 may be sealed to the composite cooling assembly 312 by a coating 338, which may include an epoxy.

The heat transfer member 318 includes a first portion 339, a second portion 340, and a third portion 342 disposed between the first portion 339 and the second portion 340. The first and

second portions

339, 340 are formed of a high thermal conductivity material such as described above. The third portion 342 is formed of a PCM such as described above. In certain aspects, the PCM may be a solid-solid PCM.

In various aspects, the present disclosure provides a method of manufacturing an electronic assembly according to various aspects of the present disclosure. The method will be described in the context of the electronic component 120 of fig. 2A. However, one skilled in the art will appreciate that similar method steps may be used to form other heat transfer components, such as those described herein.

Referring to fig. 7, a method 360 of manufacturing an electronic assembly 120 according to various aspects of the present disclosure is provided. At 364, the method includes forming the heat transfer component 128. In certain aspects, the first portion 146 and the second portion 148 can be formed separately from the third portion 150 and joined to the third portion 150. For example, the first and

second portions

146, 148 may be formed by casting, extrusion, machining, additive manufacturing, laser cutting, powder pressing and sintering, powder pressing with spark plasma sintering, or combinations thereof. When the third portion 150 includes a solid-solid PCM, the third portion 150 may be formed by hot pressing. The third portion 150 may be disposed between the first portion 146 and the second portion 148. For example, third portion 150 may be coupled to first portion 146 and second portion 148, such as by adhesive bonding, diffusion bonding, soldering, or a combination thereof.

In various alternative aspects, the electronic assembly may include a heat transfer member, such as heat transfer member 190 of fig. 3, having an encapsulated solid-liquid PCM. In some examples, the outer portion 192 is formed as a single piece, such as by casting. The inner portion 194 is injected in its liquid state. The outer portion 192 is sealed to retain the inner portion 194 within the outer portion 192. In other examples, the outer portion 192 is formed as multiple sections or portions, such as by extrusion or machining. Sections of the outer portion 192 are stacked with the inner portion 194 in its solid form. The outer portion 192 seals around the inner portion 194 to enclose the inner portion 194 within the outer portion 192. In other examples, the outer portion precursor begins as two sheets joined (e.g., by laser welding) on their periphery except for a small area for inserting the needle. The needles may be used to cause the two sheets to separate to form the cavity and create the outer portion 192. The inner portion 194 may be injected in liquid form after the cavity is formed. In yet another example, the inner portion 194 includes a PCM in a plastic bag. The outer portion 192 is formed around the inner portion 194.

Returning to FIG. 7, at 368, the housing 126 is formed. Forming the housing 126 includes placing the heat transfer member 128 in a mold. The mold may define a shape that is substantially the negative shape of the housing 126. The first material is injected into the mold such that it flows around and engages a portion of the heat transfer member 128. The first material is cured to form the housing 126. The curing of the first material causes the first material to adhere to the heat transfer member 128, thereby coupling the heat transfer member 128 to the housing 126. Thus, forming the enclosure 126 and coupling the heat transfer member 128 to the enclosure 126 may be performed simultaneously. When the first material comprises a metal, forming the housing 126 may comprise overmolding. When the first material comprises a polymer, forming the housing 126 may include overmolding.

In various alternative aspects, for example, the housing 126 is separately formed, such as by casting or molding. The heat transfer member 128 is disposed within the channel 152. The heat transfer member 128 is coupled to the housing 126, for example, by an adhesive (e.g., a thermally conductive adhesive), a press fit, a friction stir weld, a spin weld, a laser braze, an ultrasonic weld, a compression lock, a direct electrical fusion bond, or a combination thereof. Thus, forming the enclosure 126 may be performed prior to coupling the heat transfer member 128 to the enclosure 126.

At 372, the method 360 further includes coupling the electronic component 124 to the heat transfer component 128. Coupling the electronic component 124 to the heat transfer component 128 may include disposing a TIM on at least one of the second surface 158 of the heat transfer component 128 and an opposing surface of the electronic component 124.

At 376, the method 360 further includes potting the electronic component 124 and/or applying the conformal coating 166. The conformal coating 166 engages the second surface 158 of the heat transfer member 128.

At 380, the electronic component 124 may be disposed within the electronics compartment 141, and the second cover 135 may be coupled to the second wall 139 to enclose the electronic component 124 within the housing 126. The method may optionally further comprise one or more additional steps. For example, the first cap 134 may be coupled to the first wall 138 such that a fluid seal is formed between the first cap 134 and the first wall 138. The heat transfer fluid 130 may be disposed within the fluid compartment 140 and/or circulated through the fluid compartment 140.

The foregoing description of the embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also differ in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims

1. A composite cooling assembly comprising:

2. The composite cooling assembly of claim 1, wherein a volume ratio of the first material to the second material is greater than or equal to about 1.

3. The composite cooling assembly of claim 1, wherein the heat transfer member further comprises a plurality of protrusions extending from the first surface into the fluid compartment.

4. The composite cooling assembly of claim 3, wherein the plurality of protrusions comprise the second material.

5. The composite cooling assembly of claim 3, wherein the plurality of protrusions are selected from the group consisting of: a plurality of pins, a plurality of fins, and combinations thereof.

6. The composite cooling assembly of claim 1, wherein the heat transfer component further comprises a third material comprising a phase change material.

7. The composite cooling assembly of claim 6, wherein the heat transfer member includes a second surface defining an opposite of the first surface, and including: a first portion comprising the first surface; a second portion comprising the second surface; and a third portion disposed between the first portion and the second portion, the first portion and the second portion each comprising the second material, and the third portion comprising the third material.

8. The composite cooling assembly of claim 6 wherein the third material is encapsulated by the second material.

9. An electronic assembly, comprising:

a composite cooling assembly, comprising:

a heat transfer fluid disposed within the fluid compartment; and

10. A method of manufacturing a composite cooling assembly, the method comprising:

the heat transfer member comprises a second material; and is