CN111621232A - Polishing paste for copper plating layer of gravure printing cylinder and preparation method thereof - Google Patents

Polishing paste for copper plating layer of gravure printing cylinder and preparation method thereof Download PDF

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Publication number
CN111621232A
CN111621232A CN202010643049.4A CN202010643049A CN111621232A CN 111621232 A CN111621232 A CN 111621232A CN 202010643049 A CN202010643049 A CN 202010643049A CN 111621232 A CN111621232 A CN 111621232A
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China
Prior art keywords
parts
weight
polishing paste
copper
polishing
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CN202010643049.4A
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Chinese (zh)
Inventor
李春虎
裴建光
胡龙
杨俊杰
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Yunnan Yinfan Technology Co ltd
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Yunnan Yinfan Technology Co ltd
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Priority to CN202010643049.4A priority Critical patent/CN111621232A/en
Publication of CN111621232A publication Critical patent/CN111621232A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to the field of gravure printing, in particular to polishing paste for a copper-plated layer of a gravure printing cylinder and a preparation method thereof. The polishing paste disclosed by the invention is prepared by mixing 2-15 parts of water-soluble silicone oil, 2-10 parts of stearic acid, 2-10 parts of palmitic acid, 1-4 parts of a thickening agent, 20-50 parts of a first abrasive, 0-20 parts of a second abrasive, 0-40 parts of a third abrasive, 1-5 parts of an emulsifier, 0.1-1 part of an antibacterial agent and 30-50 parts of water. The polishing paste is used for polishing the copper-plated layer of the gravure printing cylinder, and the polishing paste disclosed by the invention is used for polishing the copper-plated layer of the gravure printing cylinder, so that the polishing paste is high in polishing efficiency, good in smoothness, capable of being stored for a long time and not prone to going bad and sinking.

Description

Polishing paste for copper plating layer of gravure printing cylinder and preparation method thereof
Technical Field
The invention relates to the field of gravure printing, in particular to polishing paste for a copper-plated layer of a gravure printing cylinder and a preparation method thereof.
Background
The intaglio printing plate is composed of pits corresponding to the original pattern and the surface of the printing plate. When printing, the ink is filled into the pits, the ink on the surface of the printing plate is scraped by the doctor blade, and the printing plate is in certain pressure contact with the printing stock to transfer the ink in the pits to the printing stock, thereby completing printing. Most of the printing plates for the recent intaglio printing are manufactured on the surface of a round cylinder, and a round-to-round printing mode is adopted, wherein an impression cylinder is usually arranged on the upper part, and a printing plate cylinder is arranged on the lower part. The lower portion of the plate cylinder is immersed in an ink tank from which the plate surfaces take ink (also by ink-jet from an ink pump or by ink transfer from an ink roller immersed in the tank). A thin steel sheet scraper is arranged above the ink groove and pressed on the surface of the printing plate cylinder to scrape ink (wiped by a wiping roller rotating reversely) on the non-image-text position on the printing plate surface. The ink retained in the ink holes (or lines) for printing text is transferred to the paper (plastic film, aluminium foil, etc.) passing through the tangent position of two rollers, so printing text. The gravure printing cylinder is generally made of cheap and strong steel or aluminum, then a copper coating which is easy to engrave is attached to the surface of the gravure printing cylinder, and the copper coating is engraved to form a printing plate, and in order to prolong the service life and reduce the abrasion, the copper printing plate is also plated with wear-resistant and corrosion-resistant chromium metal.
The copper coating of the gravure printing cylinder is generally prepared by an electroplating method, although the processing efficiency is high, the problems of fine unevenness of the metal surface, low surface smoothness and the like exist, polishing is required to be carried out before engraving plate making to improve the smoothness, and because the copper coating is thin, the conventional metal surface polishing processes such as oxidation or acid chemical polishing and the like are adopted, the smoothness can not meet the requirements, and the copper coating is easy to damage. The chinese patent application 200580020350.3, which uses electrolysis to polish, has a problem that it is not easy to control the polishing amount although the effect is high. At present, the surface polishing of the copper-electroplated layer of the gravure plate mainly adopts polishing paste for mechanical polishing, the used polishing paste is divided into water-based polishing paste and oil-based polishing paste, the water-based polishing paste takes water as a solvent, is environment-friendly and odorless, has no harm to human bodies, but has larger use amount, general light-emitting performance and easy residual black grease on workpieces. The oily polishing paste has good gloss, small using amount and no residue on the surface of a workpiece, but contains volatile organic solvent and has odor, and the oily polishing paste is harmful to human bodies after being used for a long time. Chinese patent application 201811490670.0 discloses an emulsion type polishing paste for copper layer of gravure and its preparation method, firstly weighing 35% -55% of water, heating to 80 ℃, then adding 1% -4% of octadecanoic acid, 2% -5% of paraffin and 3% -6% of natural grease, after completely dissolving, adding 30% -50% of abrasive and 0.1% -0.5% of auxiliary agent, fully stirring uniformly, and cooling. Wherein the abrasive is 3000-mesh common abrasive such as silicon carbide, brown fused alumina, white fused alumina and the like, and the auxiliary agent is surfactant such as TX-10, OP-10, quaternary ammonium salt, sodium dodecyl sulfate and the like. The emulsion type gravure copper layer polishing paste prepared by the method has the characteristics of small smell and no harm to human bodies of aqueous polishing pastes, and also has the characteristics of good gloss of oily polishing pastes, small using amount, no residue on the surfaces of workpieces and the like. However, in the actual use process, the problems of easy bottom deposition and low polishing efficiency of the abrasive exist, and because the formula selects natural grease which is easy to oxidize and deteriorate, the storage life is too short, and the polishing speed needs to be controlled during use, such as high polishing speed, higher temperature of a copper coating and polishing paste, easy oxidation and deterioration of the natural grease, easy oxidation and blackening of the copper coating and generation of pungent odor, so that the polishing efficiency is low at the same time.
Disclosure of Invention
The invention aims to solve the problems that the abrasive of the existing emulsion type polishing paste for the copper plating layer of the gravure printing cylinder is easy to sink, the storage life is too short, and the polishing efficiency is lower, and provides the polishing paste for the copper plating layer of the gravure printing cylinder, which has the advantages of difficult sinking of the abrasive, long storage life and high polishing efficiency.
The invention discloses a polishing paste for a copper-plated layer of a gravure printing roller, which is characterized by being prepared by mixing 2-15 parts by weight of water-soluble silicone oil, 2-10 parts by weight of stearic acid, 2-10 parts by weight of palmitic acid, 1-4 parts by weight of a thickening agent, 20-50 parts by weight of a first grinding material, 0-20 parts by weight of a second grinding material, 0-40 parts by weight of a third grinding material, 1-5 parts by weight of an emulsifier, 0.1-1 part by weight of an antibacterial agent and 30-50 parts by weight of water.
The thickening agent is one or a composition of more of polyacrylic acid, montmorillonite and quaternary ammonium salt modified montmorillonite. Further, the thickener is preferably a polyacrylic thickener.
The first abrasive is one or a composition of more of ferric oxide red powder with the particle size of 500-2500 meshes and chromium oxide green powder with the particle size of 500-2500 meshes; the second grinding material is one or a combination of several of diamond micro powder with the grain size of 0.2-5 mu m and cubic boron nitride micro powder with the grain size of 0.2-5 mu m. The third grinding material is 30-100 meshes of walnut shell powder.
The emulsifier is one or a combination of a plurality of nonionic surfactants, anionic surfactants and amphoteric surfactants. Further, the emulsifier is preferably a nonionic surfactant.
The antibacterial agent is one or a composition of more of sodium benzoate, methyl isothiazolinone, methyl chloro isothiazolinone and benzisothiazolinone. Furthermore, the kasong compounded by the methylisothiazolinone and the methylchloroisothiazolinone is preferred. The use of the antibacterial agent can prevent the polishing paste from going bad and smelling, and prolong the shelf life.
The water is one of tap water, deionized water and distilled water. Further, deionized water is preferred.
The invention discloses polishing paste for a copper-plated layer of a gravure printing cylinder, which is characterized by comprising the following specific steps of: (1) heating water to 75-90 ℃ according to the proportion, adding stearic acid and palmitic acid, adding an emulsifier after completely dissolving, and uniformly dispersing and mixing; (2) cooling to room temperature to 50 deg.C, adding water-soluble silicone oil, thickener, and antibacterial agent, and mixing; (3) adding the first grinding material, the second grinding material and the third grinding material under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
The polishing paste disclosed by the invention is used for polishing a copper-plated layer of a gravure printing cylinder, has high polishing efficiency and good finish, can be stored for a long time, and is not easy to deteriorate and sink.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications can be made by one skilled in the art after reading the teachings of the present invention, and such equivalents will still fall within the scope of the invention as defined in the appended claims.
Example 1
The formula (weight portion ratio) is as follows: 10 parts of QC101 water-soluble silicone oil, 8 parts of stearic acid, 5 parts of palmitic acid, 3 parts of 934 polyacrylic acid thickener, 30 parts of 800-mesh ferric oxide red powder, 5 parts of 0.5 mu m diamond micro powder, 2 parts of AE09 nonionic surfactant, 0.3 part of Proxel CRL antibacterial agent and 40 parts of deionized water.
The preparation method comprises the following specific steps: (1) heating the ionized water to 80 ℃ according to the proportion, adding stearic acid and palmitic acid, adding AE09 nonionic surfactant after completely dissolving, and dispersing and mixing uniformly; (2) cooling to 45 deg.C, adding QC101 water-soluble silicone oil, C-1076 polyacrylic acid thickener, and Proxel CRL antibacterial agent, and mixing; (3) adding 30 parts of ferric oxide red powder with the particle size of 800 meshes and diamond micro powder with the particle size of 0.5 mu m under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
Example 2
The formula (weight portion ratio) is as follows: 12 parts of TS-19 water-soluble silicone oil, 8 parts of stearic acid, 8 parts of palmitic acid, 1 part of 934 polyacrylic acid thickener, 1 part of SD-1 quaternary ammonium salt modified montmorillonite thickener, 20 parts of 600-mesh ferric oxide red powder, 15 parts of 800-mesh chromium oxide green powder, 4 parts of 1.5-mu m diamond micropowder, 2 parts of 1-mu m cubic boron nitride micropowder, 20 parts of 50-mesh walnut shell powder, 1 part of 6501 nonionic surfactant, 1 part of T-C6 amphoteric surfactant, 0.2 part of antibacterial agent kasong and 45 parts of deionized water.
The preparation method comprises the following specific steps: (1) heating deionized water to 75 ℃ according to the proportion, adding stearic acid and palmitic acid, adding 6501 nonionic surfactant and T-C6 amphoteric surfactant after completely dissolving, and uniformly dispersing and mixing; (2) cooling to 40 deg.C, adding TS-19 water soluble silicone oil, 934 polyacrylic acid thickener, SD-1 quaternary ammonium salt modified montmorillonite thickener, and antibacterial agent Kathon, and mixing; (3) adding iron sesquioxide red powder with the particle size of 600 meshes, chromium sesquioxide green powder with the particle size of 800 meshes, diamond micro powder with the particle size of 1.5 mu m, cubic boron nitride micro powder with the particle size of 1 mu m and walnut shell powder with the particle size of 50 meshes under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
Example 3
The formula (weight portion ratio) is as follows: 8 parts of M-601 water-soluble silicone oil, 6 parts of stearic acid, 5 parts of palmitic acid, 1.5 parts of C-1076 polyacrylic acid thickener, 15 parts of ferric oxide red powder with the particle size of 1000 meshes, 30 parts of chromium oxide green powder with the particle size of 800 meshes, 3 parts of amphoteric surfactant lecithin, 0.5 part of sodium benzoate antibacterial agent and 35 parts of distilled water.
The preparation method comprises the following specific steps: (1) heating distilled water to 85 deg.C, adding stearic acid and palmitic acid, dissolving completely, adding amphoteric surfactant lecithin, and dispersing and mixing; (2) cooling to room temperature, adding M-601 water soluble silicone oil, C-1076 polyacrylic acid thickener and sodium benzoate antibacterial agent, and mixing; (3) adding ferric oxide red powder with the particle size of 1000 meshes and chromium oxide green powder with the particle size of 800 meshes under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
Example 4
The formula (weight portion ratio) is as follows: 9 parts of TS-19 water-soluble silicone oil, 5 parts of stearic acid, 6 parts of palmitic acid, 934 polyacrylic acid thickener, 40 parts of chromium oxide green powder with the particle size of 1200 meshes, 25 parts of walnut shell powder with the particle size of 50 meshes, 1 part of AES anionic surfactant, 0.3 part of antibacterial agent kasong and 38 parts of tap water.
The preparation method comprises the following specific steps: (1) heating water to 80 ℃ according to the proportion, adding stearic acid and palmitic acid, adding AES anionic surfactant after all the stearic acid and the palmitic acid are dissolved, and uniformly dispersing and mixing; (2) cooling to 45 deg.C, adding TS-19 water-soluble silicone oil and antibacterial agent kasong, and mixing; (3) adding green chromium oxide powder with particle size of 1200 meshes and walnut shell powder with particle size of 50 meshes under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
Example 5
The formula (weight portion ratio) is as follows: 11 parts of SM-601 water-soluble silicone oil, 6 parts of stearic acid, 5 parts of palmitic acid, 1.5 parts of 934 polyacrylic acid thickener, 35 parts of chromium oxide green powder with the particle size of 800 meshes, 6 parts of boron nitride micro powder with the particle size of 1 mu m, 25 parts of walnut shell powder with the particle size of 80 meshes, 2 parts of AES anionic surfactant, 0.2 part of antibacterial agent kasong and 50 parts of deionized water.
The preparation method comprises the following specific steps: (1) heating deionized water to 85 ℃ according to the proportion, adding stearic acid and palmitic acid, adding AES anionic surfactant after all the stearic acid and the palmitic acid are dissolved, and uniformly dispersing and mixing; (2) cooling to room temperature, adding SM-601 water-soluble silicone oil and antibacterial agent kasong, and mixing; (3) adding green chromium oxide powder with the particle size of 800 meshes, boron nitride micro powder with the particle size of 1 mu m and walnut shell powder with the particle size of 80 meshes under high-speed stirring, and uniformly mixing; (4) cooling, and packaging.
The inventive example was tested in comparison with comparative example 1 (chinese patent application 201811490670.0 example 1) and comparative example 2 (aqueous polishing paste), and the test results are as follows:
sample name Degree of gloss Dosage of Polishing time Residue is remained Stored for 12 months for observation
Comparative example 1 761 100g/m2 45 minutes Has no residue Has peculiar smell, serious bottom sinking and difficult uniform stirring
Comparative example 2 670 150 g/m2 120 minutes Plate head whole circle remains Has peculiar smell, serious bottom sinking and difficult uniform stirring
Example 1 780 40g/m2 35 minutes Has no residue No peculiar smell and no bottom
Example 2 782 35g/m2 28 minutes Has no residue No peculiar smell and no bottom
Example 3 768 98g/m2 40 minutes Has no residue No peculiar smell, slightly sinking bottom and easy stirring
Example 4 768 95g/m2 40 minutes Has no residue No peculiar smell, slightly sinking bottom and easy stirring
Example 5 780 30g/m2 25 minutes Has no residue No peculiar smell and no bottom
As can be seen from the above table, the polishing paste disclosed by the invention for polishing the copper-plated layer of the gravure printing cylinder has the advantages of high polishing efficiency, good smoothness, long-term storage and difficult deterioration and bottom sinking.

Claims (8)

1. The polishing paste is characterized by being prepared by mixing 2-15 parts by weight of water-soluble silicone oil, 2-10 parts by weight of stearic acid, 2-10 parts by weight of palmitic acid, 1-4 parts by weight of a thickening agent, 20-50 parts by weight of a first abrasive, 0-20 parts by weight of a second abrasive, 0-40 parts by weight of a third abrasive, 1-5 parts by weight of an emulsifier, 0.1-1 part by weight of an antibacterial agent and 30-50 parts by weight of water.
2. The polishing paste for copper-plating layers of gravure cylinders according to claim 1, wherein the thickener is one or a combination of polyacrylic acid, montmorillonite, and quaternary ammonium salt modified montmorillonite.
3. The polishing paste for copper plating layers of gravure printing cylinders according to claim 1, wherein the first abrasive is one or a combination of several of red iron trioxide powder having a particle size of 500 to 2500 mesh and green chromium trioxide powder having a particle size of 500 to 2500 mesh.
4. The polishing paste for a copper-plating layer of a gravure printing cylinder according to claim 1, wherein the second abrasive is one or a combination of diamond micro powder having a particle size of 0.2 to 5 μm and cubic boron nitride micro powder having a particle size of 0.2 to 5 μm.
5. The copper-plating layer polishing paste for the gravure cylinder according to claim 1, wherein the third abrasive is walnut shell powder having a particle size of 30 to 100 mesh.
6. The polishing paste for copper-plated layer of gravure cylinder according to claim 1, wherein the emulsifier is one or more selected from the group consisting of nonionic surfactant, anionic surfactant and amphoteric surfactant.
7. The polishing paste for copper plating layer of gravure cylinder according to claim 1, wherein said antibacterial agent is one or a combination of sodium benzoate, methylisothiazolinone, methylchloroisothiazolinone, and benzisothiazolinone.
8. The copper-plating layer polishing paste for the gravure printing cylinder according to claim 1 is prepared by the following specific steps:
(1) heating water to 75-90 ℃ according to the proportion, adding stearic acid and palmitic acid, adding an emulsifier after completely dissolving, and uniformly dispersing and mixing;
(2) cooling to room temperature to 50 deg.C, adding water-soluble silicone oil, thickener, and antibacterial agent, and mixing;
(3) adding the first grinding material, the second grinding material and the third grinding material under high-speed stirring, and uniformly mixing;
(4) cooling, and packaging.
CN202010643049.4A 2020-07-07 2020-07-07 Polishing paste for copper plating layer of gravure printing cylinder and preparation method thereof Pending CN111621232A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113000344A (en) * 2021-03-03 2021-06-22 湖北觉辰工艺有限公司 Preparation method of gilded copper statue

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1041000A (en) * 1989-08-23 1990-04-04 刘梦时 High effective polishing paste for non-ferrous metal and preparation method
CN1357585A (en) * 2000-12-04 2002-07-10 拜尔公司 Chemical and mechanical polishing paste for metal and dielectric structure
CN101176983A (en) * 2007-11-28 2008-05-14 浙江工业大学 Semi-fixing abrasive grain polishing method of brass sheet substrate
CN103773246A (en) * 2012-10-22 2014-05-07 宁波运通化工科技有限公司 Liquid polishing wax composition
CN104830237A (en) * 2015-05-19 2015-08-12 中国人民解放军第五七一九工厂 Ointment composition for bronze part grinding and polishing
CN109370442A (en) * 2018-12-07 2019-02-22 东莞市同欣表面处理科技有限公司 A kind of intaglio plate layers of copper special-purpose polishing cream
CN110643219A (en) * 2019-11-14 2020-01-03 云南开放大学 Gravure ink for printing PET aluminum-plated film

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1041000A (en) * 1989-08-23 1990-04-04 刘梦时 High effective polishing paste for non-ferrous metal and preparation method
CN1357585A (en) * 2000-12-04 2002-07-10 拜尔公司 Chemical and mechanical polishing paste for metal and dielectric structure
CN101176983A (en) * 2007-11-28 2008-05-14 浙江工业大学 Semi-fixing abrasive grain polishing method of brass sheet substrate
CN103773246A (en) * 2012-10-22 2014-05-07 宁波运通化工科技有限公司 Liquid polishing wax composition
CN104830237A (en) * 2015-05-19 2015-08-12 中国人民解放军第五七一九工厂 Ointment composition for bronze part grinding and polishing
CN109370442A (en) * 2018-12-07 2019-02-22 东莞市同欣表面处理科技有限公司 A kind of intaglio plate layers of copper special-purpose polishing cream
CN110643219A (en) * 2019-11-14 2020-01-03 云南开放大学 Gravure ink for printing PET aluminum-plated film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113000344A (en) * 2021-03-03 2021-06-22 湖北觉辰工艺有限公司 Preparation method of gilded copper statue

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