CN111584412A - Conveying tray and processing method of processed object - Google Patents
Conveying tray and processing method of processed object Download PDFInfo
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- CN111584412A CN111584412A CN202010095644.9A CN202010095644A CN111584412A CN 111584412 A CN111584412 A CN 111584412A CN 202010095644 A CN202010095644 A CN 202010095644A CN 111584412 A CN111584412 A CN 111584412A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packaging Frangible Articles (AREA)
- Dicing (AREA)
Abstract
Provided are a conveyance tray and a method for processing a workpiece, wherein information can be written on a recording medium when the conveyance tray is of a specific type. A transfer tray (1) stores and transfers a plurality of device chips (204). A conveyance tray (1) is provided with: a tray main body (2) having a device support section (6) having a front surface (6-1) that supports a plurality of device chips (204), and a frame body (7) formed around the outer periphery of the device support section (6); a recording medium (4) which is provided in the tray main body (2) and which is capable of writing or reading information by wireless communication; and an identification mark (5) for identifying whether the transport tray (1) is of a type that enables writing of information to the recording medium (4).
Description
Technical Field
The present invention relates to a conveyance tray for storing processed chips and a method of processing a workpiece.
Background
In the semiconductor industry, for example, there is a step of storing a plurality of chips divided by a cutting device in one tray in order to transfer the chips to a next step (see, for example, patent document 1). In this case, in order to transfer information during processing to the next step, a frame serving as a conveying unit having an RFID (Radio Frequency identification) tag has been developed (see, for example, patent document 2).
Patent document 1: japanese laid-open patent publication No. 2000-095291
Patent document 2: japanese laid-open patent publication No. 2008-040810
However, when the provider of the processing apparatus recommends the use of a specific transport tray, it is desirable to allow writing of information such as processing information to the recording medium and manage the quality of the divided chips only when the recommended transport tray is used. As described above, in the transport unit disclosed in patent document 2, it is desirable to write information to the recording medium when the transport unit is of a specific type.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a transport tray and a processing method for a workpiece, which can write information to a recording medium when the transport tray is of a specific type.
In order to solve the above problems and achieve the object, a transfer tray according to the present invention is a transfer tray for storing and transferring a plurality of chips, the transfer tray including: a tray main body having a device support portion having a front surface for supporting a plurality of chips, and a frame body formed around an outer periphery of the device support portion; a recording medium provided in the tray main body and capable of writing or reading information by wireless communication; and an identification mark for identifying whether the transport tray is of a type that enables writing to the recording medium.
In the above-described transport tray, the transport tray may have an adhesive layer that is attached to a front surface of the device support portion of the tray main body and has an adhesive force.
The processing method of the object to be processed according to the present invention is a processing method of a processed object in which chips are stored in the conveyance tray, the processing method including the steps of: a processing step of processing a workpiece to form a plurality of chips; a storage step of storing the plurality of chips in the conveyance tray; a determination step of determining whether or not the conveyance tray is of a type that enables writing to the recording medium by imaging the identification mark by an imaging means; and a recording step of recording information in the processing step in the recording medium when it is determined that the type of the conveyance tray is a writable type.
In the method of processing the workpiece, the transfer tray may include an adhesive layer that is attached to a front surface of the device support portion of the tray main body and has an adhesive force.
The invention of the application has the following effects: when the conveyance tray is of a specific type, information can be written on the recording medium.
Drawings
Fig. 1 is a perspective view showing a configuration example of a conveyance tray according to embodiment 1.
Fig. 2 is a perspective view showing a configuration example of a processing apparatus using the conveyance tray according to embodiment 1.
Fig. 3 is a perspective view showing an example of a workpiece to be processed in the processing apparatus shown in fig. 2.
Fig. 4 is a cross-sectional view showing a state in which the transfer tray shown in fig. 1 stores device chips.
Fig. 5 is a flowchart illustrating a flow of a method of processing a workpiece according to embodiment 1.
Fig. 6 is a view schematically showing, in partial cross section, a determination step and a recording step of the method of processing the workpiece shown in fig. 5.
Description of the reference symbols
1: a carrying tray; 2: a tray main body; 3: an adhesive layer; 4: a recording medium; 5: identifying the mark; 6: a device support portion; 6-1: a front side; 7: a frame body; 120: a tray shooting unit (shooting unit); 200: a workpiece; 204: a device chip (chip); ST 1: a processing step; ST 2: a storage step; ST 3: a step of discrimination; ST 4: and (5) recording.
Detailed Description
A mode (embodiment) for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art and substantially the same. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.
[ embodiment 1]
A conveying tray and a processing method of a workpiece according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a conveyance tray according to embodiment 1. Fig. 2 is a perspective view showing a configuration example of a processing apparatus using the conveyance tray according to embodiment 1. Fig. 3 is a perspective view showing an example of a workpiece to be processed in the processing apparatus shown in fig. 2. Fig. 4 is a cross-sectional view showing a state in which the transfer tray shown in fig. 1 stores device chips. Fig. 5 is a flowchart illustrating a flow of a method of processing a workpiece according to embodiment 1. Fig. 6 is a view schematically showing, in partial cross section, a determination step and a recording step of the method of processing the workpiece shown in fig. 5.
The conveyance tray 1 shown in fig. 1 of embodiment 1 is used in the processing apparatus 210 shown in fig. 2. The machining device 210 shown in fig. 2 is a device for cutting the workpiece 200 shown in fig. 3. As shown in fig. 3, a workpiece 200 to be processed in a processing apparatus 210 according to embodiment 1 is formed in a flat rectangular plate shape in plan view. In embodiment 1, as shown in fig. 3, the workpiece 200 is a so-called Package substrate configured by sealing a plurality of semiconductor chips with a resin, such as a CSP (Chip Size Package), a QFN (Quad flat no-lead Package), or the like.
The electrodes of the semiconductor chips are connected to the bumps 202, respectively. A plurality of lines to divide 203 are formed in a lattice shape on the front surface of the object 200, and semiconductor chips are mounted in each region divided by the lines to divide 203. The object 200 configured as described above is divided into the device chips (corresponding to the chips described in the claims) 204 by cutting the lines to be divided 203 with the processing apparatus 210 shown in fig. 2.
Next, the present specification describes a processing apparatus 210 that divides the workpiece 200 into device chips 204. The machining device 210 is a device that performs cutting along the plurality of lines to divide 203 while holding the workpiece 200 on the holding table 10. In embodiment 1, the processing apparatus 210 is an apparatus that holds the workpiece 200 to which the dicing tape is not attached on the holding table 10, performs so-called full dicing on the workpiece 200, and divides the workpiece into the device chips 204.
As shown in fig. 2, the processing device 210 includes: a holding table 10 for sucking and holding the workpiece 200 by a holding surface 11; a cutting unit 20 that cuts and divides the line 203 to be divided of the object 200 sucked and held by the holding table 10 by the cutting tool 21; and a control unit 100.
The holding table 10 has a rectangular holding surface 11 for holding the workpiece 200. The holding surface 11 is provided with: a suction port, not shown, for sucking the workpiece 200 and the device chip 204; and a relief groove, not shown, for the cutting insert 21 to be relieved. The suction port is provided at a position overlapping the device chip 204 and opens at the holding surface 11. The relief groove is provided at a position corresponding to the line 203 and is formed recessed from the holding surface 11.
The suction port of the holding table 10 is connected to a vacuum suction source, not shown, and the workpiece 200 is sucked and held on the holding surface 11 by the suction port being sucked by the vacuum suction source. The holding table 10 is provided to be movable in the X-axis direction by a not-shown processing feeding unit and rotatable about an axis parallel to the Z-axis direction by a not-shown rotation driving source.
The cutting unit 20 cuts the workpiece 200. The cutting unit 20 has a spindle, not shown, to which a cutting tool 21 is attached, and the cutting tool 21 cuts the workpiece 200 held by the holding table 10.
The cutting tool 21 is an extremely thin cutting abrasive having a substantially ring shape. The workpiece 200 is cut by rotating the cutting tool 21 by the spindle. The spindle is housed in the spindle case 22. The spindle of the cutting unit 20 and the axis of the cutting tool 21 are set parallel to the Y-axis direction.
The cutting unit 20 is provided to be movable in the Y-axis direction by a not-shown split feed unit and movable in the Z-axis direction by a not-shown cutting feed unit with respect to the workpiece 200 held by the holding table 10. The cutting unit 20 can position the cutting tool 21 at an arbitrary position on the holding surface 11 of the holding table 10 by dividing the feeding unit and the cutting-in feeding unit. The cutting unit 20 moves in the Y-axis direction and the Z-axis direction by the dividing and feeding unit and the cutting and feeding unit, thereby cutting the line to divide 203 of the object 200 held by the holding table 10 moved in the X-axis direction by the processing and feeding unit to divide the object 200 into the plurality of device chips 204.
The processing device 210 further includes: a cassette 30 that stores a plurality of workpieces 200 before processing; a carrying-out unit 40 for taking out the workpiece 200 from the magazine 30; a sealing and conveying unit 50 for conveying the pre-processed object 200 taken out of the cassette 30 to the holding table 10; an imaging unit 60 that images the workpiece 200 before processing to acquire an image for alignment; a cleaning unit 70 for cleaning the lower surface of each of the divided device chips 204; a drying unit 80 that dries the device chip 204 cleaned by the cleaning unit 70; a transfer tray placing unit 90 on which the transfer tray 1 shown in fig. 1 is placed, the transfer tray 1 storing the device chips 204 obtained by dividing the device chips; a conveying unit 110 that is a conveying unit; and a tray photographing unit 120, which is a photographing unit.
The cassette 30 stores a plurality of workpieces 200. The cassette 30 overlaps a plurality of workpieces 200 at intervals in the Z-axis direction. The cartridge 30 has an opening 31 through which the workpiece 200 can be inserted and removed. The cassette 30 is provided to be movable up and down in the Z-axis direction by a cassette lifter not shown.
The carrying-out unit 40 includes: a carrying-out unit 41 that takes out one sheet of the workpiece 200 before processing from the cassette 30; and a pair of rails 42 on which the workpiece 200 taken out from the cassette 30 is temporarily placed. The sealing and conveying unit 50 sucks and holds the workpiece 200 on the pair of rails 42, conveys the sucked and held workpiece 200 to the holding table 10, and places the workpiece on the holding surface 11 of the holding table 10. The imaging unit 60 outputs the imaged image to the control unit 100. In embodiment 1, the imaging unit 60 is attached to the package conveyance unit 50. The cleaning unit 70 is provided between the holding table 10 and the conveyance tray placement unit 90. The drying unit 80 is disposed between the cleaning unit 70 and the conveyance tray placement unit 90.
The conveyance tray placing section 90 places the conveyance tray 1 on the upper surface 91. In embodiment 1, two conveyance tray placement units 90 are provided with an interval therebetween in the Y axis direction. The upper surface 91 of the conveyance tray placing section 90 is formed flat in the horizontal direction and is formed larger than the planar shape of the workpiece 200 and the conveyance tray 1. The conveyance tray placing unit 90 may be configured to stack and store a plurality of conveyance trays 1, and the conveyance tray placing unit 90 may further include an elevator unit that is movable up and down in order to place the conveyance trays 1 therebelow. In order to take out the stacked plurality of conveyance trays 1, the apparatus may have an opening/closing door connected to the conveyance tray placement unit 90 on the front surface thereof.
The transfer unit 110 transfers the plurality of device chips 204, which are the cut workpiece 200, from the holding table 10 to the transfer tray 1 placed on the upper surface 91 of the transfer tray placement unit 90. As shown in fig. 1, the conveyance unit 110 includes a 1 st conveyance unit 111, a 2 nd conveyance unit 112, and a 3 rd conveyance unit 113.
The 1 st conveying unit 111 conveys the plurality of device chips 204 as the cut workpiece 200 from the holding table 10 to the cleaning unit 70. The 2 nd transfer unit 112 transfers the plurality of device chips 204, which are the cleaned workpiece 200, from the cleaning unit 70 to the drying unit 80. The 3 rd conveying unit 113 conveys the plurality of device chips 204, which are the dried workpieces 200, from the drying unit 80 to the conveying tray 1 placed on the upper surface 91 of one of the conveying tray placing parts 90.
The tray imaging unit 120 images the identification mark (shown in fig. 4) 5 of the conveyance tray 1 placed on the upper surface 91 of the conveyance tray placing part 90 after the object 200 is stored, and acquires an image of the identification mark 5. The tray photographing unit 120 outputs the acquired image to the control unit 100. In embodiment 1, the tray imaging unit 120 is attached to the 3 rd conveying unit 113.
The transfer tray 1 placed on the upper surface 91 of the transfer tray placing section 90 is used for storing and transferring a plurality of device chips 204 formed by dividing the object 200 along the line to divide 203. As shown in fig. 1 and 4, the conveyance tray 1 has a tray main body 2, an adhesive layer 3, a recording medium 4 (shown only in fig. 4), and an identification mark 5 (shown only in fig. 4).
The tray main body 2 has: a device support portion 6 having a flat rectangular shape in plan view and including a recess having a size capable of accommodating the workpiece 200; and a frame 7 formed around the outer periphery of the device support portion 6.
The device support portion 6 is formed of a concave portion recessed from the upper surface of the conveyance tray 1, and is formed in a rectangular shape larger than the planar shape of the workpiece 200 in embodiment 1. The device support portion 6 has a front surface 6-1 at the bottom thereof for supporting the plurality of device chips 204 with the adhesive layer 3 interposed therebetween. The front surface 6-1 is formed flat in the horizontal direction. The front surface 6-1 of the device support portion 6 is set so as to be able to house all the device chips 204 singulated from the workpiece 200 at a time.
The frame 7 is formed around the outer periphery of the front surface 6-1 of the device support portion 6. The adhesive layer 3 is provided on the front surface 6-1 of the device support portion 6 of the tray main body 2 and attached to the front surface 6-1 of the device support portion 6. The adhesive layer 3 is exposed on the device support portion 6.
The adhesive layer 3 has an adhesive force (i.e., a viscous force) for adhering the plurality of device chips 204. In embodiment 1, the adhesive layer 3 is disposed on the entire front surface 6-1 of the device support portion 6, and is formed to have a constant thickness. The adhesive layer 3 may be formed of, for example, a heat-sensitive adhesive sheet Intelimer (registered trademark) tape manufactured by NITTA corporation.
The recording medium 4 is provided in the tray main body 2. In embodiment 1, as shown in fig. 4, the recording medium 4 is embedded in the tray main body 2. The recording medium 4 is capable of writing information from the outside by wireless communication, and is capable of recording information written from the outside by wireless communication. The recording medium 4 can read information recorded from the outside by wireless communication. In embodiment 1, the recording medium 4 is an RFID (Radio Frequency identification) tag, but the present invention is not limited to the RFID tag.
The identification mark 5 is used to identify whether or not the transport tray 1 is of a type that enables writing of information to the recording medium 4. In embodiment 1, the identification mark 5 is provided on the housing 7. In embodiment 1, the identification mark 5 is a mark indicating a manufacturing company of the machining device 210, and for example, a registered trademark indicating the manufacturing company of the machining device 210 is used. The identification mark 5 may be formed by printing a mark, a number, or characters, or may be formed by an uneven portion formed on the housing 7 or the like, a notch formed on the housing 7 or the like, or the like.
As shown in fig. 4, the transfer tray 1 configured as described above stores a plurality of device chips 204 obtained by cutting the workpiece 200 into pieces, and attaches the device chips to the adhesive layer 3 at one time. Since the transfer tray 1 that accommodates the plurality of device chips 204 in this manner attaches each device chip 204 to the adhesive layer 3, it is possible to suppress the device chip 204 accommodated in the device support portion 6 from moving and coming into contact with another device chip 204 during transfer, and thus, the device chip 204 from being chipped at the outer periphery of the device chip 204 or from being broken by the device chip 204 flying out of the device support portion 6. In embodiment 1, the transfer tray 1 does not have a partition portion for partitioning the device chips 204 from each other on the device support portion 6.
The control unit 100 controls each component of the machining device 210 to cause the machining device 210 to perform a machining operation on the workpiece 200. As shown in fig. 2, control section 100 includes storage section 101, determination section 102, and writing section 103.
The storage unit 101 stores the image of the identification mark 5. In embodiment 1, the storage unit 101 stores the image of the identification mark 5 of the conveyance tray 1 captured by the tray capturing unit 120. In embodiment 1, the storage means 101 stores processing content information (corresponding to information in processing step ST1 described later) indicating conditions under which the processing device 210 processes the workpiece 200 and the device chip 204.
The determination unit 102 determines whether or not the conveyance tray 1 placed on the conveyance tray placement unit 90 and imaged by the tray imaging unit 120 is of a type that enables writing of information to the recording medium 4. In embodiment 1, when the image of the identification mark 5 of the transport tray 1 placed on the transport tray placement unit 90 captured by the tray imaging unit 120 matches the image of the identification mark 5 stored in the storage unit, the determination unit 102 determines that the transport tray 1 placed on the transport tray placement unit 90 is of a type in which information can be written to the recording medium 4. In embodiment 1, the image of the identification mark 5 of the transport tray 1 placed on the transport tray placing unit 90 captured by the tray capturing unit 120 is normalized and correlated with the image of the identification mark 5 stored in the storage unit, and when the correlation value is equal to or greater than a predetermined value set in advance, the determination unit 102 determines that the images match, and determines that the transport tray 1 placed on the transport tray placing unit 90 is of a type in which information can be written on the recording medium 4.
In embodiment 1, the image of the identification mark 5 of the transport tray 1 placed on the transport tray placing unit 90 captured by the tray capturing unit 120 and the image of the identification mark 5 stored in the storage unit are normalized and correlated, and when the correlation value is smaller than a predetermined value set in advance, the determination unit 102 determines that the images do not match, and determines that the transport tray 1 placed on the transport tray placing unit 90 is not of a type in which information can be written to the recording medium 4.
When the determination unit 102 determines that the transport tray 1 placed on the transport tray placement unit 90 is of a type that enables information to be written to the recording medium 4, the writing unit 103 reads out, from the storage unit 101, processing content information indicating conditions for processing the device chip 204 placed on the transport tray 1 of the transport tray placement unit 90, and outputs the processing content information to the recording unit 104 connected to the control unit 100.
The recording unit 104 writes the processing content information from the writing unit 103 to the recording medium 4 of the conveyance tray 1 placed on the conveyance tray placing unit 90. The recording unit 104 is configured by a known RFID tag reader, for example.
The control unit 100 is connected to a display device 105 including a liquid crystal display device or the like for displaying a state of a machining operation, an image, and the like, and an input device 106 used by an operator for registering machining content information and the like. The input device 106 is constituted by an external input device 107 such as a touch panel and a keyboard provided in the display device 105.
Further, the control unit 100 is a computer, and the control unit 100 includes: an arithmetic processing device having a microprocessor such as a Central Processing Unit (CPU); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input/output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the machining device 210 to the above-described components of the machining device 210 via the input/output interface device.
The function of the storage unit 101 is realized by storing the processing content information and the image of the identification mark 5 by a storage device. The functions of the determination unit 102 and the writing unit 103 are realized by the arithmetic processing device performing arithmetic processing in accordance with a computer program stored in the storage device.
Next, a machining operation of the machining device 210 according to embodiment 1 will be described. The operator stores the workpiece 200 before cutting in the magazine 30, places the conveyance tray 1 on the conveyance tray placement unit 90, and registers the processing content information in the control unit 100 by operating the input device 106. When the control unit 100 receives a machining operation start instruction from the operator, the machining device 210 starts the machining operation. In the machining operation, the control unit 100 sequentially applies the machining method of the workpiece shown in fig. 5 to the workpiece 200 in the magazine 30.
The method of processing the object is a method of storing the device chips 204 in the conveyance tray 1, and as shown in fig. 5, the method of processing the object includes processing step ST1, storing step ST2, determining step ST3, and recording step ST 4. Processing step ST1 is a step of cutting the workpiece 200 to form a plurality of device chips 204. In processing step ST1, the processing apparatus 210 takes out one piece of the workpiece 200 from the magazine 30 by the carrying-out unit 40, and conveys the workpiece 200 from the rail 42 to the holding table 10 by the sealing and conveying unit 50. In processing step ST1, the processing device 210 sucks and holds the workpiece 200 on the holding surface 11 of the holding table 10 by the vacuum suction source, moves the holding table 10 downward of the imaging unit 60 by the processing feed unit, and images the workpiece 200 by the imaging unit 60 to perform alignment.
In processing step ST1, the processing apparatus 210 cuts the line to be divided 203 by cutting the cutting tool 21 into the line to be divided 203 until reaching the relief groove by relatively moving the cutting unit 20 and the holding table 10 along the line to be divided 203 by the processing feed unit, the division feed unit, the cutting feed unit, and the rotation drive source based on the processing content information.
In processing step ST1, the processing apparatus 210 cuts all the lines to divide 203 by the cutting tool 21, and then suctions and holds the device chips 204 on the holding table 10 by the 1 ST transfer unit 111 while suctorily holding the device chips 204 on the holding table 10. The processing apparatus 210 releases the suction holding of the holding table 10, and conveys the device chip 204 sucked and held by the 1 st conveying unit 111 to the cleaning unit 70 at a time.
In processing step ST1, after the device chips 204 are cleaned by the cleaning unit 70, the processing apparatus 210 sucks and holds the cleaned device chips 204 by the 2 nd conveying unit 112 and conveys them to the drying unit 80. After the device chip 204 is dried by the drying unit 80, the processing apparatus 210 proceeds to a storage step ST 2.
The storing step ST2 is a step of storing the plurality of device chips 204 in the conveyance tray 1. In the storing step ST2, the processing apparatus 210 sucks and holds the cut, cleaned, and dried device chips 204 by the 3 rd conveying unit 113 and conveys them to the conveying tray 1 placed on the conveying tray placing section 90.
In the storing step ST2, the processing apparatus 210 presses the device chip 204 sucked and held by the 3 rd conveying unit 113 to the adhesive layer 3 of the conveying tray 1 to bond the device chip 204 by the adhesive layer 3, and then releases the suction and holding of the 3 rd conveying unit 113, and the process proceeds to a determination step ST 3.
The decision step ST3 is a step of: the tray imaging unit 120 images the identification mark 5 of the transport tray 1 placed on the transport tray placing unit 90 and containing the plurality of device chips 204, and determines whether or not the transport tray 1 is of a type that can be written to the recording medium 4. In embodiment 1, in the determination step ST3, as shown in fig. 6, the machining device 210 uses the tray imaging unit 120 to image the identification mark 5 of the conveyance tray 1 placed on the conveyance tray placing unit 90 and containing the plurality of device chips 204. The processing apparatus 210 determines whether or not the image of the identification mark 5 of the transport tray 1 placed on the transport tray placing unit 90 captured by the tray capturing unit 120 matches the image of the identification mark 5 stored in the storage unit by the determination unit 102, and if it is determined that the images match, determines that the transport tray 1 placed on the transport tray placing unit 90 is of a type that enables information to be written to the recording medium 4, and proceeds to recording step ST 4.
The recording step ST4 is a step of recording the processed content information in the processing step ST1 on the recording medium 4 when the determination unit 102 determines that the type of the conveyance tray 1 is a type in which information can be written on the recording medium. In the recording step ST4, the processing apparatus 210 reads out, from the storage unit 101, the processing content information indicating the conditions under which the device chips 204 mounted in the transport tray 1 of the transport tray mounting unit 90 are processed by the writing unit 103, and outputs the processing content information to the recording unit 104 connected to the control unit 100. In the recording step ST4, the processing device 210 writes the processing content information from the writing unit 103 to the recording medium 4 of the transport tray 1 placed on the transport tray placing unit 90 by the recording unit 104, and ends the processing method of the workpiece.
In addition, in the determination step ST3, when it is determined by the determination means 102 that the image of the identification mark 5 of the transport tray 1 placed on the transport tray placement unit 90 captured by the tray capturing means 120 does not match the image of the identification mark 5 stored in the storage means, and it is determined that the transport tray 1 placed on the transport tray placement unit 90 is not of a type that enables information to be written to the recording medium 4, the method of processing a workpiece according to embodiment 1 is ended.
The transfer tray 1 having the device chip 204 bonded to the adhesive layer 3 is transferred to the next step by an operator or the like, and a new transfer tray 1 is placed on the transfer tray placement unit 90 on which the transfer tray 1 has been transferred to the next step by the operator or the like. The device chips 204 attached to the adhesive layer 3 of the transfer tray 1 transferred to the next process are picked up one by one from the adhesive layer 3.
The machining device 210 cuts the next workpiece 200 to sequentially cut the workpieces 200 in the cassette 30, and ends the machining operation when all the workpieces 200 in the cassette 30 are cut.
Since the conveyance tray 1 according to embodiment 1 has the identification mark 5 for identifying whether or not the type of information that can be written into the recording medium 4 is present, it is possible to determine whether or not the type of information that can be written into the recording medium 4 is present by obtaining an image of the identification mark 5. As a result, the following effects are obtained: when the conveyance tray 1 is of a specific type, information can be written to the recording medium 4.
Further, since the transfer tray 1 of embodiment 1 has the adhesive layer 3, it is possible to suppress the occurrence of chipping in the outer periphery of the device chip 204 or breakage of the device chip 204 by flying out from the device support portion 6, because the device chip 204 housed in the device support portion 6 moves and comes into contact with another device chip 204 during transfer.
The method for processing a workpiece according to embodiment 1 includes the steps of: a determination step ST3 of photographing the identification mark 5 of the conveyance tray 1 placed on the conveyance tray placing section 90 and containing the plurality of device chips 204 by the tray photographing unit 120, and determining whether or not the conveyance tray 1 is of a type in which information can be written to the recording medium 4; and a recording step ST4 of recording the processed content information in the processing step ST1 on the recording medium 4 when it is determined that the type of the conveyance tray 1 is the information writable type, and therefore, the following effects are obtained: when the conveyance tray 1 is of a specific type, information can be written to the recording medium 4.
The present invention is not limited to the above embodiments. That is, various modifications can be made and implemented without departing from the scope of the present invention. In embodiment 1, the transfer tray 1 is a tray in which the partitions for partitioning the device chips 204 from each other are not formed on the device support portion 6, but in the present invention, the tray is not limited to a tray in which the partitions are not formed and which is held by the adhesive layer 3, and may be a tray in which the partitions for partitioning the device chips 204 from each other are formed on the device support portion 6.
Claims (4)
1. A carrying tray for storing and carrying a plurality of chips, characterized in that,
the conveying tray comprises:
a tray main body having a device support portion having a front surface for supporting a plurality of chips, and a frame body formed around an outer periphery of the device support portion;
a recording medium provided in the tray main body and capable of writing or reading information by wireless communication; and
and an identification mark for identifying whether the transport tray is of a type that enables writing to the recording medium.
2. The handling tray according to claim 1,
the conveying tray has an adhesive layer which is attached to the front surface of the device support portion of the tray main body and has an adhesive force.
3. A method of processing a workpiece, wherein chips are stored in the transfer tray according to claim 1 or 2,
the processing method of the processed object comprises the following steps:
a processing step of processing a workpiece to form a plurality of chips;
a storage step of storing the plurality of chips in the conveyance tray;
a determination step of determining whether or not the conveyance tray is of a type that enables writing to the recording medium by imaging the identification mark by an imaging means; and
and a recording step of recording information in the processing step in the recording medium when it is determined that the type of the transport tray is a writable type.
4. The method of processing a workpiece according to claim 3,
the conveying tray has an adhesive layer which is attached to the front surface of the device support portion of the tray main body and has an adhesive force.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-027657 | 2019-02-19 | ||
| JP2019027657A JP7304709B2 (en) | 2019-02-19 | 2019-02-19 | Workpiece processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111584412A true CN111584412A (en) | 2020-08-25 |
Family
ID=72126061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010095644.9A Pending CN111584412A (en) | 2019-02-19 | 2020-02-17 | Conveying tray and processing method of processed object |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7304709B2 (en) |
| KR (1) | KR20200101284A (en) |
| CN (1) | CN111584412A (en) |
| TW (1) | TWI833901B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI814374B (en) * | 2022-05-10 | 2023-09-01 | 鴻勁精密股份有限公司 | Layered tray displacing device and handler |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2023068137A1 (en) * | 2021-10-18 | 2023-04-27 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000095291A (en) | 1998-09-22 | 2000-04-04 | Hitachi Ltd | Semiconductor chip carrier |
| JP2004284601A (en) | 2003-03-19 | 2004-10-14 | Renesas Technology Corp | Method for carrying, mounting and packaging semi-conductor device, and method for reusing stored article |
| US20040238623A1 (en) | 2003-05-09 | 2004-12-02 | Wayne Asp | Component handling device having a film insert molded RFID tag |
| JP2008040810A (en) | 2006-08-07 | 2008-02-21 | Shin Etsu Polymer Co Ltd | Molding for rfid system |
| US8066470B2 (en) * | 2007-11-12 | 2011-11-29 | National Semiconductor Corporation | Waffle pack |
| JP2009130045A (en) | 2007-11-21 | 2009-06-11 | Renesas Technology Corp | Wafer control system |
| KR100946334B1 (en) * | 2008-03-25 | 2010-03-09 | 세크론 주식회사 | Test tray, apparatus of discriminating a test tray and test handler having the same |
| US8240549B2 (en) * | 2009-07-29 | 2012-08-14 | Macronix International Co., Ltd. | IC package tray embedded RFID |
| CN102640253B (en) | 2010-10-04 | 2014-06-18 | 晟碟半导体（上海）有限公司 | Discrete component backward traceability and semiconductor device forward traceability |
| JP5690615B2 (en) | 2011-03-03 | 2015-03-25 | リンテック株式会社 | Ring frame and process management system |
| JP6605946B2 (en) | 2015-12-24 | 2019-11-13 | 株式会社ディスコ | Method for picking up chips from the chip storage tray |
| JP2019014488A (en) | 2017-07-04 | 2019-01-31 | 信越ポリマー株式会社 | Tray for electronic components and manufacturing method of the same |
-
2019
- 2019-02-19 JP JP2019027657A patent/JP7304709B2/en active Active
-
2020
- 2020-01-30 KR KR1020200011281A patent/KR20200101284A/en not_active Application Discontinuation
- 2020-02-14 TW TW109104645A patent/TWI833901B/en active
- 2020-02-17 CN CN202010095644.9A patent/CN111584412A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI814374B (en) * | 2022-05-10 | 2023-09-01 | 鴻勁精密股份有限公司 | Layered tray displacing device and handler |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI833901B (en) | 2024-03-01 |
| TW202032695A (en) | 2020-09-01 |
| KR20200101284A (en) | 2020-08-27 |
| JP2020136481A (en) | 2020-08-31 |
| JP7304709B2 (en) | 2023-07-07 |
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