CN111586967A - Copper-clad circuit board and preparation method thereof - Google Patents
Copper-clad circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN111586967A CN111586967A CN202010509031.5A CN202010509031A CN111586967A CN 111586967 A CN111586967 A CN 111586967A CN 202010509031 A CN202010509031 A CN 202010509031A CN 111586967 A CN111586967 A CN 111586967A
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- copper
- hydrocarbon resin
- circuit board
- parts
- clad circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Abstract
The invention discloses a copper-clad circuit board which comprises glass cloth and copper foils positioned on one side or two sides of the glass cloth, wherein hydrocarbon resin glue is covered on the surface of the glass cloth, and ceramic powder is uniformly distributed in the hydrocarbon resin glue. The invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps of 1) preparing hydrocarbon resin adhesive; 2) putting the glass cloth into hydrocarbon resin glue for soaking; 3) drying the glass cloth soaked with the hydrocarbon resin adhesive to form a prepreg; 4) cutting the prepreg in the step 3) into a set size; 5) and (3) laminating the prepreg in the step 4) with copper foil with corresponding size, and then performing hot-pressing forming to obtain the copper-clad circuit board. The copper-clad circuit board provided by the invention has the advantages of high strength, high peeling strength, excellent dielectric property and low dielectric loss.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a copper-clad circuit board and a preparation method thereof.
Background
With the high-speed development of electronic information technology, particularly the high frequency and high speed of signal transmission, the quality requirement of signal transmission is higher and higher, the signal transmission speed is required to be as fast as possible, and the signal transmission loss is as small as possible, and the copper clad laminate related to the signal transmission is required to have higher high frequency characteristic, lower dielectric constant and dielectric loss, because the signal transmission speed of the substrate is inversely proportional to the square root of the dielectric constant of the substrate material, the smaller the dielectric constant of the substrate material is, the better the substrate material is; on the other hand, a smaller dielectric loss represents less loss in signal transmission, and thus a material with a smaller dielectric loss can provide better transmission quality.
Generally, the substrate of the circuit board is formed by combining a metal foil and a hydrocarbon resin layer in a pressing manner to improve the dielectric constant and the dielectric loss value, and improve the flame retardancy and the moisture absorption, however, the substrate formed by the metal foil and the hydrocarbon resin layer has insufficient peeling strength and strength, and further the function and the reliability of the electronic product are affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention discloses a copper-clad circuit board and a preparation method thereof.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the embodiment of the invention discloses a copper-clad circuit board, which comprises glass cloth and copper foils positioned on one side or two sides of the glass cloth, wherein hydrocarbon resin glue is covered on the surface of the glass cloth, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
As one preferable scheme of the invention, the hydrocarbon resin glue comprises the following substances in parts by weight: 265 parts of hydrocarbon resin, 20-25 parts of curing agent, 150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent.
Further preferably, the hydrocarbon resin is at least one selected from the group consisting of petroleum resin C5 and petroleum resin C9.
Further preferably, the ceramic powder includes alumina having a particle size of 10 to 50 μm.
Further preferably, the coupling agent includes a silane coupling agent.
Further preferably, the curing agent comprises dicyandiamide.
The embodiment of the invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps:
step 1): preparing hydrocarbon resin glue, namely preparing the following substances in parts by weight: 265 parts of hydrocarbon resin, 20-25 parts of curing agent, 150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2): putting the glass cloth into hydrocarbon resin glue for soaking;
step 3): drying the glass cloth soaked with the hydrocarbon resin adhesive to form a prepreg;
step 4): cutting the prepreg in the step 3) into a set size;
step 5): and (3) laminating the prepreg in the step 4) with copper foil with corresponding size, and then performing hot-pressing forming to obtain the copper-clad circuit board.
As one of the preferable embodiments of the present invention, the hydrocarbon resin is at least one selected from the group consisting of petroleum resin C5 and petroleum resin C9.
As one of the preferable modes of the invention, the ceramic powder comprises alumina with the grain diameter of 10-50 μm.
As one of preferable embodiments of the present invention, the coupling agent includes a silane coupling agent.
As one of the preferable schemes of the invention, the glass cloth soaked with the hydrocarbon resin glue is baked at the temperature of 120 ℃ and 140 ℃ for 200 ℃ and 350 seconds to form the prepreg.
As one of the preferable schemes of the invention, the prepreg and the copper foil with corresponding size are laminated and then hot pressed for 2-3h at the temperature of 180-200 ℃, thereby obtaining the copper-clad circuit board.
Compared with the prior art, the invention has at least the following advantages:
1) the copper-clad circuit board provided by the invention has the advantages that the strength of the copper-clad plate is improved through the ceramic powder;
2) the copper-clad circuit board provided by the invention can ensure that the copper-clad plate has certain toughness through the hydrocarbon resin;
3) the copper-clad circuit board provided by the invention has higher anti-stripping strength, so that the stability is good.
4) The carbon-hydrogen resin in the invention enables the copper-clad plate to have excellent dielectric property and low dielectric loss.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a schematic structural diagram of a copper-clad circuit board according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments and the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.
Example 1:
referring to fig. 1, embodiment 1 of the invention discloses a copper-clad circuit board, which includes a glass cloth 1 and copper foils 2 located on one side or two sides of the glass cloth 1, wherein hydrocarbon resin glue is coated on the surface of the glass cloth 1, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
As one of the preferable schemes of the invention, the hydrocarbon resin glue comprises the following substances in parts by weight: 250 parts of hydrocarbon resin, 20 parts of curing agent, 120 parts of ceramic powder, 0.2 part of coupling agent and 20 parts of solvent.
It is further preferred that the hydrocarbon resin is selected from petroleum resin C5, the ceramic powder comprises alumina having a particle size of 10 μm, the coupling agent is a silane coupling agent such as A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltris (. beta. -methoxyethoxy) silane), and the curing agent is dicyandiamide.
The embodiment 1 of the invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps:
step 1), preparing hydrocarbon resin adhesive, namely preparing the following substances in parts by weight: 250 parts of hydrocarbon resin, 20 parts of curing agent, 120 parts of ceramic powder, 0.2 part of coupling agent and 20 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2), putting the glass cloth 1 into hydrocarbon resin glue for soaking;
step 3), baking the glass cloth 1 soaked with the hydrocarbon resin glue for 200s at the temperature of 120 ℃ so as to form a prepreg;
step 4): cutting the prepreg in the step 3) into a set size;
step 5): and (3) laminating the prepreg in the step 4) with the copper foil 2 with the corresponding size, and then carrying out hot pressing at 180 ℃ for 2h to obtain the copper-clad circuit board.
Example 2:
referring to fig. 1, embodiment 2 of the invention discloses a copper-clad circuit board, which includes a glass cloth 1 and copper foils 2 located on one side or two sides of the glass cloth 1, wherein hydrocarbon resin glue is coated on the surface of the glass cloth 1, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
As one of the preferable schemes of the invention, the hydrocarbon resin glue comprises the following substances in parts by weight: 255 parts of hydrocarbon resin, 22 parts of curing agent, 130 parts of ceramic powder, 0.5 part of coupling agent and 22 parts of solvent.
It is further preferred that the hydrocarbon resin is selected from petroleum resin C5, the ceramic powder comprises alumina having a particle size of 20 μm, the coupling agent is a silane coupling agent such as A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltris (. beta. -methoxyethoxy) silane), and the curing agent is dicyandiamide.
The embodiment 2 of the invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps:
step 1), preparing hydrocarbon resin adhesive, namely preparing the following substances in parts by weight: 255 parts of hydrocarbon resin, 22 parts of curing agent, 130 parts of ceramic powder, 0.5 part of coupling agent and 22 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2), putting the glass cloth 1 into hydrocarbon resin glue for soaking;
step 3), baking the glass cloth 1 soaked with the hydrocarbon resin glue for 250s at the temperature of 125 ℃ to form a prepreg;
step 4), cutting the prepreg in the step 3) into a set size;
and 5) laminating the prepreg in the step 4) with the copper foil 2 with the corresponding size, and then carrying out hot pressing at 185 ℃ for 2h to obtain the copper-clad circuit board.
Example 3:
referring to fig. 1, embodiment 3 of the present invention discloses a copper-clad circuit board, including a glass cloth 1 and copper foils 2 located on one side or both sides of the glass cloth 1, wherein hydrocarbon resin glue is coated on the surface of the glass cloth 1, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
As one of the preferable schemes of the invention, the hydrocarbon resin glue comprises the following substances in parts by weight: 260 parts of hydrocarbon resin, 24 parts of curing agent, 140 parts of ceramic powder, 0.8 part of coupling agent and 23 parts of solvent.
It is further preferred that the hydrocarbon resin is selected from petroleum resin C9, the ceramic powder comprises alumina having a particle size of 30 μm, the coupling agent is a silane coupling agent such as A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltris (. beta. -methoxyethoxy) silane), and the curing agent is dicyandiamide.
The embodiment 3 of the invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps:
step 1), preparing hydrocarbon resin adhesive, namely preparing the following substances in parts by weight: 250 parts of hydrocarbon resin, 22 parts of curing agent, 130 parts of ceramic powder, 0.5 part of coupling agent and 22 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2), putting the glass cloth 1 into hydrocarbon resin glue for soaking;
step 3), baking the glass cloth 1 soaked with the hydrocarbon resin glue for 300s at the temperature of 130 ℃ so as to form a prepreg;
step 4): cutting the prepreg in the step 3) into a set size;
step 5): and (3) laminating the prepreg in the step 4) with the copper foil 2 with the corresponding size, and then carrying out hot pressing at the temperature of 190 ℃ for 2.5h to obtain the copper-clad circuit board.
Example 4:
referring to fig. 1, embodiment 4 of the invention discloses a copper-clad circuit board, which includes a glass cloth 1 and copper foils 2 located on one side or two sides of the glass cloth 1, wherein hydrocarbon resin glue is coated on the surface of the glass cloth 1, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
As one of the preferable schemes of the invention, the hydrocarbon resin glue comprises the following substances in parts by weight: 265 parts of hydrocarbon resin, 25 parts of curing agent, 150 parts of ceramic powder, 1.5 parts of coupling agent and 25 parts of solvent.
Further preferably, the hydrocarbon resin is selected from petroleum resin C5 and petroleum resin C9, the ceramic powder comprises alumina having a particle size of 50 μm, the coupling agent is a silane coupling agent such as A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltris (. beta. -methoxyethoxy) silane), and the curing agent is dicyandiamide.
The embodiment 4 of the invention also discloses a preparation method of the copper-clad circuit board, which comprises the following steps:
step 1), preparing hydrocarbon resin adhesive, namely preparing the following substances in parts by weight: 265 parts of hydrocarbon resin, 25 parts of curing agent, 150 parts of ceramic powder, 1.5 parts of coupling agent and 25 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2), putting the glass cloth 1 into hydrocarbon resin glue for soaking;
step 3), baking the glass cloth 1 soaked with the hydrocarbon resin glue for 350 seconds at the temperature of 140 ℃ so as to form a prepreg;
step 4), cutting the prepreg in the step 3) into a set size;
and 5) laminating the prepreg in the step 4) with the copper foil 2 with the corresponding size, and then carrying out hot pressing at 200 ℃ for 3h to obtain the copper-clad circuit board.
Each index of the copper-clad circuit board provided by the embodiments 1-4 of the invention is qualified through detection, and the detection result is shown in table 1.
TABLE 1
Through the technical scheme, the copper-clad circuit board provided by the embodiment 1-4 of the invention improves the strength of the copper-clad plate through the ceramic powder; the copper-clad circuit board provided by the invention can ensure that the copper-clad plate has certain toughness through the hydrocarbon resin; the copper-clad circuit board provided by the invention has higher anti-stripping strength, so that the stability is good; the carbon-hydrogen resin in the invention enables the copper-clad plate to have excellent dielectric property and low dielectric loss.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A copper-clad circuit board is characterized in that: the glass cloth comprises glass cloth and copper foils located on one side or two sides of the glass cloth, hydrocarbon resin glue covers the surface of the glass cloth, and ceramic powder is uniformly distributed in the hydrocarbon resin glue.
2. The copper-clad circuit board according to claim 1, characterized in that: the hydrocarbon resin glue comprises the following substances in parts by weight: 265 parts of hydrocarbon resin, 20-25 parts of curing agent, 150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent.
3. The copper-clad circuit board according to claim 2, characterized in that: the hydrocarbon resin is at least one selected from petroleum resin C5 and petroleum resin C9.
4. The copper-clad circuit board according to claim 2, characterized in that: the ceramic powder comprises alumina with the grain diameter of 10-50 mu m.
5. The copper-clad circuit board according to claim 2, characterized in that: the coupling agent includes a silane coupling agent.
6. The copper-clad circuit board according to claim 2, characterized in that: the curing agent includes dicyandiamide.
7. A preparation method of a copper-clad circuit board is characterized by comprising the following steps: the method comprises the following steps:
step 1): preparing hydrocarbon resin glue, namely preparing the following substances in parts by weight: 265 parts of hydrocarbon resin, 20-25 parts of curing agent, 150 parts of ceramic powder, 0.2-1.5 parts of coupling agent and 20-25 parts of solvent are stirred and mixed to prepare hydrocarbon resin adhesive;
step 2): putting the glass cloth into hydrocarbon resin glue for soaking;
step 3): drying the glass cloth soaked with the hydrocarbon resin adhesive to form a prepreg;
step 4): cutting the prepreg in the step 3) into a set size;
step 5): and (3) laminating the prepreg in the step 4) with copper foil with corresponding size, and then performing hot-pressing forming to obtain the copper-clad circuit board.
8. The method for manufacturing a copper-clad circuit board according to claim 7, characterized in that: the hydrocarbon resin is at least one of petroleum resin C5 and petroleum resin C9; and/or the coupling agent is a silane coupling agent.
9. The method for manufacturing a copper-clad circuit board according to claim 7, characterized in that: the ceramic powder comprises alumina with the grain diameter of 10-50 mu m.
10. The method for manufacturing a copper-clad circuit board according to claim 7, characterized in that: baking the glass cloth soaked with the hydrocarbon resin adhesive at the temperature of 120-140 ℃ for 200-350 seconds to form a prepreg; and/or laminating the prepreg and the copper foil with the corresponding size, and then hot-pressing at the temperature of 180-200 ℃ for 2-3h to obtain the copper-clad circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509031.5A CN111586967A (en) | 2020-06-07 | 2020-06-07 | Copper-clad circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509031.5A CN111586967A (en) | 2020-06-07 | 2020-06-07 | Copper-clad circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN111586967A true CN111586967A (en) | 2020-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010509031.5A Withdrawn CN111586967A (en) | 2020-06-07 | 2020-06-07 | Copper-clad circuit board and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113307541A (en) * | 2021-06-03 | 2021-08-27 | 中国振华集团云科电子有限公司 | Hydrocarbon resin ceramic bonding sheet and batch production process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08309918A (en) * | 1995-05-22 | 1996-11-26 | Nippon Denkai Kk | Copper clad laminated sheet, printed circuit board using the same and production of them |
| CN105440645A (en) * | 2014-07-10 | 2016-03-30 | 中山台光电子材料有限公司 | Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof |
| CN109233543A (en) * | 2017-05-03 | 2019-01-18 | 中山台光电子材料有限公司 | Resin combination and the article being made from it |
| CN110446335A (en) * | 2019-07-22 | 2019-11-12 | 沈振春 | A kind of compound layer circuit board and preparation method thereof |
| CN111187478A (en) * | 2018-11-15 | 2020-05-22 | 上海安缔诺科技有限公司 | Composite material and sheet for microwave circuit substrate, microwave circuit substrate and preparation method of microwave circuit substrate |
-
2020
- 2020-06-07 CN CN202010509031.5A patent/CN111586967A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08309918A (en) * | 1995-05-22 | 1996-11-26 | Nippon Denkai Kk | Copper clad laminated sheet, printed circuit board using the same and production of them |
| CN105440645A (en) * | 2014-07-10 | 2016-03-30 | 中山台光电子材料有限公司 | Phosphorus-containing flame retardant low-dielectric resin composition and preparation method and application thereof |
| CN109233543A (en) * | 2017-05-03 | 2019-01-18 | 中山台光电子材料有限公司 | Resin combination and the article being made from it |
| CN111187478A (en) * | 2018-11-15 | 2020-05-22 | 上海安缔诺科技有限公司 | Composite material and sheet for microwave circuit substrate, microwave circuit substrate and preparation method of microwave circuit substrate |
| CN110446335A (en) * | 2019-07-22 | 2019-11-12 | 沈振春 | A kind of compound layer circuit board and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113307541A (en) * | 2021-06-03 | 2021-08-27 | 中国振华集团云科电子有限公司 | Hydrocarbon resin ceramic bonding sheet and batch production process thereof |
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Application publication date: 20200825 |
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