CN111653417A - Plug-in type integrated inductor - Google Patents
Plug-in type integrated inductor Download PDFInfo
- Publication number
- CN111653417A CN111653417A CN202010390174.9A CN202010390174A CN111653417A CN 111653417 A CN111653417 A CN 111653417A CN 202010390174 A CN202010390174 A CN 202010390174A CN 111653417 A CN111653417 A CN 111653417A
- Authority
- CN
- China
- Prior art keywords
- welding
- coil
- insert
- integrally molded
- inductor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 230000005389 magnetism Effects 0.000 claims description 10
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 3
- 239000006247 magnetic powder Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F2027/297—Terminals; Tapping arrangements for signal inductances with pin-like terminal to be inserted in hole of printed path
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a plug-in type integrated inductor which comprises a coil and a magnetic main body coated outside the coil, wherein two ends of the coil are respectively provided with a first welding pin and a second welding pin which extend downwards, the bottom of the magnetic main body is provided with a plurality of bosses, and a plurality of radiating grooves are formed between the bosses. The inductor directly penetrates through the PCB in an inserting mode, the first welding pin and the second welding pin are welded with the bottom surface of the PCB, welding is firm, cold welding cannot occur, a high-requirement drop test can be passed, the EMI resistance of the inductor is good, the saturation current is large, the service life is long, the size is small, and the inductor can be widely applied to automobile navigation, mobile phones, liquid crystal televisions, notebook computers, communication equipment and instruments.
Description
Technical Field
The invention relates to the technical field of inductors, in particular to a plug-in type integrally formed inductor.
Background
The inductor is a component capable of converting electric energy into magnetic energy to be stored, and the inductor in the market at present mainly comprises an assembled inductor and an integrally formed inductor. The assembled inductor has low production cost, but has large tolerance of inductance value, fragile product, poor EMI resistance effect, manual intensive production and difficult realization of miniaturization of volume. The anti EMI performance of integrated into one piece formula inductor is good, saturation current is big, automated production, long service life, and the small volume of flattening, integrated into one piece formula inductor on the existing market are mostly SMD inductor, and product lug weld is on the PCB face, but this kind of SMD inductor, because electrode welding is directly welded on the PCB board, area of contact is little, can not pass through the drop test of high requirement. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a plug-in type integrally formed inductor which is small in size and firm in welding.
The invention is realized by the following technical scheme:
the utility model provides a plug-in components formula integrated into one piece inductor, includes the coil and the cladding is in the magnetism main part in the coil outside, the both ends of coil are equipped with downwardly extending's first welding respectively and participate in and the second welding participates in, the bottom of magnetism main part is equipped with a plurality of bosss, form a plurality of radiating grooves between the boss.
Further, two bosses are arranged at the bottom of the magnetic body, and a heat dissipation groove is formed between the bosses.
Furthermore, the outer surfaces of the first welding pin and the second welding pin are plated with a tin-bismuth alloy layer or a tin layer.
Further, the coil is a high-temperature self-adhesive copper wire.
Further, the magnetic body is integrally formed by punching and molding metal magnetic powder.
Further, the heat dissipation groove is arranged right below the coil, and the first welding pins and the second welding pins are arranged in the heat dissipation groove.
Furthermore, the depth of the heat dissipation groove is 0.3 mm-1 mm.
Further, the shape of the magnetic body is a cuboid.
Further, the magnetism main part is the cuboid magnetism main part of square for the bottom surface, the radiating groove is located on the diagonal line of cuboid magnetism main part bottom surface, first welding is participated in and the second welding is participated in and is located in the radiating groove.
Further, the magnetic body is cylindrical in shape.
Compared with the prior art, the magnetic main body is coated on the outer side of the coil, so that the inductor has good EMI resistance, large saturation current, long service life and small volume, the first welding pin and the second welding pin which extend downwards are respectively arranged at two ends of the coil, the inductor can directly penetrate through the PCB in a splicing mode, the first welding pin and the second welding pin are welded with the bottom surface of the PCB, the welding is firm, a high-requirement drop test can be passed, the bosses are arranged at the bottom of the magnetic main body, the heat dissipation grooves are formed among the bosses, and when the bottom of the magnetic main body is contacted with the bottom surface of the PCB, hot gas of reflow soldering can be effectively and smoothly discharged through the heat dissipation grooves, the end-to-end welding of a product is ensured, and no false soldering can occur.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first directional structural diagram of a plug-in integrated inductor according to the present invention;
FIG. 2 is a second structural diagram of the integrated inductor according to the present invention;
fig. 3 is an exploded view of the integrated inductor of the present invention.
In the figure: 1-a coil; 2-a magnetic body; 3-a first solder pin; 4-a second solder pin; 5-boss; 6-heat dissipation groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the plug-in integrated inductor of the present invention includes a coil 1 and a magnetic body 2 covering the coil 1, wherein two ends of the coil 1 are respectively provided with a first soldering pin 3 and a second soldering pin 4 extending downward, the bottom of the magnetic body 2 is provided with a plurality of bosses 5, and a plurality of heat dissipation grooves 6 are formed between the bosses 5. The outside cladding through coil 1 has magnetism main part 2, make the anti EMI performance of inductor good, saturation current is big, long service life, small, both ends through coil 1 are equipped with downwardly extending's first welding respectively and participate in 3 and second welding and participate in 4, make the inductor can be with the mode of pegging graft directly pass the PCB board, first welding is participated in 3 and second welding and is participated in 4 and PCB board bottom surface welding, the welding is firm, can pass through high-demand drop test, bottom through magnetism main part 2 is equipped with a plurality of bosss 5, form a plurality of radiating grooves 6 between the boss 5, when magnetism main part 2 bottom and PCB board bottom surface contact, can effectively discharge reflow soldering's steam smoothly through the radiating groove, guarantee the product end is just welded, false welding can not appear.
As a specific implementation mode, two bosses 5 are arranged at the bottom of the magnetic body 2, a heat dissipation groove 6 is formed between the bosses 5, hot gas of reflow soldering is smoothly discharged through the heat dissipation groove 6, and the end-to-end soldering of a product is ensured without rosin joint.
The outer surfaces of the first welding pin 3 and the second welding pin 4 are plated with tin-bismuth alloy layers or tin layers, so that the first welding pin 3 and the second welding pin 4 are welded with the bottom of the PCB more firmly.
The magnetic main body 2 is integrally formed by metal magnetic powder in a punching mode, the production process is simple, and the structure is stable.
The radiating groove 6 is arranged under the coil 1, heat dissipation of the bottom of the coil 1 is facilitated, the first welding pin 3 and the second welding pin 4 are arranged in the radiating groove 6, and when the first welding pin 3 and the second welding pin 4 are welded to the bottom surface of the PCB, the magnetic main body 2 is tensioned more easily and fixed to the front surface of the PCB.
The depth of the heat dissipation groove 6 is 0.3 mm-1 mm, as an optimal implementation mode, the depth of the heat dissipation groove 6 is 0.5mm, the thickness of the magnetic main body 2 is reduced while the reflow soldering hot gas can be effectively and smoothly discharged through the heat dissipation groove 6, the production cost is saved, the problem that the magnetic main body 2 can be welded on a PCB correctly can be solved, and the phenomena of askew soldering and oblique soldering caused by hot gas impact are avoided.
As a specific embodiment, the magnetic body 2 has a rectangular parallelepiped shape.
As another specific embodiment, the magnetic body 2 is shaped as a cylinder.
As a preferred embodiment, the magnetic body 2 is a rectangular parallelepiped magnetic body with a square bottom surface, the heat dissipation groove 6 is formed on a diagonal line of the bottom surface of the rectangular parallelepiped magnetic body, and the first soldering pin 3 and the second soldering pin 4 are formed in the heat dissipation groove 6, so that the volume of the magnetic body 2 is minimized under the condition of ensuring the performance of the inductor and simplifying the production process.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A plug-in type integrated into one piece inductor which characterized in that: including coil and cladding the magnetism main part in the coil outside, the both ends of coil are equipped with downwardly extending's first welding respectively and participate in and the second welding participates in, the bottom of magnetism main part is equipped with a plurality of bosss, form a plurality of radiating grooves between the boss.
2. The insert-type integrally molded inductor according to claim 1, wherein: the bottom of the magnetic body is provided with two bosses, and a heat dissipation groove is formed between the bosses.
3. The insert-type integrally molded inductor according to claim 1, wherein: and the outer surfaces of the first welding pin and the second welding pin are plated with a tin-bismuth alloy layer or a tin layer.
4. The insert-type integrally molded inductor according to claim 1, wherein: the coil is a high-temperature self-adhesive copper wire.
5. The insert-type integrally molded inductor according to claim 1, wherein: the magnetic main body is formed by integrally punching and molding metal magnetic powder.
6. The insert-type integrally molded inductor according to claim 1, wherein: the heat dissipation groove is arranged right below the coil, and the first welding pins and the second welding pins are arranged in the heat dissipation groove.
7. The insert-type integrally molded inductor according to claim 1, wherein: the depth of the heat dissipation groove is 0.3 mm-1 mm.
8. The insert-type integrally molded inductor according to claim 1, wherein: the magnetic main body is in a cuboid shape.
9. The insert-type integrally molded inductor according to claim 1, wherein: the magnetic body is a cuboid magnetic body with a square bottom surface, the radiating groove is formed in the diagonal line of the bottom surface of the cuboid magnetic body, and the first welding pin and the second welding pin are arranged in the radiating groove.
10. The insert-type integrally molded inductor according to claim 1, wherein: the magnetic body is cylindrical in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010390174.9A CN111653417A (en) | 2020-05-08 | 2020-05-08 | Plug-in type integrated inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010390174.9A CN111653417A (en) | 2020-05-08 | 2020-05-08 | Plug-in type integrated inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111653417A true CN111653417A (en) | 2020-09-11 |
Family
ID=72346038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010390174.9A Pending CN111653417A (en) | 2020-05-08 | 2020-05-08 | Plug-in type integrated inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111653417A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4401098A1 (en) * | 2023-01-13 | 2024-07-17 | Huawei Digital Power Technologies Co., Ltd. | Magnetic device and manufacturing method thereof, and electronic device |
-
2020
- 2020-05-08 CN CN202010390174.9A patent/CN111653417A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4401098A1 (en) * | 2023-01-13 | 2024-07-17 | Huawei Digital Power Technologies Co., Ltd. | Magnetic device and manufacturing method thereof, and electronic device |
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