CN111668361A

CN111668361A - Packaging structure, manufacturing method thereof and electronic device

Info

Publication number: CN111668361A
Application number: CN201910162917.4A
Authority: CN
Inventors: 李晋棠
Original assignee: GIO Optoelectronics Corp
Current assignee: Fanglue Electronics Co ltd
Priority date: 2019-03-05
Filing date: 2019-03-05
Publication date: 2020-09-15

Abstract

The invention discloses a packaging structure, a manufacturing method thereof and an electronic device. The manufacturing method comprises the following steps: preparing a mother substrate, wherein the mother substrate is provided with a lead layer, and the lead layer comprises a plurality of patterned circuits; forming a plurality of visual units on the mother substrate, wherein the bright area of each visual unit is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area; arranging a plurality of packaging pieces on the mother substrate, wherein each packaging piece completely covers each bright area and partially covers the corresponding patterned circuit, so that the average reflectivity inside each packaging piece is larger than that outside each packaging piece; and cutting along the periphery of each vision unit.

Description

Packaging structure, manufacturing method thereof and electronic device

Technical Field

The present invention relates to a package structure, a method for manufacturing the same, and an electronic device, and more particularly, to a package structure with high contrast, a method for manufacturing the same, and an electronic device.

Background

The light emitting diode is a light emitting element made of a semiconductor material, and the element has two electrode terminals, and a voltage is applied between the terminals, and a very small voltage is applied, so that residual energy can be excited and released in the form of light through the combination of electron holes. Different from a common incandescent bulb, the light-emitting diode belongs to cold light, and has the advantages of low power consumption, long element service life, no need of lamp warming time, high reaction speed and the like; in addition, the module has small size, is vibration-resistant, suitable for mass production, and can be easily made into a tiny or array module according to the application requirements, so that the module can be widely applied to lighting equipment, indicators of information, communication, consumer electronics, backlight modules of display equipment, and displays, and is one of the essential important elements in daily life.

Disclosure of Invention

The invention aims to provide a packaging structure with high contrast ratio, a manufacturing method thereof and an electronic device.

To achieve the above object, a method for manufacturing a package structure according to the present invention comprises: preparing a mother substrate, wherein the mother substrate is provided with a conducting wire layer, and the conducting wire layer comprises a plurality of patterned circuits; forming a plurality of visual units on the mother substrate, wherein each visual unit is provided with a bright area and a dark area, the bright area is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area; arranging a plurality of packaging pieces on the mother substrate, wherein each packaging piece completely covers the bright area of each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each packaging piece is larger than the average reflectivity outside each packaging piece; and cutting the mother substrate along the periphery of each vision unit.

In one embodiment, the step of forming a plurality of visual units on the mother substrate further includes: forming a plurality of light reflecting layers on the mother substrate, wherein each light reflecting layer is positioned above or below the wire layer, and at least one part of each light reflecting layer defines a bright area of each visual unit.

In one embodiment, the step of forming a plurality of visual units on the mother substrate further includes: and forming a plurality of light absorbing layers on the mother substrate, wherein each light absorbing layer is arranged along the periphery of the bright area of each visual unit, and each light absorbing layer defines the dark area of each visual unit.

In one embodiment, in the step of preparing the mother substrate, the mother substrate is a light reflecting plate or a light absorbing plate.

In one embodiment, in the step of forming the plurality of light reflecting layers on the mother substrate, the wire layer is positioned between the light reflecting layers and the mother substrate.

In one embodiment, the step of forming a plurality of visual units on the mother substrate further includes: forming a plurality of light absorbing layers on the mother substrate, wherein each light absorbing layer is arranged along the periphery of the bright area of each visual unit, and each light absorbing layer defines the dark area of each visual unit; in the step of forming the plurality of light reflecting layers on the mother substrate, the wire layer is positioned between the light reflecting layer and the mother substrate, or the light reflecting layer is positioned between the wire layer and the mother substrate.

In one embodiment, before the step of cutting the mother substrate along the periphery of each vision unit, the method further comprises: forming a plurality of first electrical connection pads on the mother substrate, so that at least one first electrical connection pad is arranged around each visual unit, and the first electrical connection pads correspond to the patterned circuits of the lead layer; and forming a plurality of second electrical connection pads on the lead layer of the mother substrate, so that the photoelectric elements of the visual units are electrically connected with the lead layer through the second electrical connection pads respectively.

In one embodiment, before the step of cutting the mother substrate along the periphery of each vision unit, the method further comprises: forming a plurality of through holes on the mother substrate, wherein the through holes correspond to the patterned circuits of the lead layer; and arranging a conductive piece on each through hole and electrically connected to the corresponding patterned circuit, wherein the conductive piece is electrically connected to the photoelectric element of each visual unit through each patterned circuit.

In one embodiment, in the step of disposing a plurality of packages on the mother substrate, each package further covers to a dark area in each corresponding vision unit.

To achieve the above objective, a package structure according to the present invention includes a substrate, a conductive layer, a vision unit and a package. The conducting wire layer is arranged on the substrate and comprises a plurality of patterned circuits. The visual unit is arranged on the substrate, wherein the visual unit is provided with a bright area and a dark area defined along the periphery of the bright area, the bright area is provided with a photoelectric element, and the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits. The package is arranged on the substrate, wherein the package completely covers the bright area of the visual unit and partially covers the corresponding patterned circuit, and the average reflectivity inside the package is greater than that outside the package.

In one embodiment, the substrate is a flexible board.

In one embodiment, the substrate is a light absorbing plate or a light reflecting plate.

In one embodiment, the package structure further includes a light reflecting layer disposed on the substrate, the light reflecting layer being disposed above or below the conductive layer, at least a portion of the light reflecting layer defining a bright area of the visual unit.

In one embodiment, the package structure further includes a light absorbing layer disposed on the substrate, wherein the light absorbing layer is disposed around the bright area of the visual unit and the light absorbing layer defines the dark area of the visual unit.

In one embodiment, the package structure further includes a light absorbing layer disposed on the substrate or the light reflecting layer, wherein the light absorbing layer is disposed around the bright area of the visual unit and the light absorbing layer defines the dark area of the visual unit.

In one embodiment, the wire layer is positioned between the light reflecting layer and the substrate.

In one embodiment, the wire layer is located between the light reflecting layer and the substrate, or the light reflecting layer is located between the wire layer and the substrate.

In one embodiment, the package structure further includes a plurality of first electrical connection pads and a plurality of second electrical connection pads, the plurality of first electrical connection pads are disposed on the substrate, wherein each of the first electrical connection pads is disposed around the vision unit and corresponds to the patterned circuit of the conductive trace layer; the plurality of second electrical connection pads are arranged on the substrate, wherein each second electrical connection pad is arranged on the lead layer and is electrically connected to the photoelectric element of each visual unit through each patterned circuit corresponding to the lead layer.

In one embodiment, the package structure further includes a plurality of through holes and conductive members. A plurality of through holes are arranged on the substrate and correspond to the patterned circuits of the lead layer; the conductive members are disposed in the through holes and electrically connected to the corresponding patterned circuits, wherein the conductive members are electrically connected to the optoelectronic devices of the vision units through the corresponding patterned circuits.

To achieve the above object, an electronic device according to the present invention includes a driving circuit board, one of the package structures, and a plurality of conductive materials. The driving circuit board comprises a conductive layer; the packaging structures are arranged on the driving circuit board; a plurality of conductive materials are disposed on the conductive layer. The photoelectric element of each packaging structure is electrically connected to the conductive layer of the driving circuit board through the patterned circuits and the conductive materials.

As mentioned above, in the package structure, the manufacturing method thereof and the electronic device of the present invention, the visual unit has the structure design of the bright area of the optoelectronic device and the dark area defined along the periphery of the bright area, so that when the package completely covers the bright area of the visual unit, the average reflectivity inside the package can be greater than the average reflectivity outside the package, and thus, the package structure and the electronic device have a high contrast characteristic, and the product competitiveness can be improved.

Drawings

Fig. 1 is a flow chart illustrating a method for manufacturing a package structure according to a preferred embodiment of the invention.

Fig. 2A to fig. 2H are schematic views illustrating a manufacturing process of a package structure according to an embodiment of the invention.

Fig. 3A, fig. 4A, fig. 5A and fig. 6A are schematic top views of package structures according to different embodiments of the invention.

FIG. 3B is a cross-sectional view of the package structure of FIG. 3A along section line 3B-3B.

Fig. 4B is a cross-sectional view of the package structure of fig. 4A along the line 4B-4B.

Fig. 5B is a cross-sectional view of the package structure of fig. 5A along section line 5B-5B.

Fig. 6B is a cross-sectional view of the package structure of fig. 6A along section line 6B-6B.

Fig. 7 is a schematic diagram of an electronic device according to an embodiment of the invention.

Detailed Description

The package structure, the method of manufacturing the same, and the electronic device according to the preferred embodiments of the present invention will be described with reference to the accompanying drawings, wherein like elements are denoted by like reference numerals.

As shown in fig. 1, the method for manufacturing the package structure may include: preparing a mother substrate, wherein the mother substrate has a conductive line layer, and the conductive line layer comprises a plurality of patterned lines (step S01); forming a plurality of visual units on the mother substrate, wherein each visual unit has a bright area and a dark area, the bright area is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area (step S02); disposing a plurality of packages on the mother substrate, wherein each package completely covers the bright area of each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside each package (step S03); and cutting the mother substrate along the periphery of each of the vision units (step S04). The mother substrate may comprise a hard substrate or a soft substrate. In some embodiments, if the mother substrate includes a flexible substrate, in order to enable subsequent circuits or devices to be smoothly formed on the flexible substrate through subsequent processes and facilitate the operation of the flexible substrate, the flexible substrate is first formed on the rigid carrier, and the rigid carrier is removed in the subsequent steps. However, if the mother substrate includes a hard base material, this process is not required.

Please refer to fig. 1 in conjunction with fig. 2A to 2H to describe each step in detail. Fig. 2A to 2H are schematic diagrams illustrating a manufacturing process of the package structure 1 according to an embodiment of the invention.

First, the mother substrate 11 is prepared (step S01). The mother substrate 11 may include an insulating substrate, and the insulating substrate may be made of glass, resin, metal, ceramic, or a composite material. The resin material has flexibility and may include an organic polymer material, and a Glass Transition Temperature (Tg) of the organic polymer material may be, for example, 250 ℃ to 600 ℃, and a preferred Temperature range may be, for example, 300 ℃ to 500 ℃. With such a high glass transition temperature, it is possible to form a device or a wiring directly on a flexible substrate in a process to be performed later. Here, the organic polymer material may be a thermoplastic material, such as Polyimide (PI), Polyethylene (PE), polyvinyl chloride (PVC), Polystyrene (PS), acrylic, fluorinated polymer (Fluoropolymer), polyester (polyester) or nylon (nylon).

As shown in fig. 2A, the mother substrate 11 of the present embodiment includes a flexible substrate 111 (made of PI, for example) and is disposed on the rigid carrier 10 by gluing or coating. In addition, as shown in fig. 2B, the mother substrate 11 further has a conductive layer (not shown), which may include a plurality of patterned lines 112. Fig. 2B shows that the number of the patterned lines 112 is four. The patterned circuit 112 may be a thin film conductive circuit fabricated by a thin film process, which may be a semiconductor process, and may be a Low Temperature Polysilicon (LTPS) process, an amorphous silicon (α -Si) process, or a metal oxide (e.g., IGZO) semiconductor process; alternatively, the patterned circuit 112 may be a conductive circuit formed by copper foil or other conductive materials, which is not limited in the present invention. In some embodiments, when the active matrix electronic device is to be subsequently assembled, a thin film element, a conductive line, or a film layer may be further formed on the substrate 111, for example, a thin film transistor, a thin film resistor, a capacitor, a conductive layer, a metal layer, an insulating layer, a transmission line for a scan signal and a data signal, and the like are formed.

Next, before the step S04 of cutting the mother substrate along the periphery of each of the visual units, as shown in fig. 2B, the manufacturing method of the embodiment may further include: a plurality of first electrical connection pads 16 are formed on the mother substrate 11, wherein the first electrical connection pads 16 correspond to the patterned circuits 112 of the conductive trace layer. The material of the first electrical connection pads 16 is, for example, but not limited to, copper, silver or gold, or a combination thereof, or other suitable conductive material. Here, the first electrical connection pads 16 can be formed by, for example, a printing process or other suitable methods. The first pads 16 of the present embodiment are formed on the patterned circuits 112 (four pads), and are in direct contact with each other and electrically connected to each other.

In addition, before the step S02 of forming a plurality of visual elements on the mother substrate, as shown in fig. 2C, the manufacturing method of the embodiment may further include: a plurality of light reflecting layers 12 are directly or indirectly formed on the mother substrate 11. The light reflective layer 12 is, for example, but not limited to, a white photoresist, and the light reflective layer 12 may be formed on the mother substrate 11 or the patterned circuit 112 by, for example, coating, printing or other suitable methods, or simultaneously formed on the patterned circuit 112 and the substrate 111 at suitable positions in the present embodiment. The light reflecting layer 12 can reflect the light emitted to the substrate 111 and emit the light upwards, so as to improve the light emitting efficiency and contrast. It should be noted that the step of forming the plurality of light-reflecting layers 12 may be performed after the process of forming the conductive wire layers, so that each light-reflecting layer 12 may be located on the conductive wire layer (the patterned circuit 112) (as shown in fig. 2C of this embodiment); alternatively, the process of forming the conductive line layer may be performed before, so that the light reflective layer 12 may be located under the conductive line layer (the patterned circuit 112) (not shown), which is not limited in the present invention.

In addition, before the step S02 of forming a plurality of visual elements on the mother substrate, as shown in fig. 2D, the manufacturing method of the embodiment may further include: a plurality of light absorbing layers 15 are directly or indirectly formed on the mother substrate 11. Here, the light absorption layer 15 is, for example, but not limited to, a black photoresist, and may be formed by, for example, coating or printing, or other suitable methods. In this embodiment, the light absorbing layer 15 is formed on the light reflecting layer 12 and beside the first electrical connection pad 16. In various embodiments, the process of forming the plurality of light-absorbing layers 15 or the plurality of first electrical connection pads 16 on the mother substrate 11 may also be performed before or after the step S02 of forming the plurality of visual elements on the mother substrate, which is not limited by the present invention.

Then, as shown in fig. 2E, step S02 is performed again: forming a plurality of visual units 13 on the mother substrate 11, wherein each visual unit 13 defines a bright area LA and a dark area DA, at least one photoelectric element 131 is directly or indirectly disposed on the mother substrate 11 in the bright area LA, the photoelectric element 131 is disposed corresponding to and electrically connected to at least one of the patterned circuits 112, and the dark area DA is defined along the periphery of the bright area LA. As the name implies, the dark area DA is an area at least covering the light absorption layer 15 to absorb light through the light absorption layer 15 to present a dark area, and the bright area LA is an area provided with the photoelectric element 131 and the light reflection layer 12 to emit light through the photoelectric element 131 or reflect light through the light reflection layer 12 to present a bright area, thereby improving contrast. In some embodiments, the vision unit 13 may include, for example, but not limited to, three photo-elements 131 to constitute three sub-pixels.

In the present embodiment, the optoelectronic device 131 may be a flip chip type optoelectronic device, such as but not limited to an LED (light emitting diode), a Mini LED or a Micro LED, and may include at least one electrode. The photoelectric element 131 of the present embodiment includes two electrodes (not shown) as an example. In addition, before the step S02 of forming the plurality of visual elements 13 on the mother substrate 11 for electrically connecting with the electrodes of the optoelectronic device 131, the method of the present embodiment may further include: a plurality of second electrical connection pads 17 are formed on the conductive layer (patterned circuit 112) of the mother substrate 11, such that the electro-optical element 131 of each of the vision units 13 can be electrically connected to the conductive layer (patterned circuit 112) through each of the second electrical connection pads 17. Here, the material of the second electrical connection pad 17 is, for example, but not limited to, copper, silver or gold, or a combination thereof, or other suitable conductive material. The plurality of second electrical connection pads 17 can be fabricated by, for example, a printing process or other suitable methods, such that each of the optoelectronic devices 131 can be electrically connected to the corresponding patterned circuit 112 through two of the second electrical connection pads 17. In some embodiments, the material is a conductive material such as a solder ball or a gold bump (Au bump), or a material such as copper paste, silver paste, or Anisotropic Conductive Paste (ACP), for example, by heating, so that the two electrodes of the optoelectronic device 131 can be electrically connected to the second electrical connection pads 17, respectively. In various embodiments, the photo element 131 may also be electrically connected to the corresponding patterned circuit 112 by wire bonding (wire bonding), which is not limited in the present invention.

In the present embodiment, as shown in fig. 2E, a part of the light reflecting layer 12 is located under the photoelectric element 131 of the visual unit 13 to reflect the light emitted from the lower side of the photoelectric element 131 to the substrate 111, thereby improving the light emitting efficiency. In addition, the light absorbing layers 15 of the present embodiment are disposed along the periphery of the bright area LA of each of the visual elements 13, so that the light absorbing layers 15 define the dark area DA of each of the visual elements 13, and a portion of the light reflecting layers 12 define the bright area LA of each of the visual elements 13. In other words, in the present embodiment, the area without the light absorbing layer 15 can be regarded as the bright area LA, the area with the light absorbing layer 15 can be regarded as the dark area DA, and the dark area DA is defined along the periphery of the bright area LA (i.e., the dark area DA surrounds the bright area LA). In addition, in the aforementioned process of forming a plurality of first electrical connection pads 16, at least one first electrical connection pad 16 is disposed around each of the vision units 13. Here, it is exemplified that a plurality of (two shown in fig. 2E) first electrical connection pads 16 are disposed around each of the vision units 13, so that the plurality of first electrical connection pads 16 can be electrically connected to the corresponding optoelectronic devices 131 through the corresponding patterned circuits 112 and the second electrical connection pads 17.

Next, as shown in fig. 2F, a plurality of packages 14 are disposed on the mother substrate 11, wherein each package 14 completely covers the bright area LA of each visual unit 13 and partially covers the corresponding patterned circuit 112, so that the average reflectivity inside each package 14 is greater than the average reflectivity outside each package (step S03). Since each package 14 of the present embodiment completely covers the bright area LA of each visual unit 13, the area covered by the package 14 can be regarded as the aforementioned bright area LA, and the area not covered by the package 14 includes the light absorbing layer 15, and thus can be regarded as the aforementioned dark area DA. The package 14 may be formed by curing a simple transparent packaging adhesive material to completely cover the optoelectronic device 131 and a portion of the light reflective layer 12 and the patterned circuit 112, thereby protecting the optoelectronic device 131, the light reflective layer 12 and the patterned circuit 112 from moisture or foreign matter.

In some embodiments, the light emitting color of the package structure is adjusted by the package 14 according to design requirements. For example, if the package 14 is a package adhesive with phosphor added, the color of the light emitted from the package structure can be controlled by matching the color of the photoelectric element 131. For example, the blue light-emitting device 131 may be combined with a yellow phosphor that can be excited by blue light to form white light. In addition, the side of the package 14 of the present embodiment is located between the light absorption layer 15 and the optoelectronic device 131, and the package 14 does not cover the light absorption layer 15. However, in different embodiments, each package 14 may further cover (part of) the light absorbing layer 15 within the corresponding visual cell 13, and the present invention is not limited thereto.

Finally, the mother substrate 11 is cut along the periphery of each of the vision units 13 (step S04). Here, the mother substrate 11 is generally cut along the periphery of each vision unit 13 between two adjacent first electrical connection pads 16, so as to obtain a plurality of package structures 1 as shown in fig. 2H. However, before performing the cutting process of step S04, the manufacturing method of the present embodiment may further include: the rigid carrier plate 10 is removed (fig. 2G). Of course, in different embodiments, the rigid carrier 10 may be removed after the cutting step S04, and the invention is not limited thereto.

Accordingly, the package structure 1 of the embodiment shown in fig. 2H includes a substrate 111, a conductive layer (not shown), a vision unit 13, and a package 14. The substrate 111 is a flexible board (different embodiments can be a rigid board); the conductive layer is disposed on the substrate 111 and may include a plurality of patterned circuits 112; the visual unit 13 is disposed on the substrate 111, wherein the visual unit 13 has a bright area LA and a dark area DA defined along a periphery of the bright area LA, the bright area LA is disposed with the optoelectronic device 131, and the optoelectronic device 131 is disposed corresponding to and electrically connected to the patterned circuit 112; the package 14 is disposed on the substrate 111, wherein the package 14 completely covers the bright area LA of the visual unit 13 and partially covers the corresponding patterned circuit 112, so that the average reflectivity inside the package 14 is greater than the average reflectivity outside the package, thereby forming the high-contrast package structure 1.

In addition, the package structure 1 of the present embodiment may further include a light reflecting layer 12 and a light absorbing layer 15, wherein the light reflecting layer 12 and the light absorbing layer 15 are respectively disposed on the substrate 111. Wherein the light reflecting layer 12 is disposed on the patterned circuit 112 such that the conductive wire layer (the patterned circuit 112) is disposed between the substrate 111 and the light reflecting layer 12, and a portion of the light reflecting layer 12 (i.e. the portion not covered by the light absorbing layer 15) can be defined as a bright area LA of the visual unit 13; in addition, the light absorbing layer 15 is disposed along the periphery of the bright area LA of the visual unit 13, and the light absorbing layer 15 may be defined as a dark area DA of the visual unit 13. Here, the light absorption layer 15 is disposed on the light reflection layer 12, so that a portion of the light reflection layer 12 may be located between the light absorption layer 15 and the patterned circuit 112.

In addition, the package structure 1 of the present embodiment may further include a plurality of first electrical connection pads 16 and a plurality of second electrical connection pads 17, wherein the plurality of first electrical connection pads 16 and the plurality of second electrical connection pads 17 are respectively disposed on the substrate 111. The first electrical connection pad 16 is disposed around the vision unit 13, corresponds to the patterned circuit 112, and is in direct contact with and electrically connected to the corresponding patterned circuit 112; the second electrical connection pads 17 are disposed on the conductive trace layer, and the optical electrical elements 131 of the visual unit 13 are electrically connected to the patterned circuits 112 corresponding to the conductive trace layer through the second electrical connection pads 17, respectively. Here, the first electrical connection pad 16 is adjacent to the light reflecting layer 12 and the light absorbing layer 15, disposed on the patterned circuit 112 and contacting the patterned circuit 112, such that the first electrical connection pad 16 can be electrically connected to the optoelectronic device 131 through the corresponding patterned circuit 112 and the second electrical connection pad 17.

Therefore, in the package structure 1 of the present embodiment, the visual unit 13 has a structure design of the bright area LA of the photoelectric element 131 and the dark area DA defined around the bright area LA, so that when the package 14 completely covers the bright area LA of the visual unit 13, the average reflectivity inside the package 14 can be greater than the average reflectivity outside the package 14, and thus, the package structure 1 has a high contrast characteristic, and the product competitiveness is improved.

Referring to fig. 3A to fig. 6B, a package structure according to various embodiments of the invention is described. Fig. 3A, fig. 4A, fig. 5A, and fig. 6A are schematic top views of package structures according to different embodiments of the present invention, respectively, fig. 3B is a schematic cross-sectional view of the package structure of fig. 3A along a section line 3B-3B, fig. 4B is a schematic cross-sectional view of the package structure of fig. 4A along a section line 4B-4B, fig. 5B is a schematic cross-sectional view of the package structure of fig. 5A along a section line 5B-5B, and fig. 6B is a schematic cross-sectional view of the package structure of fig. 6A along a section line 6B-6B. Fig. 3B is the same as fig. 2H in the description. However, for convenience of explanation, fig. 3B is still designated as a package structure 1 a.

In the embodiments of fig. 3A and 3B, the vision unit 13 of the package structure 1a may include three optoelectronic devices 131, for example, to form three sub-pixels, and the three optoelectronic devices 131 in the three sub-pixels may be red, blue and green LEDs, Mini LEDs or Micro LEDs, respectively, to form a full-color pixel unit, so that the plurality of package structures 1a (vision units 13) may form a full-color LED, Mini LED or Micro LED display. Fig. 3A shows that the three optoelectronic devices 131 may be of a common anode or common cathode design, and therefore, the package structure 1a has four first electrical connection pads 16, and each of the first electrical connection pads 16 is electrically connected to the three optoelectronic devices 131 through the corresponding patterned circuit 112.

As shown in fig. 4A and 4B, the manufacturing method and structure of the package structure 1B of the present embodiment are substantially the same as those of the package structure 1 (or 1a) of the previous embodiment. The difference is that the package structure 1b of the present embodiment does not have the first electrical connection pads 16, and before the step S04 of cutting the mother substrate 11 along the periphery of each of the vision units 13, the manufacturing method of the package structure 1b of the present embodiment may further include: forming a plurality of through holes H on the mother substrate 11 (substrate 111) such that the through holes H correspond to the patterned circuits 112 of the wiring layer; and disposing a conductive member 18 in each through hole H and electrically connected to the corresponding patterned circuit 112, wherein the conductive member 18 can be electrically connected to the optoelectronic element 131 of each vision unit 13 through each patterned circuit 112. Here, the substrate 111 may be irradiated by, for example, laser (e.g., laser) to form a plurality of through holes H penetrating through the upper and lower surfaces, and then the conductive members 18 are filled in the through holes H, so that the upper surface of the substrate 111 may be electrically connected to the lower surface of the substrate 111 through the conductive members 18 of the through holes H, and the conductive members 18 may be electrically connected to the second electrical connection pads 17 and the optoelectronic devices 131 of the visual unit 13 through the patterned circuits 112. The conductive member 18 is formed by curing a material such as, but not limited to, copper paste, silver paste, solder paste, or Anisotropic Conductive Paste (ACP). In particular, in the process, if the substrate 111 is made of a soft material (e.g., PI) and the through hole H is to be formed by irradiating laser from the lower surface of the substrate 111, the rigid carrier 10 is removed before the through hole H is formed.

As shown in fig. 5A and 5B, the manufacturing method and structure of the package structure 1c of the present embodiment are substantially the same as those of the package structure 1 (or 1a) of the previous embodiment. The difference is that the package structure 1c of the present embodiment does not have the light reflective layer 12, and therefore the patterned circuit 112 is located between the light absorbing layer 15 and the substrate 111'. Since the light reflective layer 12 is not provided, in step S01, the mother substrate (i.e., the substrate 111 ') of the present embodiment is a light reflective plate (which may be a soft plate or a hard plate) with high reflectivity, so as to directly reflect the light emitted by the optoelectronic element 131 and directed to the substrate 111', thereby improving the light extraction efficiency. In some embodiments, the light reflecting plate may be a white PI film, for example, and its reflectivity may be much greater than that of the light absorbing layer 15.

As shown in fig. 6A and 6B, the manufacturing method and structure of the package structure 1d of the present embodiment are substantially the same as those of the package structure 1 (or 1a) of the previous embodiment. The difference is that the light reflective layer 12 of the package structure 1d of the present embodiment is only disposed inside the package 14, and the light absorbing layer 15 is directly disposed on the patterned circuit 112 and is not disposed on the light reflective layer 12. Therefore, the patterned circuit 112 is located between the light absorption layer 15 and the substrate 111 ″. In addition, in step S01 of preparing the mother substrate, the mother substrate (i.e., the substrate 111 ") of the present embodiment is a light-absorbing plate (which may be a soft plate or a hard plate) with low reflectivity, so as to absorb the light emitted by the photoelectric element 131 and directed to the substrate 111 ″, thereby improving the contrast. In some embodiments, the light absorbing plate may be, for example, a black PI film, and its reflectivity may be much less than that of the light reflecting layer 12. In addition, the package structure 1d of the present embodiment does not have the first electrical connection pads 16, but uses the through holes H of the package structure 1b and the conductive members 18 to electrically connect the upper and lower surfaces of the substrate 111 ″.

It should be noted that the design in which the substrate 111' of the package structure 1c is a light reflecting plate can also be applied to the package structures 1a and 1b, and the design in which the substrate 111 ″ of the package structure 1d is a light absorbing plate can also be applied to the package structures 1a and 1b, and the invention is not limited thereto.

Fig. 7 is a schematic diagram of an electronic device according to an embodiment of the invention. As shown in fig. 7, the electronic device 3 may include a driving circuit board 2, a plurality of package structures 1e (only one package structure 1e is shown in fig. 7), and a plurality of conductive materials 31. The driving circuit board 2 includes a conductive layer 21, the package structure 1e is disposed on the driving circuit board 2, and a plurality of conductive materials 31 are disposed on the conductive layer 21. Here, the conductive material 31 may be a conductive paste or a conductive paste, such as but not limited to a material including copper paste, silver paste, tin paste, or Anisotropic Conductive Paste (ACP). Therefore, the optoelectronic devices 131 of each package structure 1e can be electrically connected to the conductive layer 21 of the driving circuit board 2 through the patterned circuits 112, the first electrical connection pads 16, and the conductive materials 31, so as to drive the optoelectronic devices 131 of the package structures 1e to emit light through the driving circuit board 2.

The package structure 1e may be one of the package structures 1, 1a to 1d, or a variation thereof. The package structure 1e of the present embodiment is a variation of the package structure 1. In the package structure 1e, the light reflecting layer 12 is disposed under the conductive wire layer (the patterned circuit 112) (the light reflecting layer 12 is disposed between the patterned circuit 112 and the substrate 111), so that the light absorbing layer 15 and the first electrical connection pad 16 can be directly disposed on the patterned circuit 112 and directly contact the patterned circuit 112. In addition, the electronic device 3 of the embodiment may further include a light absorption member 32, the light absorption member 32 is disposed between the package structure 1e and the driving circuit board 2, and the package structure 1e is disposed on the light absorption member 32 through an adhesion member 33. In addition, the electronic device 3 of the present embodiment may further include another light absorption layer 34, and the light absorption layer 34 is disposed around the package structure 1e and the conductive material 31 and on the conductive layer 21, so as to further improve the contrast of the electronic device 3.

In some embodiments, a plurality of package structures 1e may be disposed on the driving circuit board 2 at intervals (which may be arranged in straight rows, horizontal rows, or a matrix of rows and columns, or arranged in a polygon or irregular shape according to the requirement of the client), and are electrically connected to the driving circuit board respectively. In some embodiments, the plurality of package structures 1e may be formed in a matrix of rows and columns to form an Active Matrix (AM) electronic device, such as but not limited to an active matrix LED, Mini LED or micro LED display.

In summary, in the package structure, the manufacturing method thereof and the electronic device of the invention, the visual unit has a structure design of the bright area of the optoelectronic element and the dark area defined along the periphery of the bright area, so that when the package completely covers the bright area of the visual unit, the average reflectivity inside the package can be greater than the average reflectivity outside the package, and thus, the package structure and the electronic device have a high contrast characteristic, and the product competitiveness can be improved.

The foregoing is by way of example only, and not limiting. It is intended that all equivalent modifications or variations without departing from the spirit and scope of the present invention shall be included in the scope of the appended claims.

Claims

1. A method of manufacturing a package structure, comprising:

preparing a mother substrate, wherein the mother substrate is provided with a conducting wire layer, and the conducting wire layer comprises a plurality of patterned circuits;

forming a plurality of visual units on the mother substrate, wherein each visual unit is provided with a bright area and a dark area, the bright area is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area;

arranging a plurality of packages on the mother substrate, wherein each package completely covers the bright area of each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside each package; and

and cutting the mother substrate along the periphery of each visual unit.

2. The method of claim 1, wherein the step of forming the plurality of visual elements on the mother substrate further comprises:

forming a plurality of light reflecting layers on the mother substrate, wherein each light reflecting layer is located above or below the wire layer, and at least a part of each light reflecting layer defines the bright area of each visual unit.

3. The method of claim 1, wherein the step of forming the plurality of visual elements on the mother substrate further comprises:

forming a plurality of light absorbing layers on the mother substrate, wherein each light absorbing layer is disposed along the periphery of the bright area of each of the vision units, and each light absorbing layer defines the dark area of each of the vision units.

4. The manufacturing method according to claim 1, wherein in the step of preparing the mother substrate, the mother substrate is a light reflecting plate or a light absorbing plate.

5. The method according to claim 2, wherein the step of forming the plurality of light reflecting layers on the mother substrate includes positioning the wire layers between the light reflecting layers and the mother substrate.

6. The method of claim 2, wherein the step of forming the plurality of visual elements on the mother substrate further comprises:

forming a plurality of light absorbing layers on the mother substrate, wherein each light absorbing layer is arranged along the periphery of the bright area of each visual unit, and the dark area of each visual unit is defined by each light absorbing layer;

in the step of forming a plurality of light reflecting layers on the mother substrate, the wire layer is positioned between the light reflecting layer and the mother substrate, or the light reflecting layer is positioned between the wire layer and the mother substrate.

7. The manufacturing method of claim 1, wherein prior to the step of cutting the mother substrate along the periphery of each of the vision units, further comprising:

forming a plurality of first electrical connection pads on the mother substrate, so that at least one first electrical connection pad is arranged around each visual unit, and the first electrical connection pads correspond to the patterned circuits of the conductor layer; and

and forming a plurality of second electrical connection pads on the lead layer of the mother substrate, so that the photoelectric element of each visual unit is electrically connected with the lead layer through each second electrical connection pad.

8. The manufacturing method of claim 1, wherein prior to the step of cutting the mother substrate along the periphery of each of the vision units, further comprising:

forming a plurality of through holes on the mother substrate, wherein the through holes correspond to the patterned circuits of the lead layer; and

and arranging a conductive member in each through hole and electrically connected to the corresponding patterned circuit, wherein the conductive member is electrically connected to the optoelectronic element of each visual unit through each patterned circuit.

9. The manufacturing method according to claim 1, wherein in the step of disposing a plurality of packages on the mother substrate, each of the packages further covers to the dark area within the corresponding each of the vision units.

10. A package structure, comprising:

a substrate;

the conducting wire layer is arranged on the substrate and comprises a plurality of patterned circuits;

the visual unit is arranged on the substrate and provided with a bright area and a dark area defined along the periphery of the bright area, the bright area is provided with a photoelectric element, and the photoelectric element is correspondingly arranged and electrically connected with at least one of the patterned circuits; and

and the packaging part is arranged on the substrate, the packaging part completely covers the bright area of the visual unit and partially covers the corresponding patterned circuit, and the average reflectivity inside the packaging part is greater than that outside the packaging part.

11. The package structure of claim 10, wherein the substrate is a flexible board.

12. The package structure of claim 10, wherein the substrate is a light absorbing plate or a light reflecting plate.

13. The package structure of claim 10, further comprising:

and the light reflecting layer is arranged on the substrate, is positioned above or below the wire layer, and at least one part of the light reflecting layer is defined as the bright area of the visual unit.

14. The package structure of claim 10, further comprising:

a light absorbing layer disposed on the substrate, wherein the light absorbing layer is disposed along the periphery of the bright area of the vision unit, and the light absorbing layer defines the dark area of the vision unit.

15. The package structure of claim 13, further comprising:

a light absorbing layer disposed on the substrate or the light reflecting layer, wherein the light absorbing layer is disposed along the periphery of the bright area of the vision unit, and the light absorbing layer defines the dark area of the vision unit.

16. The package structure of claim 13, wherein the wire layer is between the light reflecting layer and the substrate.

17. The package structure of claim 15, wherein the wire layer is between the light reflecting layer and the substrate or the light reflecting layer is between the wire layer and the substrate.

18. The package structure of claim 10, further comprising:

a plurality of first electrical connection pads disposed on the substrate, wherein each of the first electrical connection pads is disposed around the vision unit and corresponds to the patterned circuit of the conductive line layer; and

and the plurality of second electric connecting pads are arranged on the substrate, wherein each second electric connecting pad is arranged on the lead layer, and the photoelectric element of the visual unit is electrically connected with the lead layer through each second electric connecting pad.

19. The package structure of claim 10, further comprising:

a plurality of through holes arranged on the substrate, wherein the through holes correspond to the patterned circuits of the lead layer; and

and the conductive parts are arranged in the through holes and electrically connected to the corresponding patterned circuits, wherein the conductive parts are electrically connected to the photoelectric elements of the visual units through the corresponding patterned circuits.

20. An electronic device, comprising:

a driving circuit board including a conductive layer;

a plurality of the package structures according to any one of claims 10 to 19, disposed on the driving circuit board; and

a plurality of conductive materials disposed on the conductive layer;

the photoelectric element of each packaging structure is electrically connected to the conductive layer of the driving circuit board through the patterned circuit and the conductive material.