CN111613565B - Double-turnover-head chip transfer device suitable for flexible electronic manufacturing - Google Patents

Double-turnover-head chip transfer device suitable for flexible electronic manufacturing Download PDF

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Publication number
CN111613565B
CN111613565B CN202010418915.XA CN202010418915A CN111613565B CN 111613565 B CN111613565 B CN 111613565B CN 202010418915 A CN202010418915 A CN 202010418915A CN 111613565 B CN111613565 B CN 111613565B
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Prior art keywords
head
seat
turnover
suction
rod
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CN111613565A (en
Inventor
尹周平
陈建魁
蔡光达
付宇
肖德卫
何琳
高国雄
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Wuhan Guochuangke Photoelectric Equipment Co ltd
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Wuhan Guochuangke Photoelectric Equipment Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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Abstract

The invention discloses a double-turnover-head chip transfer device suitable for manufacturing flexible electronics, which belongs to the field of manufacturing of flexible electronics. The double-turnover-head chip transfer device is simple in structure and convenient to control, can be fully suitable for the preparation process of flexible electrons, realizes continuous turnover transfer of chips, ensures the accuracy of turnover transfer of the chips, improves the chip transfer efficiency, avoids damage of the chips in the turnover transfer process, reduces the cost of turnover transfer of the chips, and has good application prospect and popularization value.

Description

Double-turnover-head chip transfer device suitable for flexible electronic manufacturing
Technical Field
The invention belongs to the field of flexible electronic manufacturing, and particularly relates to a double-turnover-head chip transfer device suitable for flexible electronic manufacturing.
Background
With the wide application of flexible electronics and the continuous development of manufacturing technology thereof, higher and higher requirements are put forward on the manufacturing and packaging speeds of the flexible electronics. In the packaging production of flexible electronics, the chip transfer is a very critical process, and the speed directly affects the production efficiency and efficiency of flexible electronics.
Usually, the chip is placed on an antenna (similar to a circuit), and the antenna has a carrier, and the carrier of the flexible electronics is also a flexible carrier with certain flexibility, and the antenna itself is also flexible. Meanwhile, the conveying process of the flexible carrier is usually roll-to-roll conveying, the conveying principle and requirements of the flexible carrier are greatly different from those of rigid electronic manufacturing, and for the picking and placing higher requirements in the chip transferring process, the key actions of picking up the chip and placing the chip must be guaranteed to be as soft as possible, so that the problem of crushing possibly caused when the chip is picked up is avoided.
At present, a traditional chip packaging device usually only has one chip transfer device, and each chip transfer device only has one turnover head to work, and only can meet a mounting device butted with the chip transfer device, for example, a pneumatic linear driving chip picking and turnover device is disclosed in the existing patent document CN 102173345A, which can realize chip transfer to a certain extent, but the efficiency of the device is difficult to break through the improvement of quality, and the efficient preparation of flexible electronics cannot be met. In addition, although there is an apparatus in the prior art that a plurality of single-flip-head chip transfer devices are used to increase the production speed, for example, a four-bonding-head rotary-type inverted packaging apparatus disclosed in the prior patent document CN 205177788U can realize the cooperation of a plurality of transfer devices, but also causes a large efficiency loss due to the problem of avoidance of the plurality of transfer devices, and the apparatus has a complicated structure and a complicated and complex control process, which results in a high use cost, maintenance cost and control cost of the apparatus during the preparation of flexible electronics, and cannot effectively reduce the manufacturing cost of the flexible electronics, thereby having a large application limitation.
Disclosure of Invention
Aiming at one or more of the defects or the improvement requirements in the prior art, the invention provides the double-turnover-head chip transfer device suitable for flexible electronic manufacturing, which can realize continuous and efficient transfer of chips on the premise of ensuring the turnover and transfer precision of the chips, avoid damage to the chips in the transfer process and improve the transfer efficiency and quality of the chips in the flexible electronic manufacturing process.
In order to achieve the above object, the present invention provides a double-flipping-head chip transfer device suitable for flexible electronic manufacturing, comprising a flipping mechanism having a flipping arm, characterized in that,
the turnover arm is coaxially provided with two chip transfer units, and the two chip transfer units are arranged at an angle of 180 degrees and used for sucking chips and turning the chips over;
the chip transfer unit comprises a turnover head mechanism and a Z-direction driving mechanism which are coaxially arranged; the turnover head mechanism is fixedly connected to the end part of the Z-direction driving mechanism through a connecting plate and can reciprocate for a certain distance along the axial direction under the driving of the Z-direction driving mechanism;
the turnover head mechanism comprises a turnover head seat, a suction rod seat and suction rods, and the two suction rods in the two turnover head mechanisms are coaxially arranged; one side end face of the turnover head seat is connected with the connecting plate, a blind hole is formed in the side end face, and a through hole penetrating through the other side end face of the turnover head seat is coaxially formed in the bottom of the blind hole; the sucker rod seat is accommodated in the blind hole, the end part of the sucker rod seat penetrates through the through hole and can be locked on the turnover head seat through a first locking nut, and the middle part of the sucker rod seat is axially provided with a through hole which is used for being matched with the sucker rod through a linear bearing; the axis of the suction rod is parallel to or coincided with the axis of the Z-direction driving mechanism, one end of the suction rod penetrates through the through hole, a suction nozzle is coaxially arranged on the end of the suction rod, the other end of the suction rod is fixedly connected with a buffer unit, and the buffer unit is arranged between the connecting plate and the turnover head seat and used for buffering the axial movement of the suction rod; and the middle part of the suction rod is axially provided with an air hole communicated with the suction nozzle, and one end of the suction rod, which is far away from the suction nozzle, is provided with an air inlet used for connecting a negative pressure system.
As a further improvement of the present invention, the radial dimension of the blind hole is larger than the radial dimension of the sucker rod seat, and the sucker rod seat can reciprocate in the direction orthogonal to the radial plane; and is
A two-degree-of-freedom fine adjustment mechanism is arranged on the overturning head seat corresponding to the orthogonal movement of the sucker rod seat on a radial plane and comprises two fine adjustment units which are orthogonally arranged; the axis of the fine adjustment unit is perpendicular to the axis of the suction rod seat, can act on two radial sides of the suction rod seat and is used for controlling the suction rod seat to perform fine adjustment movement in the axial direction of the fine adjustment unit.
As a further improvement of the invention, a fine adjustment hole is formed on the side wall surface of the turnover head base corresponding to the fine adjustment unit, the axis of the fine adjustment hole is perpendicular to the axis of the blind hole, and two ends of the fine adjustment hole respectively penetrate through the side wall surface of the turnover head base;
the fine adjustment unit comprises a first adjustment rod, a second adjustment rod, an outer sleeve, an inner sleeve and an elastic element; the outer sleeve is matched with one section of the fine adjustment hole in a threaded manner, the end part of the outer sleeve is opposite to the side wall surface of the sucker rod seat, and the second adjusting rod is matched with the other section of the fine adjustment hole in a threaded manner and is abutted against the peripheral wall surface of the sucker rod seat; a stepped through hole is formed in the middle of the outer sleeve and comprises a thread section with a smaller inner diameter and a buffer section with a larger inner diameter, and the buffer section is close to the sucker rod seat; the first adjusting rod is matched with the thread section through threads, and the elastic element is sleeved on the periphery of the end part of the first adjusting rod and is correspondingly accommodated in the buffer section; the inner sleeve is of a sleeve structure with one closed end, the closed end of the inner sleeve is abutted to the periphery of the sucker rod seat, and the open end of the inner sleeve is embedded into the buffer section and sleeved on the periphery of the elastic element.
As a further improvement of the invention, one end of the outer sleeve extends out of the peripheral wall surface of the turnover head seat, a second locking nut is arranged corresponding to the outer sleeve, and a duplex elastic pad is arranged between the end parts of the two outer sleeves; the duplex elastic cushion is attached to the periphery of the turnover head seat, and two ends of the duplex elastic cushion are respectively sleeved on the outer sleeve and can be pressed by the second locking nut.
As a further improvement of the present invention, the damping unit includes an upper spring seat, a lower spring seat, and a damping element;
the upper spring seat is abutted against the inner peripheral wall surface of the connecting plate, and the lower spring seat is abutted against the sucker rod seat; the two spring seats and the suction rod are coaxially arranged, and the buffer element is arranged between the two spring seats and can be compressed or extended in the axial direction; the end part of the suction rod is fixedly connected to the lower spring seat.
As a further improvement of the invention, a threaded hole is formed in one side of the lower spring seat, which is away from the upper spring seat, for being in threaded connection with the suction rod, and at least one annular groove is formed in the inner peripheral wall surface of the threaded hole for arranging a sealing element.
As a further improvement of the invention, an accommodating groove with a certain depth is formed on the end face of the suction rod seat, which is opposite to the lower spring seat, and the end part of the lower spring seat is embedded into the accommodating groove in a matching manner in a movable fit manner.
As a further improvement of the invention, the Z-direction driving mechanism comprises a voice coil motor, a linear guide rail, a reading head mounting seat, a grating ruler strip and a grating reading head;
the voice coil motor is fixed on the turnover arm, the axis of an output shaft of the voice coil motor is parallel to or coincided with the axis of the suction rod, and the end part of the output shaft is fixedly connected with the connecting plate; the linear guide rail and the grating ruler strip are respectively arranged on the turnover arm, the axes of the linear guide rail and the grating ruler strip are respectively parallel to the axis of the suction rod, two ends of the reading head mounting seat are respectively and fixedly connected with the connecting plate and the grating reading head, the reading head mounting seat is matched with the linear guide rail, and the grating reading head is matched with the grating ruler strip.
As a further improvement of the invention, the turnover mechanism further comprises a turnover motor;
the overturning motor is fixed on the motor base, an output shaft of the overturning motor penetrates through the motor base and is coaxially connected with the rotating shaft of the overturning arm, a sensor blocking piece is arranged on the periphery of the rotating shaft along the annular direction, and a sensor is arranged on the motor base corresponding to the sensor blocking piece.
As a further improvement of the invention, the chip transfer detection mechanism is also arranged and used for detecting whether the turnover head mechanism absorbs the chip or not;
the chip transfer detection mechanism comprises an air pressure display and an air pressure sensor head; the air pressure display is electrically connected with the air pressure sensor head through a cable, and the air pressure sensor head is connected into the negative pressure system through a pipe joint and used for monitoring the air pressure in the negative pressure system in real time.
The above-described improved technical features may be combined with each other as long as they do not conflict with each other.
Generally, compared with the prior art, the technical scheme conceived by the invention has the following beneficial effects:
(1) According to the double-turnover-head chip transfer device suitable for manufacturing the flexible electronics, the turnover arm of the turnover mechanism is coaxially and symmetrically provided with the pair of chip transfer units, the chips can be effectively and continuously sucked and turned over in the flexible electronics manufacturing process by utilizing 180-degree rotation control of the two chip transfer units, the chip sucking, turning and transferring efficiency is improved, the acting force of the suction nozzle and the chips during acting can be correspondingly adjusted by utilizing the corresponding arrangement and control of the Z-direction driving mechanism and the turnover head mechanism in the chip transfer units and the arrangement of the buffer unit in the turnover head mechanism and the adjustment of the Z-direction driving mechanism, the chips are prevented from being crushed, and the turnover and transfer quality of the chips is ensured.
(2) The double-turnover-head chip transfer device suitable for manufacturing flexible electronics is provided with the buffer unit consisting of the upper spring seat, the lower spring seat and the buffer element, and a certain buffer distance can be reserved in the axial direction of the suction rod when a suction nozzle at the end part of the suction rod is in contact with a chip by utilizing the corresponding arrangement of the buffer unit between the two spring seats and the corresponding connection of the lower spring seat and the suction rod, so that the chip is prevented from being broken due to hard contact between the chip and the suction nozzle, and the turning and transferring quality of the chip is ensured; in addition, the containing groove with a certain depth is arranged at the top of the suction rod seat corresponding to the lower spring seat, and the guide of the axial motion of the suction rod can be realized and the buffering effect of the suction rod can be further improved by utilizing the movable fit of the lower spring seat and the containing groove;
(3) The double-turnover-head chip transfer device suitable for manufacturing the flexible electronic is characterized in that a two-degree-of-freedom fine adjustment mechanism is arranged in the turnover head seat corresponding to the suction rod seat, and the two fine adjustment units which are orthogonally arranged in the two-degree-of-freedom fine adjustment mechanism are utilized to realize fine adjustment of the positions of the suction rod seat and the suction rod in the X-axis direction and the Y-axis direction (the axial direction of the suction rod is the Z-axis direction), so that three-degree-of-freedom adjustment of the suction rod is realized;
(4) According to the double-turnover-head chip transfer device suitable for flexible electronic manufacturing, the Z-direction driving mechanism is correspondingly arranged, and the operating state of the turnover head mechanism controlled in the Z direction can be fed back in real time by utilizing the corresponding arrangement of the components such as the linear guide rail, the grating ruler strip, the grating reading head and the like in the Z-direction driving mechanism, so that the working distances of the two suction rods are equal or approximately equal, the accuracy of chip transfer control is further improved, and the damage of a chip is fully avoided;
(5) According to the double-turnover-head chip transfer device suitable for flexible electronic manufacturing, the chip transfer detection mechanism consisting of the air pressure display, the air pressure sensor head and the like is arranged corresponding to the negative pressure system of the suction rod in the two turnover head mechanisms, so that the air pressure in the negative pressure system can be monitored in real time, the idling of the turnover head mechanisms is avoided, the working accuracy of the turnover head mechanisms is ensured, and the continuity and the precision of chip absorption, transfer and turnover are ensured;
(6) The double-turnover-head chip transfer device suitable for flexible electronic manufacturing is simple in structure and convenient to control, continuous turnover transfer of chips can be realized through coaxial symmetrical arrangement of the two turnover head mechanisms, and accuracy and efficiency of chip transfer are improved; meanwhile, the Z-direction driving mechanism and the two-degree-of-freedom fine adjustment mechanism are respectively arranged corresponding to each turnover head mechanism, so that the corresponding adjustment of the suction rod in the X-axis direction, the Y-axis direction and the Z-axis direction can be accurately realized, the accuracy of the positions of the two suction nozzles is always ensured, the efficiency and the precision of the chip transfer process are improved, the cost of chip turnover transfer is reduced, and the chip turnover transfer device has a better application prospect and popularization value.
Drawings
FIG. 1 is a schematic two-dimensional structure diagram of a double-flip-head chip transfer device according to an embodiment of the present invention;
FIG. 2 is a three-dimensional schematic diagram of a main structure of a dual-flip-head chip transfer device according to an embodiment of the present invention;
FIG. 3 is a two-dimensional cross-sectional view of the main structure of a dual flip head chip transfer device in an embodiment of the present invention;
FIG. 4 is a two-dimensional cross-sectional view of a flipping head mechanism of a dual-flipping-head chip transfer device in an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a two-degree-of-freedom fine adjustment mechanism of a dual-flip-head chip transfer device according to an embodiment of the present invention;
FIG. 6 is a perspective view of the arrangement structure of the Z-direction driving mechanism of the double-turnover-head chip transfer device in the embodiment of the invention;
FIG. 7 is a perspective view of the arrangement structure of the turnover mechanism of the double-turnover-head chip transfer device in the embodiment of the present invention;
FIG. 8 is a schematic diagram of the structural configuration of the chip transfer detection mechanism of the dual flip head chip transfer device in the embodiment of the present invention;
FIG. 9 is a schematic diagram of the matching of the voice coil motor and the motor base of the Z-direction driving mechanism in the embodiment of the invention;
throughout the drawings, like reference numerals designate like features, and in particular:
10. a head overturning mechanism; 101. the suction nozzle comprises a connecting plate, 102, an upper spring seat, 103, a lower spring seat, 104, a buffer element, 105, a pipe joint, 106, a sealing element, 107, a turnover head seat, 108, a suction rod seat, 109, a linear bearing, 110, a first locking nut, 111, a suction rod, 112, a two-degree-of-freedom fine adjustment mechanism and 113, a suction nozzle;
20.Z-direction driving mechanism, 201, voice coil motor seat, 202, voice coil motor, 203, linear guide rail, 204, reading head mounting seat, 205, grating ruler strip, 206, grating reading head;
30. turnover mechanism 301, turnover arm 302, motor base 303, turnover motor 304, sensor 305, sensor block sheet;
40. chip transfer detection mechanism, 401, mounting seat, 402, air pressure display, 403, air pressure sensor head, 404, pipe joint, 405, air pipe, 406, cable;
1121. the adjusting device comprises a first adjusting rod, 1122, a second locking nut, 1123, a duplex elastic pad, 1124, an outer sleeve, 1125, an elastic element, 1126, an inner sleeve, 1127, a push plate and 1128, and a second adjusting rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the respective embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The embodiment is as follows:
referring to fig. 1 to 9, the double-flipping-head chip transferring device suitable for flexible electronic manufacturing according to the preferred embodiment of the present invention includes a flipping mechanism 30, and a flipping head mechanism 10 connected to the flipping mechanism 30 by a Z-direction driving mechanism 20. Wherein, the Z-direction driving mechanism 20 and the turning head mechanisms 10 are respectively coaxially arranged in pairs, and the two turning head mechanisms 10 are arranged at 180 degrees, so that the suction nozzles 113 on the two turning head mechanisms 10 are coaxial and deviate from each other. By utilizing the structural arrangement of the two turnover head mechanisms 10, the chip can be turned over for 180 degrees accurately in the process of manufacturing the flexible electronic, and the welding spots/pins of the chip are accurately aligned to the position to be assembled when the chip feeds materials to the corresponding position of the antenna (similar to a circuit). It should be noted that, in a normal case, a solder joint of the chip tends to face upward during feeding, and when the chip is matched with the antenna, the solder joint needs to face downward to match the antenna, so that the feeding process of the chip needs to perform 180 ° flip of the chip. The double-turnover-head chip transfer device in the preferred embodiment of the invention is correspondingly arranged for realizing the process efficiently and accurately.
Specifically, in the dual-flipping-head chip transferring apparatus in the preferred embodiment, as shown in fig. 1, two flipping head mechanisms 10 are symmetrically and fixedly mounted on a flipping arm 301 of a flipping mechanism 30 through two Z-direction driving mechanisms 20, such that two suction rods 111 on the two flipping head mechanisms 10 are coaxially arranged, and two suction nozzles 113 are respectively disposed on two ends of the two suction rods 111 facing away from each other. Obviously, the two turnover head mechanisms 10 are symmetrically arranged, and the two Z-direction driving mechanisms 20 are symmetrically arranged.
Further, the flipping mechanism 30 in the preferred embodiment is shown in fig. 2, 3 and 7, and is used for powering the alternate operation of two flipping head mechanisms 10, including a flipping arm 301, a motor base 302, and a flipping motor 303. The overturning motor 303 is correspondingly fixed on the motor base 302, and an output shaft of the overturning motor 303 penetrates through the middle part of the motor base 302 and is correspondingly connected with a rotating shaft of the overturning arm 301, so that the overturning arm 301 can rotate around the shaft under the driving of the output shaft. Meanwhile, a sensor baffle 305 is correspondingly arranged on the rotating shaft of the overturning arm 301, a sensor 304 is arranged on one side of the motor base 302 close to the overturning arm 301, and a reasonable gap is kept between the sensor 304 and the sensor baffle 305. When the turnover arm 301 is driven by the turnover motor 303 to rotate, the sensor catch 305 also synchronously rotates, and the sensor 304 is matched to provide start and stop limit and zero position signals for the rotation motion, so that the rotation angle of the turnover mechanism 30 is always accurate.
Further, the Z-drive mechanism 20 in the preferred embodiment is coaxially fixed to the invert arm 301, and the two Z-drive mechanisms 20 are symmetrically disposed about a plane in which the axes of rotation of the invert arm 301 are located, as shown in fig. 6. Specifically, the Z-drive mechanism 20 includes a voice coil motor 202, a voice coil motor mount 201, a linear guide 203, a head mount 204, a grating blade 205, and a grating head 206. The voice coil motor bases 201 are fixed in the middle of the turning arm 301 in a mode parallel to the axis of the rotating shaft of the turning arm 301, the two voice coil motor bases 201 are fixedly arranged back to back, the voice coil motors 202 are fixedly arranged on the surfaces of the voice coil motor bases 201 respectively, the axes of the two voice coil motors 202 are coaxial and perpendicular to the surfaces of the voice coil motor bases 201 respectively, and the output shafts of the two voice coil motors 202 are fixedly connected with the connecting plates 101 respectively so as to be used for arranging the turning head mechanism 10 on the output shafts of the voice coil motors 202 correspondingly.
Further, the voice coil motor 202 is mounted on the voice coil motor base 201 in the preferred embodiment as shown in fig. 9, that is, a plurality of (e.g., four) counter bores are uniformly distributed on the voice coil motor base 201, so that the bottom of the voice coil motor 202 can be fixedly connected to the voice coil motor base 201 through screws. Of course, the voice coil motor base 201 may also be set to an L shape, so that the side wall of the voice coil motor 202 may also be fixedly connected to the voice coil motor base 201 through screws, thereby ensuring the connection stability between the two. If necessary, screws may be inserted into the counter bores of one voice coil motor mount 201 and the other voice coil motor 202 may be fixed to the other voice coil motor mount 201.
Meanwhile, in order to ensure the accuracy of the motion of the output shaft of the voice coil motor 202, two ends of the turning arm 301 are respectively provided with a positioning detection assembly, which comprises a linear guide rail 203 and a grating ruler 205 arranged corresponding to the two turning head mechanisms 10, the axes of the linear guide rail 203 and the grating ruler 205 are respectively parallel to the axis of the output shaft of the voice coil motor 202, and the two linear guide rails 203 are respectively provided with a reading head mounting seat 204. One end of the reading head mounting base 204 is fixedly connected with the connecting plate 101, the other end is fixedly connected with the grating reading head 206, and the grating reading head 206 is matched with the corresponding grating rack 205. The accurate movement of the link plate 101 can be realized by the driving of the voice coil motor 202 and the guiding of the linear guide 203, the grating scale 205 is read by the grating reading head 206, and the voice coil motor 204 is controlled according to the reading, thereby realizing the feedback control of the transfer height of the suction nozzle 113.
Further, the flipping head mechanism 10 in the preferred embodiment is fixed to the flipping arm 301 by a connection plate 101, as shown in fig. 3 and 4.
In a preferred embodiment, the turning head mechanism 10 shown in the lower part of fig. 3 is taken as an example, specifically, the turning head mechanism 10 includes a turning head base 107 fixedly connected to the connecting plate 101, the turning head base 107 is a plate-shaped structure horizontally arranged and having a certain thickness, a square blind hole with a certain depth is formed on one side end surface (top surface) for correspondingly accommodating the suction rod base 108, a suction rod base 108 with a square structure is accommodated in the square blind hole, and a circular through hole penetrating through the other end surface (bottom surface) is formed at the bottom of the square blind hole for passing through the connecting end part of the suction rod 111 and the suction rod base 108. Correspondingly, a first locking nut 110 is provided at the connection end of the sucker rod seat 108 for screw-fitting with the connection end to secure the sucker rod seat 108 to the inverting head seat 107. Meanwhile, a cylindrical through hole is formed in the middle of the suction rod seat 108 along the axial direction and is used for the suction rod 111 to pass through coaxially, and the suction rod 111 and the suction rod seat 108 are correspondingly matched through the linear bearing 109, so that the suction rod 111 can reciprocate for a certain distance in the axial direction, namely, the linear bearing 109 guides the axial movement of the suction rod 111.
Further specifically, a through hole is formed in the middle of the suction rod 111 along the axial direction and is used for communicating with a suction nozzle 113 coaxially arranged at the end of the suction rod 111, an air inlet is formed in the other end of the suction rod 111 corresponding to the through hole in the middle of the suction rod, and a pipe joint 105 is arranged corresponding to the air inlet and is used for connecting a negative pressure system and providing power for transferring the chip by the suction nozzle 113. Meanwhile, in the preferred embodiment, a cavity structure is formed on one side of the connecting plate 101, which is connected to the flip head base 107, and an upper spring seat 102, a lower spring seat 103 and a buffer element 104 are correspondingly arranged therein, the buffer element 104 in the preferred embodiment is a buffer spring, which is arranged between the two spring seats 102, the upper spring seat 102 is correspondingly arranged on one side close to the connecting plate 101 and correspondingly matched with one end of the buffer element 104, and the lower spring seat 103 and the upper spring seat 102 are coaxially arranged and correspondingly arranged on one side close to the sucker rod seat 108 and correspondingly matched with the other end of the buffer element 104.
In the preferred embodiment, the lower spring seat 103 is a "T-shaped" structure that includes a cylindrical end and a square end that are coaxially disposed and form a stepped structure at the junction of the two ends. When the buffer element 104 is a buffer spring, one end of the buffer element is sleeved on the cylindrical end and abuts against the end face of the square end. Meanwhile, the other end of the lower spring seat 103, which faces away from the buffering element 104, is fixedly connected with the end of the suction rod 111, and the connection form of the two includes, but is not limited to, threaded connection, welding and the like. In the preferred embodiment as shown in fig. 4, the suction rod 111 is matched with the lower spring seat 103 in a threaded manner, a mounting hole with a certain depth is axially formed in the end surface of the lower spring seat 103, and preferably, at least one annular groove is formed in the inner periphery of the mounting hole, so that at least one sealing element 106 is arranged on the outer periphery of the suction rod 111 to ensure the tightness of air suction after the negative pressure system is communicated with the air inlet. In addition, a square groove with a certain depth is formed in the top of the suction rod seat 108 corresponding to the square end of the lower spring seat 103, the square end of the lower spring seat 103 can be correspondingly embedded into the square groove, and the square end are matched in a movable fit mode, so that the lower spring seat 103 and the suction rod seat 108 can move relative to each other.
Further preferably, the middle part of the upper spring seat 102 is hollow, and can be used for the cylindrical end of the lower spring seat 103 to correspondingly pass through, and in a normal state, the upper spring seat 102 abuts against the inner wall of the connecting plate 101 and is sleeved on the periphery of the cylindrical end. Meanwhile, a circular groove with a certain depth is coaxially formed in the inner wall of the inner cavity of the connecting plate 101, which is opposite to the lower spring seat 103, and the circular groove can be used for matching and embedding the cylindrical end of the lower spring seat 103, so that a sufficient buffer space is provided for the vertical movement of the suction rod 111.
Furthermore, the size of the blind hole formed in the top surface of the turnover head seat 107 is larger than that of the sucker rod seat 108, and the inner diameter of the circular through hole formed in the bottom of the blind hole in the top surface is larger than the outer diameter of the connecting end at the end of the sucker rod seat 108, so that the sucker rod seat 108 can deviate in the blind hole, and the position of the sucker rod 111 can be adjusted. Specifically, through holes, i.e., a first fine tuning hole and a second fine tuning hole, penetrating through the blind hole on the top surface thereof are formed on the periphery of the flipping head base 107 at an interval of 90 degrees, and the axes of the two fine tuning holes are orthogonally arranged and are respectively perpendicular to the axis of the blind hole on the top surface. Meanwhile, two fine adjustment holes penetrate from the periphery of one side of the flipping head seat 107 to the periphery of the other side thereof, so as to accommodate the two-degree-of-freedom fine adjustment mechanism 112.
Specifically, the two-degree-of-freedom fine adjustment mechanism 112 in the preferred embodiment includes two fine adjustment units arranged orthogonally, and the axes of the two fine adjustment units are perpendicular to the axis of the Z-direction drive mechanism 20, i.e., perpendicular to the axis of the suction rod 111. In a preferred embodiment, the axial direction of the suction rod 111 is taken as the Z direction, then the two fine tuning units can correspondingly realize the adjustment of the suction rod 111 in the X direction and the Y direction, that is, the two-degree-of-freedom fine tuning mechanism 112 and the Z-direction driving mechanism 20 are correspondingly arranged, so that the three-degree-of-freedom adjustment of the suction rod 111 in the three-dimensional space can be realized, further, the two suction rods 111 on the two flip head mechanisms 10 are ensured to be coaxial, and the acting force of the two suction nozzles 113 acting on the chip is ensured not to damage the chip, that is, when the two suction rods 111 are respectively rotated to the position aligned with the chip carrier, the vertical heights of the two suction nozzles 113 are equal or approximately equal.
In the preferred embodiment, the fine tuning unit vertically arranged in fig. 5 is taken as an example for description, and the structure of the fine tuning unit horizontally arranged is the same as that of the fine tuning unit. In particular, the fine adjustment unit comprises an outer sleeve 1124, a first adjustment rod 1121, an elastic element 1125, an inner sleeve 1126 and a second adjustment rod 1128. The outer sleeve 1124 fits coaxially within the first fine adjustment hole and threadably fits within the fine adjustment hole, and adjustment of the amount of pressure between the inner sleeve 1126 and the straw seat 108 is accomplished by controlling the depth to which the outer sleeve 1124 is threaded.
Further, a stepped through hole is axially formed in the outer sleeve 1124, and an inner diameter of a side close to the suction rod seat 108 is larger than that of the other side, and an inner circumference of a side with a smaller inner diameter is formed with an inner thread to be threadedly matched with the first adjusting rod 1121. Correspondingly, one end with the larger inner diameter is of a unthreaded hole structure, and an annular step surface is formed at the joint of the other end of the unthreaded hole structure and the other end of the unthreaded hole structure. An elastic element 1125 is coaxially disposed in the optical hole with a larger inner diameter, and is correspondingly sleeved on the outer circumference of the end of the first adjusting rod 1121, with one end abutting against the annular step surface and the other end abutting against the end surface of the inner sleeve 1126. The inner sleeve 1126 in the preferred embodiment is a closed-end sleeve structure with an open end coaxially extending into the light hole and surrounding the outer periphery of the elastic element 1125 and a closed end abutting against the outer peripheral wall of the straw seat 108. By tightening or loosening the first adjustment rod 1121, the pressure of the elastic member 1125 against the inner sleeve 1126, i.e., the amount of pressure between the inner sleeve 1126 and the straw holder 108, can be adjusted accordingly.
In addition, a second adjusting rod 1128 is coaxially disposed on the other side of the sucker rod seat 108 away from the first adjusting rod 1021, and is in threaded fit connection with the fine adjustment hole of the flipping head seat 107, and the sucker rod seat 108 can be correspondingly pushed to a corresponding position by controlling the screwing length of the second adjusting rod. Preferably, a push plate 1127 is disposed at the end of the second adjustment rod 1128 to increase the contact area with the sucker rod base 108 and ensure the stability of the sucker rod base 108 under force. The corresponding position of the sucker rod seat 108 on the axis of the first fine tuning hole can be adjusted by correspondingly controlling the first adjusting rod 1121 and the second adjusting rod 1128, and the adjustment is recorded as the X-axis direction; meanwhile, the corresponding adjustment of the sucker rod seat 108 in the Y-axis direction can be realized by the corresponding control of the two adjusting rods in the other fine adjustment unit.
Further, second locking nuts 1122 for locking the outer sleeves 1124 rotated in place are respectively provided at ends of the outer sleeves 1124 in correspondence to the two fine adjustment units. Meanwhile, a duplex elastic pad 1123 is disposed between the two outer sleeves 1124, and wraps and clings to the peripheral side wall surface of the turnover head seat 107, and both ends of the duplex elastic pad are respectively sleeved on the end portions of the outer sleeves 1124, and can be pressed on the periphery of the turnover head seat 107 by a second locking nut 1122.
In order to monitor whether the inverting head mechanism 10 accurately transfers the chip in real time, the chip transfer detection mechanisms 40 are respectively arranged corresponding to the two inverting head mechanisms 10, and each chip transfer detection mechanism comprises an air pressure display 402 fixed on a mounting seat 401, the air pressure display 402 is connected with an air pressure sensor head 403 through a cable 406, and the air pressure sensor head 403 is connected with an air pipe 405 of a negative pressure system through a pipe joint 404, so that the real-time monitoring of the air pressure in the corresponding suction rod 111 is realized, and the inverting head mechanisms 10 are ensured to accurately absorb the chip.
The double-flip-head chip transfer device in the preferred embodiment of the invention preferably has the following working process:
firstly, before the operation of transferring the chip is started, two first locking nuts 110 are unscrewed, and then the X-direction and Y-direction positions of suction nozzles 113 are adjusted through a two-degree-of-freedom fine adjustment mechanism 112, so that the suction nozzles 113 of two turnover head mechanisms 10 are ensured to be coaxial and are aligned to the central position of the chip on the carrier; then the two first locking nuts 110 are tightened, and the two sets of first adjustment rods 1121 and second adjustment rods 1128 are tightened;
secondly, the voice coil motor 202 of the Z-direction driving mechanism 20 is started, and the Z-direction driving mechanism 20 is controlled by the control system, so that the initial heights and the transfer heights of the suction nozzles 113 of the two turnover head mechanisms 10 are consistent when chips are transferred, and the chips can be successfully transferred under the condition of normal work;
then, the flip motor 303 of the flip mechanism 30 and the chip transfer detecting mechanism 40 are turned on, and the chip transfer operation is started in conjunction with the Z-direction driving mechanism 20. After the first flipping head mechanism 10 successfully sucks a chip, the motor 303 of the flipping mechanism 30 drives the flipping arm 301 to rotate 180 degrees (counterclockwise), so that the second flipping head mechanism 10 moves to the position where the first flipping head mechanism 10 is before rotating, and starts to transfer another chip. Then the second turnover head mechanism 10 rotates 180 degrees (clockwise), so that the first turnover head mechanism 10 returns to the initial position, the chip transfer operation is continuously executed, and the chip transfer operation is circularly and repeatedly carried out by the two turnover head mechanisms 10. In the process of transferring the chip by the turnover head mechanism 10, the grating reading head 206 reads the grating ruler 205 and controls the voice coil motor 204 according to the reading, so as to realize the feedback control of the transfer height of the suction nozzle 113; sensor 304 provides start, stop limit and zero position signals for rotational movement. The air pressure sensor head 403 of the chip transfer detection mechanism 40 can monitor the change of the negative pressure of the air path in real time, display the change on the air pressure display 402, and perform feedback control on the detection information to ensure that the suction nozzle 113 of each turnover head mechanism 10 does not have a chip to idle, thereby improving the operation efficiency of the whole device.
The double-turnover-head chip transfer device suitable for flexible electronic manufacturing has the advantages of simple structure and simplicity and convenience in control, and can realize continuous turnover transfer of chips and improve the accuracy and efficiency of chip transfer by coaxially and symmetrically arranging the two turnover head mechanisms; meanwhile, the Z-direction driving mechanism and the two-degree-of-freedom fine adjustment mechanism are arranged corresponding to each overturning head mechanism respectively, so that the corresponding adjustment of the suction rod in the X-axis direction, the Y-axis direction and the Z-axis direction can be accurately realized, the accuracy of the positions of the two suction nozzles is always ensured, the precision and the accuracy of the chip transferring process are improved, the chip overturning and transferring cost is reduced, and the chip overturning and transferring device has better application prospect and popularization value.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (10)

1. A double-turnover-head chip transfer device suitable for flexible electronic manufacturing comprises a turnover mechanism with a turnover arm, and is characterized in that,
the turnover arm is coaxially provided with two chip transfer units, and the two chip transfer units are arranged at an angle of 180 degrees and used for sucking chips and turning the chips over;
the chip transfer unit comprises a turnover head mechanism and a Z-direction driving mechanism which are coaxially arranged; the turnover head mechanism is fixedly connected to the end part of the Z-direction driving mechanism through a connecting plate and can reciprocate for a certain distance along the axial direction under the driving of the Z-direction driving mechanism;
the turnover head mechanism comprises a turnover head seat, a suction rod seat and suction rods, and the two suction rods in the two turnover head mechanisms are coaxially arranged; one side end face of the turnover head seat is connected with the connecting plate, a blind hole is formed in the side end face, and a through hole penetrating through the other side end face of the turnover head seat is coaxially formed in the bottom of the blind hole; the sucker rod seat is accommodated in the blind hole, the end part of the sucker rod seat penetrates through the through hole and can be locked on the turnover head seat through a first locking nut, and the middle part of the sucker rod seat is axially provided with a through hole which is used for being matched with the sucker rod through a linear bearing; the axis of the suction rod is parallel to or coincided with the axis of the Z-direction driving mechanism, one end of the suction rod penetrates through the through hole, a suction nozzle is coaxially arranged on the end of the suction rod, the other end of the suction rod is fixedly connected with a buffer unit, and the buffer unit is arranged between the connecting plate and the turnover head seat and used for buffering the axial movement of the suction rod; and the middle part of the suction rod is provided with an air hole communicated with the suction nozzle along the axial direction, and one end of the suction rod, which is deviated from the suction nozzle, is provided with an air inlet used for connecting a negative pressure system.
2. The dual flip head chip transfer device suitable for flexible electronic manufacturing of claim 1, wherein the blind hole has a radial dimension larger than that of the sucker rod base and allows the sucker rod base to reciprocate in a direction orthogonal to a radial plane; and is
A two-degree-of-freedom fine adjustment mechanism is arranged on the overturning head seat corresponding to the orthogonal movement of the sucker rod seat on a radial plane and comprises two fine adjustment units which are orthogonally arranged; the axis of the fine adjustment unit is perpendicular to the axis of the suction rod seat, can act on two radial sides of the suction rod seat and is used for controlling the suction rod seat to perform fine adjustment movement in the axial direction of the fine adjustment unit.
3. The double-flip-head chip transfer device suitable for flexible electronic manufacturing of claim 2, wherein a fine tuning hole is opened on a side wall surface of the flip head base corresponding to the fine tuning unit, an axis of the fine tuning hole is perpendicular to an axis of the blind hole, and two ends of the fine tuning hole respectively penetrate through the side wall surface of the flip head base;
the fine adjustment unit comprises a first adjustment rod, a second adjustment rod, an outer sleeve, an inner sleeve and an elastic element; the outer sleeve is matched with one section of the fine adjustment hole through threads, the end part of the outer sleeve is opposite to the side wall surface of the suction rod seat, and the second adjustment rod is matched with the other section of the fine adjustment hole through threads and is abutted against the end part of the outer wall surface of the suction rod seat; a stepped through hole is formed in the middle of the outer sleeve and comprises a thread section with a smaller inner diameter and a buffer section with a larger inner diameter, and the buffer section is close to the sucker rod seat; the first adjusting rod is matched with the thread section through threads, and the elastic element is sleeved on the periphery of the end part of the first adjusting rod and is correspondingly accommodated in the buffer section; the inner sleeve is of a sleeve structure with one closed end, the closed end of the inner sleeve is abutted to the periphery of the sucker rod seat, and the open end of the inner sleeve is embedded into the buffer section and sleeved on the periphery of the elastic element.
4. The dual-flip-head chip transfer device suitable for flexible electronic manufacturing of claim 3, wherein one end of the outer sleeve extends out of the outer peripheral wall surface of the flip head seat and is provided with a second locking nut corresponding thereto, and a duplex elastic pad is arranged between the ends of the two outer sleeves; the duplex elastic cushion is attached to the periphery of the turnover head seat, and two ends of the duplex elastic cushion are respectively sleeved on the outer sleeve and can be pressed by the second locking nut.
5. The double-flip-head chip transfer device suitable for flexible electronic manufacturing according to any one of claims 1 to 4, wherein the buffer unit comprises an upper spring seat, a lower spring seat and a buffer element;
the upper spring seat is abutted against the inner peripheral wall surface of the connecting plate, and the lower spring seat is abutted against the sucker rod seat; the two spring seats and the suction rod are coaxially arranged, and the buffer element is arranged between the two spring seats and can be compressed or extended in the axial direction; the end part of the suction rod is fixedly connected to the lower spring seat.
6. The double-flip-head chip transfer device suitable for flexible electronic manufacturing of claim 5, wherein a threaded hole is opened on a side of the lower spring seat away from the upper spring seat for threaded connection with the suction rod, and at least one annular groove is opened on an inner peripheral wall surface of the threaded hole for arrangement of a sealing element.
7. The double-flip-head chip transfer device suitable for flexible electronic manufacturing of claim 5, wherein a receiving groove with a certain depth is formed on the end surface of the sucker rod seat facing the lower spring seat, and the end of the lower spring seat is embedded into the receiving groove in a movable fit manner.
8. The dual flip head chip transfer device suitable for flexible electronic manufacturing of any one of claims 1 to 7, wherein the Z-direction drive mechanism comprises a voice coil motor, a linear guide rail, a read head mount, a grating scale bar and a grating read head;
the voice coil motor is fixed on the turnover arm, the axis of an output shaft of the voice coil motor is parallel to or coincided with the axis of the suction rod, and the end part of the output shaft is fixedly connected with the connecting plate; the linear guide rail and the grating ruler strip are respectively arranged on the turnover arm, the axes of the linear guide rail and the grating ruler strip are respectively parallel to the axis of the suction rod, two ends of the reading head mounting seat are respectively and fixedly connected with the connecting plate and the grating reading head, the reading head mounting seat is matched with the linear guide rail, and the grating reading head is matched with the grating ruler strip.
9. The double-flip-head chip transfer device suitable for flexible electronic manufacturing according to any one of claims 1 to 8, wherein the flip mechanism further comprises a flip motor;
the overturning motor is fixed on the motor base, an output shaft of the overturning motor penetrates through the motor base and is coaxially connected with the rotating shaft of the overturning arm, a sensor blocking piece is arranged on the periphery of the rotating shaft along the annular direction, and a sensor is arranged on the motor base corresponding to the sensor blocking piece.
10. The double-turnover-head chip transfer device suitable for flexible electronic manufacturing according to any one of claims 1 to 9, wherein a chip transfer detection mechanism is further provided for detecting whether the turnover head mechanism sucks a chip;
the chip transfer detection mechanism comprises an air pressure display and an air pressure sensor head; the air pressure display is electrically connected with the air pressure sensor head through a cable, and the air pressure sensor head is connected into the negative pressure system through a pipe joint and used for monitoring the air pressure in the negative pressure system in real time.
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CN113410171B (en) * 2021-06-21 2022-10-14 深圳国融智能科技有限公司 Double-turnover-head chip transfer device suitable for flexible electronic manufacturing
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