CN111592275A - Radiator and preparation method thereof - Google Patents
Radiator and preparation method thereof Download PDFInfo
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- CN111592275A CN111592275A CN202010607465.9A CN202010607465A CN111592275A CN 111592275 A CN111592275 A CN 111592275A CN 202010607465 A CN202010607465 A CN 202010607465A CN 111592275 A CN111592275 A CN 111592275A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/12—Condensation polymers of aldehydes or ketones
- C04B26/122—Phenol-formaldehyde condensation polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/248—Moulding mineral fibres or particles bonded with resin, e.g. for insulating or roofing board
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/04—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/04—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/045—Polyalkenes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/20—Polyamides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00439—Physico-chemical properties of the materials not provided for elsewhere in C04B2111/00
- C04B2111/00465—Heat conducting materials
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/30—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values
- C04B2201/32—Mortars, concrete or artificial stone characterised by specific physical values for heat transfer properties such as thermal insulation values, e.g. R-values for the thermal conductivity, e.g. K-factors
Abstract
The application provides a radiator and a preparation method thereof. The radiator comprises 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder. The material of the binder is a thermoplastic material. The ceramic particles in the heat spreader are bonded together by the binder. The preparation method comprises the following steps: uniformly mixing 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder, wherein the binder is made of a thermoplastic material; and pressurizing and heating the mixture of the ceramic particles and the binder to melt the binder and enter gaps of the ceramic particles so as to bond the ceramic particles together after the binder is solidified.
Description
Technical Field
The application relates to the technical field of radiators, in particular to a radiator and a preparation method thereof.
Background
The electronic equipment is generally provided with a radiator to improve the heat dissipation capability of the electronic equipment and avoid the influence on the performance of the electronic equipment caused by higher temperature of the electronic equipment.
The radiator in the electronic equipment can adopt a ceramic radiator, and the ceramic radiator is prepared by adopting a ceramic matrix composite material. However, in the existing ceramic radiator preparation process, high temperature is adopted to fuse and bond ceramic particles, the heating temperature in the preparation process is generally more than 1000 ℃, sometimes even exceeds 1800 ℃, the energy consumption in the production process is high, and a large amount of carbon dioxide gas can be generated in the preparation process, thus causing harm to the environment.
Disclosure of Invention
An aspect of an embodiment of the present application provides a heat sink. The radiator comprises 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder;
the material of the binder is thermoplastic material; the ceramic particles in the heat spreader are bonded together by the binder.
In one embodiment, the heat spreader includes at least two different particle size ranges of the ceramic particles.
In one embodiment, the ceramic particles include a first type of ceramic particles having a particle size ranging from 15 μm to 60 μm and a second type of ceramic particles having a particle size ranging from 1 μm to 5 μm.
In one embodiment, the mass ratio of the first type of ceramic particles to the second type of ceramic particles is 1: 1-1: 5.
in one embodiment, the material of the ceramic particles comprises at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide; and/or the presence of a gas in the gas,
the material of the binder comprises at least one of nylon, polyformaldehyde, polycarbonate, high-density polyethylene and acrylonitrile-butadiene-styrene copolymer.
Another aspect of the embodiments of the present application provides a method for manufacturing a heat sink, including:
uniformly mixing 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder, wherein the binder is a thermoplastic material;
and pressurizing and heating the mixture of the ceramic particles and the binder to melt the binder and enter gaps of the ceramic particles so as to bond the ceramic particles together after the binder is solidified.
In one embodiment, in the step of pressurizing and heating the mixture of the ceramic particles and the binder, the heating temperature is 200 ℃ to 400 ℃, and the heating time is 60min to 100 min.
In one embodiment, before the pressurizing and heating the mixture of the ceramic particles and the binder, the preparation method further includes:
providing a mould, and filling a mixture of the ceramic particles and the binder into a containing cavity of the mould;
pressurizing the mixture in the mold;
the pressurizing and heating of the mixture of the ceramic particles and the binder includes:
heating the mold and the mixture while pressurizing the mixture in the mold;
after the pressing and heating of the mixture of the ceramic particles and the binder, the preparation method further includes:
and after the binder is cooled and solidified and the ceramic particles are bonded by the binder to obtain the radiator, separating the radiator from the mold.
In one embodiment, the heat spreader includes ceramic particles of at least two different particle size ranges;
the ceramic particles comprise a first type of ceramic particles and a second type of ceramic particles, the particle size range of the first type of ceramic particles is 15-60 mu m, and the particle size range of the second type of ceramic particles is 1-5 mu m;
the mass ratio of the first type of ceramic particles to the second type of ceramic particles is 1: 1-1: 5.
in one embodiment, the material of the ceramic grains includes at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide; and/or the presence of a gas in the gas,
the material of the binder comprises at least one of nylon, polyformaldehyde, high-density polyethylene and acrylonitrile-butadiene-styrene copolymer; and/or the presence of a gas in the gas,
the particle size of the binder is smaller than that of the ceramic particles.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
according to the radiator and the preparation method thereof provided by the embodiment of the application, the radiator comprises ceramic particles and a binder, the ceramic particles are bonded together through the binder, the binder is made of a thermoplastic material, and only the binder is required to be melted in the preparation process, so that the preparation temperature is low, the energy consumption in the preparation process can be reduced, the amount of generated carbon dioxide gas can be reduced, the pollution to the environment is reduced, and the radiator is suitable for batch processing; the adhesive bonds the ceramic particles together, and the strength of the ceramic particles is greater, and the strength of the heat sink is greater.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Fig. 1 is a flow chart of a method for manufacturing a heat sink according to an exemplary embodiment of the present disclosure;
fig. 2 is a flowchart of a method for manufacturing a heat sink according to another exemplary embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
The heat sink and the method for manufacturing the heat sink in the embodiments of the present application will be described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments can be supplemented or combined with each other without conflict.
The radiator provided by the embodiment of the application can be used for electronic equipment, and the heat radiation performance of the electronic equipment is improved. The radiator comprises 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder. The material of the binder is a thermoplastic material. The ceramic particles in the heat spreader are bonded together by the binder. According to the radiator provided by the embodiment of the application, the ceramic particles are bonded together through the adhesive, the material of the adhesive is a thermoplastic material, and only the adhesive needs to be melted in the preparation process, and the ceramic particles do not need to be melted, so that the preparation temperature is low, the energy consumption in the preparation process can be reduced, and the amount of generated carbon dioxide gas can be reduced.
In addition, the main body material of the radiator provided by the embodiment of the application is ceramic particles, the insulating property of the ceramic particles is good, and the conductive interference and the radiation interference to other metal devices can be avoided when the radiator is used for electronic equipment; the ceramic particles have small specific gravity and light weight, and are beneficial to realizing the lightness and thinness of electronic equipment when used for the electronic equipment; the ceramic particles can resist high pressure and have strong radiation heat dissipation capability, so that the radiator has good high pressure resistance and heat dissipation capability; compared with the scheme of preparing the radiator by adopting a metal material, the ceramic particles have better surface corrosion resistance, surface treatment is not needed, the problems of environmental pollution and cost increase caused by secondary processing can be avoided, the radiator prepared by adopting the ceramic particles is convenient to process, the structural design freedom degree is higher, and the cost is lower.
The embodiment of the application provides a radiator. The radiator comprises 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder.
Wherein the material of the binder is thermoplastic material. The ceramic particles in the heat spreader are bonded together by the binder.
The thermoplastic material has the characteristics of softening by heating and hardening by cooling. The thermoplastic material melts and flows to the gaps between the ceramic particles at high temperatures, and upon cooling the thermoplastic material hardens, thereby bonding the ceramic particles together.
In the embodiment of the present application, the binder of the heat sink is dispersed among the ceramic particles, the binder dispersed at each position is bonded together, and the binder at each position is bonded to the adjacent ceramic particles, so that the binder bonds all the ceramic particles together.
According to the radiator provided by the embodiment of the application, the radiator comprises the ceramic particles and the binder, the ceramic particles are bonded together through the binder, the binder is made of the thermoplastic material, the binder is only required to be melted in the preparation process, and the ceramic particles are not required to be melted, so that the preparation temperature is low, the energy consumption in the preparation process can be reduced, the amount of generated carbon dioxide gas can be reduced, the pollution to the environment is reduced, and the radiator is suitable for batch processing; the adhesive bonds the ceramic particles together, and the strength of the ceramic particles is greater, and the strength of the heat sink is greater.
In some embodiments, the mass parts of the ceramic particles in the heat spreader may be 300, 350, 400, 450, 500, etc., and the mass parts of the binder may be 5, 8, 10, 13, 15, etc.
In one embodiment, the heat spreader includes ceramic particles of at least two different particle size ranges. By the arrangement, the ceramic particles with the smaller particle size range can enter gaps among the ceramic particles with the larger particle size range, so that the porosity of the radiator is reduced, the density of the radiator is increased, the strength of the radiator is improved, the surface defect of the radiator can be improved, the thermal resistance of the radiator is reduced, and the radiating effect of the radiator is improved.
In one embodiment, the ceramic particles include a first type of ceramic particles having a particle size ranging from 15 μm to 60 μm and a second type of ceramic particles having a particle size ranging from 1 μm to 5 μm. In this manner, the second type of ceramic particles may enter the interstices between the first type of ceramic particles. When the grain size range of the first ceramic grains is 15-60 mu m, the gaps among the first ceramic grains can accommodate the second ceramic grains with the grain size range of 1-5 mu m, which is more beneficial to reducing the gaps among the ceramic grains and achieving the purposes of reducing the porosity of the radiator and improving the surface defects of the radiator. In one exemplary embodiment, the first type of ceramic particles have a particle size of, for example, 15 μm, 25 μm, 35 μm, 45 μm, 55 μm, 60 μm, etc., and the second type of ceramic particles have a particle size of, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, etc.
In one embodiment, the ceramic particles include a first type of ceramic particles having a particle size ranging from 15 μm to 60 μm and a second type of ceramic particles having a particle size ranging from 1 μm to 5 μm, wherein a mass ratio of the first type of ceramic particles to the second type of ceramic particles is 1: 1-1: 5. so set up, the porosity that first type ceramic particle and second type ceramic particle set up and can make the radiator is lower, more is favorable to promoting the density and the intensity of radiator, and the surface defect of radiator is littleer simultaneously, and the radiating effect of radiator is better. In one exemplary embodiment, the mass ratio of the first type of ceramic particles to the second type of ceramic particles is, for example, 1: 1. 1: 2. 1: 3. 1: 4. 1: 5, and the like.
In one embodiment, the material of the ceramic particles includes at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide. These materials are readily available and can provide ceramic particles with greater strength, and thus heat sinks made with ceramic particles have greater strength.
In one embodiment, the material of the binder is a polymeric thermoplastic material. Thus, the adhesive has better bonding performance.
In one embodiment, the material of the binder comprises at least one of nylon, polyoxymethylene, high density polyethylene, and acrylonitrile-butadiene-styrene copolymer. When the materials of the adhesive are the materials, the thermoplastic property of the adhesive is better, and the adhesive property of the adhesive is better promoted. The nylon may be nylon 6, nylon 66, nylon 46, etc.
The embodiment of the application also provides a preparation method of the radiator. Referring to fig. 1, the method for manufacturing the heat spreader includes the following steps 110 and 120.
In the step 110, 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder are uniformly mixed, wherein the binder is made of a thermoplastic material.
In one embodiment, the step 110 of uniformly mixing 300 to 500 parts by mass of the ceramic particles with 5 to 15 parts by mass of the binder includes the steps of:
adding 300-500 parts by mass of ceramic particles and 5-15 parts by mass of binder into a high-speed mixer for mixing, wherein the mixing time is 15-30 seconds, and the rotating speed of the high-speed mixer is 1000-1500 r/min. The mixing can be repeated 3 to 6 times. In an exemplary embodiment, when 300 to 500 parts by mass of the ceramic particles and 5 to 15 parts by mass of the binder are added to a high-speed mixer for mixing, the mixing time may be 15 seconds, 20 seconds, 25 seconds, 30 seconds, etc., and the rotation speed of the high-speed mixer may be 1000r/min, 1100r/min, 1200r/min, 1300r/min, 1400r/min, 1500r/min, etc. Mixing can be repeated 3, 4, 5, 6 times, etc. in a high speed mixer.
In one embodiment, before step 110, the preparation method further comprises the steps of:
the ceramic particles are dried with a binder. Through drying ceramic particles and the binder, the water on the surfaces of the ceramic particles and the binder can be removed, the generation of defects on the surface of the radiator caused by bubbles generated in the subsequent heating process is prevented, and the improvement of the heat radiation performance of the radiator is facilitated.
In one embodiment, the ceramic particles and the binder may be dried in a drying oven at a temperature of 60 ℃ to 80 ℃ for a time of 2h to 6 h. In one exemplary embodiment, the drying temperature may be 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃ and the like, and the drying time may be 2h, 3h, 4h, 5h, 6h and the like.
In some embodiments, the mass parts of the ceramic particles in the heat spreader may be 300, 350, 400, 450, 500, etc., and the mass parts of the binder may be 5, 8, 10, 13, 15, etc.
In one embodiment, the heat spreader includes ceramic particles of at least two different particle size ranges. By the arrangement, the ceramic particles with the smaller particle size range can enter gaps among the ceramic particles with the larger particle size range, so that the porosity of the radiator is reduced, the density of the radiator is increased, the strength of the radiator is improved, the surface defect of the radiator can be improved, the thermal resistance of the radiator is reduced, and the radiating effect of the radiator is improved.
In one embodiment, the ceramic particles include a first type of ceramic particles having a particle size ranging from 15 μm to 60 μm and a second type of ceramic particles having a particle size ranging from 1 μm to 5 μm. As such, the second type of ceramic particles are more likely to enter the interstices between the first type of ceramic particles. When the grain size range of the first ceramic grains is 15-60 mu m, the gaps among the first ceramic grains can accommodate the second ceramic grains with the grain size range of 1-5 mu m, which is more favorable for achieving the purposes of reducing the porosity of the radiator and improving the surface defects of the radiator. In one exemplary embodiment, the first type of ceramic particles have a particle size of, for example, 15 μm, 25 μm, 35 μm, 45 μm, 55 μm, 60 μm, etc., and the second type of ceramic particles have a particle size of, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, etc.
In one embodiment, the ceramic particles include a first type ceramic particle and a second type ceramic particle, and the first type ceramic particle has a particle size ranging from 15 μm to 60 μm, and the second type ceramic particle has a particle size ranging from 1 μm to 5 μm, wherein the mass ratio of the first type ceramic particle to the second type ceramic particle is 1: 1-1: 5. so set up, the porosity that first type ceramic particle and second type ceramic particle set up and can make the radiator is lower, more is favorable to promoting the density and the intensity of radiator, and the surface defect of radiator is littleer simultaneously, and the radiating effect of radiator is better. In one exemplary embodiment, the mass ratio of the first type of ceramic particles to the second type of ceramic particles is, for example, 1: 1. 1: 2. 1: 3. 1: 4. 1: 5, and the like.
In one embodiment, the material of the ceramic particles includes at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide. These materials are readily available and can provide ceramic particles with greater strength, and heat sinks made with ceramic particles have greater strength.
In one embodiment, the binder has a particle size smaller than that of the ceramic particles. Therefore, the adhesive can enter gaps among the ceramic particles more easily, the adhesive and the ceramic particles can be mixed more uniformly, and the ceramic particles are bonded more firmly after the adhesive is melted.
In one embodiment, the binder has a particle size in the range of 0.5 μm to 5 μm. The particle size of the binder may be, for example, 0.5. mu.m, 1.5. mu.m, 2.5. mu.m, 3.5. mu.m, 4.5. mu.m, 5. mu.m, or the like.
In one embodiment, the material of the binder is a polymeric thermoplastic material.
In one embodiment, the material of the binder comprises at least one of nylon, polyoxymethylene, high density polyethylene, and acrylonitrile-butadiene-styrene copolymer. When the materials of the adhesive are the materials, the thermoplastic property of the adhesive is better, and the adhesive property of the adhesive is better promoted. The nylon may be nylon 6, nylon 66, nylon 46, etc.
In step 120, the mixture of the ceramic particles and the binder is heated to melt the binder into the gaps of the ceramic particles to bond the ceramic particles together after the binder is cured.
In this step, the ceramic particles and the binder are heated to melt the binder, the melted binder having fluidity flows into the gaps between the ceramic particles, wets the surfaces of the ceramic particles, the binder dispersed at each position is bonded to the adjacent ceramic particles, and the binder at each position bonds the adjacent ceramic particles, thereby bonding all the ceramic particles together.
In one embodiment, in the step 120 of pressurizing and heating the mixture of the ceramic particles and the binder, the heating temperature is 200 ℃ to 400 ℃, and the heating time is 60min to 100 min. At the heating temperature and the heating time, the binder can be melted to exhibit fluidity, and deformation of the ceramic particles due to melting can be avoided. In an exemplary embodiment, the heating temperature may be, for example, 200 ℃, 250 ℃, 300 ℃, 350 ℃, 400 ℃ or the like, and the heating time may be 60min, 70min, 80min, 90min, 100min or the like.
In one embodiment, in the step 120 of pressurizing and heating the mixture of the ceramic particles and the binder, the mixture of the ceramic particles and the binder may be pressurized at all times while being heated. In some embodiments, the mixture of ceramic particles and binder may be pressurized by applying air pressure, hydraulic pressure, or placing a weight on the mixture. The mixture is pressurized, so that the compactness of the obtained radiator can be improved, and the strength of the radiator is improved; and the flow of the binder can be promoted by pressurizing the mixture, so that the binder is more fully contacted with the ceramic particles, and the binder can bond the ceramic particles more firmly.
In one embodiment, the ceramic particles and binder may be placed in a heating device and heated by the heating device. The heating device may be a table that heats the table and transfers heat to the ceramic particles and the binder. The heating program can be set to heat the heating device. In the set temperature rise program of the heating equipment, the temperature rise rate can be 1-5 ℃/min. The heating rate of the heating means may be, for example, 1 ℃/min, 2 ℃/min, 3 ℃/min, 4 ℃/min, 5 ℃/min, or the like.
In one embodiment, referring to fig. 2, prior to the step 120 of heating the mixture of ceramic particles and the binder, the preparation method further includes the following steps 130 and 140.
In step 130, a mold is provided, and the mixture of the ceramic particles and the binder is loaded into a receiving cavity of the mold.
The shape of the containing cavity of the die is the same as that of the radiator to be prepared, ceramic particles and a binder are filled into the containing cavity of the die, the containing cavity is filled, and the shape of the radiator prepared finally is the same as that of the containing cavity.
In this step, a mold may be placed on the table, the mold further including a plate portion provided at an edge of the accommodation cavity. A vibration device is arranged under the workbench. At the in-process to the mixture of the chamber of holding of mould in-process of packing ceramic granule and binder, place the mixture on the board, start vibrating device, vibrating device passes through the workstation and drives the mould vibration, and the mixture is held the chamber by the board flow direction under the effect of vibration, can promote the efficiency of filling the mixture.
In step 140, the mixture of ceramic particles and binder is pressurized.
In this step, the pressure head can be used to pressurize the mixture in the containing cavity, so as to improve the compactness of the mixture and reduce the porosity of the mixture.
In one embodiment, the step 120 of heating and pressurizing the mixture of the ceramic particles and the binder includes:
heating the mold and the mixture while pressurizing the mixture in the mold.
After the mixture of ceramic particles and binder is loaded into a mold, the mold is placed into a heating device that transfers heat to the mold during heating, and the mold transfers heat to the mixture.
It is understood that the melting point of the mold is much higher than the temperature of heating in step 120, and the mold is not deformed during the heating process, and the shape of the heat sink is not affected.
After step 120, the preparation method further comprises: and after the binder is cooled and solidified and the ceramic particles are bonded by the binder to obtain the radiator, separating the die from the radiator.
According to the preparation method of the radiator provided by the embodiment of the application, the radiator comprises ceramic particles and a binder, the ceramic particles are bonded together through the binder, the binder is made of a thermoplastic high polymer material, and only the binder is required to be melted in the process of heating the ceramic particles and the binder in the preparation process, the ceramic particles are not required to be melted, so that the heating temperature is low, the energy consumption in the preparation process can be reduced, the amount of generated carbon dioxide gas can be reduced, the pollution to the environment is reduced, and the preparation method is suitable for batch processing; after the binder is solidified, the ceramic particles are bonded together, and the strength of the ceramic particles is higher, so that the strength of the radiator is higher.
In addition, according to the preparation method of the radiator provided by the embodiment of the application, the main material of the prepared radiator is ceramic particles, the insulating property of the ceramic particles is good, and the conductive interference and the radiation interference to other metal devices can be avoided when the radiator is used for electronic equipment; the ceramic particles have small specific gravity and light weight, and are beneficial to realizing the lightness and thinness of electronic equipment when used for the electronic equipment; the ceramic particles can resist high pressure, have strong radiation heat dissipation capacity, and can ensure that the radiator resists high pressure and has good heat dissipation capacity; compared with the scheme of preparing the radiator by adopting a metal material, the ceramic particles have better surface corrosion resistance, surface treatment is not needed, the problems of environmental pollution and cost increase caused by secondary processing can be avoided, the radiator prepared by adopting the ceramic particles is convenient to process, the structural design freedom degree is higher, and the cost is lower.
The above method embodiments basically correspond to the product embodiments, so the descriptions of the relevant details and beneficial effects can be referred to each other, and are not repeated.
In order to more clearly describe the heat dissipation effect of the heat sink provided by the embodiments of the present application, several detailed embodiments are given below:
example 1
First, 500 parts by mass of the ceramic particles and 10 parts by mass of the binder were dried in a drying oven at 60 ℃ for 3 hours, respectively. Wherein the ceramic particle includes that the particle diameter is 30 um's aluminium nitride granule and particle diameter are 3 um's aluminium nitride granule, and the quality ratio of the aluminium nitride granule that the particle diameter is 30um and the aluminium nitride granule that the particle diameter is 3um is 1: 1. the material of the binder is nylon 46, and the particle size of the binder is 2 um.
Then, placing the ceramic particles and the binder into a high-speed mixer, mixing for 15 seconds, and repeatedly mixing for 4 times at the rotating speed of 2500r/min to obtain a mixture of the ceramic particles and the binder;
subsequently, the resulting mixture is filled into a receiving cavity of a mold, and the mixture is pressurized by a ram;
then, heating the die, setting a temperature rise program, wherein the temperature rise rate is 3 ℃/min, and the temperature rises to 320 ℃; heating the mold at 320 ℃ for 70 minutes, and pressurizing the mixture in the mold while heating the mold;
and then, after cooling to room temperature, the binder is solidified to bond the ceramic particles together, the ceramic particles and the binder form a heat radiator, and the heat radiator in the mold is separated from the mold.
The heat sink obtained in example 1 was the first heat sink.
Example 2
First, 400 parts by mass of the ceramic particles and 8 parts by mass of the binder were dried in a 75 ℃ drying oven for 3 hours, respectively. The ceramic particles comprise aluminum nitride particles and aluminum oxide particles, and the mass ratio of the aluminum oxide particles to the aluminum nitride particles is 3: 1. the aluminum nitride particles comprise aluminum nitride particles with the particle size of 50um and aluminum oxide particles with the particle size of 4um, and the mass ratio of the aluminum nitride particles with the particle size of 50um to the aluminum oxide particles with the particle size of 4um is 1: 2. the alumina particles had a particle size of 15 um. The material of the binder is high-density polyethylene, and the particle size of the binder is 3 um.
Then, placing the ceramic particles and the binder into a high-speed mixer, mixing for 20 seconds, and repeatedly mixing for 5 times at the rotating speed of 2000r/min to obtain a mixture of the ceramic particles and the binder;
subsequently, the resulting mixture is filled into a receiving cavity of a mold, and the mixture is pressurized by a ram;
then, heating the die, setting a temperature rise program, wherein the temperature rise rate is 4 ℃/min, and raising the temperature to 300 ℃; heating the mold at 300 ℃ for 90 minutes, and pressurizing the mixture in the mold while heating the mold;
and then, after cooling to room temperature, the binder is solidified to bond the ceramic particles together, the ceramic particles and the binder form a heat radiator, and the heat radiator in the mold is separated from the mold.
The heat sink obtained in example 2 was the second heat sink.
Example 3
First, 480 parts by mass of ceramic particles and 15 parts by mass of a binder were dried in a drying oven at 70 ℃ for 3 hours, respectively. The ceramic particles comprise boron nitride particles, aluminum nitride particles and aluminum oxide particles, and the mass ratio of the boron nitride particles to the aluminum oxide particles to the aluminum nitride particles is 1: 1: 1. the particle size of the boron nitride particles is 20um, the particle size of the aluminum nitride particles is 20um, and the particle size of the aluminum oxide particles is 4 um. The alumina particles had a particle size of 15 um. The material of the binder is nylon 66, and the particle size of the binder is 2 um.
Then, placing the ceramic particles and the binder into a high-speed mixer, mixing for 15 seconds, and repeatedly mixing for 3 times at the rotating speed of 2000r/min to obtain a mixture of the ceramic particles and the binder;
subsequently, the resulting mixture is filled into a receiving cavity of a mold, and the mixture is pressurized by a ram;
then, heating the die, setting a temperature rise program, wherein the temperature rise rate is 4 ℃/min, and the temperature rises to 360 ℃; heating the mould at 360 ℃ for 80 minutes, and pressurizing the mixture in the mould while heating the mould;
and then, after cooling to room temperature, the binder is solidified to bond the ceramic particles together, the ceramic particles and the binder form a heat radiator, and the heat radiator in the mold is separated from the mold.
The heat sink obtained in example 3 is a third heat sink.
The first radiator, the second radiator and the third radiator obtained in the above embodiment are respectively subjected to a heat dissipation effect test, and the test data refer to table 1 below:
TABLE 1
During testing, the bottom of the radiator is close to a heat source, and the temperature difference of the bottom of the radiator refers to the temperature difference between the center position and the edge position of the bottom of the radiator. The smaller the temperature difference at the bottom of the radiator is, the better the heat radiation effect of the radiator is. After the heat radiator is used for radiating heat of the heat source for a period of time, the temperature of the heat source is stable, and the difference value between the temperature of the heat source and the temperature value of the heat source when the heat source just works is the temperature rise value of the heat source. The smaller the rise value of the heat source temperature is, the better the heat dissipation effect of the radiator is.
As can be seen from table 1, the first heat sink, the second heat sink, and the third heat sink prepared by the method provided in the embodiment of the present application have a large thermal conductivity and a good heat dissipation effect.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (10)
1. A radiator is characterized by comprising 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder;
the material of the binder is thermoplastic material; the ceramic particles in the heat spreader are bonded together by the binder.
2. The heat sink of claim 1, wherein the heat sink comprises at least two different particle size ranges of the ceramic particles.
3. The heat sink of claim 2, wherein the ceramic particles comprise a first type of ceramic particles and a second type of ceramic particles, the first type of ceramic particles having a particle size in a range of 15 μm to 60 μm, and the second type of ceramic particles having a particle size in a range of 1 μm to 5 μm.
4. The heat sink of claim 3, wherein the mass ratio of the first type of ceramic particles to the second type of ceramic particles is 1: 1-1: 5.
5. the heat sink of claim 3, wherein the ceramic particles comprise a material comprising at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide; and/or the presence of a gas in the gas,
the material of the binder comprises at least one of nylon, polyformaldehyde, polycarbonate, high-density polyethylene and acrylonitrile-butadiene-styrene copolymer.
6. A method for preparing a radiator is characterized by comprising the following steps:
uniformly mixing 300-500 parts by mass of ceramic particles and 5-15 parts by mass of a binder, wherein the binder is a thermoplastic material;
and pressurizing and heating the mixture of the ceramic particles and the binder to melt the binder and enter gaps of the ceramic particles so as to bond the ceramic particles together after the binder is solidified.
7. The method for manufacturing a heat sink according to claim 6, wherein the step of pressurizing and heating the mixture of the ceramic particles and the binder is performed at a heating temperature of 200 ℃ to 400 ℃ for 60min to 100 min.
8. The method for manufacturing a heat sink according to claim 6, wherein before the pressurizing and heating the mixture of the ceramic particles and the binder, the method further comprises:
providing a mould, and filling a mixture of the ceramic particles and the binder into a containing cavity of the mould;
pressurizing the mixture in the mold;
the pressurizing and heating of the mixture of the ceramic particles and the binder includes:
heating the mold and the mixture while pressurizing the mixture in the mold;
after the pressing and heating of the mixture of the ceramic particles and the binder, the preparation method further includes:
and after the binder is cooled and solidified and the ceramic particles are bonded by the binder to obtain the radiator, separating the radiator from the mold.
9. The method of manufacturing a heat sink according to claim 6, wherein the heat sink comprises at least two different particle size ranges of ceramic particles;
the ceramic particles comprise a first type of ceramic particles and a second type of ceramic particles, the particle size range of the first type of ceramic particles is 15-60 mu m, and the particle size range of the second type of ceramic particles is 1-5 mu m;
the mass ratio of the first type of ceramic particles to the second type of ceramic particles is 1: 1-1: 5.
10. the method of claim 6, wherein the ceramic particles are made of a material including at least one of aluminum nitride, silicon nitride, aluminum oxide, boron nitride, and silicon carbide; and/or the presence of a gas in the gas,
the material of the binder comprises at least one of nylon, polyformaldehyde, high-density polyethylene and acrylonitrile-butadiene-styrene copolymer; and/or the presence of a gas in the gas,
the particle size of the binder is smaller than that of the ceramic particles.
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