CN111615267B - Preparation method for preparing biodegradable electronic device by printing electronic technology - Google Patents
Preparation method for preparing biodegradable electronic device by printing electronic technology Download PDFInfo
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- CN111615267B CN111615267B CN202010426641.9A CN202010426641A CN111615267B CN 111615267 B CN111615267 B CN 111615267B CN 202010426641 A CN202010426641 A CN 202010426641A CN 111615267 B CN111615267 B CN 111615267B
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- 238000007639 printing Methods 0.000 title claims abstract description 55
- 238000005516 engineering process Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000002105 nanoparticle Substances 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000011701 zinc Substances 0.000 claims description 17
- 229910052725 zinc Inorganic materials 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000005543 nano-size silicon particle Substances 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000498 ball milling Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims description 6
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 3
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000004448 titration Methods 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- 239000012776 electronic material Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 16
- 239000012212 insulator Substances 0.000 abstract description 7
- 239000002070 nanowire Substances 0.000 abstract description 6
- 239000002086 nanomaterial Substances 0.000 abstract description 3
- 229920000620 organic polymer Polymers 0.000 abstract description 2
- 239000002861 polymer material Substances 0.000 abstract description 2
- 239000002055 nanoplate Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 description 12
- 239000002135 nanosheet Substances 0.000 description 3
- 238000002560 therapeutic procedure Methods 0.000 description 3
- 238000000015 thermotherapy Methods 0.000 description 3
- 108010022355 Fibroins Proteins 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000003760 magnetic stirring Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002064 nanoplatelet Substances 0.000 description 2
- 229920001606 poly(lactic acid-co-glycolic acid) Polymers 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000007281 self degradation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/04—Printing inks based on proteins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Abstract
The invention discloses a preparation method for preparing a biodegradable electronic device by a printing electronic technology, and belongs to the technical fields of engineering materials, printing electronic materials, biodegradable electronic devices and flexible electronic device preparation. The method involves dispersing traditional biodegradable nanomaterials (including conductors, semiconductors, insulators, etc.), such as nanoparticles, nanowires, nanoplates, etc., in biodegradable organic polymer materials to form functional printing ink applicable to printing electronics, and is particularly suitable for the preparation of low-cost and large-scale biodegradable electronic device machine systems.
Description
Technical Field
The invention discloses a preparation method for preparing a biodegradable electronic device by a printing electronic technology, and belongs to the technical fields of engineering materials, printing electronic materials, biodegradable electronic devices and flexible electronic preparation.
Background
In recent years, biodegradable electronic devices and systems have received attention because of their pollution-free and degradable properties. Unlike the long-term, stable requirements of conventional silicon-based microelectronics, biodegradable electronics are capable of self-degradation after they fulfill their specified functions. Biodegradable electronic devices have the unique advantage of being a biomedical device, particularly an implantable electronic device. After the life body is implanted and the functions of detection, treatment and the like are finished, the electronic device can be automatically degraded without taking out the life body after secondary operation, so that the pain, operation risk, medical cost and the like of a patient are greatly reduced. In the aspect of environmental protection, the biodegradable electronic device does not need additional tissues or personnel to carry out independent degradation treatment on the biodegradable electronic device, thereby being beneficial to the protection of ecological environment.
At present, the preparation technology for realizing the biodegradable electronic device and system is mainly based on the traditional silicon-based microelectronic preparation technology, and involves the process steps of material patterning, dry/wet etching, material evaporation and the like, and finally the prepared device or circuit is transferred to a degradable substrate. Although the method has higher maturity, the method still has the problems of high equipment cost, complex and tedious process steps and the like. Therefore, how to manufacture biodegradable electronic devices with low cost and high efficiency is the key for further development. Printing electronics is a more viable solution for the current fabrication of functional electronic devices and circuits, mainly using fast, efficient, low cost printing/printing techniques to directly form conductive loops or patterns on a substrate. Theoretically, any existing functional electronic circuit or system can be implemented using printed electronics. In view of this, it becomes necessary to prepare biodegradable electronic devices and systems using well-established printed electronics.
Disclosure of Invention
In view of the above technical background, an object of the present invention is to provide a method for preparing a biodegradable electronic device by printing electronic technology, which is particularly suitable for preparing a low-cost and large-scale biodegradable electronic device machine system by dispersing conventional biodegradable nano materials (including conductors, semiconductors, insulators, etc.), such as nano particles, nano wires, nano sheets, etc., in a biodegradable organic polymer material to form a functional printing ink applicable to the printing electronic technology.
To achieve the above and other related objects, the present invention provides a method for preparing a biodegradable electronic device by printing electronic technology, the method comprising the steps of:
s1, providing a biodegradable electronic material, wherein the electronic material comprises a semiconductor, a conductor, an insulator and the like; providing an organic solvent, wherein the organic solvent is a biodegradable material;
s2, dispersing the biodegradable electronic material in a biodegradable organic solvent to form uniform and stable printing ink;
and S3, preparing the biodegradable electronic component or system by utilizing the printing electronic technology and combining the printing ink.
Alternatively, the process may be carried out in a single-stage,
s11, selecting the silicon nano-particles as a biodegradable semiconductor raw material, obtaining the silicon nano-particles by ball milling a silicon wafer, and controlling the size of the nano-particles to be about 100 nm;
and S12, selecting zinc nano-particles as biodegradable conductor raw materials, and obtaining the zinc nano-particles by ball milling a silicon wafer, wherein the size of the nano-particles is controlled to be about 100nm.
S21. The silicon nanoparticles and zinc nanoparticles are mixed in a ratio of 1:4, respectively dispersing the materials in ethanol and methanol solutions, and treating the mixed solution for ten minutes by using high-power ultrasonic waves;
s22, sodium carboxymethyl cellulose is selected as a biodegradable substrate, and is obtained by titration and solidification.
S31, printing a thin layer of silicon on the biodegradable substrate to serve as a resistance element by utilizing a screen printing technology;
s32, printing a thin layer of zinc seat conductive electrode or interconnection line on two ends of the silicon resistance element obtained in the step 5 by utilizing screen printing metal;
s33, integrating a biodegradable thermal therapy device consisting of a heating module of a silicon resistance element and a lead part of a zinc thin layer on a biodegradable flexible substrate in a two-part printing mode;
s34: and (3) improving the electrical conductivity of the heating element and the electronic wire obtained in the steps S31-S32 through heating treatment, so that the preparation of the biodegradable thermotherapy device is finished.
Optionally, the biodegradable conductor material includes Zn, mg, fe, W, mo, but is not limited to the above.
Optionally, the biodegradable semiconductor material includes Si, ge, siGe, znO, but is not limited to the above.
Alternatively, the biodegradable insulator material includes SiO2, si3N4, mgO, but is not limited to the above.
Optionally, the biodegradable electronic material has a nanoparticle, nanowire or nanoplatelet structure form.
Alternatively, the biodegradable organic solvent material includes fibroin solution, lactic-co-glycolic acid (PLGA) solution, polylactic acid (PLA), but is not limited thereto.
Alternatively, the dispersion method employs a high power ultrasonic or magnetic stirring system.
Alternatively, the viscosity coefficient of the printing ink can be controlled by adjusting the ratio of the organic solvent to the electronic material, so that the printing ink is applicable to inkjet printing technology, screen printing technology, gravure printing technology and the like.
Optionally, the biodegradable electronic device or system includes a single element such as a transistor, a memristor, a diode, a resistor, an inductor, a capacitor, or an integrated system composed of the above elements, but is not limited to the above.
As described above, a method for manufacturing a biodegradable electronic device by printing electronic technology is provided in the present invention. The invention has the following advantages and outstanding technical effects: biodegradable electronic materials are selected and uniformly and stably dispersed in an organic solvent to form printing ink, and the biodegradable electronic devices and systems are prepared by combining a printing electronic technology. The invention avoids the complex process steps of photoetching, dry/wet etching, material evaporation and the like adopted in the past when the biodegradable electronic device is prepared, but adopts a mode of printing one by one and printing layer by layer, thereby greatly reducing the preparation cost of the biodegradable electronic device, simplifying the process steps and improving the preparation efficiency.
Drawings
Fig. 1 shows a schematic diagram of the preparation steps of the printed electronics of the present invention for preparing a biodegradable electronic device.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
It should be noted that this embodiment only provides a specific preparation step of the biodegradable thermotherapy device to illustrate the basic concept of the present invention, and only the relevant matters related to this embodiment are shown in the steps. In practical implementation of the present invention, the required printing ink material, device structure layout, size, etc. may be changed according to the requirement, and the layout of the components may be more complex.
Fig. 1 shows a method for preparing a biodegradable electronic device by printing electronic technology, comprising at least the following steps: 1) Providing a biodegradable electronic material, wherein the biodegradable electronic material mainly comprises a conductor, a semiconductor and an insulator; the structure of the biodegradable electronic material mainly comprises nano particles, nano wires and nano sheets; 2) Dispersing the biodegradable electronic material in an organic solvent to form functional printing ink facing the printing electronic technology, wherein the organic solvent has the characteristic of biodegradability; 3) And preparing the biodegradable electronic device by utilizing the printing ink and combining a printing electronic technology.
Optionally, the degradable conductor comprises Zn, mg, fe, W, mo.
Optionally, the degradable semiconductor comprises Si, ge, siGe, znO-.
Optionally, the degradable insulator comprises SiO 2 、Si 3 N 4 、MgO。
Optionally, the nanoparticle size ranges from 10 to 500 a nm a.
Optionally, the nanowire length ranges from 10-1000 nm; the nanowire diameter ranges from 10-1000 a nm a.
Optionally, the nanoplatelets range in size from 10 to 10000 nm; the thickness of the nano-sheet ranges from 10 to 100nm.
The above materials are dispersed in an organic solvent.
Optionally, the organic solvent is a biodegradable material.
Alternatively, the dispersion method is fully performed in a high power ultrasound system or a magnetic stirring system.
Optionally, the biodegradable organic solvent comprises fibroin solution, lactic acid-glycolic acid copolymer (PLGA) solution, and polylactic acid (PLA).
The process flow chart of the method comprises the following steps:
1) Silicon nano-particles are selected as biodegradable semiconductor raw materials, and can be obtained by ball milling silicon wafers, and the size of the nano-particles is controlled to be about 100 nm;
2) Zinc nano-particles are selected as biodegradable conductor raw materials, and can be obtained by ball milling silicon wafers, and the size of the nano-particles is controlled to be about 100 nm;
3) The silicon nanoparticles and zinc nanoparticles were mixed in a ratio of 1:4, respectively dispersing the materials in ethanol and methanol solutions, and treating the mixed solution for ten minutes by using high-power ultrasonic waves;
4) Sodium carboxymethyl cellulose is selected as a biodegradable substrate, and can be obtained by titration and solidification;
5) Firstly, printing a thin layer of silicon on the biodegradable substrate as a resistance element by utilizing a screen printing technology, wherein the size and the thickness of the resistance element can be controlled randomly according to requirements;
6) Printing a thin layer of zinc seat conductive electrode or interconnection wire on two ends of the silicon resistance element obtained in the step 5 by utilizing screen printing metal;
7) The biodegradable thermal therapy device consisting of a heating module of the silicon resistance element and a lead part of the zinc thin layer is integrated on the biodegradable flexible substrate in a two-part printing mode;
8) And (3) improving the conductivity of the heating element and the electronic lead obtained in the step (5-6) through heating treatment, so that the preparation of the biodegradable thermotherapy device is finished.
It should be noted that, for convenience in this embodiment, the biodegradable electronic material and device take printing ink based on silicon and zinc nanoparticles and the biodegradable thermal therapy device as examples to illustrate the preparation method of the material and device of the present invention, but other biodegradable electronic materials and devices facing the printing electronic technology are also within the protection scope of the present invention.
In summary, according to the preparation method of the biodegradable electronic material and the device facing the printing electronic technology, the biodegradable functional nanomaterial is firstly dispersed in the biodegradable organic solvent in a uniform and stable manner to form the functional printing ink, wherein the functional printing ink comprises a conductor, a semiconductor and an insulator; and then printing electronic technology including ink jet printing, screen printing, intaglio printing and the like is utilized, and a mode of printing one by one and printing layer by layer is adopted to prepare the biodegradable electronic component or an electronic circuit formed by the electronic components. The invention utilizes the advantages of simplicity, high efficiency, low cost and the like of the printing electronic technology, combines the printing ink based on the biodegradable electronic material, greatly reduces the complexity of the preparation of the biodegradable electronic components or electronic circuits, and reduces the process cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (4)
1. A method for manufacturing a biodegradable electronic device by printing electronics, characterized in that the biodegradable electronic device manufactured by the method is a single element or an integrated system consisting of a single element, comprising at least the following steps:
step 1: preparing functional printing ink, namely selecting silicon nano particles and zinc nano particles as biodegradable semiconductor raw materials and biodegradable conductor raw materials respectively; the selected silicon nanoparticles and zinc nanoparticles were each mixed with 1:4, dispersing the mass ratio in an ethanol solution and a methanol solution, and treating the mixed solution by utilizing high-power ultrasound to form the functional printing ink facing the printing electronic technology;
step 2: sodium carboxymethyl cellulose is selected as a biodegradable substrate, and is obtained by titration and solidification;
step 3: printing a thin layer of silicon on the biodegradable substrate of the step 2) as a resistance element by utilizing a screen printing technology on the ethanol solution dispersed with silicon nano particles;
step 4: printing a thin layer of zinc as a conductive electrode or an interconnection line on both ends of the resistance element obtained in the step 3) by using a screen printing technique from a methanol solution in which zinc nanoparticles are dispersed;
step 5: integrating the biodegradable electronic device consisting of the resistive element formed in the step 3) and the conductive electrode or the interconnection line formed in the step 4) on a biodegradable substrate by means of two-step printing;
step 6: and (3) improving the electrical conductivity of the resistance element and the lead electrode or the interconnection line obtained in the step (3-4) through heating treatment, and completing the preparation of the biodegradable electronic device.
2. The method of manufacturing a biodegradable electronic device according to claim 1, characterized in that the nanoparticle has a particle size ranging from 10 to 500nm.
3. The method for manufacturing a biodegradable electronic device according to claim 1, characterized in that silicon nanoparticles are selected as the biodegradable semiconductor raw material, obtained by ball milling silicon wafers, the size of the silicon nanoparticles being 100nm.
4. The method for manufacturing a biodegradable electronic device according to claim 1, characterized in that zinc nanoparticles are selected as biodegradable semiconductor raw material, obtained by ball milling silicon wafers, the size of the silicon nanoparticles being 100nm.
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