CN111632857A - Vibration assembly for semiconductor test sorting - Google Patents
Vibration assembly for semiconductor test sorting Download PDFInfo
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- CN111632857A CN111632857A CN202010483639.5A CN202010483639A CN111632857A CN 111632857 A CN111632857 A CN 111632857A CN 202010483639 A CN202010483639 A CN 202010483639A CN 111632857 A CN111632857 A CN 111632857A
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- plate
- rotating cylinder
- vibration
- cylinder
- air
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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Abstract
The invention discloses a vibration assembly for semiconductor test sorting, which comprises a hollow cylindrical base, wherein a rotating cylinder is rotatably arranged on the coaxial base; the vibration plate is movably arranged at the top end in the rotating cylinder, a sealed cavity is formed between the supporting plate and the vibration plate, and the bottom of the supporting plate is communicated with a blast mechanism for injecting air into the cavity; the vibration mechanism is fixedly arranged at the bottom end in the rotating cylinder and drives the vibration plate to reciprocate up and down in the rotating cylinder; the output cylinder is fixedly connected with the base through the frame, and the bottom of the output cylinder is provided with a rotary driving mechanism for driving the rotary cylinder to rotate. According to the invention, the rotating cylinder is rotatably arranged between the base and the output cylinder, and the rotation of the rotating cylinder is realized through the external tooth slewing bearing and the gear driving structure, and in the rotating process of the rotating cylinder, air is blown into the cavity by the air pump and is sprayed out through the air hole plate, so that the friction force between a semiconductor placed on the vibrating plate and the surface of the vibrating plate is reduced, and the semiconductor is convenient to feed.
Description
Technical Field
The invention relates to the technical field of semiconductor test sorting, in particular to a vibration assembly for semiconductor test sorting.
Background
The current test sorting equipment for semiconductor device packaging generally adopts rotary feeding. For example, the chinese utility model patent with application number 2017209479190 discloses a vibrations dish of semiconductor test sorting facilities, and vibrations pass through the guide rail and are connected with semiconductor test sorting facilities suction nozzle, and the vibrations dish is the disc, and the disc internal surface is equipped with the heliciform route.
In actual operation, the vibration disc in the prior art is easy to clamp the semiconductor on the vibration disc, so that the sorting work cannot be finished. To this end, we propose a vibration module for semiconductor test sorting to solve the above problems.
Disclosure of Invention
The present invention is directed to a vibration module for semiconductor testing and sorting, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: a vibration component for semiconductor test sorting comprises a hollow cylindrical base,
the rotating cylinder is rotatably arranged on the coaxial base;
the vibrating plate is movably arranged at the top end in the rotating cylinder and is of a conical structure, and at least one air hole plate is embedded in the top surface of the vibrating plate;
the supporting plate is fixedly arranged at the bottom of the vibration plate, a sealed cavity is formed between the supporting plate and the vibration plate, and the bottom of the supporting plate is communicated with a blast mechanism for injecting air into the cavity;
the vibration mechanism is fixedly arranged at the bottom end in the rotating cylinder and drives the vibration plate to reciprocate up and down in the rotating cylinder;
the output cylinder is rotatably installed at the top of the coaxial rotating cylinder, the output cylinder is fixedly connected with the base through the rack, and the bottom of the output cylinder is provided with a rotary driving mechanism for driving the rotating cylinder to rotate.
Preferably, the rotating cylinder is connected with the base through a slewing bearing, the slewing bearing is divided into a first outer ring and a first inner ring, the first outer ring is fixedly connected with the bottom of the rotating cylinder, and the first inner ring is fixedly connected with the top of the base.
Preferably, the vibration plate is fixedly connected with an annular thin sheet elastic metal sheet in the circumferential direction, and the outer end of the elastic metal sheet is fixedly connected to the top end of the rotating cylinder.
Preferably, the conical surface of the vibration plate faces the output cylinder, a plurality of through holes matched with the air hole plate in size penetrate through the conical surface, the air hole plate is embedded in the through holes, and air holes for exhausting air towards the direction of the output cylinder are uniformly distributed on the air hole plate.
Preferably, the air blower mechanism is including installing the air pump on rotating a section of thick bamboo inside fixed plate, the air inlet of air pump is facing to the air vent on rotating a section of thick bamboo, and the fixed intercommunication hose in gas outlet, the other end of hose passes through the play dryer that the pipe fitting joint intercommunication is loudspeaker form, bottom in the play dryer fixed mounting at the layer board, be equipped with the through-hole that is used for the pipe fitting joint to pass through on the layer board.
Preferably, the vibration mechanism comprises a bottom plate fixedly mounted on the fixing plate, an eccentric wheel driven by a motor is rotatably mounted on the bottom plate, the outer edge of the eccentric wheel is hinged to one end of a connecting rod, the other end of the connecting rod is hinged to the bottom end of a mounting bracket, the mounting bracket is sleeved on the outer side of the pipe fitting joint, and a placing hole for allowing a hose to pass through is formed in the mounting bracket.
Preferably, the vibrations subassembly still includes fixed mounting and follows the buffer gear of bottom outside the vibrations board, buffer gear includes the connecting block of bottom outside the vibrations board along fixed mounting, the connecting block activity is cup jointed on the back shaft, and has still cup jointed the spring on the back shaft simultaneously, spring top and connecting block bottom rigid coupling, the embedded mounting of back shaft is in the mounting groove that rotates a section of thick bamboo inner wall.
Preferably, the rotary driving mechanism comprises an external tooth slewing bearing, a mounting plate, a gear and a motor, the external tooth slewing bearing is divided into a second outer ring and a second inner ring with external teeth, the second outer ring is fixedly mounted at the top of the rotating cylinder, the second inner ring is fixedly mounted at the bottom of the output cylinder, the mounting plate further extends out of the output cylinder, the gear is rotatably mounted on the mounting plate and driven by the motor, and the gear is meshed with the external teeth on the second outer ring.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the rotating cylinder is rotatably arranged between the base and the output cylinder, and the rotation of the rotating cylinder is realized through the external tooth slewing bearing and the gear driving structure, and in the rotating process of the rotating cylinder, air is blown into the cavity by the air pump and is sprayed out through the air hole plate, so that the friction force between a semiconductor placed on the vibrating plate and the surface of the vibrating plate is reduced, and the semiconductor is convenient to feed.
The motor drives the eccentric wheel to rotate, drives the vibration plate to move up and down, and realizes stable vibration of the vibration plate through the buffer mechanism.
The elastic metal sheet with the smooth surface is utilized to ensure that the vibration plate can keep tightness with the inner wall of the rotating cylinder when vibrating in a small range from top to bottom, so that the semiconductor is prevented from being clamped at the joint.
And a conductive slip ring is arranged at the center of the bottom of the fixed plate, so that the normal power supply of the motor and the air pump is ensured in the rotation process of the rotating cylinder.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the structure of the vibration plate and the support plate of the present invention;
FIG. 4 is a schematic structural diagram of a vibration mechanism according to the present invention;
fig. 5 is a schematic structural view of the blower mechanism of the present invention.
In the figure: the device comprises a base 1, a 101 slewing bearing, a 101a first outer ring, a 101b first inner ring, a 2 rotating cylinder, a 201 air vent, a 202 fixing plate, a 203 mounting groove, a 3 output cylinder, a 301 external tooth slewing bearing, a 301a second outer ring, a 301b second inner ring, a 302 mounting plate, a 303 gear, a 304 motor, a 4 vibration plate, a 401 air hole plate, a 402 elastic metal sheet, a 5 supporting plate, a 501 through hole, a 6 air blowing mechanism, a 61 air pump, a 62 air outlet cylinder, a 63 pipe joint, a 64 hose, a 7 vibration mechanism, a 71 bottom plate, a 72 eccentric wheel, a 73 mounting bracket, a 7301 placing hole, a 74 connecting rod, an 8 buffer mechanism, an 81 connecting block, an 82 supporting shaft and an.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a vibration component for semiconductor testing and sorting comprises a hollow cylindrical base 1 and a rotary cylinder 2, wherein the rotary cylinder 2 is rotatably arranged on the coaxial base 1; the rotary cylinder 2 is connected with the base 1 through a rotary support 101, the rotary support 101 is divided into a first outer ring 101a and a first inner ring 101b, the first outer ring 101a is fixedly connected with the bottom of the rotary cylinder 2, and the first inner ring 101b is fixedly connected with the top of the base 1. The rotary cylinder 2 can freely rotate on the upper end of the base 1 through the slewing bearing 101.
The vibrating plate 4 is movably arranged at the top end in the rotating cylinder 2 and is of a conical structure, an annular thin sheet-shaped elastic metal sheet 402 is fixedly connected to the circumference of the vibrating plate 4, and the outer end of the elastic metal sheet 402 is fixedly connected to the top end of the rotating cylinder 2. The elastic metal sheet 402 with smooth surface can ensure that the vibration plate 4 can keep tightness with the inner wall of the rotating cylinder 2 while vibrating in a small range from top to bottom, and a semiconductor is prevented from being clamped at the joint.
The conical surface of the vibration plate 4 faces the output cylinder 3, a plurality of through holes matched with the air hole plate 401 in size are penetrated through the conical surface, the air hole plate 401 is embedded in the through holes, air holes used for discharging air to the direction of the output cylinder 3 are uniformly distributed on the air hole plate 401, and the caliber of each air hole is smaller than that of a pin on the semiconductor chip.
Referring to fig. 3 and 5, the support plate 5 is fixedly installed at the bottom of the vibration plate 4, and forms a sealed chamber with the vibration plate 4, and the bottom of the support plate 5 is communicated with a blowing mechanism 6 for injecting air into the chamber; the blowing mechanism 6 comprises an air pump 61 arranged on a fixed plate 202 inside the rotating cylinder 2, an air inlet of the air pump 61 faces to an air vent 201 on the rotating cylinder 2, an air outlet is fixedly communicated with a hose 64, the other end of the hose 64 is communicated with a horn-shaped air outlet cylinder 62 through a pipe fitting joint 63, the air outlet cylinder 62 is fixedly arranged at the bottom end in the supporting plate 5, and a through hole 501 for the pipe fitting joint 63 to pass through is arranged on the supporting plate 5.
The air pump 61 is used for blowing air into the cavity and the air is sprayed out through the air hole plate 401, so that the friction force between the semiconductor placed on the vibration plate 4 and the surface of the vibration plate 4 is reduced, and the feeding is facilitated.
Referring to fig. 4, the vibration mechanism 7 is fixedly installed at the bottom end of the rotating cylinder 2, and drives the vibration plate 4 to reciprocate up and down in the rotating cylinder 2;
the vibration mechanism 7 comprises a base plate 71 fixedly mounted on the fixing plate 202, an eccentric wheel 72 driven by a motor is rotatably mounted on the base plate 71, one end of a connecting rod 74 is hinged at the outer edge of the eccentric wheel 72, the other end of the connecting rod 74 is hinged at the bottom end of a mounting bracket 73, the mounting bracket 73 is sleeved outside the pipe fitting joint 63, and a placing hole 7301 for the hose 64 to pass through is formed in the mounting bracket 73.
A conductive slip ring (not shown) is disposed at the bottom center of the fixed plate 202, so as to ensure the normal power supply of the motor and the air pump 61 during the rotation of the rotary drum 2.
Referring to fig. 3, the vibration assembly further includes a buffer mechanism 8 fixedly mounted at the bottom of the outer edge of the vibration plate 4, the buffer mechanism 8 includes a connecting block 81 fixedly mounted at the bottom of the outer edge of the vibration plate 4, the connecting block 81 is movably sleeved on a supporting shaft 82, a spring 83 is sleeved on the supporting shaft 82, the top of the spring 83 is fixedly connected with the bottom end of the connecting block 81, and the supporting shaft 82 is embedded in a mounting groove 203 in the inner wall of the rotating cylinder 2.
Referring to fig. 1-2, the output cylinder 3 is rotatably mounted on the top of the coaxial rotating cylinder 2, the output cylinder 3 is fixedly connected to the base 1 through a frame, and the bottom of the output cylinder 3 is mounted with a rotary driving mechanism for driving the rotating cylinder 2 to rotate.
The rotary driving mechanism comprises an external tooth rotary support 301, a mounting plate 302, a gear 303 and a motor 304, the external tooth rotary support 301 is divided into a second outer ring 301a with external teeth and a second inner ring 302b, the second outer ring 301a is fixedly mounted at the top of the rotary drum 2, the second inner ring 302b is fixedly mounted at the bottom of the output drum 3, the mounting plate 302 further extends out of the output drum 3, the gear 303 is rotatably mounted on the mounting plate 302, the gear 303 is driven by the motor 304, and the gear 303 is meshed with the external teeth on the second outer ring 301 a.
According to the invention, the rotating cylinder 2 is rotatably arranged between the base 1 and the output cylinder 3, and the rotation of the rotating cylinder 2 is realized through the external tooth slewing bearing 301 and the gear 303 driving structure, in the rotating process of the rotating cylinder 2, air is blown into the cavity by the air pump 61 and is sprayed out through the air hole plate 401, so that the friction force between a semiconductor placed on the vibrating plate 4 and the surface of the vibrating plate 4 is reduced, and the semiconductor is convenient to feed.
In addition, the motor drives the eccentric wheel 72 to rotate so as to drive the vibration plate 4 to move up and down, and the stable vibration of the vibration plate 4 is realized through the buffer mechanism 8.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A vibration component for semiconductor test sorting comprises a hollow cylindrical base (1), and is characterized by further comprising:
the rotating cylinder (2) is rotatably arranged on the coaxial base (1);
the vibrating plate (4) is movably arranged at the top end in the rotating cylinder (2) and is of a conical structure, and at least one air hole plate (401) is embedded in the top surface of the vibrating plate;
the supporting plate (5) is fixedly arranged at the bottom of the vibration plate (4), a sealed cavity is formed between the supporting plate and the vibration plate (4), and the bottom of the supporting plate (5) is communicated with a blast mechanism (6) for injecting air into the cavity;
the vibration mechanism (7) is fixedly arranged at the bottom end in the rotating cylinder (2) and drives the vibration plate (4) to reciprocate up and down in the rotating cylinder (2);
the output cylinder (3) is rotatably installed at the top of the coaxial rotating cylinder (2), the output cylinder (3) is fixedly connected with the base (1) through a rack, and a rotary driving mechanism for driving the rotating cylinder (2) to rotate is installed at the bottom of the output cylinder (3).
2. The vibratory assembly of semiconductor test sorting of claim 1, wherein: the rotating cylinder (2) is connected with the base (1) through a slewing bearing (101), the slewing bearing (101) is divided into a first outer ring (101a) and a first inner ring (101b), the first outer ring (101a) is fixedly connected with the bottom of the rotating cylinder (2), and the first inner ring (101b) is fixedly connected with the top of the base (1).
3. The vibratory assembly of semiconductor test sorting of claim 1, wherein: the circumference fixedly connected with annular thin slice elasticity sheetmetal (402) of vibrations board (4), the outer end fixed connection of elasticity sheetmetal (402) is on the top of rotating a section of thick bamboo (2).
4. The vibratory assembly of semiconductor test sorting of claim 1, wherein: the conical surface of vibrations board (4) is towards output section of thick bamboo (3), run through on the conical surface a plurality of with pore plate (401) size complex through-hole, embedded the installing in the through-hole of pore plate (401), and evenly distributed has the gas pocket that is used for to output section of thick bamboo (3) direction exhaust on pore plate (401).
5. The vibratory assembly of semiconductor test sorting of claim 1, wherein: air blower mechanism (6) is including installing air pump (61) on a rotation section of thick bamboo (2) internal fixation board (202), air inlet of air pump (61) is facing to air vent (201) on a rotation section of thick bamboo (2), and fixed intercommunication hose (64) in gas outlet, the other end of hose (64) passes through pipe fitting joint (63) and communicates play tuber pipe (62) that the loudspeaker form, go out bottom in tuber pipe (62) fixed mounting in layer board (5), be equipped with on layer board (5) and be used for through-hole (501) that pipe fitting joint (63) pass through.
6. The vibratory assembly of semiconductor test sorting of claim 5, wherein: the vibration mechanism (7) comprises a bottom plate (71) fixedly mounted on the fixing plate (202), an eccentric wheel (72) driven by a motor is rotatably mounted on the bottom plate (71), the outer edge of the eccentric wheel (72) is hinged to one end of a connecting rod (74), the other end of the connecting rod (74) is hinged to the bottom end of a mounting bracket (73), the mounting bracket (73) is sleeved on the outer side of the pipe fitting joint (63), and a placing hole (7301) for a hose (64) to pass through is formed in the mounting bracket (73).
7. The vibratory assembly of semiconductor test sorting of claim 1, wherein: the vibrations subassembly still includes buffer gear (8) of fixed mounting edge bottom outside vibrations board (4), buffer gear (8) include fixed mounting along connecting block (81) of bottom outside vibrations board (4), connecting block (81) activity cup joints on back shaft (82), and still cup jointed spring (83) on back shaft (82) simultaneously, spring (83) top and connecting block (81) bottom rigid coupling, back shaft (82) embedded installation is in mounting groove (203) of rotating a section of thick bamboo (2) inner wall.
8. The vibratory assembly of semiconductor test sorting of claim 1, wherein: rotatory actuating mechanism includes external tooth slewing bearing (301), mounting panel (302), gear (303) and motor (304), external tooth slewing bearing (301) divide into second outer lane (301a) and second inner circle (302b) that have the external tooth, second outer lane (301a) fixed mounting is at the top of a section of thick bamboo (2) of rotating, second inner circle (302b) fixed mounting still extends mounting panel (302) in the bottom of an output section of thick bamboo (3) on an output section of thick bamboo (3), rotate mounting gear (303) on mounting panel (302), gear (303) pass through motor (304) drive, and gear (303) with the external tooth meshing on second outer lane (301 a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010483639.5A CN111632857A (en) | 2020-06-01 | 2020-06-01 | Vibration assembly for semiconductor test sorting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010483639.5A CN111632857A (en) | 2020-06-01 | 2020-06-01 | Vibration assembly for semiconductor test sorting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111632857A true CN111632857A (en) | 2020-09-08 |
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ID=72324905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010483639.5A Withdrawn CN111632857A (en) | 2020-06-01 | 2020-06-01 | Vibration assembly for semiconductor test sorting |
Country Status (1)
| Country | Link |
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| CN (1) | CN111632857A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127624A1 (en) * | 2020-12-18 | 2022-06-23 | 赣州好朋友科技有限公司 | Annular waterfall type feeding assembly and mineral processing device |
-
2020
- 2020-06-01 CN CN202010483639.5A patent/CN111632857A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127624A1 (en) * | 2020-12-18 | 2022-06-23 | 赣州好朋友科技有限公司 | Annular waterfall type feeding assembly and mineral processing device |
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Application publication date: 20200908 |
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| WW01 | Invention patent application withdrawn after publication |