CN111584403A - Semiconductor material processing apparatus and semiconductor material processing method - Google Patents
Semiconductor material processing apparatus and semiconductor material processing method Download PDFInfo
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- 230000007246 mechanism Effects 0.000 claims abstract description 201
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- 238000007599 discharging Methods 0.000 claims abstract description 90
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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Abstract
The invention provides semiconductor material processing equipment and a semiconductor material processing method, and relates to the technical field of material processing. The semiconductor material processing equipment comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging position and a waste position. The feeding mechanism is arranged on one side of the processing mechanism. The detection module is arranged at the processing mechanism and is connected with the control module. The control module is connected with the blanking mechanism, and the blanking mechanism is arranged on one side of the processing mechanism. The detection module is used for detecting the appearance of the materials processed by the processing mechanism, the control module is used for judging whether the processed materials are qualified or not, and controlling the blanking mechanism to convey the qualified materials to the blanking position and convey the unqualified materials to the waste position. The invention solves the technical problem that the production efficiency is still low because the waste needs to be manually removed after the material processing fails in the material processing process of the automatic feeding and discharging semiconductor material processing equipment in the prior art.
Description
Technical Field
The invention relates to the technical field of material processing, in particular to semiconductor material processing equipment and a semiconductor material processing method.
Background
With the increasing development of the semiconductor industry, the production efficiency of the semiconductor material processing process in the industry is required to be higher and higher. The traditional semiconductor material processing equipment is low in production efficiency due to the fact that materials are manually fed onto a processing table and the materials on the processing table are manually discharged, and therefore the production efficiency needs to be improved by the automatic feeding and discharging semiconductor material processing equipment.
However, the existing semiconductor material processing equipment capable of automatically feeding and discharging generally has the problem that waste materials need to be manually removed after material processing fails, and the production efficiency is still low.
Disclosure of Invention
The invention aims to provide semiconductor material processing equipment and a semiconductor material processing method, which are used for solving the technical problem that in the prior art, in the process of processing materials by the existing automatic feeding and discharging semiconductor material processing equipment, the production efficiency is still low due to the fact that waste materials need to be manually removed after the materials are processed in failure.
The semiconductor processing equipment provided by the invention comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging position and a waste material position;
the feeding mechanism is arranged on one side of the processing mechanism and used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials;
the detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the blanking mechanism, the blanking mechanism is arranged on one side of the processing mechanism, and the blanking level and the waste level are respectively positioned on one side of the blanking mechanism;
the detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified or not according to the information detected by the detection module, and controlling the discharging mechanism to convey the qualified material to the discharging position when the material is qualified, and controlling the discharging mechanism to convey the unqualified material to the waste position when the material is unqualified.
Furthermore, the detection module is a camera, and the control module is a programmable logic controller.
Further, the feeding mechanism comprises a first transverse moving driving component, a first longitudinal moving driving component and a first picking component;
the first transverse moving driving assembly is positioned above the processing mechanism and connected with the first longitudinal moving driving assembly, and the first longitudinal moving driving assembly is connected with the first picking assembly;
the first transverse moving driving assembly is used for driving the first longitudinal moving driving assembly and the first picking assembly to move along the horizontal direction, and the first longitudinal moving driving assembly is used for driving the first picking assembly to move along the vertical direction; the first picking assembly is used for picking up the materials.
Further, the blanking mechanism comprises a second transverse moving driving assembly, a second longitudinal moving driving assembly and a second picking assembly;
the second transverse moving driving assembly is positioned above the processing mechanism and connected with the second longitudinal moving driving assembly, and the second longitudinal moving driving assembly is connected with the second picking assembly;
the second transverse moving driving assembly is used for driving the second longitudinal moving driving assembly and the second picking assembly to move along the horizontal direction, and the second longitudinal moving driving assembly is used for driving the second picking assembly to move along the vertical direction; the second picking assembly is used for picking up the materials.
Further, the semiconductor material processing equipment also comprises a first material detection piece, wherein the first material detection piece is arranged on the first picking assembly and used for detecting whether the first picking assembly picks up the material.
Further, the semiconductor material processing equipment also comprises a second material detection piece, and the second material detection piece is arranged on the second picking assembly and used for detecting whether the second picking assembly picks up the material.
The semiconductor material processing method provided by the invention is applied to the semiconductor material processing equipment in any one of the technical schemes, and comprises the following steps:
the feeding process comprises the following steps: conveying the material to a processing mechanism by using a feeding mechanism;
the processing process comprises the following steps: processing the material by using a processing mechanism;
the blanking process comprises the following steps: taking the processed material out of the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified or not by using a detection module;
if the processed materials are qualified, the control module and the blanking mechanism are used for conveying the qualified materials to a blanking position;
if the processed materials are unqualified, the unqualified materials are conveyed to a waste material level by using the control module and the blanking mechanism.
Furthermore, a feeding longitudinal downward limiting position, a feeding longitudinal upward position and a feeding transverse discharging position are sequentially arranged in a feeding path of the feeding mechanism; the lower longitudinal limit of the feeding is positioned below the upper longitudinal limit of the feeding; the feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane; the feeding transverse discharging position is positioned above the processing mechanism;
the feeding process comprises the following steps:
the process of vertically taking materials by feeding: lifting the material from the lower longitudinal limit of the feeding to the upper longitudinal limit of the feeding by using a feeding mechanism;
and (3) a feeding transverse transmission process: detecting whether materials exist on the feeding longitudinal upper position, and if the materials exist on the feeding longitudinal upper position, horizontally conveying the materials on the feeding longitudinal upper position to a feeding transverse discharging position by using a feeding mechanism;
if no material exists on the loading longitudinal upper position, repeating the loading longitudinal material taking process;
if the times of repeating the feeding and longitudinal material taking processes exceed the set times, stopping the feeding process;
and (3) a loading longitudinal discharging process: and (4) moving the material on the feeding transverse discharge position downwards to the processing mechanism by using the feeding mechanism.
Further, a blanking longitudinal discharging position, a blanking transverse waste material position, a blanking position and a waste material position are sequentially arranged in a blanking path of the blanking mechanism; the blanking longitudinal discharging position is positioned above the processing mechanism; the blanking transverse discharging position, the blanking longitudinal discharging position and the blanking transverse waste material position are all positioned on the same horizontal plane; the blanking level is positioned below the blanking transverse blanking level, and the waste level is positioned below the blanking transverse waste level;
the blanking process comprises the following steps:
the blanking longitudinal material taking process: the method comprises the following steps of lifting a processed material at a processing mechanism to a blanking longitudinal discharging position by using a blanking mechanism, and judging whether the processed material is qualified or not by using a detection module;
and (3) blanking transverse transmission process: if the processed material is qualified, horizontally conveying the qualified material on a longitudinal discharging position to a transverse discharging position by using a control module and a discharging mechanism;
if the processed material is unqualified, horizontally conveying the unqualified material on the blanking longitudinal blanking position to a blanking transverse waste material position by using a control module and a blanking mechanism;
and (3) a blanking longitudinal discharging process: using a blanking mechanism to move the material on the transverse blanking position downwards to the blanking position;
and (4) moving the material on the blanking transverse waste material level downwards to the waste material level by using a blanking mechanism.
Further, after the feeding longitudinal feeding process, calculating the preset height of the material on the feeding position, and detecting the actual height of the material on the feeding position;
judging whether the preset height of the material is consistent with the actual height;
and if the preset height of the material is not consistent with the actual height, stopping the blanking longitudinal discharging process.
The semiconductor processing equipment and the semiconductor processing method provided by the invention can produce the following beneficial effects:
the invention provides semiconductor processing equipment which comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging position and a waste position. The feeding mechanism is arranged on one side of the processing mechanism, the feeding mechanism is used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials. The detection module is arranged at the processing mechanism and is connected with the control module. The control module is connected with the discharging mechanism, the discharging mechanism is arranged on one side of the processing mechanism, and the discharging position and the waste material position are respectively located on one side of the discharging mechanism. The detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified or not according to the information detected by the detection module, and controlling the discharging mechanism to convey the qualified material to the discharging position when the material is qualified, and controlling the discharging mechanism to convey the unqualified material to the waste position when the material is unqualified. The feeding mechanism in the semiconductor processing equipment can replace manual feeding, the blanking mechanism can replace manual blanking, and the detection module and the control module work in a matched mode to automatically remove processed unqualified materials, so that the production efficiency can be improved.
Compared with the prior art, the feeding mechanism and the discharging mechanism in the semiconductor material processing equipment can realize the automatic feeding and discharging process, and the production efficiency is improved. In addition, detection module, control module and unloading mechanism among this semiconductor material processing equipment can mutually support and reject the unqualified material in the material after processing, have saved the artifical process of rejecting unqualified material, further promotion production efficiency, have practiced thrift manufacturing cost.
The invention provides a semiconductor processing method and the semiconductor material processing equipment, wherein the semiconductor material processing method comprises the following steps: the feeding process comprises the following steps: conveying the material to a processing mechanism by using a feeding mechanism; the processing process comprises the following steps: processing the material by using a processing mechanism; the blanking process comprises the following steps: taking the processed material out of the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified or not by using a detection module; if the processed materials are qualified, the control module and the blanking mechanism are used for conveying the qualified materials to a blanking position; if the processed materials are unqualified, the unqualified materials are conveyed to a waste material level by using the control module and the blanking mechanism.
The semiconductor processing method provided by the invention is applied to the semiconductor material processing equipment, so that the semiconductor processing method provided by the invention has the same beneficial effects as the semiconductor material processing equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention;
FIG. 2 is a front view of the semiconductor processing apparatus of FIG. 1;
FIG. 3 is a schematic structural diagram of the feeding mechanism in FIG. 1;
FIG. 4 is a schematic structural diagram of the blanking mechanism in FIG. 1;
FIG. 5 is a schematic view of the first longitudinal motion driving assembly of FIG. 3;
fig. 6 is a schematic structural diagram of the second longitudinal movement driving assembly in fig. 4.
Icon: 1-a feeding mechanism; 10-a first traverse drive assembly; 11-a first longitudinal movement drive assembly; 12-a first picking assembly; 2-a blanking mechanism; 20-a second traverse drive assembly; 21-a second longitudinal movement driving component; 22-a second picking assembly; 3, a motor; 30-a pulley; 31-a conveyor belt; 4-a guide rail; 5-a first material detection member; 6-a buffer; 7-a second material detection member; 8-a bedplate; 9-connecting plate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1-2, the semiconductor material processing apparatus provided in this embodiment includes a feeding mechanism 1, a processing mechanism, a discharging mechanism 2, a detection module, a control module, a discharging position, and a waste position. Feed mechanism 1 sets up in one side of processing agency, and feed mechanism 1 is used for transmitting the material to the processing agency on, and the processing agency is used for processing the material. The detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the discharging mechanism 2, the discharging mechanism 2 is arranged on one side of the processing mechanism, and the discharging position and the waste material position are respectively located on one side of the discharging mechanism 2.
Wherein the material is a semiconductor material. The detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified according to the information detected by the detection module, the discharging mechanism 2 is controlled to convey the qualified material to the discharging position when the material is qualified, and the discharging mechanism 2 is controlled to convey the unqualified material to the waste position when the material is unqualified.
The feed mechanism 1 in the semiconductor processing equipment that this embodiment provided can replace artifical material loading, and unloading mechanism 2 can replace artifical unloading, and detection module and control module cooperation work can reject out the unqualified material after processing is automatic, and then can improve production efficiency.
Compared with the prior art, the process of unloading can be realized automatically to feed mechanism 1 and unloading mechanism 2 among the semiconductor material processing equipment that this embodiment provided, promotes production efficiency. In addition, detection module, control module and unloading mechanism 2 in this semiconductor material processing equipment can mutually support and reject the unqualified material in the material after processing, have saved the artifical process of rejecting unqualified material, further promotion production efficiency, have practiced thrift manufacturing cost.
It can be seen that the semiconductor material processing equipment that this embodiment provided has alleviated the semiconductor material processing equipment processing material in-process of the automatic feeding and unloading that exists among the prior art, need artificially reject the waste material after the material processing fails, lead to the still lower technical problem of production efficiency.
The semiconductor material processing equipment that this embodiment provided still includes the material loading box, and the material loading box is located one side of feed mechanism 1, and feed mechanism 1 can be with the material transport to the processing agency in the material loading box on.
The loading box is used for storing semiconductor materials, the semiconductor materials are in a sheet shape, and when the semiconductor materials are stored in the loading box, the semiconductor materials are horizontally stacked in the loading box.
It can be seen that, when the semiconductor material processing equipment provided by the embodiment processes semiconductor materials, the feeding mechanism 1 and the discharging mechanism 2 operate separately and do not interfere with each other. The feeding mechanism 1 can convey the stacked materials from the feeding box to the processing mechanism. The blanking mechanism 2 can convey the processed material to a blanking position or a waste position under the action of the detection module and the control module according to the processing effect.
Furthermore, the detection module is a camera, and the control module is a programmable logic controller.
The processing mechanism can be various semiconductor processing mechanisms adopted in the existing semiconductor industry, and correspondingly, the qualification of the semiconductor material processed by the processing mechanism has various conditions, such as whether the processed semiconductor material has cracks or not and whether the shape and the size of the semiconductor material meet the requirements or not.
The camera can send the appearance information of the processed semiconductor material to the programmable logic controller, the programmable logic controller records the qualified appearance information of the semiconductor material, such as the image information of the qualified semiconductor material, then the programmable logic controller can compare the processed semiconductor material with the qualified semiconductor material, judge whether cracks or defects are generated on the surface of the processed semiconductor material, further judge whether the processed semiconductor material is qualified, and then control the blanking mechanism 2 to work according to the judgment result.
As shown in fig. 1, 3 and 5, the loading mechanism 1 includes a first traverse drive assembly 10, a first longitudinal drive assembly 11 and a first pick-up assembly 12. The first traverse driving assembly 10 is positioned above the processing mechanism, the first traverse driving assembly 10 is connected with the first longitudinal moving driving assembly 11, and the first longitudinal moving driving assembly 11 is connected with the first picking assembly 12. The first traverse driving assembly 10 is used for driving the first longitudinal moving driving assembly 11 and the first picking assembly 12 to move along the horizontal direction, and the first longitudinal moving driving assembly 11 is used for driving the first picking assembly 12 to move along the vertical direction; the first picking assembly 12 is for picking up material.
The first traverse driving assembly 10 can drive the first traverse driving assembly 11 and the first pickup assembly 12, which are located higher than the processing mechanism, to move in the horizontal direction, so that the pickup assemblies can be driven to be located right above the processing mechanism. And the first longitudinal drive assembly 11 may drive the first picking assembly 12 to approach or process material on the machine.
The first traverse driving assembly 10 and the first longitudinal driving assembly 11 are used together to flexibly adjust the position of the first picking assembly 12, so that the first picking assembly 12 can pick up materials accurately.
Wherein the first traverse driving assembly 10 includes a motor 3, a conveyor belt 31, a pulley 30, and a guide rail 4. The guide rail 4 is horizontally fixed at a position higher than the processing mechanism, the motors 3 are mounted at both ends of the guide rail 4, one belt wheel 30 is mounted on an output shaft of each motor 3, and the conveyor belt 31 is mounted on the two belt wheels 30. The first longitudinal driving assembly 11 is slidably connected to one side of the guide rail 4 and is connected to the conveyor belt 31. The motor 3 is used for driving the conveyor belt 31 to rotate, and the conveyor belt 31 is used for driving the first longitudinal movement driving component 11 connected with the conveyor belt 31 to move along the horizontal direction.
As shown in fig. 1, 4 and 6, the blanking mechanism 2 includes a second traverse drive assembly 20, a second longitudinal drive assembly 21 and a second pick-up assembly 22. The second traverse driving assembly 20 is positioned above the processing mechanism, the second traverse driving assembly 20 is connected with the second longitudinal driving assembly 21, and the second longitudinal driving assembly 21 is connected with the second picking assembly 22. The second traverse driving assembly 20 is used for driving the second longitudinal movement driving assembly 21 and the second picking assembly 22 to move along the horizontal direction, and the second longitudinal movement driving assembly 21 is used for driving the second picking assembly 22 to move along the vertical direction; the second picking assembly 22 is for picking up material.
The second traverse driving assembly 20 can drive the second traverse driving assembly 21 and the second pick-up assembly 22, which are located higher than the processing mechanism, to move in the horizontal direction, so that the pick-up assemblies can be driven to be located right above the processing mechanism. And the second longitudinal drive assembly 21 may drive the second picking assembly 22 to approach or process material on the machine.
The second traverse driving assembly 20 and the second traverse driving assembly 21 are used in cooperation, so that the position of the second picking assembly 22 can be flexibly adjusted, and the second picking assembly 22 can pick materials accurately.
The second traverse driving unit 20 may have the same structure as the first traverse driving unit 10, and the second traverse driving unit 20 may include a motor 3, a conveyor belt 31, a pulley 30, and a guide rail 4. The guide rail 4 is horizontally fixed at a position higher than the processing mechanism, the motors 3 are mounted at both ends of the guide rail 4, one belt wheel 30 is mounted on an output shaft of each motor 3, and the conveyor belt 31 is mounted on the two belt wheels 30. The second longitudinal driving unit 21 is slidably connected to one side of the guide rail 4 and is connected to the conveyor belt 31. The motor 3 is used for driving the conveyor belt 31 to rotate, and the conveyor belt 31 is used for driving the second longitudinal movement driving component 21 connected with the conveyor belt 31 to move along the horizontal direction.
As shown in fig. 5, the semiconductor material processing apparatus provided in this embodiment further includes a first material detecting member 5, and the first material detecting member 5 is mounted on the first picking assembly 12 and is used for detecting whether the first picking assembly 12 picks up the material.
First material detection piece 5 can be photoelectric sensor, and first material detection piece 5 is used for detecting whether first subassembly 12 of picking up picks up the material, and then the smooth and easy of the material course of working of being convenient for goes on.
As shown in fig. 5, the semiconductor material processing apparatus provided in this embodiment further includes a buffer 6, the first picking assembly 12 is a suction cup, and the buffer 6 is installed between the first longitudinal movement driving assembly 11 and the first picking assembly 12.
The sucking disc is convenient for stably take out the material from the material loading box, and can reduce the damage to the material, therefore the preferred first subassembly 12 of picking up of this embodiment is the sucking disc.
Further, the first picking assembly 12 may be a vacuum chuck.
As shown in fig. 6, the semiconductor material processing apparatus provided in this embodiment further includes a second material detecting member 7, and the second material detecting member 7 is mounted on the second picking assembly 22 and is used for detecting whether the second picking assembly 22 picks up the material.
The second material detecting part 7 may also be a photoelectric sensor, and the second material detecting part 7 is used to detect whether the second picking assembly 22 picks up the material, so as to facilitate smooth proceeding of the material processing process.
In this embodiment, the second picking assembly 22 is a suction cup.
The second picking assembly 22 is preferably a suction cup in this embodiment because the suction cup can not only pick up the material stably but also reduce the damage to the material.
Further, the second picking assembly 22 may be a vacuum chuck.
As shown in fig. 1 to 4, the semiconductor material processing apparatus provided in this embodiment further includes a platen 8, and the feeding mechanism 1 and the discharging mechanism 2 are both mounted on the platen 8.
The bedplate 8 is used for supporting the feeding mechanism 1 and the discharging mechanism 2, and the feeding mechanism 1 and the discharging mechanism 2 can be arranged together, so that the occupied space of the semiconductor material processing equipment is reduced.
In this embodiment, the first longitudinal driving assembly 11 and the second longitudinal driving assembly 21 can both use the existing linear module slider.
Further, as shown in fig. 5 and 6, a connecting plate 9 may be connected to each of the linear module sliders, and the connecting plate 9 is connected to the first picking assembly 12 or the second picking assembly 22.
Further, can be provided with the department of buckling on the connecting plate 9, the department of buckling on the connecting plate 9 can increase the interval that first picking up subassembly 12 or second picking up subassembly 22 and sharp module slider directly pressed, and then can prevent that sharp module slider from influencing the process of picking up the material.
The working process of the semiconductor material processing equipment provided by the embodiment comprises a material taking process before feeding, a material feeding process, a processing process, a material taking process before discharging and a discharging process, and the specific process is as follows:
taking materials: the first picking assembly 12 is driven to suspend above the feeding box, and then the first longitudinal moving driving assembly 11 drives the first picking assembly 12 to descend at a constant speed, and when the first picking assembly 12 descends to a certain position, the first picking assembly 12 stops moving. The first picking assembly 12 is then moved vertically at a slower speed a distance sufficient to ensure that the first picking assembly 12 is in sufficient contact with the material in the upper magazine. Then, the first picking assembly 12 is started to enable the first picking assembly 12 to take out the materials in the feeding box, and the first longitudinal movement driving assembly 11 is used for driving the first picking assembly 12 to move upwards to finish the material taking process before feeding. Wherein, in the material taking process, the first material detecting member 5 keeps working to judge whether the first picking assembly 12 successfully takes the material. If the first material detecting part 5 detects that the first picking assembly 12 has the material, the material is successfully picked, and if the material is not detected, the material picking failure is proved, and at this time, the number of times of material picking failure can be recorded and the above actions can be repeated to re-pick the material. In the process of reclaiming material, when the first picking assembly 12 moves a certain distance again, a fixed value (which can be set in advance) can be added to the certain distance. And after the material taking is successful, resetting the counting of the material taking failure times, and giving an alarm to prompt if the continuous material taking failure times exceed a certain number, wherein the continuous material taking failure times can be set in advance.
The feeding process comprises the following steps: the first traverse driving assembly 10 is used to move the first picking assembly 12 to above the processing mechanism, and the first longitudinal driving assembly 11 is used to drive the material on the first picking assembly 12 to approach the processing mechanism, so that the first picking assembly 12 releases the material to locate on the processing mechanism.
The processing process comprises the following steps: after the material is positioned on the processing mechanism, the processing mechanism processes the material.
Taking materials before blanking: after the material is processed, the processing mechanism moves the material under the second picking assembly 22, and the second picking assembly 22 picks up the material. During the material taking process, the second material detecting member 7 remains in operation to determine whether the second picking assembly 22 successfully takes the material. If the second material detecting piece 7 detects that the second picking assembly 22 has the material, the material taking is successful, and if the material is not detected, the material taking is proved to be failed, and the material needs to be taken again.
The blanking process comprises the following steps: the second longitudinal moving driving assembly 21 and the second transverse moving driving assembly 20 are matched, and the materials picked up by the second picking assembly 22 are conveyed to a waste material level or a discharging level by combining the control process of the control module.
Example two:
the semiconductor material processing method provided by the embodiment applies the semiconductor material processing equipment in the first embodiment, and the semiconductor material processing method comprises a loading process, a processing process and a blanking process.
Wherein, the material loading process: and conveying the material to a processing mechanism by using a feeding mechanism. The processing process comprises the following steps: and processing the material by using a processing mechanism. The blanking process comprises the following steps: taking the processed material out of the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified or not by using a detection module; if the processed materials are qualified, the control module and the blanking mechanism are used for conveying the qualified materials to a blanking position; if the processed materials are unqualified, the unqualified materials are conveyed to a waste material level by using the control module and the blanking mechanism.
The feeding path of the feeding mechanism is sequentially provided with a feeding longitudinal downward limit position, a feeding longitudinal upper position and a feeding transverse discharging position. The lower longitudinal limit of the feeding is positioned below the upper longitudinal limit of the feeding. The feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane. The feeding transverse discharging position is positioned above the processing mechanism.
Further, the feeding process comprises a feeding longitudinal material taking process, a feeding transverse transmission process and a feeding longitudinal material discharging process.
Wherein, the vertical material process of getting of material loading: and lifting the material from the lower longitudinal limit of the feeding to the upper longitudinal limit of the feeding by using a feeding mechanism.
And (3) a feeding transverse transmission process: whether there is the material on the vertical upper level of detection material loading, if there is the material on the vertical upper level of material loading, then use feed mechanism with the material level of the vertical upper level of material loading carry to the material of material horizontal discharge on the material loading. If no material exists on the longitudinal upper position of the feeding, the longitudinal feeding process is repeated. And if the times of repeating the feeding and longitudinal material taking processes exceed the set times, stopping the feeding process.
And (3) a loading longitudinal discharging process: and (4) moving the material on the feeding transverse discharge position downwards to the processing mechanism by using the feeding mechanism.
When the semiconductor material processing equipment and the semiconductor material processing method provided by the embodiment are utilized to process materials, the feeding box can be placed on the feeding longitudinal lower limit in the feeding process, the first picking assembly is driven to be suspended right above the feeding box, then the first longitudinal moving driving assembly drives the first picking assembly to descend at a constant speed, and the first picking assembly stops moving after descending to a certain position. And then vertically moving the first picking assembly at a slower speed for a distance that ensures that the first picking assembly is in sufficient contact with the material in the upper magazine. Then, the first picking assembly is started to take out the materials in the feeding box, and then the first longitudinal moving driving assembly is used for driving the first picking assembly to move upwards to finish the material taking process before feeding.
Wherein, getting the material in-process, first material detection spare keeps work in order to judge first subassembly of picking up whether successfully to get the material. If the first material detection piece detects that the first picking assembly has the materials, the materials are successfully picked, if the materials are not detected, the failure of the materials picking is proved, and at the moment, the times of the failure of the materials picking can be recorded and the actions are repeated to re-pick the materials. In the process of reclaiming materials, when the first picking assembly moves a certain distance again, a fixed value (which can be set in advance) can be added to the certain distance. And after the material taking is successful, resetting the counting of the material taking failure times, and giving an alarm to prompt if the continuous material taking failure times exceed a certain number, wherein the continuous material taking failure times can be set in advance.
The blanking mechanism is characterized in that a longitudinal blanking position, a transverse blanking waste position, a blanking position and a waste position are sequentially arranged in a blanking path. The longitudinal discharging position of the blanking is positioned above the processing mechanism. The feeding transverse feeding position, the feeding longitudinal feeding position and the feeding transverse waste material position are all located on the same horizontal plane. The blanking level is positioned below the blanking horizontal blanking level, and the waste level is positioned below the blanking horizontal waste level.
Further, the blanking process comprises a blanking longitudinal material taking process, a blanking transverse transmission process and a blanking longitudinal material discharging process.
Wherein, the unloading is vertically got the material process: and the blanking mechanism is used for lifting the processed material at the processing mechanism to a blanking longitudinal discharging position, and the detection module is used for judging whether the processed material is qualified.
And (3) blanking transverse transmission process: and if the processed material is qualified, horizontally conveying the qualified material on the longitudinal discharging position of the discharging to the transverse discharging position of the discharging by using the control module and the discharging mechanism. And if the processed materials are unqualified, horizontally conveying the unqualified materials on the blanking longitudinal discharging position to the blanking transverse waste material position by using the control module and the blanking mechanism.
And (3) a blanking longitudinal discharging process: and (4) using a blanking mechanism to move the material on the transverse blanking position downwards to the blanking position. And (4) moving the material on the blanking transverse waste material level downwards to the waste material level by using a blanking mechanism.
When the semiconductor material processing device in the first embodiment and the semiconductor material processing method provided by the first embodiment are used for processing materials, in the feeding process, the second material detection piece can be used for judging whether the second picking assembly successfully picks the materials. If the second material detection piece detects that the second picking assembly has the material, the material taking is successful, and if the material is not detected, the material taking is proved to be failed, and the material needs to be taken again.
Further, after the feeding longitudinal feeding process, the preset height of the material on the feeding position is calculated, and the actual height of the material on the feeding position is detected. And then judging whether the preset height of the material is consistent with the actual height, and if the preset height of the material is not consistent with the actual height, stopping the blanking longitudinal discharging process.
If the preset height of the material is not consistent with the actual height, fragments or the material is not separated from the blanking mechanism, so that whether the preset height of the material is consistent with the actual height or not can be judged, the blanking longitudinal discharging process can be stopped in time to process the damaged material on the blanking level in time or the situation that the material is still carried by the blanking mechanism after the blanking process is processed in time.
The preset height of the material on the blanking position can be calculated according to the formula (1):
D＝D0-(n-1)×Δd (1)
wherein D is the preset height of the material on the blanking position, and D0The height of the blanking position, n is the counting number of the blanked materials (n is more than or equal to 1), and delta d is the thickness of each material.
The semiconductor processing method provided by the embodiment is applied to the semiconductor material processing equipment, so that the semiconductor processing method provided by the embodiment and the semiconductor material processing equipment can solve the same technical problems and achieve the same technical effects.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The semiconductor material processing equipment is characterized by comprising a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging position and a waste position;
the feeding mechanism is arranged on one side of the processing mechanism and used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials;
the detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the blanking mechanism, the blanking mechanism is arranged on one side of the processing mechanism, and the blanking level and the waste level are respectively positioned on one side of the blanking mechanism;
the detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified or not according to the information detected by the detection module, controlling the discharging mechanism to convey the qualified material to the discharging position when the material is qualified, and controlling the discharging mechanism to convey the unqualified material to the waste position when the material is unqualified.
2. The semiconductor material processing apparatus of claim 1, wherein the detection module is a camera and the control module is a programmable logic controller.
3. The semiconductor material processing apparatus of claim 1, wherein the feed mechanism comprises a first traverse drive assembly, and a first pickup assembly;
the first transverse moving driving assembly is positioned above the processing mechanism and connected with the first longitudinal moving driving assembly, and the first longitudinal moving driving assembly is connected with the first picking assembly;
the first transverse moving driving assembly is used for driving the first longitudinal moving driving assembly and the first picking assembly to move along the horizontal direction, and the first longitudinal moving driving assembly is used for driving the first picking assembly to move along the vertical direction; the first picking assembly is used for picking up materials.
4. The semiconductor material processing apparatus according to any one of claims 1 to 3, wherein the blanking mechanism comprises a second traverse drive assembly, and a second pickup assembly;
the second traverse driving assembly is positioned above the processing mechanism and is connected with the second longitudinal movement driving assembly, and the second longitudinal movement driving assembly is connected with the second picking assembly;
the second traverse driving assembly is used for driving the second longitudinal moving driving assembly and the second picking assembly to move along the horizontal direction, and the second longitudinal moving driving assembly is used for driving the second picking assembly to move along the vertical direction; the second picking assembly is used for picking up materials.
5. The semiconductor material processing apparatus of claim 3, further comprising a first material detection member mounted on the first picking assembly for detecting whether material is picked by the first picking assembly.
6. The semiconductor material processing apparatus of claim 4, further comprising a second material detecting member mounted on the second picking assembly for detecting whether the second picking assembly picks up the material.
7. A semiconductor material processing method using the semiconductor material processing apparatus according to any one of claims 1 to 6, the semiconductor material processing method comprising:
the feeding process comprises the following steps: conveying the material to the processing mechanism by using the feeding mechanism;
the processing process comprises the following steps: processing the material by using the processing mechanism;
the blanking process comprises the following steps: taking the processed material out of the processing mechanism by using the blanking mechanism, and judging whether the processed material is qualified or not by using the detection module;
if the processed material is qualified, the control module and the blanking mechanism are used for conveying the qualified material to the blanking position;
and if the processed materials are unqualified, the control module and the blanking mechanism are used for conveying the unqualified materials to the waste material position.
8. The semiconductor material processing method according to claim 7, wherein a feeding longitudinal downward limit position, a feeding longitudinal upward position and a feeding transverse discharging position are sequentially arranged in a feeding path of the feeding mechanism; the feeding longitudinal lower limit is positioned below the feeding longitudinal upper limit; the feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane; the feeding transverse discharging position is positioned above the processing mechanism;
the feeding process comprises the following steps:
the process of vertically taking materials by feeding: lifting the material from the lower longitudinal limit to the upper longitudinal limit by using the feeding mechanism;
and (3) a feeding transverse transmission process: detecting whether a material exists on the feeding longitudinal upper position, and if so, horizontally conveying the material on the feeding longitudinal upper position to the feeding transverse discharging position by using the feeding mechanism;
if no material exists on the feeding longitudinal upper position, repeating the feeding longitudinal material taking process;
if the times of repeating the feeding longitudinal material taking process exceed the set times, stopping the feeding process;
and (3) a loading longitudinal discharging process: and using the feeding mechanism to move the material on the transverse feeding position of the feeding downwards to the processing mechanism.
9. The semiconductor material processing method according to claim 7, wherein a blanking longitudinal blanking position, a blanking transverse waste position, the blanking position and the waste position are sequentially arranged in a blanking path of the blanking mechanism; the blanking longitudinal discharging position is positioned above the processing mechanism; the blanking transverse discharging position, the blanking longitudinal discharging position and the blanking transverse waste material position are all positioned on the same horizontal plane; the blanking position is located below the blanking transverse blanking position, and the waste position is located below the blanking transverse waste position;
the blanking process comprises the following steps:
the blanking longitudinal material taking process: the blanking mechanism is used for lifting the processed material at the processing mechanism to the blanking longitudinal discharging position, and the detection module is used for judging whether the processed material is qualified or not;
and (3) blanking transverse transmission process: if the processed materials are qualified, horizontally conveying the qualified materials on the blanking longitudinal discharging position to the blanking transverse discharging position by using the control module and the blanking mechanism;
if the processed materials are unqualified, horizontally conveying the unqualified materials on the blanking longitudinal discharging position to the blanking transverse waste material position by using the control module and the blanking mechanism;
and (3) a blanking longitudinal discharging process: the blanking mechanism is used for moving the material on the blanking transverse discharge position downwards to the blanking position;
and using the blanking mechanism to move the material on the blanking transverse waste material level downwards to the waste material level.
10. The semiconductor material processing method according to claim 9, wherein after a blanking longitudinal discharging process, a preset height of the material on the blanking position is calculated, and an actual height of the material on the blanking position is detected;
judging whether the preset height of the material is consistent with the actual height;
and if the preset height of the material is not consistent with the actual height, stopping the blanking longitudinal discharging process.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110822A (en) * | 2022-12-07 | 2023-05-12 | 晶科能源股份有限公司 | Solar cell tracing method and cell transmission equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000883A (en) * | 2006-01-10 | 2007-07-18 | 韩美半导体株式会社 | Workbench for semiconductor manufacturing engineering |
| WO2014175586A1 (en) * | 2013-04-22 | 2014-10-30 | 한미반도체 주식회사 | Semiconductor strip sawing apparatus |
| CN104162817A (en) * | 2014-08-11 | 2014-11-26 | 宜昌迪森智能科技有限公司 | Split-type intelligent grinding machine |
| CN107344676A (en) * | 2017-07-24 | 2017-11-14 | 深圳市嘉熠精密自动化科技有限公司 | A kind of automatic loading and unloading mechanism |
| CN108792559A (en) * | 2018-07-20 | 2018-11-13 | 林焕城 | Bat printing keycap equipment automatic conveyor line |
| CN108828372A (en) * | 2018-08-08 | 2018-11-16 | 深圳市易胜德机械设备有限公司 | Device for inspecting electronic component package |
| CN209513597U (en) * | 2019-02-15 | 2019-10-18 | 广州汇才拓穗教育咨询服务有限公司 | A kind of double chip detection transporting apparatus of dynamic formula |
| JP2020040141A (en) * | 2018-09-07 | 2020-03-19 | 株式会社キーレックス | Take-out device of steel plate for pressing |
| CN111055100A (en) * | 2019-12-27 | 2020-04-24 | 中国科学院沈阳自动化研究所 | Accurate positioning mechanism for door head plate |
-
2020
- 2020-05-22 CN CN202010445688.XA patent/CN111584403B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000883A (en) * | 2006-01-10 | 2007-07-18 | 韩美半导体株式会社 | Workbench for semiconductor manufacturing engineering |
| JP2007189226A (en) * | 2006-01-10 | 2007-07-26 | Hanmi Semiconductor Co Ltd | Table for semiconductor manufacturing process |
| WO2014175586A1 (en) * | 2013-04-22 | 2014-10-30 | 한미반도체 주식회사 | Semiconductor strip sawing apparatus |
| CN104162817A (en) * | 2014-08-11 | 2014-11-26 | 宜昌迪森智能科技有限公司 | Split-type intelligent grinding machine |
| CN107344676A (en) * | 2017-07-24 | 2017-11-14 | 深圳市嘉熠精密自动化科技有限公司 | A kind of automatic loading and unloading mechanism |
| CN108792559A (en) * | 2018-07-20 | 2018-11-13 | 林焕城 | Bat printing keycap equipment automatic conveyor line |
| CN108828372A (en) * | 2018-08-08 | 2018-11-16 | 深圳市易胜德机械设备有限公司 | Device for inspecting electronic component package |
| JP2020040141A (en) * | 2018-09-07 | 2020-03-19 | 株式会社キーレックス | Take-out device of steel plate for pressing |
| CN209513597U (en) * | 2019-02-15 | 2019-10-18 | 广州汇才拓穗教育咨询服务有限公司 | A kind of double chip detection transporting apparatus of dynamic formula |
| CN111055100A (en) * | 2019-12-27 | 2020-04-24 | 中国科学院沈阳自动化研究所 | Accurate positioning mechanism for door head plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116110822A (en) * | 2022-12-07 | 2023-05-12 | 晶科能源股份有限公司 | Solar cell tracing method and cell transmission equipment |
| CN116110822B (en) * | 2022-12-07 | 2024-05-10 | 晶科能源股份有限公司 | Solar cell tracing method and cell transmission equipment |
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