CN111585136B

CN111585136B - Electronic connector encapsulating method based on non-rigid material mold

Info

Publication number: CN111585136B
Application number: CN202010608089.5A
Authority: CN
Inventors: 袁翠苹; 安华; 徐警卫; 张帅; 赵琳; 贺彩霞
Original assignee: CETC 54 Research Institute
Current assignee: CETC 54 Research Institute
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2021-06-04
Anticipated expiration: 2040-06-30
Also published as: CN111585136A

Abstract

The invention discloses an electronic connector encapsulating method based on a non-rigid material mold, and belongs to the technical field of electronic connector encapsulation. The method designs a non-rigid material encapsulating mold, and encapsulates the electronic connector through the processes of cleaning, leaking stoppage, mold assembly, glue preparation, defoaming, encapsulating, curing, demolding, maintenance and the like. The non-rigid material encapsulating mold is made of two adhesive tapes, namely a glass fiber cloth adhesive tape and a Teflon coating adhesive tape, is simple to manufacture and low in manufacturing cost, and realizes quick response of manufacturing. Compared with the traditional rigid material mold, the encapsulating mold has better mold release performance, lower manufacturing cost and wider applicability.

Description

Electronic connector encapsulating method based on non-rigid material mold

Technical Field

The invention relates to the technical field of electronic connector encapsulation, in particular to an electronic connector encapsulation method based on a non-rigid material mold.

Background

When the electronic connector has the requirement of waterproof or vibration resistance, the electronic connector can be encapsulated. At present, most of encapsulation molds are made of rigid materials. However, as the variety of electronic connectors increases, the problems of long processing cycle of rigid material mold, high manufacturing cost and the like become more and more prominent. For example, for different types of electronic connectors, an aluminum alloy material mold and a polytetrafluoroethylene material mold, which are commonly used by enterprises, are required to design a mold potting cavity according to the size of a part of the electronic connector to be potted and the space for releasing the stress of a lead every time. In addition, the potting mold of the rigid material generally employs a cutting process, which makes the manufacturing cost high and makes it difficult to achieve a quick response from the development stage to the production stage. On the other hand, after the metal material is used for manufacturing the encapsulating mold, the procedures of trimming the mold, coating silicone grease on the inner cavity of the mold and the like are added in the encapsulating process, and the mold is more complicated to clamp, so that the processing period is prolonged, and the production efficiency is lower.

Disclosure of Invention

The invention aims to solve the problems in the prior art and provides an electronic connector potting method based on a non-rigid material mold, which has the rapid response capability from a development stage to a production stage, can reduce the manufacturing cost and improve the production efficiency.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

an electronic connector encapsulating method based on a non-rigid material mold comprises the following steps:

step one, gluing a Teflon coating adhesive tape and a glass fiber cloth adhesive tape to prepare a non-rigid encapsulation mold tape; the width of the glass fiber cloth adhesive tape is larger than that of the Teflon coating adhesive tape, the Teflon coating adhesive tape and the glass fiber cloth adhesive tape are aligned on one side, and the glass fiber cloth adhesive tape which is widened on the other side forms an adhesive connecting part;

wiping off dirt on the surface of the encapsulated part of the electronic connector and wiping the encapsulated part dry;

winding the encapsulation mold belt along the periphery of the electronic connector, adhering the adhesive connecting part of the encapsulation mold belt to the periphery of the electronic connector, and taking the area surrounded by the Teflon coating adhesive tape part of the encapsulation mold belt as the encapsulated part of the electronic connector;

preparing glue solution by adopting an organic silicon material, and then placing the prepared glue solution in a vacuum box for defoaming;

step five, pouring the defoamed glue solution into an area surrounded by the Teflon coating glue solution part to realize the potting of the electronic connector;

fixing the encapsulated electronic connector on a clean workbench, and waiting for the glue solution to be cured;

step seven, demolding the electronic connector from the encapsulating mold belt after the glue solution is cured;

step eight, inspecting the encapsulating position of the electronic connector after demolding, cutting off the encapsulating material if the phenomenon of glue leakage, air bubbles or degumming is found, cleaning, and encapsulating again according to the step three to the step eight.

Further, the glue solution is prepared from a base paste and a vulcanizing agent.

Further, the glue solution is poured in the fifth step in a specific manner that a glue gun or a glue dispenser is adopted to inject the glue solution into the area surrounded by the teflon coating glue tape part.

Furthermore, in the encapsulating mold belt, the length of the Teflon coating adhesive tape is 2 mm-3 mm longer than the peripheral circumference of the electronic connector.

Further, the potting mold tape is wound at least 2 times along the periphery of the electronic connector.

An electronic connector encapsulating method based on a non-rigid material mold is applied to a non-sealed electronic connector and comprises the following steps:

preparing glue solution by adopting an organic silicon material, then placing the prepared glue solution in a vacuum box for defoaming, and plugging the gap at the position to be encapsulated by using silicon rubber;

Compared with the prior art, the invention has the beneficial effects that:

1. demolding is superior to rigid material molds. In the prior art, the surface of a metal material die such as aluminum alloy and the like is easy to bond, the demoulding is inconvenient, and the inner cavity of the die needs to be coated with a demoulding agent such as silicone grease and the like, so that the encapsulating process is increased; although the polytetrafluoroethylene material is a material which is not easy to be bonded, the bonding force is still strong when the polytetrafluoroethylene material is bonded in a large area. The mold release performance of the non-rigid encapsulating mold designed by the invention is far better than that of molds made of aluminum alloy and polytetrafluoroethylene materials, and the mold release agent does not need to be coated in the mold in advance.

2. The manufacturing cost is low. In the prior art, a rigid material encapsulation mold is usually machined, the manufacturing is complex, the manufacturing cost of the encapsulation mold is increased, and the electronic connector is updated and replaced quickly, so that a plurality of rigid material molds designed and manufactured can be eliminated quickly, and waste is caused. The non-rigid encapsulating mold designed by the invention is a disposable mold, is simple to manufacture, has low material cost, and improves enterprise profits to a certain extent.

3. A fast response of the manufacturing is achieved. The encapsulating method of the electronic connector based on the non-rigid material mold reduces the procedures of trimming the mold, coating silicone grease on the inner cavity of the mold and the like, shortens the processing period, is simple and quick to manufacture, and improves the production efficiency of enterprises.

4. The application range is wide. With the increasing variety of electronic connectors, for different types of electronic connectors, the rigid material mold needs to design a mold potting cavity according to the size of a part to be potted of the electronic connector and the space for releasing the stress of the lead every time. The non-rigid encapsulating mold disclosed by the invention is wide in application range and can be suitable for encapsulating any type of electronic connector.

Drawings

Fig. 1 is a flow chart of an electronic connector potting method in an embodiment of the invention.

Fig. 2 is a reference diagram of a non-rigid material mold in an embodiment of the invention.

Detailed Description

The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, an electronic connector potting method based on a non-rigid material mold includes the following steps:

the method comprises the following steps: and designing a potting mold of a non-rigid material. The non-rigid material mould is made of Teflon coating adhesive tape and glass fiber cloth adhesive tape.

The preparation method comprises the following steps: and (3) oppositely sticking the glass fiber cloth adhesive tape and the Teflon coating adhesive tape, wherein the Teflon coating adhesive tape is directly contacted with the glue solution. When the two tapes are adhered to each other, the Teflon coating tape and the glass fiber cloth tape should ensure that one ends of the two tapes are aligned. The width of the glass fiber cloth adhesive tape is higher than that of the Teflon coating adhesive tape, and the difference between the two is determined according to the actual situation. The length of the Teflon coating adhesive tape is 2 mm-3 mm longer than the peripheral perimeter of the electronic connector.

Step two: and (4) cleaning. Wiping off dirt such as grease on the surface of the encapsulated part of the electronic connector, and immediately wiping off the dirt;

step three: and (6) plugging. For the non-sealed electronic connector, the silicon rubber is carefully coated at the gap for plugging. This step can be omitted for the sealed electronic connector;

step four: and (6) installing a mold. The mold is wrapped around the periphery of the electronic connector. The non-rigid material mold was wrapped 2 turns around the electronic connector periphery. When the non-rigid material mold is wound, the wound mold and the electronic connector are tightly attached to each other to the greatest extent, the shape of the wound mold is round and smooth, and the inner wall of the wound mold is flat;

step five: and (5) preparing glue. Preparing an organic silicon material, wherein the two-component organic silicon material is prepared by matching two parts of materials, namely base paste and a vulcanizing agent;

step six: and (4) defoaming. Placing the glue solution prepared in the fifth step into a vacuum box for defoaming immediately;

step seven: and (6) encapsulating. And slowly pouring the gel liquid after the defoaming in the step six into a disposable injector inclined at about 45 degrees, mounting the injector on a gel gun or a dispenser, and filling the gel liquid into a mold. For larger molds, direct pouring with a beaker is allowed;

step eight: and (5) curing. And fixing the workpiece subjected to the encapsulation in the step seven on a clean workbench, and curing the workpiece. In the glue solution curing process, the workpiece is not allowed to move, incline or vibrate;

step nine: and (6) demolding. The state of the product encapsulation part is not allowed to be damaged during demoulding;

step ten: and (7) maintenance. And after the mould is dismantled or inspected, cutting off the potting material when the phenomena of glue leakage, air bubbles and degumming are found, cleaning, and then re-potting by using the same material.

The method adopts the non-rigid material encapsulating mold made of the Teflon coating adhesive tape and the glass fiber cloth adhesive tape to complete the encapsulating process of the electronic connector, and has the characteristics of low cost, simple operation and wide application range.

The potting of the low frequency socket will be described in more detail below as an example.

Referring to fig. 2, a teflon coating tape 1, a glass cloth tape 2, and a socket base 3 are included. And a non-rigid material encapsulating mold made of a Teflon coating adhesive tape and a glass fiber cloth adhesive tape is adopted, so that the encapsulation of the low-frequency socket is completed. The method comprises the following steps:

The preparation method comprises the following steps: and (3) oppositely sticking the glass fiber cloth adhesive tape and the Teflon coating adhesive tape, wherein the Teflon coating adhesive tape is directly contacted with the glue solution. When the two tapes are adhered to each other, the Teflon coating tape and the glass fiber cloth tape should ensure that one ends of the two tapes are aligned. And the width of the glass fiber cloth adhesive tape is larger than that of the Teflon coating adhesive tape, and the difference value of the two is the height of the socket base. The length of the Teflon coating adhesive tape is 2 mm-3 mm longer than the peripheral perimeter of the socket.

Step two: and (4) cleaning. And (3) wiping dirt such as grease, dust and the like on the surface of the encapsulated part (comprising a metal outer frame at the tail part of the socket, a welding spot and a lead) by using cotton yarn or absorbent cotton cloth dipped in aviation washing gasoline, immediately wiping the surface by using clean and dry cotton yarn or absorbent cotton cloth, repeating the steps until no dirt exists on the clean and dry cotton yarn or absorbent cotton cloth, and airing for 10-20 min.

Step three: and (6) plugging. For the non-sealing socket, the type 704 silicon rubber is carefully coated on the gap for plugging. The adhesive must not contaminate welding spot and wire when plugging. This step can be omitted for the sealed socket.

Step four: and (6) installing a mold. The mold is wrapped around the socket periphery. The non-rigid material mold was wrapped 2 turns around the socket periphery. When the non-rigid material mold is wound, the wound mold and the socket are tightly attached to each other to the greatest extent, the shape of the wound mold is round, and the inner wall of the wound mold is smooth.

Step five: and (5) preparing glue. An organic silicon sealant is used for encapsulation. The weight of the base paste and the weight of the vulcanizing agent are 100: 5.

Step six: and (4) defoaming. And D, immediately placing the glue solution prepared in the step five into a vacuum box for deaeration, wherein the vacuum degree is limited by that the glue solution in the beaker does not overflow, and the air suction and release operation can be repeatedly carried out until no bubbles exist basically.

Step seven: and (6) encapsulating. And slowly pouring the gel liquid after the defoaming in the step six into a disposable injector inclined at about 45 degrees, mounting the injector on a gel gun or a dispenser, and filling the gel liquid into a mold. For larger molds, direct pouring with a beaker is allowed. In the pouring process, the glue solution should be slowly poured along the lead, so that air bubbles cannot be brought in due to too fast pouring. The thickness of the glue solution encapsulation is determined according to the internal size of the connector, and generally the glue solution encapsulation can completely cover 3-5 mm of welding points.

step nine: and (6) demolding. The state of the product pouring and sealing part is not allowed to be damaged during demoulding. After demolding, if there is excess potting material, the excess potting material is removed with a blade. And (3) dipping the filled and sealed workpiece and the silicon grease around the filled and sealed workpiece by using gauze to wipe clean.

In a word, the non-rigid material encapsulating mold is made of two adhesive tapes, namely a glass fiber cloth adhesive tape and a Teflon coating adhesive tape, is simple to manufacture and low in manufacturing cost, and realizes quick response of manufacturing. Compared with the traditional rigid material mold, the encapsulating mold has better mold release performance, lower manufacturing cost and wider applicability.

The above description is only a few embodiments of the present invention, but the present invention is not limited to these embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit and principle of the present invention, and the equivalents or substitutions are included in the scope of the present invention as defined by the appended claims.

Claims

1. An electronic connector encapsulating method based on a non-rigid material mold is characterized by comprising the following steps:

2. The method for potting electronic connectors based on a non-rigid material mold as claimed in claim 1, wherein the glue is formulated from a base paste and a vulcanizing agent.

3. The method for potting electronic connectors based on non-rigid material mold according to claim 1, wherein the glue solution is poured in the fifth step by injecting the glue solution into the area surrounded by the teflon coating glue tape part by using a glue gun or a glue dispenser.

4. The method for potting electronic connectors based on a non-rigid material mold as claimed in claim 1, wherein the length of the teflon coated tape in the potting mold strip is 2mm to 3mm longer than the peripheral perimeter of the electronic connector.

5. The method of claim 1, wherein the potting mold strip is wrapped at least 2 times around the periphery of the electronic connector.

6. The electronic connector encapsulating method based on the non-rigid material mold is characterized by being applied to a non-sealing type electronic connector and comprising the following steps of: