CN111613711A - IC array packaging module of LED chip - Google Patents
IC array packaging module of LED chip Download PDFInfo
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- CN111613711A CN111613711A CN201910137976.6A CN201910137976A CN111613711A CN 111613711 A CN111613711 A CN 111613711A CN 201910137976 A CN201910137976 A CN 201910137976A CN 111613711 A CN111613711 A CN 111613711A
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- array
- led chips
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- led chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 239000005022 packaging material Substances 0.000 claims abstract description 8
- 238000005286 illumination Methods 0.000 abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 239000004519 grease Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an IC array packaging module of an LED chip, which comprises a plurality of LED chips, a circuit board and packaging materials, wherein the LED chips are arranged in an array manner, the LED chips are respectively provided with corresponding optical elements, the LED chips are respectively provided with independent power input pins and independent output pins, the control of a single LED chip can be carried out, and the integrally packaged IC array module can randomly change displayed patterns according to the requirement; the LED chip is a white light flip chip with a silicon substrate, the packaging material is silicone grease or a resin material, the optical element is a whole formed by a micro-lens array, and electrochromic films are arranged on the periphery of each micro-lens, so that the display and illumination functions can be freely switched.
Description
Technical Field
The invention relates to the technical field of LED chip packaging, in particular to an IC array packaging module of an LED chip.
Background
The conventional LED dot matrix module has the disadvantage of displaying a severe mosaic of patterns, and the array has the advantages of high efficiency, long service life, fast response time, low sensitivity to collision and vibration, and the like, so that the LED dot matrix module can be used in lighting devices which have used incandescent lamps so far frequently, especially in headlights, reading lamps or flashlights of automobiles. Meanwhile, the LED array has higher luminous intensity, so that the LED array is also suitable for traffic signal equipment or a projection light source at present.
However, at present, an LED array often can only realize a specific function, and each LED chip in the array cannot be controlled individually, for example, in patent CN200680005818, the LED chip is controlled in units of rows, so that in the actual application process, there are disadvantages that the display shape is not easy to change, and the display function and the illumination function are not easy to switch.
Disclosure of Invention
The invention aims to realize single control of the LED array chip, thereby more conveniently switching patterns in the practical application process and simultaneously realizing integration of a display function and an illumination function.
To achieve the above object, the present invention provides an IC array package module of an LED chip, comprising: the LED light source comprises a plurality of LED chips, a circuit board and packaging materials, wherein the LED chips are respectively provided with corresponding optical elements and are arranged in an array mode, and the LED chips are respectively provided with independent power input pins and independent output pins and can control a single LED chip.
Furthermore, the LED chip is a white light flip chip with a silicon substrate, so that the heat dissipation function of integrated packaging is improved conveniently.
Further, the packaging material is a transparent or semitransparent material such as silicone grease or resin.
Furthermore, the optical element is an integral body formed by a micro-lens array, and each micro-lens corresponds to each LED chip.
Furthermore, electrochromic films are arranged on the periphery of each micro lens, so that the display function and the illumination function can be switched conveniently, and under the display function, the pattern boundary is clear and does not have a fuzzy feeling.
Compared with the prior art, the invention has the following beneficial effects:
the single LED chip is provided with an independent power input pin and an independent power output pin, can be independently controlled, and the integrated packaged IC array module can randomly change the displayed pattern according to the requirement; the electrochromic film is arranged around each LED chip, so that the display function and the illumination function can be switched conveniently, and when the display function is used, the contrast between light and shade is bright, the boundary is obvious, and no fuzzy feeling exists.
Drawings
FIG. 1 is a schematic diagram of an IC array package module according to the present invention.
Fig. 2 is a detailed packaging diagram of the IC array package module of the present invention.
FIG. 3 is an illustration of the shape of the embodiment 1 of the present invention.
Fig. 4 is a working principle diagram of embodiment 1 of the present invention.
Fig. 5 is a working principle diagram of embodiment 2 of the present invention.
Reference numerals: 1-an LED chip; 2-a circuit board; 3-packaging material; 4-an optical element; 5-electrochromic thin film; 11-an input pin; 12-output pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Specific example 1:
referring to fig. 3 and 4, the present invention provides an IC array package module of an LED chip, one embodiment of the IC array package module of an LED chip provided by the present invention is a display function applied to an automobile tail light, and a right-turn shape is selected for the embodiment for description. According to the IC array packaging module applied to the LED chips of the automobile tail light, the function of displaying a right turn shape of the automobile tail light is turned on according to a right turn instruction, the I2J13, the I3 (J13-J14), the I4 (J13-J15), the I5 (J2-J16), the I6 (J2-J17), the I7 (J2-J18), the I8 (J2-J19), the I9 (J2-J18), the I10 (J2-J17), the I11 (J2-J16), the I12 (J13-J15), the I13 (J13-J14) and the I14J13 LED chips are lightened, and a weak electric field is applied to the electrochromic film on the periphery of each corresponding LED chip in the right turn shape, so that the electrochromic film is changed into a dark color and stray light can be absorbed, and the display boundary is clear. An IC array package module applied to an LED chip of an automobile tail lamp comprises: the LED light source comprises a plurality of LED chips 1, a circuit board 2 and packaging materials 3, wherein the LED chips 1 are respectively provided with corresponding optical elements 4, the optical elements 4 are microlens arrays, the LED chips 1 are arranged in an array mode, the LED chips 1 are respectively provided with independent power input pins 11 and independent output pins 12, and a single LED chip can be controlled.
Specifically, the LED chip 1 is a white flip chip with a silicon substrate, which is convenient for improving the heat dissipation function of integrated package.
Specifically, the optical element 4 is an integral body formed by a microlens array, and each microlens corresponds to each LED chip.
Specifically, the electrochromic films 5 are arranged around the microlenses, under the action of a weak electric field, the electrochromic films 5 are changed into black to absorb stray light, light rays are collimated and emitted through the optical element 4, the LED chips which are not lighted do not emit light rays, and the pattern boundaries are clear and do not have fuzzy feeling.
Specific example 2:
referring to fig. 5, the present invention provides an IC array package module of an LED chip, and one embodiment of the IC array package module of an LED chip provided by the present invention is an illumination function applied to an automobile lamp, and the embodiment thereof will be described. The IC array packaging module applied to automobile lamp illumination provided by the embodiment lights all the LED chips on the module, at the moment, the electrochromic film is colorless, and stray light can be emitted out, so that the maximum luminous flux is achieved. An IC array package module for automotive lamp lighting applications, comprising: the LED light source comprises a plurality of LED chips 1, a circuit board 2 and packaging materials 3, wherein the LED chips 1 are respectively provided with corresponding optical elements 4, the optical elements 4 are microlens arrays, the LED chips 1 are arranged in an array mode, the LED chips 1 are respectively provided with independent power input pins 11 and independent output pins 12, and a single LED chip can be controlled.
Specifically, the LED chip 1 is a white flip chip with a silicon substrate, which is convenient for improving the heat dissipation function of integrated package.
Specifically, the optical element 4 is an integral body formed by a microlens array, and each microlens corresponds to each LED chip.
Specifically, the electrochromic films 5 are arranged around the microlenses, and when the lighting function is performed, the electrochromic films 5 are colorless, and at the moment, the light rays of the LED chip can be emitted to the maximum extent.
The foregoing lists merely illustrate specific embodiments of the invention. It will be clear that the invention is not limited to the above embodiments, but that many similar modifications are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the present invention are to be considered within the scope of the invention.
Claims (4)
1. An IC array package module of an LED chip, comprising: the LED packaging structure comprises a plurality of LED chips (1), a circuit board (2) and packaging materials (3), and is characterized in that the LED chips (1) are respectively provided with corresponding optical elements (4), the LED chips (1) are arranged in an array, and the LED chips (1) are respectively provided with independent power input pins (11) and independent output pins (12).
2. The IC array package module of LED chips according to claim 1, characterized in that the LED chip (1) is a white flip chip.
3. The IC array package module of LED chips according to claim 1, characterized in that the optical element (4) is an integral part of a microlens array.
4. The IC array package module of LED chips according to claim 4, wherein an electrochromic film (5) is disposed around each microlens of the optical element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910137976.6A CN111613711A (en) | 2019-02-25 | 2019-02-25 | IC array packaging module of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910137976.6A CN111613711A (en) | 2019-02-25 | 2019-02-25 | IC array packaging module of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111613711A true CN111613711A (en) | 2020-09-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910137976.6A Pending CN111613711A (en) | 2019-02-25 | 2019-02-25 | IC array packaging module of LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111613711A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103310691A (en) * | 2013-06-19 | 2013-09-18 | 陈健 | LED array imaging light source |
| US20140186979A1 (en) * | 2005-02-03 | 2014-07-03 | Epistar Corporation | Light emitting device and manufacture method thereof |
| CN107076387A (en) * | 2014-11-20 | 2017-08-18 | 皇家飞利浦有限公司 | LED device with individually addressable LED module |
| US20170294418A1 (en) * | 2016-04-12 | 2017-10-12 | Cree, Inc. | High density pixelated led and devices and methods thereof |
| US20190044040A1 (en) * | 2017-08-03 | 2019-02-07 | Cree, Inc. | High density pixelated-led chips and chip array devices |
| CN209515736U (en) * | 2019-02-25 | 2019-10-18 | 中节能晶和照明有限公司 | A kind of IC array package module of LED chip |
-
2019
- 2019-02-25 CN CN201910137976.6A patent/CN111613711A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140186979A1 (en) * | 2005-02-03 | 2014-07-03 | Epistar Corporation | Light emitting device and manufacture method thereof |
| CN103310691A (en) * | 2013-06-19 | 2013-09-18 | 陈健 | LED array imaging light source |
| CN107076387A (en) * | 2014-11-20 | 2017-08-18 | 皇家飞利浦有限公司 | LED device with individually addressable LED module |
| US20170294418A1 (en) * | 2016-04-12 | 2017-10-12 | Cree, Inc. | High density pixelated led and devices and methods thereof |
| US20190044040A1 (en) * | 2017-08-03 | 2019-02-07 | Cree, Inc. | High density pixelated-led chips and chip array devices |
| CN209515736U (en) * | 2019-02-25 | 2019-10-18 | 中节能晶和照明有限公司 | A kind of IC array package module of LED chip |
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Address after: No. 689, aixihu North Road, high tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: China energy saving Jinghe Technology Co.,Ltd. Address before: No. 689, aixihu North Road, high tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: CECEP LATTICELIGHTING Co.,Ltd. |