CN111618665B - High-efficiency low-damage processing method and processing device - Google Patents
High-efficiency low-damage processing method and processing device Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 232
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- 239000000463 material Substances 0.000 claims abstract description 88
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- 238000004148 unit process Methods 0.000 claims abstract description 3
- 238000003754 machining Methods 0.000 claims description 43
- 238000000227 grinding Methods 0.000 claims description 13
- 238000003801 milling Methods 0.000 claims description 8
- 238000007514 turning Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 230000003902 lesion Effects 0.000 claims description 2
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- 230000002500 effect on skin Effects 0.000 abstract description 7
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
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Abstract
The invention discloses a high-efficiency low-damage processing method and a processing device, wherein the high-efficiency low-damage processing method comprises the steps of arranging a workpiece and a processing unit, wherein the processing unit processes the workpiece at a preset processing speed which is not lower than the processing speed corresponding to the embrittlement of materials of the workpiece; the high-efficiency low-damage processing device is used for executing the high-efficiency low-damage processing method and comprises a base used for installing a workpiece and a processing unit and a driving unit connected with the processing unit and used for driving the processing unit to a preset processing speed. According to the invention, the skin effect of sub-surface damage caused by embrittlement of workpiece materials is caused by setting the processing speed of the processing unit in the processing process, and the damage depth of the workpiece tends to be shallow, so that the damage depth of the workpiece is reduced, the integrity of the workpiece is ensured, and the processing quality and the processing efficiency are improved.
Description
Technical Field
The invention relates to the technical field of material processing, in particular to a high-efficiency low-damage processing method and a processing device.
Background
The plastic material, the hard and brittle material, the composite material and other materials have good mechanical and physical properties and are widely applied to the fields of aerospace, national defense, semiconductors, automobiles, cutting tools and the like. The material is difficult to process, and the processing process has the defects of low processing efficiency, low precision and poor quality.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a high-efficiency low-damage processing method which can reduce the damage degree in the material processing process.
The invention also provides a high-efficiency low-damage processing device for executing the high-efficiency low-damage processing method.
In a first aspect, an embodiment of the present invention provides a high-efficiency low-damage processing method, including:
setting a workpiece and a processing unit;
and the processing unit processes the workpiece at a preset processing speed, wherein the preset processing speed is not lower than the processing speed corresponding to embrittlement of the workpiece.
The high-efficiency low-damage processing method in the embodiment of the invention at least has the following beneficial effects:
in the embodiment of the invention, the workpiece is processed at the preset processing speed by the processing unit, so that the workpiece is embrittled, the skin effect of subsurface damage is caused, and the damage depth of the workpiece tends to be shallow, so that the damage depth of the workpiece is reduced, the integrity of the workpiece is ensured, and the processing quality and the processing efficiency are improved.
According to other embodiments of the invention, the preset processing speed is a processing speed corresponding to material embrittlement of the material or plastic components in the material, or is not lower than 150 m/s.
According to other embodiments of the invention, the workpiece is machined by one or more of grinding, turning and milling.
According to the high-efficiency low-damage machining method of the other embodiments of the invention, the workpiece is repeatedly machined for a plurality of times, and the machining depth of the machining unit is different every time.
According to the high-efficiency low-damage machining method of the other embodiments of the invention, the workpiece is repeatedly machined for a plurality of times, and the machining depth of the machining unit is gradually reduced.
According to other embodiments of the invention, the workpiece is repeatedly processed for a plurality of times, and the grain size of the processing units is gradually reduced.
According to other embodiments of the present invention, a high-efficiency low-damage machining method is provided in which the workpiece is machined while being ultrasonically vibrated.
In a second aspect, an embodiment of the present invention provides a high-efficiency low-damage processing apparatus for performing the above-mentioned high-efficiency low-damage processing method, including:
a base for mounting the workpiece and the processing unit;
and the driving unit is connected with the processing unit and is used for driving the processing unit to reach the preset processing speed.
The high-efficiency low-damage processing device in the embodiment of the invention at least has the following beneficial effects:
in the embodiment of the invention, the driving unit is used for driving the processing unit to increase the processing speed of the processing unit, so that the damage depth of the workpiece is kept on the surface layer, and the damage depth of the machined subsurface of the material is reduced, thereby improving the processing quality of the workpiece.
According to other embodiments of the present invention, a high efficiency low damage processing apparatus further comprises an ultrasonic unit coupled to the processing unit to ultrasonically vibrate the processing unit.
According to other embodiments of the invention, the high-efficiency low-damage processing device further comprises a detection element for detecting the processing speed of the processing unit.
Drawings
FIG. 1 is a schematic flow chart of a material processing method in an embodiment of the present invention;
FIG. 2 is a fitted curve of material strain rate versus change in brittleness of the material;
FIG. 3 is a fitted curve of material strain rate versus material damage depth;
fig. 4 is a schematic structural view of a material processing apparatus according to an embodiment of the present invention.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the embodiments of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, if a feature is referred to as being "disposed", "fixed", "connected", or "mounted" to another feature, it may be directly disposed, fixed, or connected to the other feature or may be indirectly disposed, fixed, connected, or mounted to the other feature. In the description of the embodiments of the present invention, if "a number" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "greater than", "lower" or "inner" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
Referring to fig. 1, an embodiment of the present invention provides a high-efficiency low-damage processing method, including the following processing steps:
firstly, setting a workpiece to be processed and a processing unit for processing the workpiece;
and then, processing the workpiece by the processing unit at a preset processing speed which is not lower than a processing speed corresponding to the embrittlement of the material of the workpiece.
It is noted that, during high-speed working of a material, internal defects of the material are activated under impact load, resulting in nucleation, propagation and interdigitation of microcracks, and more cracks are generated in the surface layer of the material, resulting in embrittlement of the material. The material resistance of the crack tip generated by the material can be increased along with the increase of the strain rate, the crack is prevented from expanding, the damage depth of the surface of the material is reduced, and therefore the skin effect of subsurface damage is caused by material embrittlement. Fig. 2 lists several fitting curves of material damage depth and material brittleness change, where the horizontal axis of the coordinate is the material brittleness change degree, and the vertical axis of the coordinate is the material damage depth, and it can be seen that as the processing speed or strain rate increases, the material brittleness increases, and the subsurface damage induced by processing is only distributed on the shallow surface layer of the workpiece, so as to reduce the damage depth of the material in the processing process and improve the processing efficiency.
In addition, by fitting a relation curve between the subsurface damage depth and the strain rate of the material, referring to fig. 3, the horizontal axis represents the material strain rate, and the vertical axis represents the subsurface damage depth of the material, and mathematically, the relationship between the subsurface damage depth and the strain rate of the material is:
the relationship between the processing speed of a material and the strain rate of the material is:
where δ represents the depth of the lesion, k1，k2And d epsilon/dt is a dimensionless parameter, the material strain rate of the workpiece and v is the processing speed of the workpiece.
As can be seen from equation (2), the strain rate of the material is directly proportional to the machining speed, and an increase in the speed of the machining unit results in an increase in the strain rate of the workpiece material. k is a radical of2The method is related to the size of the material and the processing depth and can be calculated through a derivation formula.
From the formula (1), it can be seen that the subsurface damage depth of the material is in direct proportion to the negative index of the strain rate, that is, the subsurface damage depth of the workpiece decreases with the increase of the processing speed and gradually approaches to the surface layer, so that the skin effect of the subsurface damage of the workpiece is realized, the subsurface damage of the workpiece can be reduced by increasing the processing speed, the processing efficiency of the workpiece is improved, and the processing quality is optimized.
The skin effect is an inherent characteristic of engineering material damage, namely, in the loading process of a workpiece with high strain rate, the damage (such as cracks, dislocation, phase change) of the material is concentrated in a local loading area and does not expand in a large range, so that in the material processing process, the subsurface damage depth is reduced along with the increase of the processing speed or the strain rate. The preset processing speed is a processing speed corresponding to material embrittlement of the workpiece, and the preset processing speed is a processing speed corresponding to material embrittlement of the workpiece aiming at a plastic material; aiming at hard and brittle materials, the conventional ultra-high speed processing speed (the processing speed is more than 150 m/s) is adopted; for composite materials, this refers to the processing speed at which the plastic components in the material undergo material embrittlement.
The skin effect of material damage exists in the processing of hard and brittle materials, plastic materials, composite materials and other materials. It is noted that the workpiece materials to which the present invention is directed include hard and brittle materials, plastic materials, composite materials, and the like. In the processing process of the hard and brittle material, along with the increase of the processing speed, the brittleness index is increased, the processed cutting chip is gradually reduced, the subsurface damage density is increased, and the depth is reduced; aiming at plastic materials, the plastic deformation of the materials is restrained by the ultra-high speed processing, the materials are removed in a brittle failure mode, the temperature of a processing area is reduced, and the thickness of a deteriorated layer on the surface of a workpiece is reduced. The material is in a high strain rate state in the ultra-high speed machining process, and the brittleness index of the hard and brittle material can be improved or the brittleness index of the plastic material can be realized by utilizing the strain rate hardening effect in the machining process, so that the subsurface damage depth of the workpiece machining is reduced by the skin effect of causing the subsurface damage of the workpiece.
The processing speed corresponding to the embrittlement of the plastic component in the plastic material or the composite material can be judged by observing the shape of the machined chip of the material at different processing speeds (processing strain rates), the section appearance of the chip, the surface hardening degree of the workpiece, the surface quality of the workpiece and the like, so as to judge that the material is in a plastic failure state or a brittle failure state. For example, in the plastic material, as the processing speed increases during processing, the processed chip is converted from continuous to discontinuous, and the chip has the characteristic of brittle fracture, at which point the workpiece is subjected to material embrittlement, so that the processing state of the workpiece is represented by the form of the chip.
In the case of normal low speed processing, the plastic material is removed in the form of a continuous strip of chips, while the brittle material is broken. As the processing speed increases, the plastic material becomes brittle and the chips become jagged or broken from a continuous ribbon. Taking 7050-T7451 aluminum alloy as an example, the aluminum alloy is a plastic material, and when the aluminum alloy is machined at a cutting speed of 1257m/min, chips are obviously jagged, and the aluminum alloy is embrittled.
The embrittlement of the workpiece material is related to factors such as the processing temperature of the workpiece, the processing load applied by the processing unit, the processing depth, the processing speed, the performance of the workpiece, and the like, and the processing speed corresponding to the embrittlement speed of the workpiece material can be obtained through experiments by fixing other parameters and adjusting the processing speed of the processing unit.
Before the workpiece is machined, the machining unit and/or the workpiece can be positioned, so that the machining unit can machine at the preset machining depth and the corresponding machining position of the workpiece, and the machining precision is guaranteed. The processing mode of the processing unit for the workpiece can be selected according to the specific processing technology of the workpiece, such as grinding, turning, milling and the like, and the type of the processing unit can also be selected according to the specific processing technology of the workpiece, such as a grinding wheel, a turning tool, a milling cutter and the like. The processing speed of the processing unit may refer to a moving speed, a feeding speed, a rotating speed, etc. of the processing unit with respect to the workpiece.
The processing mode of the processing unit for the workpiece can adopt a mode that the processing unit moves, rotates or combines the movement and the rotation relative to the workpiece; for example, the processing unit is set as a milling cutter, and the milling cutter moves relative to the workpiece according to a preset track so as to mill the workpiece; or the processing unit is set as a turning tool, and the turning tool is gradually fed relative to the workpiece to realize the turning of the workpiece; or the processing unit is set as a grinding wheel, the edge of the grinding wheel is provided with a grinding edge, and when the grinding wheel rotates and moves relative to the workpiece, continuous grinding force is applied to the workpiece, so that the workpiece is ground. The machining method provided by the embodiment is wide in application range, and can be used for machining the workpiece by selecting a corresponding machining mode according to different machining requirements.
The processing depth of the workpiece has an upper limit, when the processing depth of the workpiece is large, if the preset processing depth is reached by only performing single processing, the damage degree of the workpiece is serious, the processed workpiece is extremely easy to damage, and in order to meet the process requirements of the processing depth and the processing quality of the workpiece, the workpiece needs to be circularly processed for multiple times and gradually fed to the preset thickness.
Specifically, according to the machining depth requirement of the workpiece, a single machining depth is set, and the workpiece is machined successively until a preset machining depth is reached. The single processing means that the processing unit finishes processing the whole surface to be processed of the workpiece on the premise of the preset processing depth. According to the self-property of the material and the specific processing depth requirement, the processing unit can set different processing depths each time, so that the processing depths are suitable for the current workpiece processing situation, and the flexibility of workpiece processing is improved; according to the principle of rough machining and finish machining, a larger machining depth can be set firstly, and the machining depth is reduced step by step along with the increase of machining times, so that the damage depth of the surface of the workpiece is reduced and the surface quality of the workpiece is improved on the premise of ensuring that the workpiece has enough machining depth; in addition, different processing workpieces can be selected for different processing depths to be executed, for example, after a cutter is adopted to cut a certain thickness, the workpiece is ground, so that both the processing efficiency and the processing quality are considered.
In actual production, processing units with different granularities and hardness can be selected to process the workpiece according to the specific processing requirements of the workpiece, wherein the granularity refers to the size of grains used for mainly processing the workpiece in the processing units; the smaller the granularity of the processing unit is, the smaller the damage depth of the workpiece is, the larger-granularity processing unit can realize rough processing of the workpiece, can quickly eliminate the defects on the surface of the workpiece or damage caused in the previous working procedure, and ensures that the surface of the workpiece has certain flatness; the machining unit with smaller granularity can realize finish machining of the workpiece, ensure the integrity and the smoothness of the surface of the workpiece and reduce subsequent machining procedures and machining time. In this embodiment, the workpiece is repeatedly processed for a plurality of times, and the particle size of the processing unit is reduced step by step, so as to ensure the processing efficiency of the workpiece and the surface quality of the workpiece.
In order to further optimize the processing quality of the workpiece, a processing unit with smaller granularity can be selected, the processing speed of the processing unit is improved, the processing speed does not exceed the processing speed corresponding to embrittlement of workpiece materials, and the single processing depth is reduced, so that high-efficiency low-damage processing is realized, and the surface quality of the workpiece is improved.
In another embodiment, in the process of processing the workpiece, the ultrasonic vibration unit is added, so that the grinding force can be reduced, and the stability of a processing system is improved; the friction force between the cutter and the workpiece can be reduced, the generation of grinding heat is reduced, and the problem of workpiece surface burn is reduced or avoided; the surface roughness of the workpiece can be reduced, and the surface processing quality of the workpiece is improved.
Referring to fig. 4, an embodiment of the present invention further provides a high-efficiency low-damage processing apparatus for performing the above material processing method, the material processing apparatus includes a base 100 and a driving unit 200, the base 100 is used for mounting a workpiece 300 and a processing unit 400, and the base 100 provides an operation platform for the movement of the processing unit 400 and the processing of the workpiece 300; the driving unit 200 is connected to the processing unit 400 and provides power support to the processing unit 400 so that the processing unit 400 processes the workpiece 300 at a preset processing speed.
The driving unit 200 drives the processing unit 400 to increase the processing speed of the processing unit 400, so that the damage depth of the workpiece 300 is kept on the surface layer, high-efficiency low-damage processing is realized, and the workpiece 300 is prevented from being embrittled and damaged to influence the surface integrity of the workpiece 300 by limiting the processing speed of the processing unit 400.
The processing unit 400 is movable and/or rotatable relative to the workpiece 300, and the driving unit 200 may be one or more of a motor, a cylinder, and the like, so as to realize the movement and/or rotation of the processing unit 400 relative to the workpiece 300. The type of the processing unit 400 can be selected according to actual use requirements, such as a grinding wheel, a turning tool, a milling cutter and the like.
The base 100 may be provided with a fixture for clamping or fixing the workpiece 300, so that the workpiece 300 is kept in a stationary state during the processing, thereby improving the processing precision. The jig may be a table for providing a placement plane for the workpiece 300, a jig capable of attracting the workpiece 300, a robot capable of holding the workpiece 300, or the like. The jig can be provided with a plurality of workpieces 300 at one time, so that the processing unit 400 can process the plurality of workpieces 300 once, and the processing efficiency of the processing device is improved.
The base 100 may further have a first moving module 110 mounted thereon, and the clamp is mounted on the first moving module 110 and driven by the first moving module 110 to move, so as to facilitate positioning between the processing unit 400 and the workpiece 300, and enable the processing unit 400 to process different regions of the workpiece 300. The first moving module 110 may be provided with at least two moving assemblies, and the extending directions of the moving guide rails in different moving assemblies are different, so that the workpiece 300 can be adjusted in different directions.
The base 100 can be further provided with a second moving module 120, the second moving module 120 can drive the processing unit 400 to move in the vertical direction, so that the processing unit 400 can be close to the workpiece 300 for feeding, or away from the workpiece 300 to avoid the movement of the workpiece 300, and the processing depth of the processing unit 400 on the workpiece 300 can be adjusted through the movement of the processing unit 400 in the vertical direction, so that the processing device can adapt to different processing requirements; the second moving module 120 may further include a plurality of moving assemblies, and the processing unit 400 is mounted on the moving assemblies, and can be driven by the moving assemblies to perform position adjustment in a horizontal plane, so as to move the processing unit 400 relative to the workpiece 300, so that the processing unit 400 can process different regions of the workpiece 300.
The first moving module 110 and the second moving module 120 may be selected from existing automatic or manual moving modules on the premise of satisfying the moving requirements of the processing unit 400 and the workpiece 300.
In another embodiment, the driving unit 200 is further provided with an ultrasonic unit 130, the processing unit 400 generates ultrasonic vibration under the influence of the ultrasonic unit 130, and the ultrasonic vibration assists the processing unit 400 in processing the workpiece 300, so that the problem of surface burning of the workpiece 300 can be effectively reduced or avoided, and the surface processing quality of the workpiece 300 can be improved.
The base 100 may further be provided with a detecting element for detecting the processing parameter of the processing unit 400, for example, a displacement sensor is provided to detect the processing depth of the processing unit 400, a pressure sensor is provided to test the acting force applied to the workpiece 300 by the processing unit 400, a speed sensor is provided to detect the processing speed of the processing unit 400, and the like, so as to obtain the real-time processing parameter of the processing unit 400 and ensure the processing precision of the workpiece 300.
The high-efficiency low-damage processing device can be applied to processing equipment such as lathes, milling machines, grinding machines and the like, so that the workpiece 300 can meet different processing requirements, and the processing quality of the workpiece 300 in different processing environments is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (9)
1. A high-efficiency low-damage processing method is characterized by comprising the following steps:
setting a workpiece and a processing unit;
according to
And
where δ represents the depth of the lesion, k1，k2Is a dimensionless parameter, d epsilon/dt is a material of a workpieceThe material strain rate v is the processing speed of the workpiece;
the processing unit processes the workpiece at a preset processing speed, and aiming at the plastic material, the preset processing speed is not lower than the processing speed corresponding to embrittlement of the workpiece material; aiming at the composite material, the preset processing speed is not lower than the processing speed corresponding to the embrittlement of the plastic component in the workpiece material; and aiming at the hard and brittle materials, the preset processing speed is not lower than 150 m/s.
2. A high efficiency and low damage machining method as claimed in claim 1, wherein the workpiece is machined by one or more of grinding, turning and milling.
3. The high-efficiency low-damage machining method according to any one of claims 1 to 2, characterized in that the machining is repeated a plurality of times for the workpiece, and a machining depth of the machining unit is different each time.
4. The high-efficiency low-damage processing method according to any one of claims 1 to 2, wherein the processing is repeated a plurality of times on the workpiece, and a processing depth of the processing unit is gradually decreased.
5. A high-efficiency low-damage machining method according to any one of claims 1 to 2, characterized in that the machining is repeated a plurality of times on the workpiece, and the grain size of the machining unit is gradually decreased.
6. A high-efficiency low-damage machining method according to any one of claims 1 to 2, characterized in that the workpiece is machined while ultrasonic vibration is performed.
7. The high-efficiency low-damage processing apparatus for performing the high-efficiency low-damage processing method according to any one of claims 1 to 6, comprising:
a base for mounting the workpiece and the processing unit;
and the driving unit is connected with the processing unit and is used for driving the processing unit to reach the preset processing speed.
8. A high efficiency low damage processing apparatus according to claim 7, further comprising an ultrasonic unit connected to said processing unit for ultrasonically vibrating said processing unit.
9. A high efficiency low damage processing apparatus according to claim 7, further comprising a detecting element for detecting a processing speed of said processing unit.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010426289.9A CN111618665B (en) | 2020-05-19 | 2020-05-19 | High-efficiency low-damage processing method and processing device |
| JP2022552329A JP2023516642A (en) | 2020-05-19 | 2020-11-27 | High-efficiency low-damage processing method and processing equipment |
| US17/802,283 US20230143368A1 (en) | 2020-05-19 | 2020-11-27 | Machining method and machining device improving machining efficiency and preserving workpiece surface integrity |
| EP20937035.2A EP4155024A4 (en) | 2020-05-19 | 2020-11-27 | Machining method and machining device having high efficiency and low damage |
| PCT/CN2020/132300 WO2021232735A1 (en) | 2020-05-19 | 2020-11-27 | Machining method and machining device having high efficiency and low damage |
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| CN202010426289.9A CN111618665B (en) | 2020-05-19 | 2020-05-19 | High-efficiency low-damage processing method and processing device |
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| Publication Number | Publication Date |
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| CN111618665A CN111618665A (en) | 2020-09-04 |
| CN111618665B true CN111618665B (en) | 2022-03-29 |
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| US (1) | US20230143368A1 (en) |
| EP (1) | EP4155024A4 (en) |
| JP (1) | JP2023516642A (en) |
| CN (1) | CN111618665B (en) |
| WO (1) | WO2021232735A1 (en) |
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| CN111618665A (en) | 2020-09-04 |
| JP2023516642A (en) | 2023-04-20 |
| EP4155024A1 (en) | 2023-03-29 |
| US20230143368A1 (en) | 2023-05-11 |
| WO2021232735A1 (en) | 2021-11-25 |
| EP4155024A4 (en) | 2023-11-15 |
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