CN111662640A - Modified liquid crystal material for 5G communication, copper-clad plate and preparation method thereof - Google Patents
Modified liquid crystal material for 5G communication, copper-clad plate and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Abstract
The invention discloses a modified liquid crystal material for 5G communication, a copper-clad plate and a preparation method thereof, wherein the modified liquid crystal material comprises the following raw materials in parts by weight: 80-120 parts of lyotropic liquid crystal polymer liquid and 1-30 parts of filler, wherein the filler is at least one of PTFE, hollow glass beads and talcum powder. The modified liquid crystal material has the characteristics of low dielectric constant, low dielectric loss and low thermal expansion coefficient; when the copper-clad plate is prepared, continuous coating can be carried out, so that the method is more efficient and is beneficial to reducing the cost; the prepared copper-clad plate has high peel strength.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a modified liquid crystal material for 5G communication, a copper-clad plate and a preparation method thereof.
Background
Liquid Crystal Polymers (LCPs) are a general term for liquid crystalline polymer materials, and are broadly classified into Thermotropic (TLCP) and lyotropic (LLCP) types. Among them, the former is a solid which exhibits liquid crystallinity in a high-temperature molten state, and the latter is a liquid which is dissolved in a solvent and exhibits liquid crystallinity at a certain concentration. Due to the unique chain structure and the ordered arrangement among molecules, the liquid crystal polymer has excellent comprehensive physical and mechanical properties, such as high thermal deformation temperature, good dimensional stability, good mechanical property, insulating property, irradiation resistance, chemical resistance, aging resistance, self-flame retardance, low permeability and the like. However, the thermotropic liquid crystal polymer material needs to be reprocessed in a high-temperature molten state to prepare products such as required films or blocks, and the lyotropic liquid crystal polymer can be used for preparing the required products at high efficiency and low cost by coating or tape casting and other processing methods at normal temperature, so that the thermotropic liquid crystal polymer material has obvious process advantages and cost advantages.
Nowadays, the 5G era has come, smart devices such as smart phones and tablet computers have become popular, and mobile communication devices such as mobile phones are light, thin and multifunctional, so that the mobile communication devices are increasingly pursuing low loss and high efficiency, and under such a condition, the demand for high-frequency substrate materials, namely Flexible Copper Clad Laminates (FCCL), is increasing, wherein the most important characteristics required for the materials are low Dk and Df, high heat resistance (low thermal expansion coefficient) and high peel strength. At present, PI (polyimide) materials are mostly adopted as insulating materials for manufacturing the FCCL, but the PI materials have the defects of high hygroscopicity, high Dk, high Df and the like, cannot be suitable for high frequency, and cannot meet the requirements of the FCCL under modern conditions. Therefore, the pursuit of materials having properties capable of coping with high frequencies, low dielectric properties, and low loss has become a current focus. LCP (liquid crystal polymer) is increasingly applied to various fields due to its special properties, especially high temperature resistance, high fluidity and dielectric property, possessed by its specific molecular structure, and market demand in the future is increasing. Compared with PI film, LCP film has more excellent special performance and can be more suitable for high-frequency and high-speed network times.
The Flexible Copper Clad Laminate (FCCL) is a material having a certain flexibility, which is used as a circuit board substrate after a copper foil layer and a polymer layer are bonded. Compared with epoxy resin, ceramic and other hard board materials, the Flexible Copper Clad Laminate (FCCL) has irreplaceable application in the fields of wearable products and precise consumer electronics, and is widely applied to mobile phone antennas, signal transmission lines, precise multilayer circuit boards and the like. The conventional process for manufacturing a Flexible Copper Clad Laminate (FCCL) mainly adopts a process mode of hot pressing of a copper foil and a polymer base film. For a liquid crystal polymer flexible copper clad laminate (LCP-FCCL), a stricter high-temperature hot-pressing process is required, the equipment cost and the processing cost are high, and the stability is poor.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the modified liquid crystal material for 5G communication, the copper-clad plate and the preparation method thereof are provided, the preparation method is simple, and the obtained copper-clad plate is high in peel strength.
In order to solve the technical problems, the invention adopts the technical scheme that:
a modified liquid crystal material for 5G communication comprises the following raw materials in parts by weight: 80-120 parts of lyotropic liquid crystal polymer liquid and 1-30 parts of filler, wherein the filler is at least one of PTFE, hollow glass beads and talcum powder.
The invention adopts another technical scheme that:
the preparation method of the copper-clad plate for 5G communication comprises the steps of coating the modified liquid crystal material for 5G communication on a copper foil, and then sequentially carrying out drying treatment and annealing treatment to obtain the copper-clad plate for 5G communication.
The invention adopts another technical scheme that:
the copper-clad plate for 5G communication is characterized by being prepared by the preparation method of the copper-clad plate for 5G communication.
The invention has the beneficial effects that:
1. the modified liquid crystal material is formed by mixing lyotropic liquid crystal polymer liquid and filler, and has simple components and low cost; the modified liquid crystal material has the characteristics of low dielectric constant, low dielectric loss and low thermal expansion coefficient.
2. When the copper-clad plate is prepared, continuous coating can be carried out, so that the method is more efficient and is beneficial to reducing the cost; the prepared copper-clad plate has high peel strength, and has lower dielectric constant, dielectric loss and thermal expansion coefficient compared with the existing LCP copper-clad plate and PI copper-clad plate.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description will be given with reference to the embodiments.
The most key concept of the invention is as follows: at least one of PTFE, hollow glass beads and talcum powder is adopted to modify the lyotropic liquid crystal polymer, and the obtained modified liquid crystal material has the characteristics of low dielectric constant, low dielectric loss and low thermal expansion coefficient.
A modified liquid crystal material for 5G communication comprises the following raw materials in parts by weight: 80-120 parts of lyotropic liquid crystal polymer liquid and 1-30 parts of filler, wherein the filler is at least one of PTFE, hollow glass beads and talcum powder.
From the above description, the beneficial effects of the present invention are: the modified liquid crystal material is formed by mixing lyotropic liquid crystal polymer liquid and filler, and has simple components and low cost; the modified liquid crystal material has the characteristics of low dielectric constant, low dielectric loss and low thermal expansion coefficient.
Further, the viscosity of the lyotropic liquid crystal polymer liquid is 300 to 30000 cps.
From the above description, the viscosity of the liquid can be adjusted according to the amount of the solvent.
Further, the raw materials in parts by weight are preferably as follows: 100 parts of lyotropic liquid crystal polymer liquid and 5-25 parts of filler.
Furthermore, the solid content of the modified liquid crystal material for 5G communication is 13-26%, and the viscosity is 4000-6000 cps.
The invention relates to another technical scheme which is as follows:
the preparation method of the copper-clad plate for 5G communication comprises the steps of coating the modified liquid crystal material for 5G communication on a copper foil, and then sequentially carrying out drying treatment and annealing treatment to obtain the copper-clad plate for 5G communication.
According to the description, when the copper-clad plate is prepared, continuous coating can be carried out, so that the method is more efficient and is beneficial to reducing the cost; the prepared copper-clad plate has high peel strength, and has lower dielectric constant, dielectric loss and thermal expansion coefficient compared with the existing LCP copper-clad plate and PI copper-clad plate.
Further, the drying treatment temperature is 75-85 ℃, and the drying treatment time is 10-20 min.
Further, the annealing temperature is 150-250 ℃, and the time is 3-5 h.
The invention relates to another technical scheme which is as follows:
the copper-clad plate for 5G communication is prepared by the preparation method of the copper-clad plate for 5G communication.
Further, the liquid crystal display panel comprises a copper foil and a modified liquid crystal material layer attached to the copper foil, wherein the thickness of the modified liquid crystal material layer is 41-102 mu m.
As can be seen from the above description, the thickness of the modified liquid crystal material layer can be adjusted as desired.
Further, the copper foil has a thickness of 12 μm.
Example one
The embodiment of the invention discloses a preparation method of a copper-clad plate for 5G communication, which comprises the following steps:
1. and (3) preparing the modified liquid crystal material for 5G communication.
Mixing the following raw materials in parts by weight: 80-120 parts of lyotropic liquid crystal polymer liquid and 1-30 parts of filler, wherein the filler is at least one of PTFE, hollow glass beads and talcum powder, the average particle size of the PTFE is about 5 mu m, the particle size of the hollow glass beads is 16 mu m, and the talcum powder is of a sheet structure. The thermal expansion coefficient of PTFE is 16 ppm/DEG C, the dielectric constant Dk (10GHz) is 2-2.2, and the dielectric loss Df (10GHz) is 0.001. The dielectric constant Dk (10GHz) of the hollow glass beads is 1.9, and the dielectric constant Dk (10GHz) of the talcum powder is 1.6-2.0. Preferably, the following raw materials are mixed in parts by weight: 100 parts of lyotropic liquid crystal polymer liquid and 5-25 parts of filler. The viscosity of the lyotropic liquid crystal polymer liquid is 300-30000 cps, and can be adjusted by controlling the amount of the solvent. And after mixing, uniformly stirring and dispersing to obtain a modified liquid crystal material, wherein the solid content of the obtained modified liquid crystal material is 13-26%, and the viscosity of the obtained modified liquid crystal material is 4000-6000 cps.
2. And coating the modified liquid crystal material for 5G communication on a copper foil, and then sequentially carrying out drying treatment and annealing treatment to obtain the copper-clad plate for 5G communication.
The drying temperature is 75-85 ℃, and the drying time is 10-20 min. The annealing treatment temperature is 150-250 ℃, and the time is 3-5 h. The finally obtained copper-clad plate comprises a copper foil and a modified liquid crystal material layer attached to the copper foil, wherein the thickness of the modified liquid crystal material layer is 41-102 mu m, and the thickness of the copper foil is 12 mu m and is electrolytic copper.
Example two
The second embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is PTFE. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 9875cps, the solid content of the obtained modified liquid crystal material is about 18%, and the viscosity is 4500 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
EXAMPLE III
The third embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is hollow glass beads. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 23450cps, and the obtained modified liquid crystal material has a solid content of about 18% and a viscosity of about 5500 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
Example four
The fourth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is talcum powder. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 24783cps, the solid content of the obtained modified liquid crystal material is about 18%, and the viscosity is about 5800 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
EXAMPLE five
The fifth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is PTFE and hollow glass beads, and the weight ratio of the PTFE to the hollow glass beads is 1: 1. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 27896cps, and the obtained modified liquid crystal material has a solid content of about 18% and a viscosity of about 5800 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
EXAMPLE six
The sixth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is PTFE and talcum powder, and the weight ratio of the PTFE to the talcum powder is 1: 1. mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 26532cps, and the solid content of the obtained modified liquid crystal material is about 22%, and the viscosity is about 5800 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
EXAMPLE seven
The seventh embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is hollow glass beads and talcum powder, and the weight ratio of the hollow glass beads to the talcum powder is 1: 1. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 10658cps, the solid content of the obtained modified liquid crystal material is about 23%, and the viscosity is about 5900 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
Example eight
The eighth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 25 parts of filler, wherein the filler is a mixture of PTFE, hollow glass beads and talcum powder, and the weight ratio of the PTFE to the hollow glass beads to the talcum powder is 1:1: 1. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is about 30000cps, and the obtained modified liquid crystal material has a solid content of about 19% and a viscosity of about 5500 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
Example nine
The ninth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 80 parts of lyotropic liquid crystal polymer liquid and 1 part of filler, wherein the filler is PTFE. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 6879cps, and the solid content of the obtained modified liquid crystal material is about 13% and the viscosity is about 4000 cps.
In the step 2, the temperature of the drying treatment is 75 ℃, and the time is 20 min. The temperature of the annealing treatment is 250 ℃, and the time is 3 h. The thickness of the resulting modified liquid crystal material layer was 41 μm.
Example ten
The tenth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 90 parts of lyotropic liquid crystal polymer liquid and 5 parts of filler, wherein the filler is PTFE. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 5689cps, the solid content of the obtained modified liquid crystal material is 21%, and the viscosity is 4013 cps.
In the step 2, the temperature of the drying treatment is 85 ℃ and the time is 10 min. The temperature of the annealing treatment is 150 ℃, and the time is 5 h. The thickness of the resulting modified liquid crystal material layer was 102 μm.
EXAMPLE eleven
The eleventh embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, and is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 100 parts of lyotropic liquid crystal polymer liquid and 12 parts of filler, wherein the filler is PTFE. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 4567cps, and the solid content of the obtained modified liquid crystal material is about 23% and the viscosity is about 6000 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
Example twelve
The twelfth embodiment of the invention is a preparation method of a copper-clad plate for 5G communication, which is different from the first embodiment in that:
in the step 1, the following raw materials in parts by weight are mixed: 120 parts of lyotropic liquid crystal polymer liquid and 30 parts of filler, wherein the filler is PTFE. Mixing the lyotropic polymer liquid with filler, and stirring and dispersing at 80 deg.C for 30 min. The viscosity of the lyotropic liquid crystal polymer liquid is 300cps, the solid content of the obtained modified liquid crystal material is 26%, and the viscosity is about 4514 cps.
In the step 2, the drying treatment temperature is 80 ℃, and the drying treatment time is 15 min. The temperature of the annealing treatment is 200 ℃, and the time is 4 h. The thickness of the resulting modified liquid crystal material layer was 80 μm.
The copper-clad plates prepared in the second to twelfth embodiments were subjected to Dk (10GHz), Df (10GHz), peel strength, thermal weight loss (Td 5%), coefficient of thermal expansion, tin floating test and warping performance test, and the test results are shown in table 1. Dk and Df were tested using an Agilent E5071C network analyzer, peel strength was tested according to IPC-TM6502.4.9, thermogravimetric loss was tested according to IPC-TM6502.4.24.6, coefficient of thermal expansion was tested according to IPC-TM6502.4.41.3, and tin-floating was tested according to IPC-TM6502.4.13.
Table 1 results of performance testing
In Table 1, comparative example one and comparative example two are purchased as the same product, and the product of comparative example one is purchased from Azotek corporation and has a model number of LDS; the product of comparative example two was purchased from Taiflex corporation, model 2 LP; in comparative example three, the lyotropic liquid crystalline polymer solution was directly coated on the copper foil, and other processing conditions were the same as those in example two.
As can be seen from Table 1, both Dk and Df are reduced when the modification is carried out by adding PTFE, talc and hollow glass beads, with the reduction being most significant in examples two and three. By comparing the second embodiment with the third embodiment, the peel strength is not greatly different when the PTFE is added for modification, the temperature of heat weight loss (Td 5%) is greatly increased, the heat resistance is improved, and the material is not easily warped due to the reduction of the thermal expansion coefficient.
In summary, the modified liquid crystal material for 5G communication, the copper-clad plate and the preparation method thereof provided by the invention have the characteristics of low dielectric constant, low dielectric loss and low thermal expansion coefficient; when the copper-clad plate is prepared, continuous coating can be carried out, so that the method is more efficient and is beneficial to reducing the cost; the prepared copper-clad plate has high peel strength.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention in the specification or directly or indirectly applied to the related technical field are included in the scope of the present invention.
Claims (10)
1. The modified liquid crystal material for 5G communication is characterized by comprising the following raw materials in parts by weight: 80-120 parts of lyotropic liquid crystal polymer liquid and 1-30 parts of filler, wherein the filler is at least one of PTFE, hollow glass beads and talcum powder.
2. The modified liquid crystal material for 5G communication as claimed in claim 1, wherein the lyotropic liquid crystal polymer liquid has a viscosity of 300 to 30000 cps.
3. The modified liquid crystal material for 5G communication according to claim 1, comprising the following raw materials in parts by weight: 100 parts of lyotropic liquid crystal polymer liquid and 5-25 parts of filler.
4. The modified liquid crystal material for 5G communication as claimed in claim 1, wherein the modified liquid crystal material for 5G communication has a solid content of 13-26% and a viscosity of 4000-6000 cps.
5. A preparation method of a copper-clad plate for 5G communication is characterized in that the modified liquid crystal material for 5G communication, which is disclosed by any one of claims 1 to 4, is coated on a copper foil, and then drying treatment and annealing treatment are sequentially carried out, so that the copper-clad plate for 5G communication is obtained.
6. The preparation method of the copper-clad plate for 5G communication according to claim 5, wherein the drying treatment temperature is 75-85 ℃ and the drying treatment time is 10-20 min.
7. The preparation method of the copper-clad plate for 5G communication according to claim 5, wherein the annealing treatment temperature is 150-250 ℃ and the time is 3-5 h.
8. A copper-clad plate for 5G communication is characterized by being prepared by the preparation method of the copper-clad plate for 5G communication according to any one of claims 5 to 7.
9. The copper-clad plate for 5G communication according to claim 8, which comprises a copper foil and a modified liquid crystal material layer attached to the copper foil, wherein the thickness of the modified liquid crystal material layer is 41-102 μm.
10. The copper-clad plate for 5G communication according to claim 9, wherein the copper foil has a thickness of 12 μm.
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| CN113930084A (en) * | 2021-09-18 | 2022-01-14 | 珠海万通特种工程塑料有限公司 | Liquid crystal polymer composition and application thereof |
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| CN111002644A (en) * | 2019-12-20 | 2020-04-14 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of copper-clad plate with low dielectric constant and high peel strength |
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| CN110876230A (en) * | 2018-09-03 | 2020-03-10 | 昆山雅森电子材料科技有限公司 | Composite laminated LCP substrate and preparation method thereof |
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| CN113930084A (en) * | 2021-09-18 | 2022-01-14 | 珠海万通特种工程塑料有限公司 | Liquid crystal polymer composition and application thereof |
| CN113930084B (en) * | 2021-09-18 | 2024-05-07 | 珠海万通特种工程塑料有限公司 | Liquid crystal polymer composition and application thereof |
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