CN111615261B - Export design method and device of multi-connector module - Google Patents
Export design method and device of multi-connector module Download PDFInfo
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- CN111615261B CN111615261B CN202010354212.5A CN202010354212A CN111615261B CN 111615261 B CN111615261 B CN 111615261B CN 202010354212 A CN202010354212 A CN 202010354212A CN 111615261 B CN111615261 B CN 111615261B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
The embodiment of the application discloses a method and a device for export design of a multi-connector module, electronic equipment and a storage medium. According to the technical scheme, the schematic diagram containing the multi-connector schematic diagram symbols is extracted, auxiliary symbols are configured for each connector in the multi-connector schematic diagram symbols, the PCB diagram is constructed based on the schematic diagram, integrated packaging symbols corresponding to the multi-connector schematic diagram symbols are generated, auxiliary packaging marks corresponding to the auxiliary symbols are generated, and the position numbers, the coordinates and the directions of the connectors are identified through the auxiliary packaging marks. And then, exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification. By adopting the technical means, the mounting position and the mounting direction of each connector in the multi-connector module can be accurately determined, so that the accuracy of connector chip mounting is guaranteed, and the chip mounting working efficiency is improved.
Description
Technical Field
The embodiment of the application relates to the technical field of electronic design, in particular to a method and a device for export design of a multi-connector module.
Background
Currently, more and more ARM core board modules, DSP core board modules, FPGA core board modules, etc. are available in the embedded market, and these modules are most commonly connected in the form of board-to-board connector interfaces and are used in the system as an independent component. For easy use and reliable installation, the module generally has at least two connectors to keep balance, and if the signal resource is too much, a larger number of connectors are needed.
Because a plurality of connectors are used, in order to avoid the situations that the connectors are reversely connected and the relative positions of the connectors are deviated and dislocated, the principle drawing symbols and the packaging are designed by adopting an integrated and integrated method for leading out interfaces of the core board module. Therefore, in the design of the schematic diagram, a plurality of connector symbols are used as a module element number, and in the design of the PCB diagram, a plurality of original connector packaging elements are also designed as a module packaging element in a unified way, so that the design accuracy of the schematic diagram and the PCB diagram can be guaranteed.
However, after the plurality of connector modules are designed as an integrated component, during actual patch production, manual operation is required to patch each connector on the module one by one, and the patch process is complicated, the connectors need to be adjusted repeatedly to corresponding positions, and the patch efficiency is relatively low.
Disclosure of Invention
The embodiment of the application provides a method and a device for designing the export of a multi-connector module, which can realize automatic patch mounting of multiple connectors and guarantee the patch mounting accuracy of the connectors.
In a first aspect, an embodiment of the present application provides a method for export design of a multi-connector module, including:
extracting a schematic diagram containing multi-connector schematic diagram symbols, and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing an orientation indication of the corresponding connector;
constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector;
and exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification.
Further, before extracting the schematic diagram containing the symbols of the multi-connector schematic diagram, the method further comprises the following steps:
and extracting the multi-connector schematic diagram symbols from a schematic diagram symbol library, and drawing the multi-connector schematic diagram symbols in the schematic diagram.
Further, before extracting the multi-connector schematic symbol from the schematic symbol library, the method further comprises:
the multi-connector schematic symbol is newly built in the schematic symbol library based on a single connector symbol.
Further, configuring an auxiliary symbol for each connector in the multi-connector schematic symbol includes:
determining each connector model in the multi-connector schematic symbol;
and searching the schematic diagram symbol library based on the connector model, extracting auxiliary symbols which are stored in association with the connector model in advance, and correspondingly configuring the auxiliary symbols in the schematic diagram.
Further, the auxiliary packaging mark is overlapped with each connector packaging position on the integrated packaging symbol.
Further, the generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol includes:
constructing an integrated packaging symbol in a PCB packaging library corresponding to the multi-connector schematic diagram symbol in advance, and correspondingly storing the mapping relation between the multi-connector schematic diagram symbol and the integrated packaging symbol;
extracting the integrated packaging symbol from the PCB packaging library based on the mapping relation and corresponding to the multi-connector schematic diagram symbol;
and drawing the integrated packaging symbol on the PCB.
Further, a direction mark is added on the PCB diagram, and the direction mark is used for indicating the installation direction of the multi-connector module.
In a second aspect, an embodiment of the present application provides a device for designing a lead-out of a multi-connector module, including:
the configuration module is used for extracting a schematic diagram containing multi-connector schematic diagram symbols and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing an orientation indication of the corresponding connector;
the packaging module is used for constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector;
and the exporting module is used for exporting the PCB to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identifier.
In a third aspect, an embodiment of the present application provides an electronic device, including:
a memory and one or more processors;
the memory for storing one or more programs;
when executed by the one or more processors, cause the one or more processors to implement the export design method for a multi-connector module as described in the first aspect.
In a fourth aspect, embodiments of the present application provide a storage medium containing computer-executable instructions for performing the export design method of a multi-connector module as described in the first aspect when executed by a computer processor.
The embodiment of the application configures auxiliary symbols for each connector in the multi-connector schematic diagram symbols by extracting the schematic diagram containing the multi-connector schematic diagram symbols, constructs a PCB (printed Circuit Board) diagram based on the schematic diagram, generates integrated packaging symbols corresponding to the multi-connector schematic diagram symbols, generates auxiliary packaging identifiers corresponding to the auxiliary symbols, and identifies the bit number, the coordinate and the direction of each connector through the auxiliary packaging identifiers. And then, exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification. By adopting the technical means, the auxiliary symbol and the auxiliary packaging identification are configured through the schematic diagram and the packaging diagram corresponding to the multi-connector module, so that when the chip mounter carries out chip mounting on the basis of a PCB (printed circuit board) diagram, the mounting position and the mounting direction of each connector in the multi-connector module are accurately determined according to the auxiliary packaging identification, the accuracy of the chip mounting of the connector is guaranteed, and the working efficiency of the chip mounting is improved.
Drawings
Fig. 1 is a flowchart of a design export method of a multi-connector module according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a multi-connector module according to an embodiment of the present disclosure;
FIG. 3 is a drawing flow chart of an integrated package symbol according to an embodiment of the present application;
FIG. 4 is a schematic diagram illustrating the superposition of an auxiliary package identifier and an integrated package symbol according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a lead-out design apparatus of a multi-connector module according to a second embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, specific embodiments of the present application will be described in detail with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present application are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The application provides a derivation design method of a multi-connector module, which aims to configure auxiliary symbols and auxiliary packaging identifiers on a schematic diagram and a packaging diagram of the multi-connector module so as to identify the bit number, the coordinate and the direction of each connector in the multi-connector module, so that a chip mounting indication of the connector is provided for a chip mounter, and automatic chip mounting of each connector is performed corresponding to the chip mounter. For the traditional connector packaging mode, the schematic diagram symbol and the packaging are generally designed in an integrated and integrated mode corresponding to a plurality of connectors, so that in the schematic diagram design, the serial numbers of a plurality of connector elements are originally needed, and only one module element serial number is needed. In the design of the PCB, only one multi-connector module packaging element is needed for the original multiple connector packaging elements, so that the problems that the relative position deviation and dislocation occur between the connectors, the left and right connection of the connectors is reversed, and the up and down connection of signals is reversed are effectively solved. However, since the connectors are modularized and packaged integrally, they exist as an integrated component on the PCB and have only one integral bit number and coordinate. For practical patch production, a number of independent connector sites and coordinates are required to facilitate mounting of the module as a whole on the connectors after the patch has been soldered to each connector. However, since the integrated multi-connector module cannot acquire the bit number and the coordinates of a single connector, manual operation is required during chip mounting, the connector is repeatedly adjusted to a corresponding position, then the coordinates of the corresponding connector are acquired, and several connectors need to be operated for several times. This process is cumbersome and error prone, resulting in inefficient placement. Therefore, the export design method of the multi-connector module is provided to solve the technical problems that an error is easy to occur when the existing multi-connector module is subjected to surface mounting, and a surface mounting program is complicated.
The first embodiment is as follows:
fig. 1 is a flowchart of a export design method of a multi-connector module according to an embodiment of the present disclosure, where the export design method of the multi-connector module provided in this embodiment may be executed by an export design device of the multi-connector module, the export design device of the multi-connector module may be implemented in a software and/or hardware manner, and the export design device of the multi-connector module may be formed by two or more physical entities or may be formed by one physical entity. Generally, the export design equipment of the multi-connector module can be terminal equipment such as a computer, a schematic diagram drawing platform of a PCB (printed circuit board) and the like.
The following description will be made taking a lead-out design apparatus of a multi-connector module as an example of a main body that performs a lead-out design method of the multi-connector module. Referring to fig. 1, the export design method of the multi-connector module specifically includes:
s110, extracting a schematic diagram containing multi-connector schematic diagram symbols, and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing the orientation indication of the corresponding connector.
Specifically, when the schematic diagram is drawn, the schematic diagram is drawn based on the schematic diagram symbol library. The schematic diagram symbol library provides elements for drawing the drawing, and according to actual drawing requirements, a user can extract corresponding schematic diagram symbols from the elements for drawing the schematic diagram.
And extracting the multi-connector schematic diagram symbols from a schematic diagram symbol library, and drawing the multi-connector schematic diagram symbols in the schematic diagram. The schematic diagram symbol library contains most schematic diagram symbols required by the schematic diagram design, and the required schematic diagram symbols can be added into the existing schematic diagram symbol library according to actual needs or a certain schematic diagram symbol in the existing schematic diagram symbol library is modified according to needs. Therefore, in order to facilitate drawing of the connector on the schematic diagram, a multi-connector schematic diagram symbol is established in the schematic diagram symbol library in advance, and the multi-connector schematic diagram symbol can be called from the schematic diagram symbol library to draw the schematic diagram when the schematic diagram of the multi-connector module is drawn subsequently. When constructing the multi-connector schematic diagram symbol, the multi-connector schematic diagram symbol may be newly constructed in the schematic diagram symbol library based on a single connector symbol, or may be directly constructed from scratch. It will be appreciated that when building the multi-connector schematic symbols from scratch, the pins of each connector may be renumbered and signals may be noted on the pins. When a multi-connector schematic symbol is constructed based on a single connector, the schematic symbol of the single connector is pre-stored in a schematic symbol library, and the schematic construction is carried out based on the schematic symbol of the single connector in the schematic symbol library. And extracting the schematic diagram symbols of the single connectors with the corresponding number according to the actual arrangement number of the connectors to construct the multi-connector schematic diagram symbols, modifying the pin numbers and the signal labels according to the actual setting requirements, and storing the pin numbers and the signal labels in a schematic diagram symbol library for calling when the drawing requirements of the subsequent schematic diagram are needed. And then, when a schematic diagram containing a plurality of connectors needs to be drawn, directly calling corresponding multi-connector schematic diagram symbols from the schematic diagram symbol library to draw the schematic diagram. Moreover, based on the drawn schematic diagram, the installation direction indication of each connector is provided for convenience in subsequent mounting, and meanwhile the integrity and integrated packaging of the multi-connector module can be ensured. Then by providing an auxiliary symbol for each connector in the multi-connector symbol, referring to fig. 2, a schematic diagram of the auxiliary symbol is provided, the auxiliary symbol indicating the orientation between each connector to provide an orientation indication for each connector in the multi-connector module. When configuring these auxiliary symbols, the auxiliary symbols are first stored in association with individual connectors in the schematic symbol library. Then, when auxiliary symbols are configured, determining each connector model in the multi-connector schematic diagram symbols; and searching the schematic diagram symbol library based on the connector model, extracting auxiliary symbols which are stored in association with the connector model in advance, and correspondingly configuring the auxiliary symbols in the schematic diagram. By constructing the incidence relation between the single connector and the auxiliary symbol in advance, the drawing efficiency of the auxiliary symbol can be improved, and the drawing of the schematic diagram is optimized.
In addition, in one embodiment, when the auxiliary symbol is drawn based on the schematic diagram containing the multi-connector schematic diagram symbol, the auxiliary symbol may be generated by collecting the arrangement position and the relative orientation information of each connector in the multi-connector module, which are input by the user.
It should be noted that, corresponding auxiliary symbols need to be configured one by one corresponding to each connector on the multi-connector module, and the auxiliary symbols are placed in the schematic diagram according to the drawing requirements of the actual schematic diagram and the configuration of each connector type number in the multi-connector schematic diagram symbols, and the auxiliary symbols only play a role in schematic and are used for subsequent introduction into the PCB diagram.
S120, constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol, and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector.
Further, based on the schematic diagram for completing the auxiliary symbol configuration, a PCB diagram is further constructed based on the schematic diagram. According to the multi-connector schematic diagram symbol and the auxiliary symbol on the schematic diagram, the PCB diagram needs to draw the corresponding integrated packaging symbol and the auxiliary packaging identifier respectively. As shown in fig. 3, the integrated packaging symbol drawing process includes:
s1201, constructing an integrated packaging symbol in a PCB packaging library corresponding to the multi-connector schematic diagram symbol in advance, and correspondingly storing the mapping relation between the multi-connector schematic diagram symbol and the integrated packaging symbol;
s1202, extracting the integrated packaging symbol from the PCB packaging library based on the mapping relation and corresponding to the multi-connector schematic diagram symbol;
s1203, drawing the integrated packaging symbol on the PCB diagram.
Specifically, based on the manner of pre-constructing the multi-connector schematic diagram symbol in the schematic diagram symbol library in step S110, in order to further improve the drawing efficiency of the PCB diagram, in the embodiment of the present application, before the PCB diagram is drawn, an integrated package symbol is pre-constructed in the PCB package library, and the integrated package symbol corresponds to the multi-connector schematic diagram symbol. When the integrated packaging symbol is constructed, the multi-connector schematic diagram symbol is correspondingly constructed. After the integrated packaging symbol is constructed, the mapping relation between the integrated packaging symbol and the corresponding multi-connector schematic diagram symbol is further stored in a PCB packaging library. And subsequently, when the PCB diagram is drawn, searching a PCB packaging library based on the multi-connector schematic diagram symbols on the schematic diagram, determining the integrated packaging symbols according to the corresponding mapping relation, and extracting the integrated packaging symbols to draw the PCB diagram. It should be noted that, according to actual packaging requirements, one multi-connector schematic diagram symbol may correspond to multiple forms of PCB packages, and therefore, when an integrated package symbol is constructed corresponding to the multi-connector schematic diagram symbol, multiple integrated package symbols may be created according to actual connector packaging requirements, and the multiple integrated package symbols are further stored based on a mapping relationship with the multi-connector schematic diagram symbol. And subsequently, when a PCB diagram is drawn, searching a PCB packaging library according to the multi-connector schematic diagram symbols on the schematic diagram and the corresponding mapping relation, and determining a plurality of integrated packaging symbols with the mapping relation. And further selecting one integrated packaging symbol according to the packaging requirement information of the user to draw the PCB diagram.
In one embodiment, corresponding to the construction of the integrated packaging symbol in the PCB diagram, the construction of the integrated packaging symbol can be further performed according to the multi-connector schematic diagram symbol on the schematic diagram and in combination with the multi-connector module packaging requirement information of the user. The multi-connector module packaging requirement information requires individual connectors and packaging methods among the connectors. Based on the multi-connector module packaging requirement information, the export design equipment of the multi-connector module extracts corresponding single connector packaging symbols from the PCB packaging library, constructs the integrated packaging symbols based on the extracted single connector packaging symbols, and draws the integrated packaging symbols in the PCB packaging library. In addition, based on the constructed integrated packaging symbol, the integrated packaging symbol is also stored in a PCB packaging library. And further taking the mapping relation between the integrated packaging symbol and the multi-connector schematic diagram symbol as a data index, so that the integrated packaging symbol can be conveniently searched based on the data index subsequently, and the efficiency of subsequent PCB diagram design is improved.
On the other hand, referring to fig. 4, for the auxiliary symbol on the schematic diagram, when the PCB diagram is drawn, an auxiliary package identifier is correspondingly created to indicate the bit number, the coordinate and the direction of each connector on the multi-connector module. It will be appreciated that the packaging location of the multi-connector module is determined in conjunction with the set up requirements of the circuit as a whole when configuring the secondary package identity. According to the schematic information provided by the schematic diagram auxiliary symbol, the auxiliary packaging identifier can be correspondingly generated in the PCB diagram, and the position number, the coordinate and the direction information of each connector are determined by combining the position of each connector in the integrated packaging. And, the auxiliary package mark overlaps with each connector package position on the integrated package symbol. So as to better indicate the patch position of each connector when connector patches are subsequently performed. Meanwhile, after the patch is finished, whether the patch result is accurate or not is verified based on the attached packaging identification. It can be understood that the auxiliary package identifier may also be stored in a PCB package library correspondingly, and the mapping relationship between the auxiliary package identifier and the auxiliary symbol is stored as a data index. And when the PCB is designed subsequently, if the corresponding auxiliary symbol exists on the schematic diagram, calling the corresponding auxiliary packaging identifier according to the mapping relation to design the PCB.
In addition, the direction mark is added on the PCB diagram, and the direction mark is used for indicating the manual installation direction of the multi-connector module. Referring to fig. 4, the direction indicator combines with the prompt "please notice the direction of the notch", and when manual installation of the multi-connector module is performed, installation is performed according to the direction indicator. And furthermore, a multi-connector module can be provided for carrying out paster identification, so that direction indication can be provided subsequently when paster is carried out.
S130, exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification.
And finally, correspondingly packaging the PCB diagram, and exporting the PCB diagram to a chip mounter for multi-connector module chip mounting of an actual circuit. When the chip mounting is carried out, the chip mounter determines the position number, the coordinate and the direction of each connector based on the auxiliary packaging identification when carrying out the chip mounting on each connector, and further carries out the automatic chip mounting of the connectors one by one according to the position number. Therefore, automatic chip mounting of the chip mounter on the multiple connector modules can be achieved, the complex process of chip mounting of the multiple connector modules is simplified, and accuracy of each connector chip is guaranteed based on the auxiliary packaging identification.
In one embodiment, whether the current auxiliary packaging identifier is accurate is further judged according to the verification of the mounting result of the chip mounter, and corresponding correction information is generated when an error exists. The derivation design of the multi-connector module corrects errors caused by personnel, machines, materials or environments based on the correction information so as to ensure the accuracy of chip mounting of the chip mounter when the multi-connector module is subjected to chip mounting subsequently.
In the above, by extracting the schematic diagram including the multi-connector schematic diagram symbols, configuring the auxiliary symbols for each connector in the multi-connector schematic diagram symbols, constructing the PCB diagram based on the schematic diagram, generating the integrated packaging symbols corresponding to the multi-connector schematic diagram symbols and the auxiliary packaging identifiers corresponding to the auxiliary symbols, and identifying the bit numbers, coordinates and directions of each connector through the auxiliary packaging identifiers. And then, exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification. By adopting the technical means, the auxiliary symbol and the auxiliary packaging identification are configured through the schematic diagram and the packaging diagram corresponding to the multi-connector module, so that when the chip mounter carries out chip mounting on the basis of a PCB (printed circuit board) diagram, the mounting position and the mounting direction of each connector in the multi-connector module are accurately determined according to the auxiliary packaging identification, the accuracy of the chip mounting of the connector is guaranteed, and the working efficiency of the chip mounting is improved.
Example two:
on the basis of the foregoing embodiment, fig. 5 is a schematic structural diagram of a lead-out design apparatus of a multi-connector module according to a second embodiment of the present application. Referring to fig. 5, the export design apparatus of the multi-connector module provided in this embodiment specifically includes: a configuration module 21, an encapsulation module 22 and an export module 23.
The configuration module 21 is configured to extract a schematic diagram including multi-connector schematic diagram symbols, and configure an auxiliary symbol for each connector in the multi-connector schematic diagram symbols, where the auxiliary symbol is used to provide an indication of an orientation of the corresponding connector;
the packaging module 22 is configured to construct a PCB diagram based on the schematic diagram, generate an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol, and generate an auxiliary packaging identifier corresponding to the auxiliary symbol, where the auxiliary packaging identifier is used to identify a bit number, a coordinate, and a direction of each connector;
the exporting module 23 is configured to export the PCB diagram to a chip mounter, so that the chip mounter performs connector mounting based on the auxiliary package identifier.
In the above, by extracting the schematic diagram including the multi-connector schematic diagram symbols, configuring the auxiliary symbols for each connector in the multi-connector schematic diagram symbols, constructing the PCB diagram based on the schematic diagram, generating the integrated packaging symbols corresponding to the multi-connector schematic diagram symbols and the auxiliary packaging identifiers corresponding to the auxiliary symbols, and identifying the bit numbers, coordinates and directions of each connector through the auxiliary packaging identifiers. And then, exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification. By adopting the technical means, the auxiliary symbol and the auxiliary packaging identification are configured through the schematic diagram and the packaging diagram corresponding to the multi-connector module, so that when the chip mounter carries out chip mounting on the basis of a PCB (printed circuit board) diagram, the mounting position and the mounting direction of each connector in the multi-connector module are accurately determined according to the auxiliary packaging identification, the accuracy of the chip mounting of the connector is guaranteed, and the working efficiency of the chip mounting is improved.
The export design apparatus of the multi-connector module provided in the second embodiment of the present application can be used to execute the export design method of the multi-connector module provided in the first embodiment, and has corresponding functions and beneficial effects.
Example three:
an embodiment of the present application provides an electronic device, and with reference to fig. 6, the electronic device includes: a processor 31, a memory 32, a communication module 33, an input device 34, and an output device 35. The number of processors in the electronic device may be one or more, and the number of memories in the electronic device may be one or more. The processor, memory, communication module, input device, and output device of the electronic device may be connected by a bus or other means.
The memory 32 is a computer-readable storage medium for storing software programs, computer-executable programs, and modules, such as program instructions/modules corresponding to the export design method of the multi-connector module described in any embodiment of the present application (e.g., configuration module, encapsulation module, and export module in the export design apparatus of the multi-connector module). The memory can mainly comprise a program storage area and a data storage area, wherein the program storage area can store an operating system and an application program required by at least one function; the storage data area may store data created according to use of the device, and the like. Further, the memory may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some examples, the memory may further include memory located remotely from the processor, and these remote memories may be connected to the device over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The communication module 33 is used for data transmission.
The processor 31 executes various functional applications and data processing of the device by running software programs, instructions and modules stored in the memory, i.e. implements the export design method of the multi-connector module described above.
The input device 34 may be used to receive entered numeric or character information and to generate key signal inputs relating to user settings and function controls of the apparatus. The output device 35 may include a display device such as a display screen.
The electronic device provided above can be used to execute the export design method of the multi-connector module provided in the first embodiment, and has corresponding functions and advantages.
Example four:
embodiments of the present application also provide a storage medium containing computer-executable instructions, which when executed by a computer processor, perform a method for export design of a multi-connector module, the method for export design of the multi-connector module comprising: extracting a schematic diagram containing multi-connector schematic diagram symbols, and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing an orientation indication of the corresponding connector; constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector; and exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification.
Storage medium-any of various types of memory devices or storage devices. The term "storage medium" is intended to include: mounting media such as CD-ROM, floppy disk, or tape devices; computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Lanbas (Rambus) RAM, etc.; non-volatile memory such as flash memory, magnetic media (e.g., hard disk or optical storage); registers or other similar types of memory elements, etc. The storage medium may also include other types of memory or combinations thereof. In addition, the storage medium may be located in a first computer system in which the program is executed, or may be located in a different second computer system connected to the first computer system through a network (such as the internet). The second computer system may provide program instructions to the first computer for execution. The term "storage medium" may include two or more storage media residing in different locations, e.g., in different computer systems connected by a network. The storage medium may store program instructions (e.g., embodied as a computer program) that are executable by one or more processors.
Of course, the storage medium provided in the embodiments of the present application contains computer-executable instructions, and the computer-executable instructions are not limited to the export design method of the multi-connector module described above, and may also perform related operations in the export design method of the multi-connector module provided in any embodiments of the present application.
The export design apparatus, the storage medium, and the electronic device of the multi-connector module provided in the foregoing embodiments may perform the export design method of the multi-connector module provided in any embodiments of the present application, and refer to the export design method of the multi-connector module provided in any embodiments of the present application without detailed technical details described in the foregoing embodiments.
The foregoing is considered as illustrative of the preferred embodiments of the invention and the technical principles employed. The present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present application has been described in more detail with reference to the above embodiments, the present application is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the claims.
Claims (7)
1. A method of export design of a multi-connector module, comprising:
extracting a schematic diagram containing multi-connector schematic diagram symbols, and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing an orientation indication of the corresponding connector;
constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector;
exporting the PCB diagram to a chip mounter for the chip mounter to perform connector chip mounting based on the auxiliary packaging identification;
before extracting the schematic diagram containing the symbols of the multi-connector schematic diagram, the method further comprises the following steps:
extracting the multi-connector schematic diagram symbols from a schematic diagram symbol library, and drawing the multi-connector schematic diagram symbols in the schematic diagram;
prior to extracting the multi-connector schematic symbol from the schematic symbol library, further comprising:
creating the multi-connector schematic symbol based on a single connector symbol in the schematic symbol library;
configuring an auxiliary symbol for each connector in the multi-connector schematic symbol, comprising:
determining each connector model in the multi-connector schematic symbol;
and searching the schematic diagram symbol library based on the connector model, extracting auxiliary symbols which are stored in association with the connector model in advance, and correspondingly configuring the auxiliary symbols in the schematic diagram.
2. A derived design method for a multi-connector module according to claim 1, wherein the auxiliary package identifier overlaps with each connector package location on the integrated package symbol.
3. The method of claim 1, wherein generating an integrated packaging symbol corresponding to the multi-connector schematic symbol comprises:
constructing an integrated packaging symbol in a PCB packaging library corresponding to the multi-connector schematic diagram symbol in advance, and correspondingly storing the mapping relation between the multi-connector schematic diagram symbol and the integrated packaging symbol;
extracting the integrated packaging symbol from the PCB packaging library based on the mapping relation and corresponding to the multi-connector schematic diagram symbol;
and drawing the integrated packaging symbol on the PCB.
4. The export design method of the multi-connector module of claim 1, wherein building a PCB graph based on the schematic graph further comprises:
adding direction marks on the PCB diagram, wherein the direction marks are used for indicating the installation direction of the multi-connector module.
5. A lead-out design apparatus for a multi-connector module, comprising:
the configuration module is used for extracting a schematic diagram containing multi-connector schematic diagram symbols and configuring auxiliary symbols for each connector in the multi-connector schematic diagram symbols, wherein the auxiliary symbols are used for providing an orientation indication of the corresponding connector;
the packaging module is used for constructing a PCB diagram based on the schematic diagram, generating an integrated packaging symbol corresponding to the multi-connector schematic diagram symbol and an auxiliary packaging identifier corresponding to the auxiliary symbol, wherein the auxiliary packaging identifier is used for identifying the bit number, the coordinate and the direction of each connector;
the exporting module is used for exporting the PCB diagram to a chip mounter so that the chip mounter can carry out connector chip mounting based on the auxiliary packaging identification;
before extracting the schematic diagram containing the symbols of the multi-connector schematic diagram, the method further comprises the following steps:
extracting the multi-connector schematic diagram symbols from a schematic diagram symbol library, and drawing the multi-connector schematic diagram symbols in the schematic diagram;
prior to extracting the multi-connector schematic symbol from the schematic symbol library, further comprising:
creating the multi-connector schematic symbol based on a single connector symbol in the schematic symbol library;
configuring an auxiliary symbol for each connector in the multi-connector schematic symbol, comprising:
determining each connector model in the multi-connector schematic symbol;
and searching the schematic diagram symbol library based on the connector model, extracting auxiliary symbols which are stored in association with the connector model in advance, and correspondingly configuring the auxiliary symbols in the schematic diagram.
6. An electronic device, comprising:
a memory and one or more processors;
the memory for storing one or more programs;
when executed by the one or more processors, cause the one or more processors to implement the export design method for a multi-connector module of any of claims 1-4.
7. A storage medium containing computer-executable instructions for performing the export design method of the multi-connector module of any of claims 1-4 when executed by a computer processor.
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