CN111640839A - LED packaging process - Google Patents
LED packaging process Download PDFInfo
- Publication number
- CN111640839A CN111640839A CN202010554722.7A CN202010554722A CN111640839A CN 111640839 A CN111640839 A CN 111640839A CN 202010554722 A CN202010554722 A CN 202010554722A CN 111640839 A CN111640839 A CN 111640839A
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- China
- Prior art keywords
- sub
- substrate
- substrates
- centrifugal
- packaging
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012858 packaging process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 239000003292 glue Substances 0.000 claims abstract description 20
- 238000001556 precipitation Methods 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- 238000005119 centrifugation Methods 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The LED packaging process is characterized in that a whole substrate is divided into a plurality of sub-substrates with smaller widths before a centrifugal precipitation process, the sub-substrates subjected to glue dispensing are independently clamped on the inner wall of a centrifugal barrel, the length direction of each sub-substrate is consistent with the axial direction of the centrifugal barrel, and the smaller width of each sub-substrate enables each part of a fluorescent glue layer on the surface of each sub-substrate to be close to the distance from each part of a rotating shaft of the centrifugal barrel. By adopting the technical scheme, the uniformity of the fluorescent powder distribution after centrifugal precipitation can be ensured.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED packaging process.
Background
In the current LED packaging technology, in order to improve production efficiency, often with the monoblock base plate point glue back, direct clamping carries out the centrifugal precipitation of phosphor powder in the centrifugation cask, but can have following problem:
because the whole substrate is too wide, in the centrifugal process, the distance from the fluorescent glue layer positioned in the middle of the substrate to the rotation center of the centrifugal drum is smaller than the distance from the fluorescent glue layer positioned close to the left edge and the right edge of the substrate to the rotation center of the centrifugal drum, so that the fluorescent powder is unevenly distributed after centrifugal precipitation.
The above-mentioned problems are also present in the chinese invention patent application No. 201710642186.4, and therefore, improvement is required.
Disclosure of Invention
The invention aims to provide an LED packaging process which can effectively solve the problem that fluorescent powder is unevenly distributed in a fluorescent glue layer after centrifugal precipitation. In order to achieve the purpose, the invention adopts the following technical scheme:
the LED packaging process is characterized in that a whole substrate is divided into a plurality of sub-substrates with smaller widths before a centrifugal precipitation process, the sub-substrates subjected to glue dispensing are independently clamped on the inner wall of a centrifugal barrel, the length direction of each sub-substrate is consistent with the axial direction of the centrifugal barrel, and the smaller width of each sub-substrate enables each part of a fluorescent glue layer on the surface of each sub-substrate to be close to the distance from each part of a rotating shaft of the centrifugal barrel.
Specifically, the method comprises the following steps:
(1) welding the LED chip on the substrate;
(2) dividing the whole substrate into a plurality of rectangular sub-substrates;
(3) dispensing the sub-substrate to form a sub-packaging substrate;
(4) placing the sub-packaging substrates in a centrifugal device for centrifugal precipitation of fluorescent powder, wherein the centrifugal device comprises a centrifugal barrel, the sub-packaging substrates are distributed on the inner wall of the centrifugal barrel, the length direction of the sub-packaging substrates is consistent with the axial direction of the centrifugal barrel, and the distances from the two long edges of the sub-packaging substrates to the axis of the centrifugal barrel are equal;
(5) and baking and forming the sub-packaging substrate.
Further, the width of the sub-package substrate is equal to the side dimension of the single packaged LED unit
Further, the method also comprises the step (6) of dividing the sub-packaging substrate into single packaging LED units.
Further, the sub-package substrate is divided along the length direction to form single package LED units.
Furthermore, the two long sides of the sub-package substrate are close to the inner wall of the centrifugal barrel or contact with the inner wall of the centrifugal barrel.
Adopt above-mentioned technical scheme, after having welded the LED chip, the cutting apart of once base plate is carried out earlier, separate into the less sub-base plate of a plurality of widths with the monoblock base plate, sub-base plate point is glued the back clamping and is carried out the centrifugal precipitation of phosphor powder in to centrifugal device, because the width of sub-base plate diminishes for the width of monoblock base plate, consequently, the inner wall of centrifugation cask is pressed close to more to the sub-base plate, make the phosphor glue layer that is located sub-base plate intermediate position to the rotation center of centrifugation cask apart from with be close to the phosphor glue layer of edge position about the sub-base plate to the distance of centrifugation cask rotation center further be close to, and then improved the homogeneity that phosphor powder distributes behind.
Drawings
FIG. 1 is a schematic diagram of phosphor centrifugation using a monolithic substrate.
FIG. 2 is a schematic diagram of fluorescent powder centrifugal precipitation by the process of the present invention.
Detailed Description
The invention is described below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, in the prior art, a whole substrate 1 is clamped for centrifugation, but the difference between the distance from the surface of the phosphor layer 2 located in the middle of the substrate 1 to the centrifuge drum 3 and the distance from the phosphor layer 2 located near the left and right edges of the substrate 1 to the rotation center of the centrifuge drum 3 is too large, so that the centrifugal deposition of the phosphor powder is not uniform.
As shown in fig. 2, the present invention discloses an LED packaging process, which has the general idea that: the whole substrate 1 is divided into a plurality of sub-substrates 4 with smaller widths before the centrifugal precipitation process, the sub-substrates 4 subjected to glue dispensing are independently clamped on the inner wall of the centrifugal barrel 3, the length direction of the sub-substrates 4 is consistent with the axial direction of the centrifugal barrel 3, the width of the sub-substrates 4 is smaller, so that the distance from each part of the fluorescent glue layer 2 on the surface of the sub-substrates 4 to the rotating shaft of the centrifugal barrel 3 is close, and the distribution uniformity of fluorescent powder in the fluorescent glue layer 2 after the centrifugal precipitation can be improved
Specifically, the method comprises the following steps:
(1) welding an LED chip on the substrate 1;
(2) dividing the whole substrate 1 into a plurality of rectangular sub-substrates 4;
(3) dispensing the sub-substrate 4 to form a sub-package substrate 1;
(4) placing the sub-packaging substrate 1 in a centrifugal device for centrifugal precipitation of fluorescent powder, wherein the centrifugal device comprises a centrifugal barrel 3, the sub-packaging substrate 1 is distributed on the inner wall of the centrifugal barrel 3, the length direction of the sub-packaging substrate 1 is consistent with the axial direction of the centrifugal barrel 3, and the distances from the two long edges of the sub-packaging substrate 1 to the axis of the centrifugal barrel 3 are equal;
(5) the sub-package substrate 1 is baked and molded.
(6) The sub-package substrate 1 is divided into individual package LED units.
In this embodiment, the substrate 1 is of a 3 × 8 specification, the divided sub-substrate 4 is of a 1 × 8 specification, the LED chips are arranged on the sub-substrate 4 in a horizontal-one-vertical-eight manner, two long sides of the sub-package substrate 1 are close to the inner wall of the centrifugal drum 3 or contact with the inner wall of the centrifugal drum 3, the width of the sub-package substrate 1 is equal to the side size of a single packaged LED unit, the width of the sub-package substrate 1 is as small as possible, and further, the distances from each position of the fluorescent glue surface on the sub-substrate 4 to the rotation axis of the centrifugal drum 3 are as close as possible, so as to fully ensure the uniformity of the distribution of the fluorescent powder in the fluorescent glue layer 2 after centrifugal precipitation.
Adopt above-mentioned technical scheme, after having welded the LED chip, the cutting apart of base plate 1 is carried out earlier, separate into the less sub-base plate 4 of a plurality of widths with monoblock base plate 1, 4 some glue back clamping of sub-base plate carry out the centrifugation of phosphor powder and deposit in the centrifugal device, because the width of sub-base plate 4 diminishes for the width of monoblock base plate 1, consequently, the inner wall of centrifugation cask 3 is pressed close to more to sub-base plate 4, make the distance that is located the fluorescent glue layer 2 of 4 intermediate positions of sub-base plate to the center of rotation of centrifugation cask 3 and the distance that is close to the fluorescent glue layer 2 of 4 left and right border positions of sub-base plate to the 3 center of rotation of centrifugation cask further be close to, and then improved the homogeneity of.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications, combinations and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. An LED packaging process is characterized in that: the whole substrate is divided into a plurality of sub-substrates with smaller width before the centrifugal precipitation process, the sub-substrates after glue dispensing are independently clamped on the inner wall of the centrifugal barrel, the length direction of the sub-substrates is consistent with the axial direction of the centrifugal barrel, and the smaller width of the sub-substrates enables the distances from all parts of the fluorescent glue layer on the surface of the sub-substrates to the rotating shaft of the centrifugal barrel to be close.
2. The LED packaging process of claim 1, wherein: the method comprises the following steps:
(1) welding the LED chip on the substrate;
(2) dividing the whole substrate into a plurality of rectangular sub-substrates;
(3) dispensing the sub-substrate to form a sub-packaging substrate;
(4) placing the sub-packaging substrates in a centrifugal device for centrifugal precipitation of fluorescent powder, wherein the centrifugal device comprises a centrifugal barrel, the sub-packaging substrates are distributed on the inner wall of the centrifugal barrel, the length direction of the sub-packaging substrates is consistent with the axial direction of the centrifugal barrel, and the distances from the two long edges of the sub-packaging substrates to the axis of the centrifugal barrel are equal;
(5) and baking and forming the sub-packaging substrate.
3. The LED packaging process of claim 2, wherein: the sub-package substrate has a width equal to the side dimension of a single packaged LED unit.
4. The LED packaging process of claim 2, wherein: and (6) dividing the sub-package substrate into single package LED units.
5. The LED packaging process of claim 3, wherein: the sub-package substrate is divided along the length direction to form single package LED units.
6. The LED packaging process according to any of claims 1-5, wherein: and two long edges of the sub-packaging substrate are close to the inner wall of the centrifugal barrel or are in contact with the inner wall of the centrifugal barrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010554722.7A CN111640839A (en) | 2020-06-17 | 2020-06-17 | LED packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010554722.7A CN111640839A (en) | 2020-06-17 | 2020-06-17 | LED packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111640839A true CN111640839A (en) | 2020-09-08 |
Family
ID=72330152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010554722.7A Pending CN111640839A (en) | 2020-06-17 | 2020-06-17 | LED packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111640839A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090153022A1 (en) * | 2007-12-14 | 2009-06-18 | Hussell Christopher P | Phosphor distribution in LED lamps using centrifugal force |
| CN107623062A (en) * | 2017-07-31 | 2018-01-23 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED packaging technology and centrifugation device |
| CN207371811U (en) * | 2017-09-07 | 2018-05-18 | 东莞伏尔甘自动化设备有限公司 | LED centrifugations mechanism |
| KR20190119281A (en) * | 2018-04-12 | 2019-10-22 | 손규창 | Centrifugal precipitation apparatus for packages |
-
2020
- 2020-06-17 CN CN202010554722.7A patent/CN111640839A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090153022A1 (en) * | 2007-12-14 | 2009-06-18 | Hussell Christopher P | Phosphor distribution in LED lamps using centrifugal force |
| CN107623062A (en) * | 2017-07-31 | 2018-01-23 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED packaging technology and centrifugation device |
| CN207371811U (en) * | 2017-09-07 | 2018-05-18 | 东莞伏尔甘自动化设备有限公司 | LED centrifugations mechanism |
| KR20190119281A (en) * | 2018-04-12 | 2019-10-22 | 손규창 | Centrifugal precipitation apparatus for packages |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200908 |
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| RJ01 | Rejection of invention patent application after publication |