CN111586991B - Circuit board developing processing system and method - Google Patents
Circuit board developing processing system and method Download PDFInfo
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- CN111586991B CN111586991B CN202010461597.5A CN202010461597A CN111586991B CN 111586991 B CN111586991 B CN 111586991B CN 202010461597 A CN202010461597 A CN 202010461597A CN 111586991 B CN111586991 B CN 111586991B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0278—Arrangement or mounting of spray heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a development processing system and method for a circuit board. Circuit board development system of processing, including at least one set of liquid medicine that acts on the PCB board spray the subsystem, this liquid medicine sprays the subsystem and includes: the arrangement mode of each air hole spray gun is matched with the arrangement mode of each through hole and/or blind hole of the PCB, and each air hole spray gun is communicated with a first air pressure pipeline and used for intermittently blowing air to the through hole or the blind hole; the gas-liquid two-phase nozzles are distributed in a staggered mode with the gas hole spray gun, each gas-liquid two-phase nozzle is communicated with a cavity bag, the cavity bags are communicated with a first liquid medicine pipeline and a second gas pressure pipeline, and the gas-liquid two-phase nozzles are used for continuously spraying developing liquid medicine onto the PCB under preset gas pressure. The invention can ensure that the exchange speed of the old liquid medicine and the new liquid medicine in the hole is effectively improved, thereby ensuring the full reaction of the printing ink and the new liquid medicine in the hole and solving the technical problem of hole blocking by the printing ink.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a system and a method for developing and processing a Circuit Board.
Background
The manufacturing of the solder mask is an important process in the PCB manufacturing process, which means that the surface of the PCB is covered with a layer of solder mask ink after the outer layer circuit pattern is manufactured, the solder mask ink is coated on circuits and base materials which are not required to be welded of the PCB, so that short circuit caused by bridging among the circuits during welding is prevented, the using amount of the solder mask is saved, meanwhile, the solder mask layer can also provide a permanent electrical environment and a chemical protection layer, the damage of moisture and various electrolytes to the circuits is prevented, the electrical property is damaged by oxidation of the circuits, external mechanical damage is prevented, and the good insulating property of the board surface is maintained.
At present, the solder resist process includes: pre-processing a solder mask, grinding the board (to remove surface oxidation and the like and increase the bonding force between the board surface and the ink) - - (solder mask aluminum sheet) - - -solder mask screen printing) - - (pre-baking (at a low temperature of 65-75 ℃/60min, volatilizing and thermally curing a solvent in the ink) - -, -exposing (curing the ink by light) - -, - -developing (removing the position where the ink is not cured by light) - -, - -post-baking (at 145 and 155 ℃, thermally curing the ink).
In the solder mask screen printing process of the solder mask process, an oil blocking point is usually added on the screen printing plate to prevent solder mask ink from penetrating into the hole in the screen printing process. The setting of keeping off oil point has reduced printing ink hand-hole problem to a certain extent, but along with the increase of the density of PCB design, printing ink still can be downthehole from the lateral part inflow that keeps off oil point, and the printing ink of hand-hole can the thermosetting at the in-process that dries by fire in advance to ink stifled hole phenomenon appears.
In the developing process of the solder resist process, as shown in fig. 1, one or more nozzles selected from fan-type nozzles, cone-type nozzles, and column-type nozzles are usually used to spray a developer solution onto the PCB to remove the unexposed ink. However, in the conventional developing process, only unexposed ink in the area of the board surface can be effectively removed, ink in the hole cannot be effectively removed due to the pool effect, and the problem of ink blocking of the hole can cause the problem that liquid medicine accumulates in the hole during the wet process production, and the reliability of the printed circuit board is finally affected.
Disclosure of Invention
The invention aims to provide a circuit board developing processing system and a circuit board developing processing method, which solve the problem that the ink at a manhole cannot be washed out in the developing process in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a circuit board development system of processing, includes that at least one set of liquid medicine that acts on the PCB board sprays the subsystem, liquid medicine sprays the subsystem and includes:
the arrangement mode of each air hole spray gun is matched with the arrangement mode of each through hole and/or blind hole of the PCB, each air hole spray gun is communicated with a first air pressure pipeline, and the air hole spray gun is used for intermittently blowing air to the through hole or the blind hole;
the gas-liquid dual-phase spray nozzles are distributed with the gas hole spray gun in a staggered mode, each gas-liquid dual-phase spray nozzle is communicated with a cavity bag, the cavity bags are communicated with a first liquid medicine pipeline and a second gas pressure pipeline, and the gas-liquid dual-phase spray nozzles are used for continuously spraying developing liquid medicine onto the PCB under preset gas pressure.
Optionally, the liquid medicine spraying subsystem further comprises: the liquid nozzle is communicated with a second liquid medicine pipeline;
and according to the advancing direction of the PCB, the liquid nozzles are at least distributed in the rear areas of the air hole spray gun and the gas-liquid two-phase nozzle.
Optionally, the liquid medicine spraying subsystem further comprises at least one water flow negative pressure suction cup arranged between the arrangement area of the liquid nozzle and the arrangement areas of the air hole spray gun and the gas-liquid two-phase nozzle.
And the water flow negative pressure sucker is used for discharging the developer solution of the dissolved ink on the board surface of the PCB and in the through hole and/or the blind hole.
Optionally, the flow rate of the liquid nozzle is greater than the flow rate of the gas-liquid two-phase nozzle.
Optionally, the liquid medicine spraying subsystem further comprises an ultrasonic vibration device for performing vibration treatment on the PCB at least in the working process of the gas-liquid two-phase nozzle.
Optionally, the number of the liquid medicine spraying subsystems is multiple, and the liquid medicine spraying subsystems are sequentially arranged according to the advancing direction of the PCB.
A circuit board developing processing method is applied to the circuit board developing processing system and comprises the following steps:
continuously spraying the developing solution onto the PCB under a preset air pressure through the gas-liquid two-phase nozzle; meanwhile, the air hole spray gun is used for intermittently blowing air to each through hole and/or blind hole of the PCB, so that the developer of the dissolved ink in the through hole and/or blind hole is discharged.
Optionally, the method further comprises the steps of: and according to the advancing direction of the PCB, at least before the PCB reaches the arrangement area of the gas-liquid two-phase nozzles and the air hole spray guns, spraying developing liquid medicine of liquid to the PCB by adopting a liquid nozzle in advance.
Optionally, the method further comprises the steps of: and after the PCB passes through the arrangement area of the liquid nozzles and before the PCB reaches the arrangement area of the air hole spray gun and the gas-liquid two-phase nozzle, discharging the developer solution of the dissolved ink on the board surface of the PCB and in the through holes and/or the blind holes.
Optionally, the method further comprises the steps of: and at least carrying out vibration treatment on the PCB through ultrasonic waves in the process of continuously spraying the developing solution onto the PCB under preset air pressure through the gas-liquid two-phase nozzle.
Compared with the prior art, the invention has the beneficial effects that:
by applying the embodiment of the invention, the gas-liquid two-phase nozzle can continuously spray new liquid medicine on the PCB, and the ink (including the ink on the surface of the PCB and the ink in partial holes) on the PCB reacts with the liquid medicine; meanwhile, the air hole spray gun intermittently blows air to the through hole and/or the blind hole on the PCB board to blow out the old liquid medicine dissolved with the ink accumulated in the hole, so that the new liquid medicine sprayed at the gap when the air hole spray gun stops blowing air can enter the hole, the exchange speed of the old liquid medicine and the new liquid medicine is effectively improved, the full reaction of the ink in the hole and the new liquid medicine is ensured, and the technical problem of ink hole blocking is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a circuit board development processing method in the prior art;
FIG. 2 is a schematic structural diagram of a circuit board development processing system according to an embodiment of the present invention;
FIG. 3 is a flow chart of a circuit board developing method according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a circuit board developing processing method according to an embodiment of the present invention.
Illustration of the drawings: the device comprises a PCB (printed circuit board) 1, a through hole 2, a liquid nozzle 3, new liquid 4, old liquid 5, printing ink 6 in the hole, an air hole spray gun 7, a gas-liquid two-phase nozzle 8, a water flow negative pressure suction cup 9 and an ultrasonic vibration device 10.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
For convenience of description, the developer in which the ink is not dissolved will be referred to as a new developer 4, and the developer in which the ink is dissolved will be referred to as an old developer 5.
Theoretically, when the new liquid medicine 4 is sprayed to the PCB board 1 by using the horizontal line of the conventional nozzle, the ink in the unexposed area of the PCB board 1 can be dissolved by the new liquid medicine 4. However, after the phenomenon of ink blocking in the solder mask screen printing process, the through holes 2 blocked by the ink are actually equivalent to blind hole design, the new liquid medicine 4 is difficult to enter the holes due to the pool effect, and even if the new liquid medicine can enter the holes, the old liquid medicine 5 cannot be exchanged with the new liquid medicine 4 after reacting with a small amount of the ink 6 in the holes to become the old liquid medicine 5, so that the new liquid medicine 4 cannot fully react with the residual ink 6 in the holes. Therefore, as can be seen from fig. 1, only a small amount of the ink 6 in the pores near the orifices is finally removed by development, and most of the ink 6 in the pores is not removed by development. From this analysis, it can be seen that the degree of exchange between the new liquid medicine 4 and the old liquid medicine 5 in the hole is an important influencing factor for the development effect.
Therefore, the embodiment of the invention provides a circuit board developing and processing system, which is additionally provided with a special design on the basis of a conventional nozzle combination design to solve the problem of liquid medicine exchange in holes, thereby improving the developing and punching capacity.
Referring to fig. 2, the circuit board developing and processing system according to the embodiment of the present invention includes at least one set of liquid medicine spraying subsystem capable of acting on the PCB 1, and the liquid medicine spraying subsystem specifically includes:
the arrangement mode of each air hole spray gun 7 is matched with the arrangement mode of each through hole 2 and/or blind hole of the PCB 1, and each air hole spray gun 7 is communicated with a first air pressure pipeline; the air hole spray gun 7 is used for intermittently blowing air to the through hole 2 or the blind hole;
each gas-liquid two-phase nozzle 8 is distributed with the air hole spray gun 7 in a staggered way, each gas-liquid two-phase nozzle 8 is communicated with a cavity bag, and the cavity bag is communicated with a first liquid medicine pipeline and a second air pressure pipeline; the gas-liquid two-phase nozzle 8 is used for continuously spraying the new liquid medicine 4 onto the PCB board 1 in a liquid state or a gas state under a preset gas pressure.
It can be understood that, in the liquid medicine spraying subsystem, the gas-liquid two-phase nozzle 8 and the air hole spray gun 7 are distributed in the same arrangement area; the arrangement mode of the air hole spray gun 7 is the same as that of the through holes 2 and/or the blind holes on the PCB 1, and an intermittent working mode is adopted; the gas-liquid two-phase nozzles 8 and the air hole spray guns 7 are distributed in a staggered mode, and a continuous working mode is adopted.
Therefore, when the PCB 1 advances to the arrangement area, the gas-liquid two-phase nozzle 8 continuously sprays new liquid medicine 4 on the PCB 1, and the ink (including the board surface ink and the ink 6 in the holes) on the PCB 1 reacts with the liquid medicine; meanwhile, the air hole spray gun 7 intermittently blows air to the through hole 2 and/or the blind hole on the PCB board 1 to blow out the old liquid medicine 5 which is accumulated in the hole and dissolves the printing ink, so that the new liquid medicine 4 sprayed at the gap when the air hole spray gun 7 stops blowing air can enter the hole, the exchange speed of the old liquid medicine 5 and the new liquid medicine 4 is effectively improved, the full reaction of the printing ink 6 in the hole and the new liquid medicine 4 is ensured, and the technical problem of ink hole blocking is solved.
The combined design of the gas-liquid two-phase nozzle 8 of the air hole spray gun 7 is mainly used for solving the development problem of the printing ink 6 in the hole due to the adoption of the arrangement design mode matched with each through hole 2 and/or blind hole on the PCB 1. In order to effectively ensure the developing effect of the ink on the panel surface, in the embodiment of the invention, each liquid medicine spraying subsystem may further include at least one liquid nozzle 3, and the liquid nozzle 3 is communicated with a second liquid medicine pipeline.
The liquid nozzles 3 are arranged at least in the rear area of the air hole spray gun 7 and the gas-liquid two-phase nozzle 8 in the advancing direction of the PCB 1. That is, in the developing process, the PCB 1 passes through the arrangement region of the liquid nozzle 3 and then passes through the arrangement region of the air hole spray gun 7 and the gas-liquid dual-phase nozzle 8. Of course, the liquid nozzles 3 may be arranged in other areas at the same time, and the invention is not limited thereto.
It should be noted that, alternatively, the flow rate of the liquid nozzle 3 is larger than the flow rate of the gas-liquid two-phase nozzle 8. Therefore, a large amount of new liquid medicine 4 can be sprayed to the PCB 1 in advance by using the liquid nozzle 3, so that the printing ink on the surface of the PCB 1 can fully react with enough liquid medicine, and a good developing effect is obtained; then, continuously spraying a small amount of new liquid medicine 4 in the distribution area of the through holes 2 and/or the blind holes by using the gas-liquid two-phase nozzle 8, and intermittently blowing out the old liquid medicine 5 in the through holes 2 and/or the blind holes by using the air hole spray gun 7, so that the ink 6 in the holes and enough new liquid medicine 4 are fully reacted. Therefore, the good developing effect of the printing ink on the surface and the printing ink 6 in the hole can be ensured, the utilization rate of the liquid medicine can be effectively improved, and the production cost is saved.
In order to further improve the liquid medicine exchange speed on the whole board surface and in the holes, the liquid medicine spraying subsystem can also comprise at least one water flow negative pressure sucker 9 which is arranged between the arrangement area of the liquid nozzle 3 and the arrangement area of the air hole spray gun 7 and the gas-liquid two-phase nozzle 8. The water flow negative pressure sucker 9 is used for discharging and treating the old liquid medicine 5 dissolved with the printing ink on the board surface of the PCB 1, the through hole 2 and/or the blind hole in an adsorption mode, so that the pool effect is reduced, and the full exchange of the new subsequently sprayed water 4 and the printing ink on the board surface and in the blind hole is ensured.
The liquid medicine spraying subsystem can also comprise an ultrasonic vibration device 10 which is at least used for carrying out vibration treatment on the PCB board 1 in the working process of the gas-liquid two-phase nozzle 8. A certain external force is provided through the ultrasonic vibration device 10, so that the new liquid medicine 4 and the printing ink 6 in the hole can further fully react and break down the hole plugging position. In practice, the PCB board 1 may be vibrated by the ultrasonic vibration device 10 in the arrangement region of the liquid nozzles 3.
It can be understood that, in practical application, a set of liquid medicine spraying subsystems can be respectively arranged at corresponding positions of two opposite board surfaces of the PCB board 1 along a direction perpendicular to the advancing direction of the PCB board 1, so as to simultaneously realize the developing processing operation of the two opposite board surfaces of the PCB board 1; and a plurality of sets of liquid medicine spraying subsystems are sequentially arranged according to the advancing direction of the PCB 1 so as to realize continuous developing processing operation and improve the processing efficiency.
Correspondingly, another embodiment of the present invention further provides a circuit board developing and processing method, which is applied to the circuit board developing and processing system, and mainly includes: continuously spraying new liquid medicine 4 onto the PCB 1 under a preset air pressure through a gas-liquid two-phase nozzle 8; meanwhile, air is intermittently blown to the through holes 2 and/or the blind holes of the PCB 1 by the air hole spray gun 7, so that the used liquid medicine 5 in the through holes 2 and/or the blind holes is discharged.
On the basis, referring to fig. 3 and 4, another embodiment of the present invention further provides another method for developing and processing a circuit board, which specifically includes the steps of:
By spraying a large amount of liquid new water 4, the full reaction of the printing ink on the board surface and the printing ink 6 in partial holes and the new water 4 can be ensured.
And 102, discharging the old liquid medicine 5 dissolved with the ink on the surface of the PCB 1 and in the through holes 2 and/or blind holes by adopting a water flow negative pressure sucker 9 in an adsorption mode.
The main purpose of this step is: the pool effect is reduced, and the subsequent new sprayed ink 4 is fully exchanged with the printing ink on the board surface and in the holes.
103, continuously spraying new liquid medicine 4 onto the PCB 1 under preset air pressure through the gas-liquid two-phase nozzle 8; meanwhile, air is intermittently blown to the through holes 2 and/or the blind holes of the PCB 1 by the air hole spray gun 7, so that the used liquid medicine 5 in the through holes 2 and/or the blind holes is discharged.
In step 103, the PCB board 1 may be vibrated by ultrasonic waves to accelerate the full reaction between the new liquid 4 and the ink 6 in the hole and to break down the hole plugging position.
In conclusion, the invention effectively improves the reaction speed and the reaction degree of the printing ink 6 in the hole and the new medicine water 4, solves the problem of hole blocking of the printing ink and improves the reliability of the product.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. The utility model provides a circuit board development system of processing, includes that at least one set of liquid medicine that acts on the PCB board sprays the subsystem, its characterized in that, liquid medicine sprays the subsystem and includes:
the arrangement mode of each air hole spray gun is matched with the arrangement mode of each through hole and/or blind hole of the PCB, each air hole spray gun is communicated with a first air pressure pipeline, and the air hole spray gun is used for intermittently blowing air to the through hole or the blind hole;
the gas-liquid dual-phase spray nozzles are distributed with the gas hole spray gun in a staggered mode, each gas-liquid dual-phase spray nozzle is communicated with a cavity bag, the cavity bags are communicated with a first liquid medicine pipeline and a second gas pressure pipeline, and the gas-liquid dual-phase spray nozzles are used for continuously spraying developing liquid medicine onto the PCB under preset gas pressure;
the liquid medicine spraying subsystem further comprises: the liquid nozzle is communicated with a second liquid medicine pipeline;
and according to the advancing direction of the PCB, the liquid nozzles are at least distributed in the rear areas of the air hole spray gun and the gas-liquid two-phase nozzle.
2. The circuit board developing and processing system according to claim 1, wherein the liquid medicine spraying subsystem further comprises at least one water flow negative pressure suction cup arranged between the arrangement region of the liquid nozzle and the arrangement regions of the gas hole spray gun and the gas-liquid two-phase nozzle;
and the water flow negative pressure sucker is used for discharging the developer solution of the dissolved ink on the board surface of the PCB and in the through hole and/or the blind hole.
3. The circuit board development processing system of claim 1, wherein the flow rate of the liquid nozzle is greater than the flow rate of the gas-liquid two-phase nozzle.
4. The circuit board developing and processing system of claim 1, wherein the chemical liquid spraying subsystem further comprises an ultrasonic vibration device for vibrating the PCB board at least during the operation of the gas-liquid two-phase nozzle.
5. The circuit board developing and processing system of claim 1, wherein the number of the liquid medicine spraying subsystems is multiple, and the liquid medicine spraying subsystems are sequentially arranged according to the advancing direction of the PCB.
6. A circuit board developing and processing method, which is applied to the circuit board developing and processing system of claim 1, comprising the steps of:
continuously spraying the developing solution onto the PCB under a preset air pressure through the gas-liquid two-phase nozzle; meanwhile, intermittently blowing air to each through hole and/or blind hole of the PCB by using the air hole spray gun so as to discharge developing solution dissolved in the ink in the through hole and/or blind hole;
further comprising the steps of: and according to the advancing direction of the PCB, at least before the PCB reaches the arrangement area of the gas-liquid two-phase nozzles and the air hole spray guns, spraying developing liquid medicine of liquid to the PCB by adopting a liquid nozzle in advance.
7. The method for developing and processing a wiring board according to claim 6, further comprising the steps of: and after the PCB passes through the arrangement area of the liquid nozzles and before the PCB reaches the arrangement area of the air hole spray gun and the gas-liquid two-phase nozzle, discharging the developer solution of the dissolved ink on the board surface of the PCB and in the through holes and/or the blind holes.
8. The method for developing and processing a wiring board according to claim 6, further comprising the steps of: and at least carrying out vibration treatment on the PCB through ultrasonic waves in the process of continuously spraying the developing solution onto the PCB under preset air pressure through the gas-liquid two-phase nozzle.
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| CN202010461597.5A CN111586991B (en) | 2020-05-27 | 2020-05-27 | Circuit board developing processing system and method |
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