CN111632951A - Positioning hole glue removing device and method for PCB steel plate - Google Patents
Positioning hole glue removing device and method for PCB steel plate Download PDFInfo
- Publication number
- CN111632951A CN111632951A CN202010430009.1A CN202010430009A CN111632951A CN 111632951 A CN111632951 A CN 111632951A CN 202010430009 A CN202010430009 A CN 202010430009A CN 111632951 A CN111632951 A CN 111632951A
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- CN
- China
- Prior art keywords
- glue removing
- platform
- dry ice
- steel plate
- positioning hole
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a positioning hole glue removing device of a PCB steel plate, which comprises a first rack and a controller, wherein the first rack is provided with a first positioning hole; the first rack is provided with a feeding platform, a glue removing platform and a discharging platform which are connected and transited by a conveying belt; the glue removing platform is provided with a glue removing mechanism, the glue removing mechanism comprises a second rack, a dry ice crusher, an air compressor and a nozzle, the second rack is arranged across the glue removing platform, and the dry ice crusher and the air compressor are arranged on one side of the glue removing platform; the air compressor is connected with the dry ice crusher through a pipeline, and the dry ice crusher is connected with the nozzle through a pipeline; the second frame comprises an A-layer frame and a B-layer frame which are respectively positioned at the upper side and the lower side of the glue removing platform; two nozzles are arranged and are respectively arranged on the layer A frame and the layer B frame. The positioning hole glue removing device and method for the PCB using the steel plate, provided by the invention, have the advantages that the automatic operation is realized, the labor input is reduced, the cost is saved, the turnover speed of the steel plate is increased, the quality of a product is more stable, and the production benefit is improved.
Description
Technical Field
The invention relates to a positioning hole glue removing device and method for a PCB steel plate, and belongs to the technical field of PCB plates.
Background
In recent years, the popularization of the 5G communication technology is a challenge to the whole electronic information industry, particularly the PCB manufacturing industry, the grade of the used materials is higher and higher, more and more low Dk & Df materials are applied, the materials are mainly PPO, compared with the traditional non-PPO materials, the electrical property of the PPO materials is better, and the high-frequency and high-speed requirements of electronic development can be better used; but at the same time, the heat resistance is high, the strength is high, the fluidity is poor, the challenge to the PCB manufacture is higher and higher, especially for the lamination process adopting pin positioning, in addition to the fine requirement of processing parameters, the challenge to the treatment of the laminated steel plate jig is also higher and higher.
At present, the glue flow treatment at the positioning hole in the industry is basically carried out by manpower, the flow rate of a product can be influenced, a large amount of manpower is consumed, the damage to a steel plate is large, the interlayer alignment degree and the plate thickness uniformity of a PCB (printed Circuit Board) can be influenced, and therefore the work simplification of the part is realized, and the important problem which puzzles the PCB processing is solved.
Disclosure of Invention
The purpose is as follows: in order to overcome the defects in the prior art, the invention provides a positioning hole glue removing device and method for a PCB (printed circuit board) by using a steel plate, and solves the problems that the glue removing difficulty of the positioning hole of the steel plate is high, a large amount of manpower is consumed, and the damage to the steel plate is large at present.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a PCB uses the locating hole degumming device of the steel plate, including the first stander and control device; the first rack is provided with a feeding platform, a glue removing platform and a discharging platform, and the feeding platform, the glue removing platform and the discharging platform are connected and transited through a conveying belt;
the glue removing platform is provided with a glue removing mechanism, the glue removing mechanism comprises a second rack, a dry ice crusher, an air compressor and a nozzle, the second rack is arranged across the glue removing platform, and the dry ice crusher and the air compressor are arranged on one side of the glue removing platform; a compressed air outlet of the air compressor is connected with an air inlet of the dry ice crusher through a pipeline, and a dry ice outlet of the dry ice crusher is connected with a nozzle through a pipeline; the second rack comprises an A-layer frame and a B-layer frame, and the A-layer frame and the B-layer frame are respectively positioned on the upper side and the lower side of the glue removing platform; the two nozzles are respectively arranged on the layer A frame and the layer B frame.
Furthermore, the frame of the layer A is a rectangular frame, slide rails are arranged on two opposite parallel edges, a cross beam is arranged between the two opposite parallel edges, slide blocks are fixed at two ends of the cross beam, and the slide blocks are matched with the slide rails; the nozzle is fixed on the moving block, and the moving block is connected with the cross beam in a sliding manner; the structure of the B-layer frame is the same as that of the A-layer frame.
Furthermore, the nozzle and the surface of the degumming platform form an included angle of 45 degrees.
Furthermore, the glue removing platform is provided with a limit stop and a positioning device.
Furthermore, an infrared inductor is installed below the limit stop and connected with the controller.
Further, the positioning device is a mechanical clamping jaw.
Further, the particle size of the dry ice particles output by the dry ice pulverizer is 0.1-0.3 mm.
The method for removing the glue from the positioning hole of the steel plate used for the PCB is carried out by utilizing the device, and the crushed dry ice particles are sprayed in the direction inclined by 45 degrees at the positioning hole of the steel plate used for the PCB, so that the glue is crushed and taken away by high-pressure air, and the purpose of removing the glue from the positioning hole is achieved.
Has the advantages that: the positioning hole glue removing device and method for the PCB steel plate provided by the invention have the advantages that the design is ingenious, the structure is simple, and the requirement of quick and simple glue removing can be met; the device is automatic to be operated, reduces the human input, practices thrift the cost, and steel sheet turnover speed promotes, and the quality of product is more stable, improves the productivity effect.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of a glue removing mechanism;
FIG. 3 is a schematic side view of the glue removal mechanism;
fig. 4 is a schematic top view of the layer a frame of fig. 2.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a positioning hole glue removing device of a PCB using a steel plate comprises a first frame and a controller; the automatic glue removing machine is characterized in that a feeding platform 1, a glue removing platform 2 and a discharging platform 3 are arranged on the first rack, and the feeding platform 1, the glue removing platform 2 and the discharging platform 3 are connected and transited through a conveying belt 8. A material preparation platform 10 is further arranged in front of the feeding platform 1, and an absorption and adjustment device 11 is arranged between the material preparation platform 10 and the feeding platform 1; inhale transfer device 11 and include horizontal slide rail and sucking disc, the sucking disc is fixed at the telescopic link lower extreme, and the telescopic link upper end is passed through the slider and is connected with horizontal slide rail, horizontal slide rail sets up in the platform of prepareeing material and one side top of feeding platform, through inhale transfer device 11 can inhale the steel sheet from platform 10 of prepareeing material and transfer to feeding platform 1.
The glue removing platform 2 is provided with a glue removing mechanism, the glue removing mechanism comprises a second rack 4, a dry ice pulverizer 5, an air compressor 6 and a nozzle 7, the second rack 4 stretches across the glue removing platform 2, and the dry ice pulverizer 5 and the air compressor 6 are arranged on one side of the glue removing platform 2; the compressed air outlet of the air compressor 6 is connected with the air inlet of the dry ice pulverizer 5 through a pipeline, the dry ice outlet of the dry ice pulverizer 5 is connected with the nozzle 7 through a pipeline, and the particle size of dry ice particles output by the dry ice pulverizer 5 is 0.1-0.3 mm.
The second frame 4 comprises an A-layer frame 41 and a B-layer frame 42, and the A-layer frame 41 and the B-layer frame 42 are respectively positioned on the upper side and the lower side of the glue removing platform 2; the number of the nozzles 7 is two, and the two nozzles are respectively arranged on the A-layer frame 41 and the B-layer frame 42.
The layer a frame 41 is a rectangular frame, wherein two opposite parallel edges are provided with a slide rail 411, a cross beam 412 is arranged between the two opposite parallel edges, two ends of the cross beam 412 are fixed with sliders 413, the sliders 413 are matched with the slide rail 411, and the sliders 413 can slide on the slide rail 411 in a reciprocating manner under the driving of a motor; the nozzle 7 is fixed on a moving block 414, the moving block 414 is slidably connected with the cross beam 412, and the moving block 414 is driven by a motor, which is a common device element in the field and can be directly applied to a commercially available micro motor. The nozzle 7 and the surface of the glue removing platform 2 form an included angle of 45 degrees. The structure of the B-layer frame 42 is the same as that of the a-layer frame 41.
And the glue removing platform 2 is provided with a limit stop and a positioning device. An infrared inductor is arranged below the limit stop block and is connected with the controller; the positioning device is a mechanical clamping jaw, and the mechanical clamping jaw adopts a common clamp for a steel plate in the prior art. The limit stops and the positioning means are not explicitly shown in the drawings, but do not affect the understanding of the technical solution by those skilled in the art.
The method for removing the glue from the positioning hole of the PCB steel plate by using the device comprises the following steps:
piling up the steel sheet 9 that will remove the glue and placing on the platform 10 of prepareeing material, transferring to feeding platform 1 through inhaling transfer device 11, after revising the position of steel sheet 9, conveying to removing gluey platform 2 through conveyer belt 8, reacing limit stop department, when the infrared inductor of limit stop below detects the top and has the object, send stop signal for the controller, conveyer belt 8 stall to utilize mechanical clamping jaw to fix steel sheet 9 on removing gluey platform 2.
When the steel plate 9 is conveyed on the conveyor belt 8, the dry ice crusher 5 starts to work, the dry ice is crushed into small particles with the particle size of 0.1-0.3mm, the air compressor 6 conveys high-pressure air with the pressure of more than 0.9MPa into the dry ice crusher 5, and then the high-pressure air carries the small particles of the dry ice to the nozzle 7 along the pipeline.
The direction of the nozzle 7 is adjusted to ensure that the nozzle 7 and the surface of the glue removing platform 2 form an included angle of 45 degrees, and the steel plate 9 is flatly placed on the glue removing platform 2, namely the nozzle 7 and the surface of the steel plate 9 form an included angle of 45 degrees.
The nozzle 7 is conveyed to a designated glue removing position by means of the sliding of the beam 412 on the sliding rail 411 and the sliding of the motion block 414 on the beam 412, a valve on the nozzle 7 is opened, granular dry ice is sprayed, the valve is opened and continuously sprayed for 8S, and the glue flowing treatment of the upper surface and the lower surface of the Slot single hole is completed. The small-particle dry ice impacts the gummosis part along with the high-pressure air, the colloid and the steel plate begin to shrink when meeting cold along with the dry ice spraying, and the colloid generates micro cracks and begins to embrittle due to the difference of the thermal expansion coefficients of the colloid and the steel plate and the different shrinkage ranges of the colloid and the steel plate; meanwhile, the high-pressure air which is used for winding the small dry ice particles continuously impacts the colloid, the physical crushing effect exists, and the dry ice particles are heated to start sublimation, so that the blasting of a microscopic region is generated; the colloid is broken and taken away by high-pressure air, so that the purpose of removing the colloid is achieved.
According to the needs, remove nozzle 7 to other hole sites that need to remove glue, accomplish the injection of monoblock steel sheet and remove gluey work. Then the mechanical clamping jaw is loosened, the conveyor belt 8 is restarted, the steel plate 9 after glue removal is conveyed to the blanking platform, meanwhile, the next steel plate to be subjected to glue removal enters the feeding platform 1 and is conveyed to the glue removal platform 2, and next circulation is started.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (8)
1. The utility model provides a PCB uses locating hole adhesive deposite device of steel sheet which characterized in that:
comprises a first frame and a controller; the first rack is provided with a feeding platform, a glue removing platform and a discharging platform, and the feeding platform, the glue removing platform and the discharging platform are connected and transited through a conveying belt;
the glue removing platform is provided with a glue removing mechanism, the glue removing mechanism comprises a second rack, a dry ice crusher, an air compressor and a nozzle, the second rack is arranged across the glue removing platform, and the dry ice crusher and the air compressor are arranged on one side of the glue removing platform; a compressed air outlet of the air compressor is connected with an air inlet of the dry ice crusher through a pipeline, and a dry ice outlet of the dry ice crusher is connected with a nozzle through a pipeline; the second rack comprises an A-layer frame and a B-layer frame, and the A-layer frame and the B-layer frame are respectively positioned on the upper side and the lower side of the glue removing platform; the two nozzles are respectively arranged on the layer A frame and the layer B frame.
2. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 1, wherein: the frame of the layer A is a rectangular frame, slide rails are arranged on two opposite parallel edges, a cross beam is arranged between the two opposite parallel edges, slide blocks are fixed at two ends of the cross beam, and the slide blocks are matched with the slide rails; the nozzle is fixed on the moving block, and the moving block is connected with the cross beam in a sliding manner; the structure of the B-layer frame is the same as that of the A-layer frame.
3. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 2, wherein: the nozzle and the surface of the degumming platform form an included angle of 45 degrees.
4. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 1, wherein: and the glue removing platform is provided with a limit stop and a positioning device.
5. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 4, wherein: an infrared inductor is installed below the limit stop and connected with the controller.
6. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 4, wherein: the positioning device is a mechanical clamping jaw.
7. The positioning hole glue removing device of the PCB using the steel plate as claimed in claim 1, wherein: the particle size of the dry ice particles output by the dry ice crusher is 0.1-0.3 mm.
8. A method for removing glue from a positioning hole of a PCB (printed Circuit Board) using a steel plate is carried out by using the device of any one of claims 1 to 7, wherein crushed dry ice particles are sprayed in the positioning hole of the PCB using the steel plate in a direction inclined by 45 degrees, the glue is crushed, and the crushed dry ice particles are taken away by high-pressure air, so that the purpose of removing the glue from the positioning hole is achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010430009.1A CN111632951A (en) | 2020-05-20 | 2020-05-20 | Positioning hole glue removing device and method for PCB steel plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010430009.1A CN111632951A (en) | 2020-05-20 | 2020-05-20 | Positioning hole glue removing device and method for PCB steel plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111632951A true CN111632951A (en) | 2020-09-08 |
Family
ID=72323447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010430009.1A Pending CN111632951A (en) | 2020-05-20 | 2020-05-20 | Positioning hole glue removing device and method for PCB steel plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN111632951A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112536293A (en) * | 2020-12-16 | 2021-03-23 | 航天科工智能机器人有限责任公司 | Workpiece glue removing system and method |
| CN112620029A (en) * | 2020-12-25 | 2021-04-09 | 郑宗健 | Electrical engineering is with removing mucilage binding fast and puts to locating hole of PCB board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112536293A (en) * | 2020-12-16 | 2021-03-23 | 航天科工智能机器人有限责任公司 | Workpiece glue removing system and method |
| CN112536293B (en) * | 2020-12-16 | 2024-03-15 | 航天科工智能机器人有限责任公司 | Workpiece photoresist removing system and photoresist removing method |
| CN112620029A (en) * | 2020-12-25 | 2021-04-09 | 郑宗健 | Electrical engineering is with removing mucilage binding fast and puts to locating hole of PCB board |
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Application publication date: 20200908 |
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