CN111601021A - Photographing device, electronic apparatus, and control method - Google Patents
Photographing device, electronic apparatus, and control method Download PDFInfo
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- CN111601021A CN111601021A CN202010392620.XA CN202010392620A CN111601021A CN 111601021 A CN111601021 A CN 111601021A CN 202010392620 A CN202010392620 A CN 202010392620A CN 111601021 A CN111601021 A CN 111601021A
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- photosensitive chip
- circuit board
- assembly
- substrate
- lens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/53—Constructional details of electronic viewfinders, e.g. rotatable or detachable
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/62—Control of parameters via user interfaces
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/63—Control of cameras or camera modules by using electronic viewfinders
- H04N23/631—Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Studio Devices (AREA)
Abstract
The embodiment of the invention discloses a shooting device, electronic equipment and a control method, wherein the shooting device comprises: the lens assembly is arranged on the circuit board, and is fixedly arranged relative to the circuit board, and the lens assembly comprises a lens body; the photosensitive chip component is arranged between the lens and the circuit board, the photosensitive chip component is arranged towards the lens body, the photosensitive chip component can move, and the photosensitive chip component is electrically connected with the circuit board; the driving component is connected with the photosensitive chip component, and the driving component drives the photosensitive chip component to move in the direction close to or far away from the lens body. The lens assembly is fixed, the photosensitive chip assembly moves to realize focusing, the smaller view finding hole can meet the requirement of long-distance shooting, and the problem of contradiction between the larger view finding hole and the view finding hole with smaller pursuit of the extremely-caused appearance during long-distance shooting can be solved.
Description
Technical Field
The embodiment of the invention relates to the technical field of communication, in particular to a shooting device, electronic equipment and a control method.
Background
In a related art, a chip is generally fixed in position, and a lens is moved to achieve a focusing purpose, as shown in fig. 1, a chip 2 is fixed in position, and when a short-distance object 1 is photographed, a lens 4 is close to a viewing hole 3, and the viewing hole 3 is small; shooting a distant object 1, wherein a lens 4 is far away from a viewing hole 3 and can be realized only by the fact that the viewing hole 3 is large; in order to seek an excellent appearance, the finder hole 3 needs to be made smaller and smaller.
Therefore, when a long-distance object is shot by a focusing mode of the movable lens, the requirements of a larger view finding hole and a view finding hole which has the extremely small appearance and is required to be smaller during long-distance shooting are contradictory.
Disclosure of Invention
The embodiment of the invention provides a shooting device and electronic equipment, which can solve the problem of contradiction between a larger view finding hole and a view finding hole which has extremely small appearance pursuit during long-distance shooting.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a shooting device applied to an electronic device, where the shooting device includes:
a circuit board;
the lens assembly is arranged on the circuit board and fixedly arranged relative to the circuit board, and the lens assembly comprises a lens body;
the photosensitive chip assembly is arranged between the lens body and the circuit board, the photosensitive chip assembly faces the lens body, the photosensitive chip assembly can move, and the photosensitive chip assembly is electrically connected with the circuit board;
the driving assembly is connected with the photosensitive chip assembly and drives the photosensitive chip assembly to move in the direction close to or far away from the lens body.
In a second aspect, an embodiment of the present invention provides an electronic device, including the shooting apparatus as described in the first aspect.
In a third aspect, an embodiment of the present invention discloses a method for controlling a camera, including:
receiving input of a user;
in response to the input, the driving component drives the photosensitive chip component to move in a direction close to or far away from the lens body so as to focus a target object.
In the embodiment of the invention, the lens component is fixed, and the driving component drives the photosensitive chip component to move in the direction close to or far away from the lens body, so that focusing is realized, and further, the smaller viewing hole can meet the requirement of long-distance shooting, and the contradiction between the larger viewing hole and the extremely smaller viewing hole in appearance pursuit during long-distance shooting can be solved.
Drawings
FIG. 1 is a diagram illustrating a difference in the opening size of a finder hole caused by a difference in the position of a lens in the related art;
FIG. 2 is a schematic diagram of a camera according to an embodiment of the disclosure;
FIG. 3 is an exploded view of a camera according to an embodiment of the present invention;
FIG. 4 is a second schematic view of the photographing apparatus according to the embodiment of the disclosure;
FIG. 5 is a third schematic view of a camera according to the third embodiment of the present disclosure;
fig. 6 is a fourth schematic view of the photographing apparatus according to the embodiment of the invention.
Description of reference numerals:
1-focusing an object, 2-chip, 3-view finding hole and 4-lens;
101-lens body, 102-support frame; 103-a first conductive slot;
201-substrate, 202-photosensitive chip, 203-first connecting piece, 204-optical filter; 205-a second conductive slot;
206-clear hole;
301-a second connector;
401-a circuit board;
501-a third connecting piece;
601-magnetic element, 602-coil, 603-shape memory alloy member;
701-detecting element.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The following describes a photographing device provided in an embodiment of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 2 to 6, an embodiment of the present invention discloses a photographing apparatus, including: circuit board 401, lens subassembly, sensitization chip subassembly and drive assembly.
The circuit board 401 is a base member of the camera, the circuit board 401 can provide a mounting base for other components of the camera, and the circuit board 401 may be any one of a single-sided board, a double-sided board and a multi-layer circuit board, which is not limited in the embodiment of the present invention.
The lens assembly is arranged on the circuit board 401, is fixedly arranged relative to the circuit board 401 and comprises a lens body 101, and the lens body 101 is used for transmitting light rays;
sensitization chip module installation is between lens body 101 and circuit board 401, sensitization chip module sets up towards lens body 101, sensitization chip module is portable, sensitization chip module is connected with circuit board 401 electricity, sensitization chip module receives by the light of lens body 101 transmission and converts light signal into the signal of telecommunication, then with signal of telecommunication transmission to circuit board 401, when sensitization chip module removes, can change the distance between lens body 101 and the sensitization chip module, thereby make the formation of image of being shot the thing become clear, realize focusing promptly.
Drive assembly links to each other with the sensitization chip subassembly, and drive assembly drive sensitization chip subassembly moves in the direction of being close to or keeping away from lens body 101, that is to say, drive assembly provides power for the sensitization chip subassembly, makes the sensitization chip subassembly be close to or keep away from lens body 101 to the distance between sensitization chip subassembly and the lens body 101 changes, also drives the sensitization chip realization of drive assembly and focuses.
It can be understood that the lens subassembly sets up for the circuit board is fixed, removes through drive assembly drive sensitization chip subassembly and can realize focusing, and relative displacement does not take place for the lens subassembly, compares in the prior art lens subassembly and takes place to remove and realize the scheme of focusing, and the mode of focusing of this scheme no matter closely shoots or remotely shoots, does not have hard demand to great the hole of finding a view, therefore can set up less hole of finding a view, can satisfy extremely the outward appearance pursuit to a certain extent.
According to the shooting device provided by the embodiment of the invention, the lens component is fixed, and the drive component is utilized to drive the photosensitive chip component to move in the direction close to or far away from the lens body 101, so that focusing is realized, and further, the shooting device can meet remote shooting by adopting a smaller view finding hole, and can solve the contradiction between the larger view finding hole and the view finding hole which is extremely attractive and smaller in appearance during remote shooting. In addition, because the lens subassembly is fixed to be set up, the reliability of shooting device has been promoted.
According to some embodiments of the present invention, as shown in fig. 2 and 3, the photosensitive chip assembly includes a substrate 201 and a photosensitive chip 202, and a driving assembly is connected to the substrate 201 to drive the substrate 201 to move; the photosensitive chip 202 is mounted on the substrate 201, and the photosensitive chip 202 is electrically connected to the circuit board 401 through the substrate 201.
From this, sensitization chip 202 can be fixed to base plate 201 to can provide the electrical connection relation for sensitization chip 202, drive assembly drive base plate 201 removes, and base plate 201 drives sensitization chip 202 and removes, can realize focusing, and sensitization chip 202 converts light signal into the signal of telecommunication, and the signal of telecommunication further transmits circuit board 401 through base plate 201, and the formation of image can be realized to the cooperation of other image processing device.
Alternatively, the substrate 201 may be a ceramic substrate.
In some alternative embodiments, as shown in fig. 2 and 3, the photosensitive chip 202 may be fixedly mounted on the substrate 201 through the first connection member 203, and the photosensitive chip 202 is electrically connected to the substrate 201 through the first connection member 203. It is understood that the first connecting member 203 is a conductive member. Alternatively, the first connecting member 203 may be a gold ball, and of course, the first connecting member 203 may also be another structural member capable of fixedly connecting the substrate 201 and the photosensitive chip 202 and achieving electrical connection, and the material and the shape of the first connecting member 203 are not limited in the present invention.
In some embodiments of the present invention, as shown in fig. 3, the substrate 201 has a light-passing hole 206, the photosensitive chip 202 is fixedly mounted on a side (i.e. the lower side in the figure) of the substrate 201 close to the circuit board 401 through the first connecting member 203, and the photosensitive chip 202 corresponds to the light-passing hole 206. Therefore, the photosensitive chip 202 can receive the light rays which sequentially pass through the lens body 101 and the light through hole 206, the arrangement of the light through hole 206 is beneficial to the layout of the first connecting piece 203, and the installation space can be saved.
Alternatively, the light passing hole 206 may be a circular hole, and the shape of the light passing hole 206 is not limited in the embodiment of the present invention.
In some optional schemes, a mounting groove is formed on the substrate 201, the mounting groove is communicated with the light through hole 206, and the photosensitive chip 202 is accommodated in the mounting groove. On one hand, the photosensitive chip 202 is accommodated in the mounting groove, so that the photosensitive chip 202 can be prevented from being damaged by stress, and the substrate 201 is used for providing a certain protection effect for the photosensitive chip 202; on the other hand, the mounting groove is of a concave structure, and the photosensitive chip 202 is accommodated in the mounting groove, so that the thickness space of the substrate 201 can be fully utilized, the stacking thickness is reduced, and the space is saved; in addition, the whole mass of the photosensitive chip assembly can be lighter, and the driving assembly can drive the photosensitive chip assembly to move conveniently.
According to some embodiments of the present invention, as shown in fig. 2, 3 and 4, a lens assembly includes a lens body 101 and a hollow support frame 102. The supporting frame 102 is mounted on the circuit board 401, the lens body 101 is mounted on the supporting frame 102, the photosensitive chip assembly is located in the supporting frame 102, and the photosensitive chip 202 is electrically connected with the circuit board 401 through the supporting frame 102. Therefore, the support frame 102 can play a role in supporting and fixing the lens body 101, and meanwhile, the support frame 102 can provide protection and electric connection for the photosensitive chip 202, so that the overall structure layout is convenient.
Alternatively, the supporting frame 102 may be fixedly connected with the circuit board 401 by glue.
In an alternative scheme, as shown in fig. 2 and fig. 3, the photographing device includes a second connecting member 301, the second connecting member 301 is movably installed between the supporting frame 102 and the substrate 201, and the second connecting member 301 is electrically connected to the supporting frame 102 and the substrate 201, so that the photosensitive chip assembly can move relative to the lens body 101 through the second connecting member 301, and meanwhile, the photosensitive chip 202 and the supporting frame 102 are electrically connected, and the structure is simple and the design is ingenious.
It is understood that the second connecting element 301 is movably installed between the supporting frame 102 and the base plate 201, the second connecting element 301 may be movably installed between the supporting frame 102 and the base plate 201, or the second connecting element 301 may be rotatably installed between the supporting frame 102 and the base plate 201, and of course, the second connecting element 301 may also be movably and rotatably installed between the supporting frame 102 and the base plate 201, which is not particularly limited in the embodiment of the present invention.
Optionally, the second connecting member 301 is a flexible conductive member, and the second connecting member 301 may be a metal ball, so that the second connecting member 301 may move between the supporting frame 102 and the substrate 201, and meanwhile, the second connecting member 301 may deform to perform the functions of contact conduction and smoothness, so that the photosensitive chip assembly is convenient to move, and the stability and reliability of electrical connection may be improved. The material and shape of the second connection member 301 are not particularly limited in the embodiment of the present invention.
As shown in fig. 3, the supporting frame 102 is provided with a first conductive groove 103, the first conductive groove 103 is electrically connected to the circuit board 401, the substrate 201 is provided with a second conductive groove 205, the second conductive groove 205 is electrically connected to the photo sensor chip 202, the second connecting member 301 is movably installed between the first conductive groove 103 and the second conductive groove 205, and the second connecting member 301 is electrically connected to the first conductive groove 103 and the second conductive groove 205 respectively.
It should be noted that, the first conductive groove 103 and the second conductive groove 205 are both configured as a groove, and the inner wall is conductive, and a conductive member may be disposed in the groove, for example, a metal plating layer such as gold plating may be disposed on the inner wall surface of the groove, and the material and the shape of the first conductive groove 103 and the second conductive groove 205 are not limited in the embodiment of the present invention.
Through the arrangement of the first conductive groove 103 and the second conductive groove 205, the second connecting piece 301 can be limited to move between the first conductive groove 103 and the second conductive groove 205, so that the second connecting piece 301 is prevented from falling and failing, and the stability and the reliability can be further improved.
In some embodiments of the present invention, as shown in fig. 3, the supporting frame 102 is sleeved outside the substrate 201, the first conductive groove is disposed on the inner circumferential surface of the supporting frame 102, and the second conductive groove 205 is disposed on the outer circumferential surface of the substrate 201. In this way, the first conductive slot 103 and the second conductive slot 205 may be disposed opposite to each other, that is, the notch of the first conductive slot 103 is opposite to the notch of the second conductive slot 205, so that the second connecting member 301 is conveniently installed between the first conductive slot 103 and the second conductive slot 205, and is electrically connected.
In some optional schemes, as shown in fig. 3, the photographing device includes a third connector 501, the third connector 501 is disposed on the circuit board 401, and the supporting frame 102 is electrically connected to the circuit board 401 through the third connector 501. Alternatively, the third connecting member 501 may be a soldering point, and the supporting frame 102 is soldered to the circuit board 401, so as to perform the functions of fixing connection and signal conduction.
According to some embodiments of the present invention, as shown in fig. 2 and fig. 3, the photographing device may further include a filter 204, the filter 204 is mounted on the substrate 201, and the filter 204 is located on a side of the light sensing chip 202 away from the circuit board 401, a certain interval may be provided between the filter 204 and the light sensing chip 202, and the filter 204 may filter light before the light enters the light sensing chip 202. Alternatively, the filter 204 may be blue glass. Alternatively, the filter 204 may be fixedly connected to the substrate 201 by glue.
According to some embodiments of the present invention, the driving assembly comprises a magnetic element and a coil, one of the magnetic element and the coil is disposed on the photosensitive chip assembly, and the other is disposed on the lens assembly or the circuit board 401; with the coil energized, the magnetic element and coil interact to drive the motion of the photosensitive chip assembly.
Illustratively, the magnetic element is arranged on the photosensitive chip assembly, the coil is arranged on the lens assembly, and the coil is located in a magnetic field of the magnetic element, so that when the coil is electrified, the magnetic element and the coil interact to generate an ampere force, and the photosensitive chip assembly is driven to move.
Illustratively, the magnetic element is disposed on the photosensitive chip assembly, the coil is disposed on the circuit board 401, and the coil is located in the magnetic field of the magnetic element, so that when the coil is energized, the magnetic element interacts with the coil to generate an ampere force, thereby driving the photosensitive chip assembly to move.
Illustratively, the magnetic element is arranged on the lens component, the coil is arranged on the photosensitive chip component, and the coil is positioned in a magnetic field of the magnetic element, so that when the coil is electrified, the magnetic element and the coil interact to generate an ampere force, and the photosensitive chip component is driven to move.
Illustratively, the magnetic element is disposed on the circuit board 401, the coil is disposed on the photosensitive chip assembly, and the coil is located in the magnetic field of the magnetic element, so that when the coil is energized, the magnetic element interacts with the coil to generate an ampere force, thereby driving the photosensitive chip assembly to move.
Therefore, the installation positions of the magnetic elements and the coils can be flexibly set, and the structural layout is convenient.
Specifically, as shown in fig. 5, the magnetic element 601 is disposed on the supporting frame 102, the coil 602 is disposed on the photosensitive chip assembly, and the coil 602 is located in the magnetic field of the magnetic element 601. Under the condition that the coil 602 is electrified, the magnetic element 601 interacts with the coil 602 to generate an ampere force, so that the photosensitive chip assembly is driven to move in a direction close to or far from the lens, and focusing is realized.
Alternatively, the magnetic element may be fixed on the supporting frame 102 by insert or glue connection, and the coil may be fixed on the photosensitive chip assembly by glue bonding. Optionally, the conducting end of the coil is conducted with the substrate 201 by means of soldering or conductive adhesive.
Alternatively, the magnetic element may be a permanent magnet, an electromagnet or a magnetically conductive iron.
It can be understood that the coil and the magnetic element can generate mutual attraction or repulsion force by controlling the size and the direction of the electrification in the coil, so that the photosensitive chip component can be driven to move, the moving direction and the moving distance of the photosensitive chip component can be controlled, the imaging becomes clear, and the focusing is realized.
According to some embodiments of the invention, the drive assembly may comprise: the shape memory alloy part is connected with the lens component and the photosensitive chip component, or the shape memory alloy part is connected with the photosensitive chip component and the circuit board 401; under the condition that the shape memory alloy piece is electrified, the shape memory alloy piece deforms to drive the photosensitive chip assembly to move. Thereby, a focus driving force can be provided by deformation of the shape memory alloy.
Specifically, as shown in fig. 6, one end of the shape memory alloy member 603 is connected to the lens assembly, and the other end is connected to the photosensitive chip assembly, and when the shape memory alloy member 603 is powered on, the shape memory alloy member 603 deforms to drive the photosensitive chip assembly to move.
It can be understood that the shape memory alloy piece can be deformed by controlling the size and the direction of electrification in the shape memory alloy piece, so that the photosensitive chip component can be driven to move, and the moving direction and the moving distance of the photosensitive chip component can be controlled, so that imaging becomes clear, and focusing is realized.
According to some embodiments of the invention, the camera further comprises a detection element.
Optionally, a detection element is disposed on the photosensitive chip assembly, and the detection element is used for detecting the distance between the photosensitive chip assembly and the lens body 101. Illustratively, as shown in FIG. 5, the detection element 701 is disposed on the substrate 201 of the photosensitive chip assembly.
Alternatively, a detection element is provided on the photosensitive chip assembly, the detection element being used to detect the distance between the photosensitive chip assembly and the circuit board 401.
Optionally, a detection element is disposed on the circuit board 401 for detecting the distance between the photosensitive chip assembly and the circuit board 401.
Or, optionally, a detecting element is disposed on the lens assembly for detecting the distance between the photosensitive chip assembly and the lens body 101.
The detection element detects the distance, so that the moving distance of the photosensitive chip assembly can be controlled, and focusing is further realized.
Therefore, the detection elements can be flexibly arranged, the structural layout is convenient, and the monitoring of the focal length is realized.
Wherein, detecting element 701 can be hall sensor, and hall sensor can the strong and weak change of perception magnetic field to can perceive the distance between sensitization chip subassembly and the lens body 101, simple structure, easy to assemble, and low cost.
As shown in fig. 3 and 4, the camera further includes a connector electrically connected to the circuit board 401, and the connector is used to connect a peripheral device.
Based on the shooting device disclosed by the embodiment of the invention, the embodiment of the invention discloses electronic equipment, and the disclosed electronic equipment comprises the shooting device.
Based on the electronic equipment disclosed by the embodiment of the invention, the embodiment of the invention also discloses a control method of the shooting device, and the control method of the shooting device comprises the following steps:
step 1001, receiving input of a user.
Alternatively, the user input may be an input for triggering focus, including but not limited to touch input, voice input. Such as user input to the focus control in the photo preview interface.
In response to the input, the driving component drives the photosensitive chip component to move in a direction close to or far away from the lens body so as to focus on the target object, step 1002.
In the embodiment of the invention, based on the electronic equipment, by receiving the input of the user, the driving component drives the photosensitive chip component to move in the direction close to or far away from the lens body in response to the input so as to focus the target object.
In the embodiment of the invention, the driving component can drive the photosensitive chip component to move through user input, so that the focusing target object is conveniently realized.
Based on the control method of the shooting device, an embodiment of the present invention further provides a device of the control method, which may include:
the receiving module is used for receiving the input of a user;
and the control module is used for responding to input and driving the photosensitive chip assembly to move in a direction close to or far away from the lens body so as to focus a target object.
In the embodiment of the invention, the driving component drives the photosensitive chip component to move in the direction close to or far away from the lens body so as to focus a target object.
The embodiment of the invention also discloses an electronic device, which comprises a processor, a memory and a computer program which is stored on the memory and can run on the processor, wherein when the computer program is executed by the processor, the steps of the control method in any embodiment are realized.
The embodiment of the invention also discloses a computer readable storage medium, wherein a computer program is stored on the computer readable storage medium, and the computer program is executed by a processor to realize the steps of the control method in any embodiment.
The electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, or the like, and the specific type of the electronic device is not limited in the embodiment of the present invention.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (15)
1. A camera, comprising:
a circuit board;
the lens assembly is arranged on the circuit board and fixedly arranged relative to the circuit board, and the lens assembly comprises a lens body;
the photosensitive chip assembly is arranged between the lens body and the circuit board, the photosensitive chip assembly faces the lens body, the photosensitive chip assembly can move, and the photosensitive chip assembly is electrically connected with the circuit board;
the driving assembly is connected with the photosensitive chip assembly and drives the photosensitive chip assembly to move in the direction close to or far away from the lens body.
2. The camera of claim 1, wherein said photosensitive chip assembly comprises:
the driving assembly is connected with the substrate so as to drive the substrate to move;
the photosensitive chip is arranged on the substrate and is electrically connected with the circuit board through the substrate.
3. The camera according to claim 2,
the photosensitive chip is fixedly arranged on the substrate through a first connecting piece, and the photosensitive chip is electrically connected with the substrate through the first connecting piece.
4. The camera of claim 3, wherein the substrate has a light hole, the light sensing chip is fixedly mounted on a side of the substrate close to the circuit board through the first connecting member, and the light sensing chip corresponds to the light hole.
5. The camera device as claimed in claim 4, wherein a mounting groove is formed on the substrate, the mounting groove is communicated with the light hole, and the photosensitive chip is accommodated in the mounting groove.
6. The camera of claim 2, wherein the lens assembly comprises:
the lens body;
the supporting frame is arranged on the circuit board, the lens body is arranged on the supporting frame, the photosensitive chip component is located in the supporting frame, and the photosensitive chip is electrically connected with the circuit board through the supporting frame.
7. The photographing apparatus according to claim 6, further comprising:
the second connecting piece is movably arranged between the support frame and the base plate, and the second connecting piece is respectively electrically connected with the support frame and the base plate.
8. The camera device as claimed in claim 7, wherein a first conductive groove is formed on the supporting frame, the first conductive groove is electrically connected to the circuit board, a second conductive groove is formed on the substrate, the second conductive groove is electrically connected to the photo sensor chip, the second connecting member is movably mounted between the first conductive groove and the second conductive groove, and the second connecting member is electrically connected to the first conductive groove and the second conductive groove, respectively.
9. The camera of claim 8, wherein the supporting frame is disposed outside the substrate, the first conductive groove is disposed on an inner circumferential surface of the supporting frame, and the second conductive groove is disposed on an outer circumferential surface of the substrate.
10. The photographing apparatus according to claim 6, further comprising:
and the third connecting piece is arranged on the circuit board, and the support frame is electrically connected with the circuit board through the third connecting piece.
11. The camera of claim 1, wherein the drive assembly comprises:
a magnetic element;
a coil, one of the magnetic element and the coil is arranged on the photosensitive chip assembly, and the other is arranged on the lens assembly or the circuit board;
when the coil is electrified, the magnetic element and the coil interact to drive the photosensitive chip assembly to move.
12. The camera of claim 1, wherein the drive assembly comprises:
the shape memory alloy part is connected with the lens component and the photosensitive chip component, or the shape memory alloy part is connected with the photosensitive chip component and the circuit board;
under the condition that the shape memory alloy piece is electrified, the shape memory alloy piece deforms to drive the photosensitive chip assembly to move.
13. The photographing apparatus according to claim 1, further comprising: the detection element is provided with a plurality of detection elements,
the detection element is arranged on the photosensitive chip assembly and used for detecting the distance between the photosensitive chip assembly and the lens body, or the detection element is used for detecting the distance between the photosensitive chip assembly and the circuit board;
alternatively, the first and second electrodes may be,
the detection element is arranged on the circuit board and used for detecting the distance between the photosensitive chip assembly and the circuit board;
alternatively, the first and second electrodes may be,
the detection element is arranged on the lens component and used for detecting the distance between the photosensitive chip component and the lens body.
14. An electronic apparatus characterized by comprising the photographing apparatus according to any one of claims 1 to 13.
15. A control method of a photographing apparatus applied to the photographing apparatus according to any one of claims 1 to 13, comprising:
receiving input of a user;
in response to the input, the driving component drives the photosensitive chip component to move in a direction close to or far away from the lens body so as to focus a target object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010392620.XA CN111601021A (en) | 2020-05-11 | 2020-05-11 | Photographing device, electronic apparatus, and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010392620.XA CN111601021A (en) | 2020-05-11 | 2020-05-11 | Photographing device, electronic apparatus, and control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111601021A true CN111601021A (en) | 2020-08-28 |
Family
ID=72189373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010392620.XA Pending CN111601021A (en) | 2020-05-11 | 2020-05-11 | Photographing device, electronic apparatus, and control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111601021A (en) |
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| CN112954178A (en) * | 2021-03-17 | 2021-06-11 | 南昌欧菲光电技术有限公司 | Camera module |
| CN113114913A (en) * | 2021-04-27 | 2021-07-13 | 维沃移动通信有限公司 | Camera and electronic equipment |
| CN113114902A (en) * | 2021-04-15 | 2021-07-13 | 维沃移动通信有限公司 | Imaging device and electronic apparatus |
| CN113114883A (en) * | 2021-03-26 | 2021-07-13 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN113194232A (en) * | 2021-04-22 | 2021-07-30 | 维沃移动通信有限公司 | Camera, electronic equipment and control method and control device thereof |
| CN113242375A (en) * | 2021-06-11 | 2021-08-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113395429A (en) * | 2021-06-18 | 2021-09-14 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113747067A (en) * | 2021-09-07 | 2021-12-03 | 维沃移动通信有限公司 | Photographing method and device, electronic equipment and storage medium |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112954178A (en) * | 2021-03-17 | 2021-06-11 | 南昌欧菲光电技术有限公司 | Camera module |
| CN113114883A (en) * | 2021-03-26 | 2021-07-13 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN113114902A (en) * | 2021-04-15 | 2021-07-13 | 维沃移动通信有限公司 | Imaging device and electronic apparatus |
| CN113194232A (en) * | 2021-04-22 | 2021-07-30 | 维沃移动通信有限公司 | Camera, electronic equipment and control method and control device thereof |
| CN113194232B (en) * | 2021-04-22 | 2022-05-20 | 维沃移动通信有限公司 | Camera, electronic equipment and control method and control device thereof |
| CN113114913A (en) * | 2021-04-27 | 2021-07-13 | 维沃移动通信有限公司 | Camera and electronic equipment |
| CN113242375A (en) * | 2021-06-11 | 2021-08-10 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113395429A (en) * | 2021-06-18 | 2021-09-14 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113747067A (en) * | 2021-09-07 | 2021-12-03 | 维沃移动通信有限公司 | Photographing method and device, electronic equipment and storage medium |
| CN113747067B (en) * | 2021-09-07 | 2024-02-02 | 维沃移动通信有限公司 | Photographing method, photographing device, electronic equipment and storage medium |
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