CN111596421A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN111596421A CN111596421A CN202010392624.8A CN202010392624A CN111596421A CN 111596421 A CN111596421 A CN 111596421A CN 202010392624 A CN202010392624 A CN 202010392624A CN 111596421 A CN111596421 A CN 111596421A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The application provides an optical module, includes: a circuit board; the temperature sensor is used for measuring the temperature of the optical module in real time; the laser is arranged on the circuit board and used for emitting optical signals; the MCU is arranged on the circuit board, acquires the temperature of the optical module and monitors the theoretical luminous efficiency of the laser according to the temperature of the optical module; the method for monitoring the theoretical luminous efficiency of the laser according to the temperature of the optical module comprises the following steps: acquiring light emitting oblique efficiency, bias current and threshold current corresponding to the temperature of the optical module according to the acquired temperature of the optical module; and obtaining the theoretical luminous efficiency of the laser according to the theoretical luminous efficiency of the laser, namely luminous skew efficiency (bias current-threshold current). MPD is not needed in the process of monitoring the emitted light power of the optical module, the emitted light power of the optical module is monitored when no MPD exists, and the emitted light power of the active optical cable optical module is monitored and reported conveniently.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. In optical communication, an optical module is a tool for realizing the interconversion of optical signals and is one of the key devices in optical communication equipment. With the rapid development of the 5G network, the optical module at the core position of optical communication has been developed greatly.
The semiconductor laser is used for signal emission of the optical module. The semiconductor laser has the advantages of good monochromaticity, good directivity, small volume, high light power utilization rate and the like, but the light power output of the semiconductor laser is greatly influenced by the change of the external environment. In order to ensure the stability of the optical module signal transmitting optical power, the optical module signal transmitting usually needs to monitor the transmitting optical power.
In some existing optical modules, in order to monitor optical power of the optical module, an MPD (backlight detector) is generally disposed beside a laser, a lens assembly is disposed to split light emitted by the laser into one beam to the MPD, and the MPD receives the beam to monitor optical power emitted by the laser. However, in an active optical cable optical module (AOC), MPD is not convenient to set, and further, monitoring of optical power of the optical module by using the MPD cannot be achieved.
Disclosure of Invention
The embodiment of the application provides an optical module, which can monitor the emitted light power of the optical module without MPD.
The application provides an optical module, includes:
a circuit board;
the temperature sensor is used for measuring the temperature of the optical module in real time;
the laser is arranged on the circuit board and used for emitting optical signals;
the MCU is arranged on the circuit board, acquires the temperature of the optical module and monitors the theoretical luminous efficiency of the laser according to the temperature of the optical module;
the method for monitoring the theoretical luminous efficiency of the laser according to the temperature of the optical module comprises the following steps:
acquiring light emitting oblique efficiency, bias current and threshold current corresponding to the temperature of the optical module according to the acquired temperature of the optical module;
and obtaining the theoretical luminous efficiency of the laser according to the theoretical luminous efficiency of the laser, namely luminous skew efficiency (bias current-threshold current).
The application provides an optical module, including circuit board, temperature sensor, laser instrument and MCU. The temperature sensor measures the temperature of the optical module in real time, the MCU can acquire the temperature of the laser through the temperature sensor, acquires the luminous skew efficiency, the bias current and the threshold current corresponding to the temperature according to the temperature of the optical module, calculates and acquires the theoretical luminous efficiency of the laser according to the theoretical luminous efficiency of the laser, namely the luminous skew efficiency (bias current-threshold current), and fits the luminous efficiency of the laser according to the theoretical luminous efficiency of the laser. Therefore, in the optical module provided by the application, the luminous power of the laser is obtained through algorithm fitting calculation, and actual measurement of the luminous power of the laser is not needed. Furthermore, the theoretical emitted light power of the optical module can be calculated and obtained according to the theoretical light emitting efficiency of the laser, MPD is not needed in the process of monitoring the emitted light power of the optical module, the emitted light power is monitored under the condition that no MPD exists in the optical module, and the emitted light power monitoring report of the active optical cable optical module is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a temperature sensor disposed on a circuit board according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to the embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and a lens assembly 400.
The upper housing 201 is covered on the lower housing 202 to form a package cavity with two openings, and the outer contour of the package cavity is generally in a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell 201 comprises a cover plate, and the cover plate covers two side plates of the upper shell 201 to form a wrapping cavity; the upper casing 201 may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper casing 201 on the lower casing 202.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one of the openings is an electric port 204, a golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 and is used for external optical fiber access to connect an optical transceiver inside the optical module 200, and photoelectric devices such as the circuit board 203 and the optical transceiver are located in a package cavity.
The upper shell 201 and the lower shell 202 are combined to facilitate the installation of devices such as the circuit board 300 and the like in the shells, and the upper shell 201 and the lower shell 202 form an outermost packaging protection shell of the optical module. The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module 200 is not integrated, so that when devices such as a circuit board are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be mounted, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping structure matched with the upper computer cage; the end of the unlocking member 203 is pulled to make the unlocking member 203 relatively move on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping structure of the unlocking component 203; by pulling the unlocking member 203, the engaging structure of the unlocking member 203 moves along with the unlocking member, and further the connection relationship between the engaging structure and the upper computer is changed, so that the engaging relationship between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with a plurality of electrical devices, such as a laser chip, a driving chip of the laser chip, a light receiving chip, a transimpedance amplifier chip, an amplitude limiting amplifier chip, a microprocessor chip, and the like, wherein the light emitting chip and the light receiving chip are directly attached to the circuit board of the optical module, and such a configuration is referred to as COB packaging in the industry.
The circuit board 300 connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like; while circuit board 300 also functions to carry the various components, such as circuit board carrying lens assembly 400.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the upper computer cage, and particularly, a metal pin/golden finger is formed on the surface of the tail end of one side of the rigid circuit board and used for being connected with the electric connector.
Fig. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present disclosure. As shown in fig. 5, the circuit board 300 is provided with a lens assembly 400, an MCU, a laser driving chip, a light receiver, a limiting amplification chip, and a temperature sensor (the laser, the laser driving chip, the light receiver, and the limiting amplification chip are shielded by the lens assembly 400 and are not shown). The temperature sensor is used for monitoring the working temperature of the optical module. The temperature sensor and the MCU are packaged together, or can be a device independent from the MCU. When the temperature sensor and the MCU are packaged together, the MCU directly obtains the working temperature of the optical module through the temperature sensor. When the temperature sensor and the MCU are independent devices, the settable position of the temperature sensor is not limited to the circuit board 300, the temperature sensor transmits a signal to the MCU, and the MCU processes the signal to obtain the operating temperature of the optical module. It should be noted that when the temperature sensor is disposed on the circuit board 300, it should be avoided as much as possible to be close to the electrical device with high heat generation, so as to obtain the operating temperature of the optical module relatively accurately.
The lens assembly 400 is disposed above the optical chip in a covering manner, and the lens assembly 400 and the circuit board 300 form a cavity for wrapping the optical chip such as a laser and an optical receiver. Lens assembly 400 is typically a plastic device that transmits a light beam and changes the direction of the light beam as it is transmitted. Specifically, light emitted by the laser enters the optical fiber after being reflected by the lens assembly, light from the optical fiber enters the light receiver after being reflected by the lens assembly, and the lens assembly not only plays a role in sealing the optical chip, but also establishes optical connection between the optical chip and the optical fiber.
High-rate data transmission requires close placement between the optical chips and their driver/matching chips to shorten the interconnections between the chips and reduce signal loss due to the interconnections, while the lens assembly 400 is housed over the optical chips, so the lens assembly 400 generally houses both the optical chips and their driver/matching chips. Therefore, the laser and the driving chip of the laser are arranged in a short distance, and the lens assembly 400 covers the laser and the driving chip of the laser; the light receiver and the transimpedance amplifier chip are arranged in close proximity, and the lens assembly 400 covers the light receiver and the transimpedance amplifier chip.
In the present embodiment, the optical fiber ribbon 500 is connected to the lens assembly 400, and light beams are output and input through the optical fiber ribbon 500. Ribbon 500 includes a plurality of optical fibers therein. Optionally, the fiber optic ribbon 500 is coupled to the lens assembly 400 via a fiber optic holder 600, the fiber optic holder 600 being adapted to hold the fiber optic ribbon 500 and couple the lens assembly 400. Optionally, the optical fibers of the fiber optic ribbon 500 are secured within the fiber optic support 600 with the end faces of the optical fibers of the fiber optic ribbon 500 flush with the end faces of the fiber optic support 600.
Fig. 6 is a schematic structural diagram of a temperature sensor provided on a circuit board 300 according to an embodiment of the present application. As shown in fig. 6, a circuit board 300 provided in the embodiment of the present application is provided with a lens assembly 400, an MCU301, a temperature sensor 302, a laser 303, and a laser driver 304. The laser 303 and laser driver 304 are housed under the lens assembly 400. The temperature sensor 302 is arranged at a position far away from the laser 303 and the laser driver 304, so that the temperature sensor 302 can be prevented from being influenced by heat generated in the working process of the laser 303 and the laser driver 304, and the accuracy of the temperature sensor 302 in measuring the working temperature of the optical module can be further prevented from being influenced.
In the technical field of optical modules, in order to monitor the optical power emitted by an optical module and realize the optical power monitoring reporting function of the optical module, MPD needs to be set in the optical module, and the optical power emitted by the optical module is monitored through the MPD. And the active optical cable optical module has no MPD, so that the emitted optical power of the optical module has no monitoring and reporting function. The optical module provided in the embodiment of the present application is configured to implement a function of monitoring and reporting optical module emitted optical power without MPD or without MPD.
In the optical module, the emitted light power of the optical module is closely related to the light emitting efficiency of the laser, and the emitted light power of the optical module can be calculated through the light emitting efficiency fitting of the laser. Meanwhile, the emitted light power of the optical module is closely related to the temperature of the optical module.
Furthermore, in the embodiment of the present application, the temperature of the optical module is monitored, the theoretical light emitting efficiency of the laser is determined according to the corresponding relationship between the temperature of the optical module and each parameter affecting the light emitting efficiency of the laser and the corresponding relationship between each key parameter affecting the light emitting efficiency of the laser and the light emitting efficiency of the laser, then the theoretical emitted light power of the optical module is obtained according to the theoretical light emitting efficiency of the laser through fitting calculation, and the theoretical emitted light power of the optical module is used as an emitted light power monitoring report value of the optical module, so that the emitted light power monitoring of the optical module is completed.
In the embodiments of the present application, the key parameters affecting the luminous efficiency of the laser include the luminous ramp efficiency, the bias current and the threshold current. Among them, the temperature of the light receiving module has relatively large influence on the light emitting efficiency and the bias current. In the embodiment of the present application, a corresponding relationship between the temperature of the optical module and the light-emitting oblique efficiency and the bias current, such as a corresponding functional relationship between the temperature of the optical module and the light-emitting oblique efficiency and the bias current, may be obtained through a large number of experiments. And then when the temperature of the optical module is obtained, obtaining the corresponding luminous oblique efficiency and the bias current according to the corresponding functional relation between the temperature of the optical module and the luminous oblique efficiency and the bias current respectively, and then determining the theoretical luminous efficiency of the laser according to the corresponding relation between each key parameter which influences the luminous efficiency of the laser and the luminous efficiency of the laser.
In the embodiment of the application, a corresponding table of the temperature of the optical module and the luminous skew efficiency and the bias current can be obtained through a large number of experiments, and the corresponding table is used for representing the corresponding relation between the temperature of the optical module and the luminous skew efficiency and the bias current. And simultaneously, according to a large number of experiments, finding out the corresponding relation between the luminous efficiency of the laser and each key parameter influencing the luminous efficiency of the laser and the corresponding relation between the theoretical emitted light power of the optical module and the theoretical luminous efficiency of the laser.
Alternatively, the theoretical laser luminous efficiency is the luminous efficiency (bias current — threshold current). Optionally, the theoretical emitted optical power of the optical module is equal to N × theoretical luminous efficiency of the laser, and N is a positive number smaller than 1. Preferably, 0.67. ltoreq. N.ltoreq.0.73, e.g., N0.7.
Further, experiments show that the threshold current is less affected by the temperature of the light receiving module, and therefore the threshold current can be selected to be a certain value in the embodiment of the present application. For example, the threshold current is fixed to 0.8 mA. And then obtaining the luminous oblique efficiency and the bias current of the optical module at the corresponding temperature, obtaining the theoretical luminous efficiency of the laser according to the corresponding relation between the theoretical luminous efficiency of the laser and the luminous oblique efficiency and the bias current, obtaining the theoretical emitted luminous power of the optical module according to the relation between the theoretical emitted luminous power of the optical module and the theoretical luminous efficiency of the laser, and further monitoring and reporting the emitted luminous power of the optical module.
In the embodiment of the application, a temperature-luminous oblique efficiency lookup table representing the corresponding relation between the temperature of the optical module and the luminous oblique efficiency and a temperature-bias current lookup table representing the corresponding relation between the temperature of the optical module and the bias current are obtained through a large number of experiments. When the temperature of the optical module is obtained, according to the temperature of the optical module, a temperature-luminous oblique efficiency lookup table is searched to obtain luminous oblique efficiency corresponding to the temperature of the optical module, and a temperature-bias current lookup table is searched to obtain bias current corresponding to the temperature of the optical module.
In the embodiment of the present application, the operating temperature of the optical module can be as low as-40 ℃ and as high as 150 ℃, so the temperature intervals of the temperature-luminous oblique efficiency lookup table and the temperature-bias current lookup table are-40 ℃ to 150 ℃. However, when the temperature of the optical module reaches a high temperature, the variation of the light-emitting oblique efficiency is relatively small, and is nearly stable, so in the embodiment of the present application, the temperature range of the temperature-light-emitting oblique efficiency lookup table can be relatively reduced, for example, the temperature range can be selected from-40 ℃ to 140 ℃.
Further, in the embodiment of the present application, the temperature intervals of the temperature-luminous oblique efficiency lookup table and the temperature-bias current lookup table may be equal or unequal. For example, the temperature intervals in the temperature-luminescence slope efficiency lookup table and the temperature-bias current lookup table are both M, and M is usually a positive integer of 1 ℃, 2 ℃, 3 ℃ and the like; or the temperature interval in the temperature-luminous oblique efficiency lookup table is X, the temperature interval in the temperature-bias current lookup table is Y, X and Y are positive integers of 1 ℃, 2 ℃, 3 ℃ and the like, but X and Y are not equal.
Since the luminescence slope efficiency is relatively less affected by temperature, in the embodiment of the present application, the temperature interval in the temperature-luminescence slope efficiency lookup table may be selected to be relatively large, such as 8 ℃, 10 ℃, and the like. Optionally, the temperature of the temperature-luminescence diagonal efficiency lookup table may be-40 ℃, -28 ℃, -16 ℃, -4 ℃ … … 116 ℃, 128 ℃, 140 ℃.
Since the bias current is relatively significantly affected by temperature, in the embodiment of the present application, the temperature interval in the temperature-bias current lookup table may be selected to be relatively small, such as 1 ℃, 2 ℃, and the like. Alternatively, the temperatures in the temperature-bias current look-up table may be-40 ℃, -38 ℃, -36 ℃, -4 ℃ … … 146 ℃, 148 ℃, 150 ℃.
Table one is a temperature-luminous oblique efficiency lookup table provided in the embodiment of the present application; the second table is a temperature-bias current lookup table provided in the embodiment of the present application, where the bias current in the second table is a DA value of the bias current, and the bias current needs to be converted in the calculation process.
Table one:
table two:
if the temperature of the optical module is detected to be 20 ℃, the light-emitting oblique efficiency corresponding to 20 ℃ is 0.5mW/mA by searching the temperature-light-emitting oblique efficiency lookup table, and the DA value of the bias current corresponding to 20 ℃ is 39 by searching the temperature-bias current lookup table. The corresponding bias current at 20 ℃ is obtained by converting the DA value of the bias current to be (39 × 0.15) ═ 5.85mA, and the theoretical luminous efficiency of the laser can be calculated to be 2.525mW according to the theoretical luminous efficiency of the laser which is luminous skew efficiency (bias current-threshold current). Then, according to the theoretical light emitting power of the optical module being 0.7 × the theoretical light emitting efficiency of the laser, the theoretical light emitting power of the optical module can be calculated to be 1.7675 mW.
If the temperature of the optical module is detected and cannot be directly found from the temperature-luminous oblique efficiency lookup table or the temperature-bias current lookup table, namely the temperature-luminous oblique efficiency lookup table or the temperature-bias current lookup table does not include the temperature of the optical module, in order to obtain luminous oblique efficiency and bias current corresponding to the temperature of the optical module, the temperature closest to the temperature of the optical module can be found from the temperature-luminous oblique efficiency lookup table or the temperature-bias current lookup table, then the corresponding luminous oblique efficiency and bias current are obtained through the closest temperature, and further the theoretical luminous efficiency of the laser and the theoretical emitted light power of the optical module are calculated. Or, two temperature values close to the temperature of the optical module are found out by combining the temperature-luminous oblique efficiency lookup table or the temperature-bias current lookup table, and the luminous oblique efficiency or the bias current corresponding to the temperature of the optical module is obtained through linear calculation according to the two close temperature values and the corresponding luminous oblique efficiency or the bias current.
Optionally, if the temperature of the optical module is detected, a temperature-light-emitting oblique efficiency lookup table is searched, and if no temperature in the temperature-light-emitting oblique efficiency lookup table is the same as the temperature of the laser, two temperature values close to the temperature of the optical module in the temperature-light-emitting oblique efficiency lookup table are obtained; and calculating and determining the light emitting oblique efficiency corresponding to the temperature of the optical module according to the two temperature values close to the temperature of the optical module and the corresponding light emitting oblique efficiency.
Optionally, if the temperature of the optical module is detected, searching a temperature-bias current lookup table, and if no temperature in the temperature-bias current lookup table is the same as the temperature of the optical module, acquiring two temperature values in the temperature-bias current lookup table, which are close to the temperature of the optical module; and calculating and determining the bias current corresponding to the temperature of the optical module according to the two temperature values close to the temperature of the optical module and the corresponding bias current.
Assuming that, when the temperature of the optical module is detected to be-25 ℃, a temperature-luminous oblique efficiency lookup table is searched, wherein the temperature is not-25 ℃, the-28 ℃ closest to-25 ℃ can be searched from the temperature-luminous oblique efficiency lookup table, and then the luminous oblique efficiency corresponding to-28 ℃ is obtained to be 0.7 mW/mA. Then, when the temperature of the optical module is detected to be-25 ℃, a temperature-bias current lookup table is searched, wherein the temperature-bias current lookup table does not have the temperature of-25 ℃, the-24 ℃ and-26 ℃ closest to the temperature of-25 ℃ can be searched from the temperature-bias current lookup table, because more than one closest temperature is found, the average value of the bias currents corresponding to the temperature-bias current lookup table and the temperature-bias current lookup table can be used as the bias current corresponding to the temperature of-25 ℃, further, the DA value 50 of the bias current corresponding to the temperature of-24 ℃ and the DA value 50 of the bias current corresponding to the temperature of-26 ℃ are obtained, the DA value of the bias current corresponding to the temperature of-25 ℃ is calculated to be 50, and the corresponding bias current is obtained. And then calculating the theoretical luminous efficiency of the laser and the theoretical emitted light power of the optical module according to the obtained luminous oblique efficiency and the bias current.
Assuming that, when the temperature of the optical module is detected to be-25 ℃, a temperature-light-emission diagonal efficiency lookup table is searched, wherein the temperature is not-25 ℃, light-emission diagonal efficiencies close to-25 ℃ can be found from the temperature-light-emission diagonal efficiency lookup table, and in combination with the light-emission diagonal efficiencies of 0.7mW/mA at-28 ℃ and 0.6mW/mA at-16 ℃, a linear relationship is assumed to exist between the light-emission diagonal efficiencies of-25 ℃, 28 ℃ and-16 ℃, and the light-emission diagonal efficiency of 0.675/mW/mA at-25 ℃ can be calculated. Similarly, the temperature-bias current lookup table is used for finding out the temperature close to-25 ℃ and the temperature close to-26 ℃, combining the DA value 50 of the bias current corresponding to-24 ℃ and the DA value 50 of the bias current corresponding to-26 ℃, calculating the DA value 50 of the bias current corresponding to-25 ℃ on the assumption that the bias currents between-25 ℃, 24 ℃ and-26 ℃ have a linear relation, and obtaining the corresponding bias current through conversion of the DA value of the bias current. And further calculating the theoretical luminous efficiency of the laser and the theoretical emitted light power of the optical module according to the obtained luminous oblique efficiency and the bias current. Therefore, the calculation amount of the light-emitting oblique efficiency and the bias current corresponding to the temperature of-25 ℃ is small, and the determined light-emitting oblique efficiency and the determined bias current are relatively accurate, so that the relatively accurate theoretical light-emitting efficiency of the laser and the theoretical emitted light power of the optical module can be conveniently obtained.
Therefore, in the optical module provided in the embodiment of the present application, the temperature sensor measures the temperature of the optical module in real time, the MCU may obtain the temperature of the optical module through the temperature sensor, obtain the light emission skew efficiency and the bias current corresponding to the temperature according to the temperature of the optical module, calculate and obtain the theoretical light emission efficiency of the laser according to the theoretical light emission efficiency of the laser (light emission skew efficiency — threshold current), calculate and obtain the theoretical light emission power of the optical module according to the theoretical light emission power of the optical module (laser theoretical light emission power — N), and further implement the monitoring of the light emission power of the optical module by calculating the theoretical light emission efficiency of the laser and the theoretical light emission power of the optical module through algorithm fitting. Therefore, the optical module provided by the embodiment of the application does not need to use MPD in the process of monitoring the luminous efficiency of the laser or the emitted optical power of the optical module, so that the emitted optical power is monitored without MPD in the optical module, and the emitted optical power of the active optical cable optical module is conveniently monitored and reported.
In the embodiment of the application, the theoretical luminous efficiency or the theoretical emitted light power of the laser of the optical module obtained through calculation is stored in a relatively fixed protocol address, and the upper computer reads the theoretical luminous efficiency or the theoretical emitted light power of the laser or the optical module stored in the protocol address, so that the upper computer monitors the theoretical luminous efficiency or the theoretical emitted light power of the laser or the optical module.
All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the present application will become readily apparent to those skilled in the art from consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. A light module, comprising:
a circuit board;
the temperature sensor is used for measuring the temperature of the optical module in real time;
the laser is arranged on the circuit board and used for emitting optical signals;
the MCU is arranged on the circuit board, acquires the temperature of the optical module and monitors the theoretical luminous efficiency of the laser according to the temperature of the optical module;
the method for monitoring the theoretical luminous efficiency of the laser according to the temperature of the optical module comprises the following steps:
acquiring light emitting oblique efficiency, bias current and threshold current corresponding to the temperature of the optical module according to the acquired temperature of the optical module;
and obtaining the theoretical luminous efficiency of the laser according to the theoretical luminous efficiency of the laser, namely luminous skew efficiency (bias current-threshold current).
2. The optical module according to claim 1, wherein the threshold current is a constant value, and a temperature-light emission slope efficiency lookup table and a temperature-bias current lookup table are stored in the optical module;
according to the temperature of the optical module, searching a temperature-luminous oblique efficiency lookup table to obtain luminous oblique efficiency corresponding to the temperature of the optical module, and searching a temperature-bias current lookup table to obtain bias current corresponding to the temperature of the optical module.
3. The optical module of claim 2, wherein the looking up the temperature-luminous skew efficiency look-up table to obtain the luminous skew efficiency corresponding to the temperature of the optical module comprises:
searching a temperature-luminous oblique efficiency lookup table, and if the temperature in the temperature-luminous oblique efficiency lookup table is not the same as the temperature of the laser, acquiring two temperature values which are close to the temperature of the optical module in the temperature-luminous oblique efficiency lookup table;
and calculating and determining the light emitting oblique efficiency corresponding to the temperature of the optical module according to two temperature values close to the temperature of the optical module and the corresponding light emitting oblique efficiency.
4. The optical module of claim 2, wherein the lookup temperature-bias current lookup table for obtaining the bias current corresponding to the temperature of the laser comprises:
searching a temperature-bias current lookup table, and if no temperature in the temperature-bias current lookup table is the same as the temperature of the optical module, acquiring two temperature values which are close to the temperature of the optical module in the temperature-bias current lookup table;
and calculating and determining the bias current corresponding to the temperature of the optical module according to two temperature values close to the temperature of the optical module and the corresponding bias current.
5. The optical module of claim 2, wherein the temperature-luminous oblique efficiency lookup table has a temperature range of-40 ℃ to 140 ℃ and the temperature-bias current lookup table has a temperature range of-40 ℃ to 150 ℃.
6. The optical module of claim 2, wherein the temperature interval in the temperature-luminous slope efficiency lookup table is 12 ℃ and the temperature interval in the temperature-bias current lookup table is 2 ℃.
7. The light module of claim 1, wherein the MCU is further configured to:
and obtaining the theoretical emitting light power of the optical module according to the theoretical emitting light power of the optical module, wherein N is more than or equal to 0.67 and less than or equal to 0.73.
8. The light module of claim 7, wherein the MCU is further configured to:
and storing the obtained theoretical transmitting optical power of the optical module to a target address so that an upper computer can directly read the theoretical transmitting optical power of the optical module.
9. The optical module of claim 7, wherein N is 0.7.
10. A light module as claimed in claim 1, characterized in that the temperature sensor is located in the MCU.
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