CN111601028A - Thermal imaging shooting and recording device - Google Patents
Thermal imaging shooting and recording device Download PDFInfo
- Publication number
- CN111601028A CN111601028A CN202010552540.6A CN202010552540A CN111601028A CN 111601028 A CN111601028 A CN 111601028A CN 202010552540 A CN202010552540 A CN 202010552540A CN 111601028 A CN111601028 A CN 111601028A
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- array
- thermal imaging
- camera
- thermal
- shooting
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- 238000001931 thermography Methods 0.000 title claims abstract description 42
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 239000000523 sample Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
- H04N7/181—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a plurality of remote sources
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a thermal imaging shooting and recording device, which belongs to the technical field of image shooting and recording and comprises a base, wherein a shooting array, a thermal image array, an illuminating device, a transmission module and an image display device are arranged on the base, and the shooting array and the thermal image array are connected with the image display device through the transmission module. The thermal imaging shooting device provided by the invention can meet the requirements of carrying out related thermal imaging shooting on objects with a microspur closed space and a large length-width ratio.
Description
Technical Field
The invention relates to the technical field of image shooting and recording, in particular to a thermal imaging shooting and recording device.
Background
Any object with temperature can emit infrared rays, the thermal imager receives the infrared rays emitted by the object, the temperature distribution of the surface of the measured object is displayed through a picture after color processing, and abnormal points of the temperature are found out according to the temperature difference, so that the functions of temperature detection and maintenance are achieved.
The thermal imaging camera has the working principle of thermal infrared imaging technology, and the core of the thermal imaging camera is a thermal imager which is a sensor capable of detecting infrared ray quantity and converts infrared ray intensity into real-time video images to be displayed. The existing thermal imaging camera is generally applied to an open space when in use, and is difficult to be applied to a microspur closed space and an object with a large length-width ratio for thermal imaging shooting and recording of related equipment due to the focal length problems of an imager and a camera lens.
Disclosure of Invention
The present invention is directed to overcome the above-mentioned shortcomings in the prior art, and provides a thermal imaging camera device for thermal imaging and recording on an object with a large length-width ratio in a microspur enclosed space.
In order to achieve the purpose, the thermal imaging shooting device comprises a base, wherein a shooting array, a thermal image array, an illuminating device, a transmission module and an image display device are arranged on the base, and the shooting array and the thermal image array are connected with the image display device through the transmission module.
Furthermore, the thermal image array comprises a plurality of thermal imaging sensors arranged in an array, and the camera array comprises a plurality of camera sensors arranged in an array.
Further, the thermal imaging sensors and the camera sensors are alternately arranged.
Further, the illumination apparatus includes a plurality of LED lamps arranged on both sides of the camera array.
Furthermore, the transmission module adopts a data transmission line or a wireless communication module.
Further, the base comprises a PCB and a protective shell, the PCB is fixed on the protective shell, and the camera array, the thermal image array, the lighting device, the transmission module and the image display device are fixed on the PCB and electrically connected.
Furthermore, the camera shooting array and the thermal image array are respectively connected with external data receiving equipment through the transmission module.
Compared with the prior art, the invention has the following technical effects: the thermal imaging shooting device provided by the invention is provided with the shooting array and the thermal image array, and the lighting equipment is arranged to provide the light source, so that a long rectangular space can be covered in a static state, and the requirements of performing related thermal imaging shooting on objects with a micro-distance closed space and a large length-width ratio can be met.
Drawings
The following detailed description of embodiments of the invention refers to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a thermal imaging camera device according to the present invention.
In the figure:
1-a base; 2-a camera sensor; 3-a thermal imaging sensor; 4-a lighting device; 5-a transmission module; 6-image display device.
Detailed Description
To further illustrate the features of the present invention, refer to the following detailed description of the invention and the accompanying drawings. The drawings are for reference and illustration purposes only and are not intended to limit the scope of the present disclosure.
As shown in fig. 1, the present embodiment discloses a thermal imaging camera device, which includes a base 1, a camera array, a thermal image array, an illumination device 4, a transmission module 5 and an image display device 6 are disposed on the base 1, and both the camera array and the thermal image array are connected to the image display device 6 through the transmission module 5.
It should be noted that, when the temperature of the object is above-273 deg.c, energy will be available, and infrared rays will be radiated, in this embodiment, the thermal imaging camera is to detect the infrared radiation value of the surface of the object by an infrared sensitive detector, visually represent different values with different colors, and display the thermal imaging graph of the infrared camera by an image display device.
Further, the thermal image array comprises a plurality of thermal imaging sensors 3 arranged in an array, and the camera array comprises a plurality of camera sensors 2 arranged in an array.
Further, the thermal imaging camera device in this embodiment is applied to a microspur closed space, that is, the object to be measured is very close to the thermal imaging camera device, for example, 5mm, at this time, the object surface that each infrared detector can cover is, for example, a rectangular space of 3 × 3mm, the distance between each probe of the thermal imaging array needs to be less than or equal to 3mm, and an array of 5 probes can monitor a rectangular space of 3 × 15 mm. The thermal imaging array and the measured object perform 20mm relative operation in the vertical direction, and thermal imaging recording within the range of 23mm multiplied by 15mm can be realized.
Further, the thermal imaging sensor 3 and the camera sensor 2 are alternately arranged.
It should be noted that, because the distance between the camera device and the object to be measured is very close, each probe can only cover a part, and by alternately arranging the thermal imaging sensor and the camera sensor, the thermal imaging and the camera can cover the whole space.
Further, the lighting device 4 comprises a plurality of LED lamps arranged on two sides of the camera array, and the LED lamps also need to be arranged at intervals, so that the visible light rays are uniformly irradiated without shading shadows.
Further, the transmission module 5 adopts a data transmission line or a wireless communication module, and is used for transmitting data of the thermal image array and the camera array to the image display device 6 or an external data receiving device.
Further, the base 1 comprises a PCB plate and a protective housing, the PCB plate is fixed on the protective housing, and the camera array, the thermal image array, the lighting device 4, the transmission module 5, the image display device 6 and the like are fixed on the PCB plate in a mechanical fixing manner and form electrical connection.
It should be noted that the closed space means that no natural light source enters, the macro means that the camera device is very close to the object to be measured, for example, 5mm, and the area of the object to be measured is 10mm × 20mm, in which case a single sensor or camera cannot cover the whole object to be measured. In the embodiment, the thermal imaging camera device in an array form is arranged, and the plurality of LED lamps are arranged to provide a light source, so that a long rectangular space, such as a surface of 15mm × 3mm, can be covered in a static state, and the external relative operation is matched, such as the object to be measured can move up and down 20mm (or the thermal imaging camera device can move up and down 20mm), i.e., the surface of 15mm × 23mm can be covered.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. A thermal imaging shooting device is characterized by comprising a base, wherein a shooting array, a thermal image array, an illuminating device, a transmission module and an image display device are arranged on the base, and the shooting array and the thermal image array are connected with the image display device through the transmission module.
2. The thermal imaging camera device of claim 1, wherein said thermal image array comprises a plurality of thermal imaging sensors arranged in an array, and said camera array comprises a plurality of camera sensors arranged in an array.
3. The thermal imaging camera device of claim 2, wherein said thermal imaging sensors and said camera sensors are arranged alternately.
4. The thermal imaging camera of claim 1, wherein said illumination device comprises a plurality of LED lights disposed on either side of said camera array.
5. The thermal imaging camera device of claim 1, wherein said transmission module is a data transmission line or a wireless communication module.
6. The thermal imaging camera device of claim 1, wherein the base comprises a PCB board and a protective housing, the PCB board is fixed to the protective housing, and the camera array, the thermal image array, the illumination device, the transmission module and the image display device are fixed to the PCB board and electrically connected to each other.
7. The thermal imaging camera device according to any one of claims 1 to 6, wherein the camera array and the thermal image array are further connected to an external data receiving device via the transmission module, respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010552540.6A CN111601028A (en) | 2020-06-17 | 2020-06-17 | Thermal imaging shooting and recording device |
Applications Claiming Priority (1)
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CN202010552540.6A CN111601028A (en) | 2020-06-17 | 2020-06-17 | Thermal imaging shooting and recording device |
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CN111601028A true CN111601028A (en) | 2020-08-28 |
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CN202010552540.6A Pending CN111601028A (en) | 2020-06-17 | 2020-06-17 | Thermal imaging shooting and recording device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201453256U (en) * | 2009-07-01 | 2010-05-12 | 深圳市特思高电子有限公司 | Temperature detector with camera shooting and photographing functions |
CN110278378A (en) * | 2019-07-12 | 2019-09-24 | 易诚高科(大连)科技有限公司 | A kind of multi-cam camera system based on infrared photography adjustment |
CN211981990U (en) * | 2020-06-17 | 2020-11-20 | 国网安徽省电力有限公司滁州供电公司 | Thermal imaging shooting and recording device |
-
2020
- 2020-06-17 CN CN202010552540.6A patent/CN111601028A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201453256U (en) * | 2009-07-01 | 2010-05-12 | 深圳市特思高电子有限公司 | Temperature detector with camera shooting and photographing functions |
CN110278378A (en) * | 2019-07-12 | 2019-09-24 | 易诚高科(大连)科技有限公司 | A kind of multi-cam camera system based on infrared photography adjustment |
CN211981990U (en) * | 2020-06-17 | 2020-11-20 | 国网安徽省电力有限公司滁州供电公司 | Thermal imaging shooting and recording device |
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